Pub Date : 2026-01-28DOI: 10.1016/j.mser.2026.101186
Sanghun Kim , Yeomin Yoon , Dong Hun Kim
Thin films used in advanced flexible devices must not only exhibit mechanical flexibility but also maintain stability against moisture and high temperatures while retaining their functional properties. This review focuses on the recent progress in replacing conventional organic-based flexible devices with high-performance inorganic thin-film devices fabricated via high-temperature deposition. As most flexible substrates cannot withstand the high temperatures required for the direct deposition of epitaxial or highly crystallized films, alternative strategies, such as the use of chemically etchable sacrificial layers or physically separable two-dimensional materials, have been developed to enable high-quality thin-film transfer onto flexible substrates. In this review, we systematically summarize the types of sacrificial and two-dimensional layers applied in transfer methods that have been explored to date, including both chemical and physical approaches. This review also highlights the functional properties of the transferred inorganic thin films, including their stability, ferromagnetism, ferroelectricity, multiferroicity, and optical and electrical characteristics, and discusses their potential for novel device applications. Finally, we address the current limitations of sacrificial and two-dimensional layer selection and transfer methodologies, and provide perspectives on future research directions to guide the development of high performance next-generation flexible electronics.
{"title":"Recent advances in the transfer of functional oxide thin films: A review","authors":"Sanghun Kim , Yeomin Yoon , Dong Hun Kim","doi":"10.1016/j.mser.2026.101186","DOIUrl":"10.1016/j.mser.2026.101186","url":null,"abstract":"<div><div>Thin films used in advanced flexible devices must not only exhibit mechanical flexibility but also maintain stability against moisture and high temperatures while retaining their functional properties. This review focuses on the recent progress in replacing conventional organic-based flexible devices with high-performance inorganic thin-film devices fabricated via high-temperature deposition. As most flexible substrates cannot withstand the high temperatures required for the direct deposition of epitaxial or highly crystallized films, alternative strategies, such as the use of chemically etchable sacrificial layers or physically separable two-dimensional materials, have been developed to enable high-quality thin-film transfer onto flexible substrates. In this review, we systematically summarize the types of sacrificial and two-dimensional layers applied in transfer methods that have been explored to date, including both chemical and physical approaches. This review also highlights the functional properties of the transferred inorganic thin films, including their stability, ferromagnetism, ferroelectricity, multiferroicity, and optical and electrical characteristics, and discusses their potential for novel device applications. Finally, we address the current limitations of sacrificial and two-dimensional layer selection and transfer methodologies, and provide perspectives on future research directions to guide the development of high performance next-generation flexible electronics.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101186"},"PeriodicalIF":31.6,"publicationDate":"2026-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146073677","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-24DOI: 10.1016/j.mser.2026.101189
Jichang Sun , Ruixiang Wang , Pengyu Meng , Liansheng Li , Jin-Zhi Guo , Qinghua Liang , Xing-Long Wu
All-solid-state fluoride-ion batteries (ASSFIBs) are regarded as highly promising candidates for next-generation energy storage beyond lithium-based systems due to their exceptional theoretical energy density (>5000 Wh kg–1) and intrinsic safety. Nevertheless, the practical deployment of ASSFIBs is hindered by the lack of high-performance fluoride-ion solid-state electrolytes (FISSEs). Recently, rare earth (RE) elements have attracted considerable interest for advancing high-performance FISSEs by leveraging their unique physicochemical properties. To provide a timely overview of progress in this rapidly evolving field, this review examines the critical functions of RE elements in state-of-the-art FISSEs, covering both typical Tysonite-type FISSEs (e.g., LaF3, CeF3) and RE-doped systems (e.g., Ba1–xEuxSnF4+x and Ce1–yThyF3+y). We begin by outlining the operational mechanism of ASSFIBs, categorizing the main types of FISSEs, and evaluating their respective advantages and limitations. We then highlight recent advances in performance optimization and battery applications of RE-enhanced FISSEs. Finally, we proposed the potential future research directions for RE-containing FISSEs. Through the precision design of RE-based FISSEs and their rational pairing with electrode materials, high Coulombic efficiency and environmental friendliness can be achieved. Consequently, ASSFIBs are expected to become the next-generation energy storage technology for widespread use in electric transportation and grid-scale renewable energy storage.
