Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707567
B. Xu, Xiangyin Zeng, Jiangqi He, Dong-ho Han
Causality check and enforcement is practically important to the performance evaluation for interconnects based on time domain simulation. In this paper one causality check method based on minimum-phase and all-pass decomposition is proposed. Compared with conventional time domain approach, uncertainties from Gibbs error are bypassed. In contrast with conventional frequency domain methods, this method does not require whole frequency band information put by the Hilbert transform process. The effectiveness of propose method is demonstrated through numerical examples, as well as measured s-parameters
{"title":"Checking causality of interconnects through minimum-phase and all-pass decomposition","authors":"B. Xu, Xiangyin Zeng, Jiangqi He, Dong-ho Han","doi":"10.1109/HDP.2006.1707567","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707567","url":null,"abstract":"Causality check and enforcement is practically important to the performance evaluation for interconnects based on time domain simulation. In this paper one causality check method based on minimum-phase and all-pass decomposition is proposed. Compared with conventional time domain approach, uncertainties from Gibbs error are bypassed. In contrast with conventional frequency domain methods, this method does not require whole frequency band information put by the Hilbert transform process. The effectiveness of propose method is demonstrated through numerical examples, as well as measured s-parameters","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"443 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114583536","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707617
C. Bailey
Today most of the IC and board designs are undertaken using two-dimensional graphics tools and rule checks. System-in-package is driving three-dimensional design concepts and this is posing a number of challenges for electronic design automation (EDA) software vendors. System-in-package requires three-dimensional EDA tools and design collaboration systems with appropriate manufacturing and assembly rules for these expanding technologies. Simulation and Analysis tools today focus on one aspect of the design requirement, for example, thermal, electrical or mechanical. System-in-Package requires analysis and simulation tools that can easily capture the complex three dimensional structures and provided integrated fast solutions to issues such as thermal management, reliability, electromagnetic interference, etc. This paper discusses some of the challenges faced by the design and analysis community in providing appropriate tools to engineers for System-in-Package design
{"title":"Design and modeling challenges for high density packaging","authors":"C. Bailey","doi":"10.1109/HDP.2006.1707617","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707617","url":null,"abstract":"Today most of the IC and board designs are undertaken using two-dimensional graphics tools and rule checks. System-in-package is driving three-dimensional design concepts and this is posing a number of challenges for electronic design automation (EDA) software vendors. System-in-package requires three-dimensional EDA tools and design collaboration systems with appropriate manufacturing and assembly rules for these expanding technologies. Simulation and Analysis tools today focus on one aspect of the design requirement, for example, thermal, electrical or mechanical. System-in-Package requires analysis and simulation tools that can easily capture the complex three dimensional structures and provided integrated fast solutions to issues such as thermal management, reliability, electromagnetic interference, etc. This paper discusses some of the challenges faced by the design and analysis community in providing appropriate tools to engineers for System-in-Package design","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122127025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707600
Bingting Hu, Jie-min Zhou, P. Zhou, Yingge Yang
A simplified BGA flip chip model was established based on Ansys software to investigate thermal stress in the solder joints. The thermal cycle dwell time, thermal cycle temperature range and the maximum dwell temperature were changed to observe their effects on the thermal fatigue life of solder joint; the length and thickness of substrate were also changed to research the dimension effect. The thermal cycle lives were calculated and compared according to two different modified Coffin-Manson equations. The results indicate that the thermal fatigue life decreases with enlarging the thermal cycle dwell time, the thermal cycle range and the maximum dwell temperature. The fatigue life also decreases as the length and thickness of substrate increase. The thermal cycle parameters can be used to accelerate the process of thermal cycle experiment. And the study of dimension effect on thermal fatigue life gave optimization of the package structure
{"title":"The effect of accelerated thermal cycle parameters and the geometry dimensions on solder joint reliability","authors":"Bingting Hu, Jie-min Zhou, P. Zhou, Yingge Yang","doi":"10.1109/HDP.2006.1707600","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707600","url":null,"abstract":"A simplified BGA flip chip model was established based on Ansys software to investigate thermal stress in the solder joints. The thermal cycle dwell time, thermal cycle temperature range and the maximum dwell temperature were changed to observe their effects on the thermal fatigue life of solder joint; the length and thickness of substrate were also changed to research the dimension effect. The thermal cycle lives were calculated and compared according to two different modified Coffin-Manson equations. The results indicate that the thermal fatigue life decreases with enlarging the thermal cycle dwell time, the thermal cycle range and the maximum dwell temperature. The fatigue life also decreases as the length and thickness of substrate increase. The thermal cycle parameters can be used to accelerate the process of thermal cycle experiment. And the study of dimension effect on thermal fatigue life gave optimization of the package structure","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123074385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707610