{"title":"The critical role of rare-earth elements in solid-state electrolytes for all-solid-state fluoride-ion batteries","authors":"Jichang Sun , Ruixiang Wang , Pengyu Meng , Liansheng Li , Jin-Zhi Guo , Qinghua Liang , Xing-Long Wu","doi":"10.1016/j.mser.2026.101189","DOIUrl":"10.1016/j.mser.2026.101189","url":null,"abstract":"<div><div>All-solid-state fluoride-ion batteries (ASSFIBs) are regarded as highly promising candidates for next-generation energy storage beyond lithium-based systems due to their exceptional theoretical energy density (>5000 Wh kg<sup>–</sup><sup>1</sup>) and intrinsic safety. Nevertheless, the practical deployment of ASSFIBs is hindered by the lack of high-performance fluoride-ion solid-state electrolytes (FISSEs). Recently, rare earth (RE) elements have attracted considerable interest for advancing high-performance FISSEs by leveraging their unique physicochemical properties. To provide a timely overview of progress in this rapidly evolving field, this review examines the critical functions of RE elements in state-of-the-art FISSEs, covering both typical Tysonite-type FISSEs (e.g., LaF<sub>3</sub>, CeF<sub>3</sub>) and RE-doped systems (e.g., Ba<sub>1</sub><sub>–</sub><sub><em>x</em></sub>Eu<sub><em>x</em></sub>SnF<sub>4+<em>x</em></sub> and Ce<sub>1</sub><sub>–</sub><sub><em>y</em></sub>Th<sub><em>y</em></sub>F<sub>3+<em>y</em></sub>). We begin by outlining the operational mechanism of ASSFIBs, categorizing the main types of FISSEs, and evaluating their respective advantages and limitations. We then highlight recent advances in performance optimization and battery applications of RE-enhanced FISSEs. Finally, we proposed the potential future research directions for RE-containing FISSEs. Through the precision design of RE-based FISSEs and their rational pairing with electrode materials, high Coulombic efficiency and environmental friendliness can be achieved. Consequently, ASSFIBs are expected to become the next-generation energy storage technology for widespread use in electric transportation and grid-scale renewable energy storage.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101189"},"PeriodicalIF":31.6,"publicationDate":"2026-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146023760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Hydrocephalus is one of the most common brain disorders and remains an incurable condition throughout life. The existing gold standard treatment method for hydrocephalus includes surgical cerebrospinal fluid shunting with the help of “one-size-fits-all” catheters. Although this method is very efficient, following their insertion, catheters are subjected to various complications, including flow resistance, blockage, mechanical malfunctions, and being subjected to host-immune response as well as microbial infection. To overcome these complications, we proposed implementing three-dimensional (3D) printing technology to develop the next generation of catheters with improved functionality and liquid flowability. Our suggested technology is based on imaging data on the final destination site (via computed tomography scan or magnetic resonance imaging) in such a way that it fits the needs of the body in a personalized manner. Herein we report for the first time, digital light processing (DLP) 3D printing of helical-shaped, flexible catheters using commercially available KeySplint soft resin. These catheters offer fully customizable features such as diameter, the number and placement of drainage holes tailored to individual patient needs. In vitro stability study of the 3D printed KeySplint samples suggested that the 3D printed catheters may remain structurally stable under physiological conditions for atleast 3240 hrs (135 days). Moreover, to further enhance catheter’s functionality, a pH-responsive smart surface chemistry was introduced on the catheter surface using two strategies (via plasma coating and by simply mixing with 3D printing resin) that can respond dynamically to tackle two critical challenges related to catheters: blockage of the catheters by undesired proteins, choroid plexus, blood clots and infection/biofilm prevention via chemical intramolecular rearrangement in the functional moieties of the coating. Both CB-OH coated and 5 % CB-OH mixed 3D printed catheters significantly inhibited bacterial biofilm formation at 24, 48, and 72 hrs compared to pristine catheters. On top of that, the CB-OH coated 3D printed helical catheters showed a 37-folds reduction in particles deposition per unit volume relative to conventional 3D printed linear catheters. These results suggest that the proposed surface-functionalized 3D printed personalized catheters could provide a promising solution for medical implants treating hydrocephalus.
{"title":"3D printing of personalized catheters with smart pH-responsive coating for improved functionality, cytocompatibility, and anti-bacterial characteristics","authors":"Eid Nassar-Marjiya , Krishanu Ghosal , Nagham Rashed , Amani Jahjaa , Nagham Moallem Safuri , Merna Shaheen-Mualim , Bassma Khamaisi , Simran Jindal , Majd Bisharat , Konda Reddy Kunduru , Lama Mattar , Tirosh Mekler , Maria Khoury , Netanel Korin , Boaz Mizrahi , Shady Farah","doi":"10.1016/j.mser.2025.101047","DOIUrl":"10.1016/j.mser.2025.101047","url":null,"abstract":"<div><div>Hydrocephalus is one of the most common brain disorders and remains an incurable condition throughout life. The existing gold standard treatment method for hydrocephalus includes surgical cerebrospinal fluid shunting with the help of “one-size-fits-all” catheters. Although this method is very efficient, following their insertion, catheters are subjected to various complications, including flow resistance, blockage, mechanical malfunctions, and being subjected to host-immune response as well as microbial infection. To overcome these complications, we proposed implementing three-dimensional (3D) printing technology to develop the next generation of catheters with improved functionality and liquid flowability. Our suggested technology is based on imaging data on the final destination site (via computed tomography scan or magnetic resonance imaging) in such a way that it fits the needs of the body in a personalized manner. Herein we report for the first time, digital light processing (DLP) 3D printing of helical-shaped, flexible catheters using commercially available KeySplint soft resin. These catheters offer fully customizable features such as diameter, the number and placement of drainage holes tailored to individual patient needs. <em>In vitro</em> stability study of the 3D printed KeySplint samples suggested that the 3D printed catheters may remain structurally stable under physiological conditions for atleast 3240 hrs (135 days). Moreover, to further enhance catheter’s functionality, a pH-responsive smart surface chemistry was introduced on the catheter surface using two strategies (via plasma coating and by simply mixing with 3D printing resin) that can respond dynamically to tackle two critical challenges related to catheters: blockage of the catheters by undesired proteins, choroid plexus, blood clots and infection/biofilm prevention via chemical intramolecular rearrangement in the functional moieties of the coating. Both CB-OH coated and 5 % CB-OH mixed 3D printed catheters significantly inhibited bacterial biofilm formation at 24, 48, and 72 hrs compared to pristine catheters. On top of that, the CB-OH coated 3D printed helical catheters showed a 37-folds reduction in particles deposition per unit volume relative to conventional 3D printed linear catheters. These results suggest that the proposed surface-functionalized 3D printed personalized catheters could provide a promising solution for medical implants treating hydrocephalus.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101047"},"PeriodicalIF":31.6,"publicationDate":"2026-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146023761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-21DOI: 10.1016/j.mser.2026.101191
Jianbin Zhan , Yang Li , Zixu Guo , Ruijing Ma , Shengqian Wang , Xinsheng Yang , Asker Jarlöv , Huajun Cao , Feng Lin , Yilun Xu , Kun Li , Yong-Wei Zhang , Kun Zhou
In elastocaloric (eC) refrigeration, conventionally fabricated NiTi alloys require complex deformation processing such as forging and rolling to achieve desired properties, compromising the intricate geometries for industrial applications. To overcome this limitation, we develop a four-dimensional-printed NiTi alloy with encoded (4D-ped) microstructures, fabricated in a near-net-shape manner. Benefiting from the multi-scale microstructures including tailored grain size and fraction of Ni4Ti3 nanoparticles, this alloy evades the trade-off between cooling capacity and energy efficiency. The novel architecture enables a stage-wise phase transformation (PT) mechanism, leading to a quasi-linear mechanical response. This unique architecture triggers a novel eC mechanism other than conventional AM NiTi: the superior properties arise not only from the reduced transformation energy barrier enabled by R-phase nanodomain formation due to fine Ni4Ti3 nanoparticles in coarse grains, but also from the enhanced yield strength induced by dense Ni4Ti3 precipitation in fine-grained domains, which promotes a stable stress-induced PT and enables effective latent heat absorption. As a result, the 4D-ped NiTi achieves a temperature drop of ∼15 K and a material coefficient of performance of 36.5, delivering superior eC performance compared with existing AM alloys. These findings advance the fabrication of high-performance eC structures with intricate geometries through 4D printing.