Yan Bohan, Wang Chunqing, Zhang Wei
In this work, two eutectic solders: 80Au20Sn and 52In48Sn were chosen for fiber bonding through laser soldering, and scanning electronic microscope (SEM) equipped with energy dispersive x-ray detector (EDX) was used to investigate the microstructures of at four interfaces between two solders and two metallizations: Au-Sn/(Au/Ti), Au-Sn/( Au/Ni), In-Sn/ (Au/Ti), In-Sn/(Au/Ni). Results show that as for the Au-Sn solder joint a large amount of zeta-phase was formed at the Au-Sn/(Au/Ti) interface with its morphology closely related with laser input energy; while at the Au-Sn/(Au/Ni) interface scallop-like (Au,Ni)Sn appeared with a low input energy and irregular-shaped (Au,Ni) 3Sn2 emerged with a high input energy. As for the In-Sn solder, the IMCs at the In-Sn/ (Au/Ti) interface transformed from a Au(In,Sn)2 layer to isolated Auln2 cubes with the increase of input energy while at the In-Sn/(Au/Ni) interface a thin layer of Au(In,Sn)2 was formed. As the connecting layer, Ti did not react in the soldering process
本文选择80Au20Sn和52In48Sn两种共晶焊料进行激光焊接，并利用配备能量色散x射线探测器(EDX)的扫描电子显微镜(SEM)研究了两种焊料和Au- sn /(Au/Ti)、Au- sn /(Au/Ni)、In- sn /(Au/Ti)、In- sn /(Au/Ni)两种金属化层之间4个界面的微观结构。结果表明:对于Au- sn焊点，在Au- sn /(Au/Ti)界面处形成了大量的zeta相，其形貌与激光输入能量密切相关;在Au-Sn/(Au/Ni)界面处，以低输入能量出现扇贝状(Au,Ni)Sn，以高输入能量出现不规则形状(Au,Ni) 3Sn2。对于In-Sn钎料，随着输入能量的增加，In-Sn/(Au/ Ti)界面处的IMCs由Au(In,Sn)2层转变为孤立的aun2立方体，而In-Sn/(Au/Ni)界面处形成了一层薄薄的Au(In,Sn)2层。作为连接层的Ti在焊接过程中没有发生反应
{"title":"The microstructure of eutectic Au-Sn and In-Sn solders on Au/Ti and Au/Ni metallizations during laser solder bonding process for optical fiber alignment","authors":"Yan Bohan, Wang Chunqing, Zhang Wei","doi":"10.1109/HDP.2006.1707610","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707610","url":null,"abstract":"In this work, two eutectic solders: 80Au20Sn and 52In48Sn were chosen for fiber bonding through laser soldering, and scanning electronic microscope (SEM) equipped with energy dispersive x-ray detector (EDX) was used to investigate the microstructures of at four interfaces between two solders and two metallizations: Au-Sn/(Au/Ti), Au-Sn/( Au/Ni), In-Sn/ (Au/Ti), In-Sn/(Au/Ni). Results show that as for the Au-Sn solder joint a large amount of zeta-phase was formed at the Au-Sn/(Au/Ti) interface with its morphology closely related with laser input energy; while at the Au-Sn/(Au/Ni) interface scallop-like (Au,Ni)Sn appeared with a low input energy and irregular-shaped (Au,Ni) 3Sn2 emerged with a high input energy. As for the In-Sn solder, the IMCs at the In-Sn/ (Au/Ti) interface transformed from a Au(In,Sn)2 layer to isolated Auln2 cubes with the increase of input energy while at the In-Sn/(Au/Ni) interface a thin layer of Au(In,Sn)2 was formed. As the connecting layer, Ti did not react in the soldering process","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125082784","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707611
Qian Yong-biao, Sang Wen-bin, Xia Jun, Min Jiahua, T. Jianyong, L. Xiaoyan
CdZnTe gamma spectrometers with capacitive Frisch grid structure can potentially achieve a higher detecting resolution and their geometrical structures have an important role in optimizing the detector performance. In the paper, three geometrical structures of capacitive Frisch grid detectors were investigated by using Finite element method based on the 3-dimensional weighting potential and field distribution. Simulation results indicated the trapezoid prism model could get better detector performance, whose novel structure has not only a better weighting potential distribution but also a bigger detector volume than the cuboid models
{"title":"A novel structure for CdZnTe capacitive frisch grid radiation detector","authors":"Qian Yong-biao, Sang Wen-bin, Xia Jun, Min Jiahua, T. Jianyong, L. Xiaoyan","doi":"10.1109/HDP.2006.1707611","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707611","url":null,"abstract":"CdZnTe gamma spectrometers with capacitive Frisch grid structure can potentially achieve a higher detecting resolution and their geometrical structures have an important role in optimizing the detector performance. In the paper, three geometrical structures of capacitive Frisch grid detectors were investigated by using Finite element method based on the 3-dimensional weighting potential and field distribution. Simulation results indicated the trapezoid prism model could get better detector performance, whose novel structure has not only a better weighting potential distribution but also a bigger detector volume than the cuboid models","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124451686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707596
D. Lu, C. Wong
Lead-free and environmentally sound interconnect bonding processes are urgently needed. Among the possibilities are electrically conductive adhesives (ECAs) and lead-free solders (Codenhead, R. and DeCoursy, D., 1985). Compared to soldering technology, ECA technology can offer numerous advantages such as fewer processing steps which reduces processing cost, lower processing temperature which makes the use of heat-sensitive and low cost substrate possible, and fine pitch capability