{"title":"A 4D-printed NiTi alloy with encoded microstructures evades the cooling capacity–energy efficiency trade-off in elastocaloric refrigeration","authors":"Jianbin Zhan , Yang Li , Zixu Guo , Ruijing Ma , Shengqian Wang , Xinsheng Yang , Asker Jarlöv , Huajun Cao , Feng Lin , Yilun Xu , Kun Li , Yong-Wei Zhang , Kun Zhou","doi":"10.1016/j.mser.2026.101191","DOIUrl":"10.1016/j.mser.2026.101191","url":null,"abstract":"<div><div>In elastocaloric (eC) refrigeration, conventionally fabricated NiTi alloys require complex deformation processing such as forging and rolling to achieve desired properties, compromising the intricate geometries for industrial applications. To overcome this limitation, we develop a four-dimensional-printed NiTi alloy with encoded (4D-ped) microstructures, fabricated in a near-net-shape manner. Benefiting from the multi-scale microstructures including tailored grain size and fraction of Ni<sub>4</sub>Ti<sub>3</sub> nanoparticles, this alloy evades the trade-off between cooling capacity and energy efficiency. The novel architecture enables a stage-wise phase transformation (PT) mechanism, leading to a quasi-linear mechanical response. This unique architecture triggers a novel eC mechanism other than conventional AM NiTi: the superior properties arise not only from the reduced transformation energy barrier enabled by R-phase nanodomain formation due to fine Ni<sub>4</sub>Ti<sub>3</sub> nanoparticles in coarse grains, but also from the enhanced yield strength induced by dense Ni<sub>4</sub>Ti<sub>3</sub> precipitation in fine-grained domains, which promotes a stable stress-induced PT and enables effective latent heat absorption. As a result, the 4D-ped NiTi achieves a temperature drop of ∼15 K and a material coefficient of performance of 36.5, delivering superior eC performance compared with existing AM alloys. These findings advance the fabrication of high-performance eC structures with intricate geometries through 4D printing.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101191"},"PeriodicalIF":31.6,"publicationDate":"2026-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146023703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Gate-all-around (GAA) transistors and memristors are two key electronic components for the semiconductor industry, as they can enable high-performance computation and memory. State-of-the-art devices contain a 700–100,000 nm2 insulating thin film exposed to electrical fields, and understanding its progressive degradation and breakdown is essential to build reliable devices. Investigations in this direction must fabricate test structures and/or devices of similar sizes, otherwise the conclusions extracted are not applicable. Many research groups use electron beam lithography, but this technique introduces polymer residues and leads to low fabrication yields due to the complex lift-off process. Some groups use conductive Atomic Force Microscopy (CAFM), which employs an ultra-sharp conductive tip to analyse the properties of a material at small areas ranging from 1 to 600 nm2. However, the currents registered by CAFM strongly depend on three parameters that are difficult to control: the radius of the probe tips, the spring constant of the cantilever, and the relative humidity of the environment. Therefore, a major problem of CAFM is reproducibility. Moreover, the minimum current densities that standard CAFM can detect range from 0.16 to 100 A/cm2, but that is insufficient to study gate dielectrics for low power applications (that requires analysing values below 0.01 A/cm2). Here we present nanodot CAFM, a measuring protocol that consists of placing the probe tip of a CAFM on metallic nanodots patterned on the surface of the material under test. These structures cover areas between 700 and 10,000 nm2, and they can be easily deposited on any arbitrary sample using a standard evaporator and a cheap aluminium anodic oxide template as shadow mask. Our experiments demonstrate that this setup is insensitive to relative humidity changes from 55 % to 4 %, deflection setpoint changes from −0.5 to 1 V, spring constant changes from 0.8 to 18 N/m, and tip radius changes from 2 to 200 nm, leading to a very high reproducibility. Moreover, this setup allows analysing current densities below 10−2 A/cm2, which extends its range of use. Our approach can help the community to make industry-relevant studies with a high throughput without having to undergo expensive, slow, and low-yield nanofabrication processes (such as electron beam lithography or multi project wafer tape outs).
{"title":"Nanodot conductive atomic force microscopy","authors":"Osamah Alharbi , Yue Yuan , Wenwen Zheng , Yue Ping , Sebastian Pazos , Husam Alshareef , Kaichen Zhu , Mario Lanza","doi":"10.1016/j.mser.2026.101187","DOIUrl":"10.1016/j.mser.2026.101187","url":null,"abstract":"<div><div>Gate-all-around (GAA) transistors and memristors are two key electronic components for the semiconductor industry, as they can enable high-performance computation and memory. State-of-the-art devices contain a 700–100,000 nm<sup>2</sup> insulating thin film exposed to electrical fields, and understanding its progressive degradation and breakdown is essential to build reliable devices. Investigations in this direction must fabricate test structures and/or devices of similar sizes, otherwise the conclusions extracted are not applicable. Many research groups use electron beam lithography, but this technique introduces polymer residues and leads to low fabrication yields due to the complex lift-off process. Some groups use conductive Atomic Force Microscopy (CAFM), which employs an ultra-sharp conductive tip to analyse the properties of a material at small areas ranging from 1 to 600 nm<sup>2</sup>. However, the currents registered by CAFM strongly depend on three parameters that are difficult to control: the radius of the probe tips, the spring constant of the cantilever, and the relative humidity of the environment. Therefore, a major problem of CAFM is reproducibility. Moreover, the minimum current densities that standard CAFM can detect range from 0.16 to 100 A/cm<sup>2</sup>, but that is insufficient to study gate dielectrics for low power applications (that requires analysing values below 0.01 A/cm<sup>2</sup>). Here we present nanodot CAFM, a measuring protocol that consists of placing the probe tip of a CAFM on metallic nanodots patterned on the surface of the material under test. These structures cover areas between 700 and 10,000 nm<sup>2</sup>, and they can be easily deposited on any arbitrary sample using a standard evaporator and a cheap aluminium anodic oxide template as shadow mask. Our experiments demonstrate that this setup is insensitive to relative humidity changes from 55 % to 4 %, deflection setpoint changes from −0.5 to 1 V, spring constant changes from 0.8 to 18 N/m, and tip radius changes from 2 to 200 nm, leading to a very high reproducibility. Moreover, this setup allows analysing current densities below 10<sup>−2</sup> A/cm<sup>2</sup>, which extends its range of use. Our approach can help the community to make industry-relevant studies with a high throughput without having to undergo expensive, slow, and low-yield nanofabrication processes (such as electron beam lithography or multi project wafer tape outs).</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101187"},"PeriodicalIF":31.6,"publicationDate":"2026-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146023704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-19DOI: 10.1016/j.mser.2026.101190
Joo-Won Lee , Sung-Chul Kim , Sichi Li , Cheol-Hui Ryu , Sungju Jun , Taehun Im , Liwen F. Wan , Min-Seok Kim , So-Hye Cho , Gwang-Hee Lee , Sohee Jeong
Two-dimensional metallic transition metal dichalcogenides offer high electrical conductivity and large surface areas for electrocatalysis, yet their inherent basal planes are catalytically inert. Here, we present an atomic-scale vacancy engineering strategy to activate the basal surfaces of metallic WSe2 for reversible oxygen electrocatalysis. This approach, based on intentionally designed substitutional metal doping, promotes the spontaneous formation of selenium vacancies while preserving the metallic 1 T′ phase, thereby creating highly reactive and oxygen-affinitive sites. Density functional theory calculations reveal that these vacancy-mediated metal complexes dramatically lower the energy barriers for initial oxygen adsorption, enabling dissociative oxygen adsorption. Operando and ex-situ spectroscopic analyses confirm that vacancy-mediated metal complexes transform into dynamic Se/W-oxide intermediates under operating conditions. Se/W-oxides on the surface experimentally and theoretically prove electrocatalytic activity and reversibility. Applying this strategy in lithium–oxygen batteries, the basal-plane activated WSe2 shows high discharge capacities (9868 mA h g−1, corresponding to 3947 mA h ), impressive cycle retention over 550 cycles at 1000 mA h g−1, and outstanding rate–capability over a wide current–density range (100–3000 mA g−1) during 256 cycles.
二维金属过渡金属二硫化物具有高导电性和大的电催化表面积，但其固有基面具有催化惰性。在这里，我们提出了一个原子尺度的空位工程策略来激活金属WSe2的基表面进行可逆氧电催化。这种方法基于有意设计的取代金属掺杂，促进了硒空位的自发形成，同时保留了金属1 T '相，从而产生了高活性和氧亲和位点。密度泛函理论计算表明，这些空位介导的金属配合物显著降低了初始氧吸附的能垒，使解离氧吸附成为可能。Operando和非原位光谱分析证实，在操作条件下，空位介导的金属配合物转变为动态Se/ w -氧化物中间体。从实验和理论上证明了表面Se/ w氧化物的电催化活性和可逆性。将此策略应用于锂氧电池，基底面活化的WSe2显示出高放电容量（9868 mA h g−1，对应于3947 mA h阴极−1），在1000 mA h g−1下超过550次的令人印象深刻的循环保持，以及在256次循环中在宽电流密度范围（100-3000 mA g−1）内出色的倍率能力。
{"title":"Atomic-scale vacancy engineering unlocks basal-plane catalytic activity in metallic WSe2 for reversible oxygen electrocatalysis","authors":"Joo-Won Lee , Sung-Chul Kim , Sichi Li , Cheol-Hui Ryu , Sungju Jun , Taehun Im , Liwen F. Wan , Min-Seok Kim , So-Hye Cho , Gwang-Hee Lee , Sohee Jeong","doi":"10.1016/j.mser.2026.101190","DOIUrl":"10.1016/j.mser.2026.101190","url":null,"abstract":"<div><div>Two-dimensional metallic transition metal dichalcogenides offer high electrical conductivity and large surface areas for electrocatalysis, yet their inherent basal planes are catalytically inert. Here, we present an atomic-scale vacancy engineering strategy to activate the basal surfaces of metallic WSe<sub>2</sub> for reversible oxygen electrocatalysis. This approach, based on intentionally designed substitutional metal doping, promotes the spontaneous formation of selenium vacancies while preserving the metallic 1 T′ phase, thereby creating highly reactive and oxygen-affinitive sites. Density functional theory calculations reveal that these vacancy-mediated metal complexes dramatically lower the energy barriers for initial oxygen adsorption, enabling dissociative oxygen adsorption. <em>Operando</em> and <em>ex-situ</em> spectroscopic analyses confirm that vacancy-mediated metal complexes transform into dynamic Se/W-oxide intermediates under operating conditions. Se/W-oxides on the surface experimentally and theoretically prove electrocatalytic activity and reversibility. Applying this strategy in lithium–oxygen batteries, the basal-plane activated WSe<sub>2</sub> shows high discharge capacities (9868 mA h g<sup>−1</sup>, corresponding to 3947 mA h <span><math><msubsup><mrow><mi>g</mi></mrow><mrow><mi>cathode</mi></mrow><mrow><mo>−</mo><mn>1</mn></mrow></msubsup></math></span>), impressive cycle retention over 550 cycles at 1000 mA h g<sup>−1</sup>, and outstanding rate–capability over a wide current–density range (100–3000 mA g<sup>−1</sup>) during 256 cycles.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101190"},"PeriodicalIF":31.6,"publicationDate":"2026-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146023705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-16DOI: 10.1016/j.mser.2026.101188
Zhijun Zhang , Chi Hu , Xuanyu Chen , Haohe Huang , Fuguang Ban , Xuhao Zhu , Chongxing Huang
Thermal insulation materials are indispensable for energy conservation, thermal management, and protection under diverse service conditions. In the context of carbon neutrality and sustainable development, biomass-based materials have emerged as attractive alternatives to petroleum-derived counterparts owing to their renewability, hierarchical porosity, and structural tunability. Nevertheless, their practical applications are hindered by inherent limitations such as thermal instability, moisture sensitivity, and insufficient multifunctionality. This review systematically summarizes recent advances in biomass-based thermal insulation materials, with a focus on raw material selection, structural design strategies, and performance optimization. Particular attention is given to emerging approaches that enable multifunctional integration—ranging from elasticity and thermal management to electromagnetic shielding and infrared stealth—through multiscale structural engineering and interfacial synergy. Finally, the opportunities and challenges associated with balancing thermal insulation, mechanical robustness, and multifunctional performance are highlighted, and future prospects are proposed for guiding the sustainable development of next-generation biomass-based thermal insulation materials.
{"title":"Biomass-based thermal insulation materials: Design strategies, multifunctional integration, and prospects","authors":"Zhijun Zhang , Chi Hu , Xuanyu Chen , Haohe Huang , Fuguang Ban , Xuhao Zhu , Chongxing Huang","doi":"10.1016/j.mser.2026.101188","DOIUrl":"10.1016/j.mser.2026.101188","url":null,"abstract":"<div><div>Thermal insulation materials are indispensable for energy conservation, thermal management, and protection under diverse service conditions. In the context of carbon neutrality and sustainable development, biomass-based materials have emerged as attractive alternatives to petroleum-derived counterparts owing to their renewability, hierarchical porosity, and structural tunability. Nevertheless, their practical applications are hindered by inherent limitations such as thermal instability, moisture sensitivity, and insufficient multifunctionality. This review systematically summarizes recent advances in biomass-based thermal insulation materials, with a focus on raw material selection, structural design strategies, and performance optimization. Particular attention is given to emerging approaches that enable multifunctional integration—ranging from elasticity and thermal management to electromagnetic shielding and infrared stealth—through multiscale structural engineering and interfacial synergy. Finally, the opportunities and challenges associated with balancing thermal insulation, mechanical robustness, and multifunctional performance are highlighted, and future prospects are proposed for guiding the sustainable development of next-generation biomass-based thermal insulation materials.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101188"},"PeriodicalIF":31.6,"publicationDate":"2026-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145974404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Additive manufacturing (AM) has revolutionized the production of complex, integrated, and lightweight hot-section components for aero-engines, gas turbines, and hypersonic vehicles. However, the limited variety of printable Ni-based superalloys and their performance limitations remain major obstacles. The development of high-performance, defect-free superalloys specifically designed for AM is essential for advancing this technology. This review summarizes recent progress in the compositional design of AM-oriented Ni-based superalloys. It examines experimental trial-and-error methods for reducing printing defects and enhancing alloy performance. The high-throughput experiments in accelerating alloy screening and design are also discussed. Furthermore, the integration of multiscale computational simulations with microstructural and property optimization is analyzed, underscoring the value of combined strategies. The workflow and methodologies for machine learning-assisted alloy design are elaborated, focusing on the achievement of defect-free, high-performance compositions and the establishment of integrated composition-microstructure-property relationships. Finally, the current challenges and future research directions in AM Ni-based superalloy design are critically evaluated, providing insights and guidance for the development of AM-specific superalloys.
{"title":"Compositional design of Ni-based superalloys for additive manufacturing: Progress and perspectives","authors":"Bingbing Yin , Wei Yong , Jiarui Zhu , Haoyu Ge , Shuaicheng Zhu , Yunwei Gui , Wenjing Zhang , Huadong Fu , Jianxin Xie","doi":"10.1016/j.mser.2026.101185","DOIUrl":"10.1016/j.mser.2026.101185","url":null,"abstract":"<div><div>Additive manufacturing (AM) has revolutionized the production of complex, integrated, and lightweight hot-section components for aero-engines, gas turbines, and hypersonic vehicles. However, the limited variety of printable Ni-based superalloys and their performance limitations remain major obstacles. The development of high-performance, defect-free superalloys specifically designed for AM is essential for advancing this technology. This review summarizes recent progress in the compositional design of AM-oriented Ni-based superalloys. It examines experimental trial-and-error methods for reducing printing defects and enhancing alloy performance. The high-throughput experiments in accelerating alloy screening and design are also discussed. Furthermore, the integration of multiscale computational simulations with microstructural and property optimization is analyzed, underscoring the value of combined strategies. The workflow and methodologies for machine learning-assisted alloy design are elaborated, focusing on the achievement of defect-free, high-performance compositions and the establishment of integrated composition-microstructure-property relationships. Finally, the current challenges and future research directions in AM Ni-based superalloy design are critically evaluated, providing insights and guidance for the development of AM-specific superalloys.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101185"},"PeriodicalIF":31.6,"publicationDate":"2026-01-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145974403","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-07DOI: 10.1016/j.mser.2026.101184
Sourabh B. Ghode , Chandrashekhar S. Patil , Jaydip K. Sawant , Jungmin Kim , Mahesh Y. Chougale , Muhammad Noman , Qazi Muhammad Saqib , Jinho Bae
Artificial intelligence (AI) is accelerating the evolution of the fourth industrial revolution, driving demand for high-performance and energy-efficient AI accelerators such as GPUs, TPUs, and NPUs. Among them, NPUs emulate neural systems and support low-power, human-like computing. However, as AI workloads intensify, conventional 2D memory-logic architectures face bottlenecks in data transfer, scalability, and integration density. This review focuses on emerging three-dimensional (3D) memristor-based neuromorphic architecture that enables in-memory computing by vertically integrating memristive layers, enhancing memory density, parallelism, and energy efficiency. We systematically examine material choices, including Hafnium(IV) Oxide (HfO2), Tantalum(V) Oxide (Ta2O5), and Titanium Dioxide (TiO2) fabrication techniques, and integration strategies that support scalable 3D stacking. Key challenges such as device variability, thermal constraints, and process compatibility are critically analyzed. We further highlight the role of 3D memristors in enabling next-generation NPUs capable of real-time, brain-like computation. This review provides insights into developing future neuromorphic systems with transformative impact on AI, edge computing, and intelligent autonomous platforms.
{"title":"3-dimensional multistate memristor structures based neuromorphic devices for high-density in-memory computing","authors":"Sourabh B. Ghode , Chandrashekhar S. Patil , Jaydip K. Sawant , Jungmin Kim , Mahesh Y. Chougale , Muhammad Noman , Qazi Muhammad Saqib , Jinho Bae","doi":"10.1016/j.mser.2026.101184","DOIUrl":"10.1016/j.mser.2026.101184","url":null,"abstract":"<div><div>Artificial intelligence (AI) is accelerating the evolution of the fourth industrial revolution, driving demand for high-performance and energy-efficient AI accelerators such as GPUs, TPUs, and NPUs. Among them, NPUs emulate neural systems and support low-power, human-like computing. However, as AI workloads intensify, conventional 2D memory-logic architectures face bottlenecks in data transfer, scalability, and integration density. This review focuses on emerging three-dimensional (3D) memristor-based neuromorphic architecture that enables in-memory computing by vertically integrating memristive layers, enhancing memory density, parallelism, and energy efficiency. We systematically examine material choices, including Hafnium(IV) Oxide <strong>(</strong>HfO<sub>2</sub>), Tantalum(V) Oxide <strong>(</strong>Ta<sub>2</sub>O<sub>5</sub>), and Titanium Dioxide (TiO<sub>2</sub>) fabrication techniques, and integration strategies that support scalable 3D stacking. Key challenges such as device variability, thermal constraints, and process compatibility are critically analyzed. We further highlight the role of 3D memristors in enabling next-generation NPUs capable of real-time, brain-like computation. This review provides insights into developing future neuromorphic systems with transformative impact on AI, edge computing, and intelligent autonomous platforms.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101184"},"PeriodicalIF":31.6,"publicationDate":"2026-01-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145923547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2026-01-06DOI: 10.1016/j.mser.2025.101175
Qionglei Hu , Yanan Liu , Ye Ding , Xiangqian Shi , Chen Chen , Shichao Guo , Jie Xu , Lishuang Fan , Lijun Yang
Zinc-based energy storage devices are considered promising candidates for next-generation high power density and sustainable electrochemical energy storage systems, owing to their intrinsic safety, environmental compatibility, and cost advantages. However, the practical application of zinc anodes remains hindered by challenges such as uncontrolled dendrite growth and interfacial side reactions, which significantly impede their commercialization. Conventional processing techniques, constrained by limited precision and flexibility, struggle to achieve precise control over the micro/nano-structure of zinc anodes as well as large-area, uniform fabrication. Following the research paradigm of structural regulation, performance optimization, scalable manufacturing, this review systematically summarizes recent advances in cross-scale precision machining technologies such as ultrafast laser processing for constructing micro/nano-structured zinc anodes, with a focus on the mechanisms behind the enhanced electrochemical performance and the potential for industrial application. Finally, addressing current research bottlenecks, we outline key future research directions and development pathways, including bio-inspired structural design, scalable fabrication processes, and multi-scenario applicability.
{"title":"Microstructural engineering of zinc anodes: Expediting the fabrication and industrial-scale deployment of high-performance batteries","authors":"Qionglei Hu , Yanan Liu , Ye Ding , Xiangqian Shi , Chen Chen , Shichao Guo , Jie Xu , Lishuang Fan , Lijun Yang","doi":"10.1016/j.mser.2025.101175","DOIUrl":"10.1016/j.mser.2025.101175","url":null,"abstract":"<div><div>Zinc-based energy storage devices are considered promising candidates for next-generation high power density and sustainable electrochemical energy storage systems, owing to their intrinsic safety, environmental compatibility, and cost advantages. However, the practical application of zinc anodes remains hindered by challenges such as uncontrolled dendrite growth and interfacial side reactions, which significantly impede their commercialization. Conventional processing techniques, constrained by limited precision and flexibility, struggle to achieve precise control over the micro/nano-structure of zinc anodes as well as large-area, uniform fabrication. Following the research paradigm of structural regulation, performance optimization, scalable manufacturing, this review systematically summarizes recent advances in cross-scale precision machining technologies such as ultrafast laser processing for constructing micro/nano-structured zinc anodes, with a focus on the mechanisms behind the enhanced electrochemical performance and the potential for industrial application. Finally, addressing current research bottlenecks, we outline key future research directions and development pathways, including bio-inspired structural design, scalable fabrication processes, and multi-scenario applicability.</div></div>","PeriodicalId":386,"journal":{"name":"Materials Science and Engineering: R: Reports","volume":"169 ","pages":"Article 101175"},"PeriodicalIF":31.6,"publicationDate":"2026-01-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145923546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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