{"title":"Overview of recent advances on isotropic conductive adhesives","authors":"D. Lu, C. Wong","doi":"10.1109/HDP.2006.1707596","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707596","url":null,"abstract":"Lead-free and environmentally sound interconnect bonding processes are urgently needed. Among the possibilities are electrically conductive adhesives (ECAs) and lead-free solders (Codenhead, R. and DeCoursy, D., 1985). Compared to soldering technology, ECA technology can offer numerous advantages such as fewer processing steps which reduces processing cost, lower processing temperature which makes the use of heat-sensitive and low cost substrate possible, and fine pitch capability","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116497356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707558
Chen Guanghua, Y. Jun, Li Junhai
Subband adaptive filtering reduces computational complexity and improves convergence performance. Here three kinds of subband adaptive filters (SAF) are investigated. The basic structure is simply composed of subbands decomposition and adaptive filters with low computation power. Based on the basic one, the second structure added by cross-filters is to eliminate subbands aliasing. The last one is an efficient method using polyphase decomposition and identities equations. Moreover, we analyse their advantages and defects on the computation complexity on echo cancelling and convergence performance on system identifying in virtue of MATLAB. The computer simulation results illustrate that compared to the fullband filter, SAF requires less computation power and possesses better convergence performance
{"title":"Analysis and application performance simulation of subband adaptive filtering structures","authors":"Chen Guanghua, Y. Jun, Li Junhai","doi":"10.1109/HDP.2006.1707558","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707558","url":null,"abstract":"Subband adaptive filtering reduces computational complexity and improves convergence performance. Here three kinds of subband adaptive filters (SAF) are investigated. The basic structure is simply composed of subbands decomposition and adaptive filters with low computation power. Based on the basic one, the second structure added by cross-filters is to eliminate subbands aliasing. The last one is an efficient method using polyphase decomposition and identities equations. Moreover, we analyse their advantages and defects on the computation complexity on echo cancelling and convergence performance on system identifying in virtue of MATLAB. The computer simulation results illustrate that compared to the fullband filter, SAF requires less computation power and possesses better convergence performance","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"728 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116614850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707561
Lirong Zheng, M. Nejad, S. Rodriguez, Lu Zhang, Cairong Chen, H. Tenhunen
In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, long-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draw energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented
{"title":"System-on-flexible-substrates: electronics for future smart-intelligent world","authors":"Lirong Zheng, M. Nejad, S. Rodriguez, Lu Zhang, Cairong Chen, H. Tenhunen","doi":"10.1109/HDP.2006.1707561","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707561","url":null,"abstract":"In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, long-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draw energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128353322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707589
S. Okamoto
Commercial aromatic liquid-crystalline polymers (LCP) are known to be unable to dissolve in any common organic solvents. Recently, we succeeded in the development of innovative solvent-casting type LCP by a design of the molecule structure. In addition to standard LCP film properties such as environmental compatibility, moisture resistance and heat resistance, the casting-type LCP film exhibits less anisotropy, high adhesion to copper foils and peculiar behavior of modulus of elasticity suitable for mounting IC chip. The solvent-casting type LCP has many advantages to be applied for the various electro devices
{"title":"Newly developed LCP solvent casting film and its applications","authors":"S. Okamoto","doi":"10.1109/HDP.2006.1707589","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707589","url":null,"abstract":"Commercial aromatic liquid-crystalline polymers (LCP) are known to be unable to dissolve in any common organic solvents. Recently, we succeeded in the development of innovative solvent-casting type LCP by a design of the molecule structure. In addition to standard LCP film properties such as environmental compatibility, moisture resistance and heat resistance, the casting-type LCP film exhibits less anisotropy, high adhesion to copper foils and peculiar behavior of modulus of elasticity suitable for mounting IC chip. The solvent-casting type LCP has many advantages to be applied for the various electro devices","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127021007","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707602
E. Monlevade, T. Reinikainen
A propagating crack can follow several different paths, depending mainly on the energy associated with the advancing crack tip. The crack can follow single phase boundaries (grain boundaries), interphase boundaries, or propagate across a continuous lattice. The Sn-Ag-Cu system, at the composition and temperature range common for solder alloys, would have as equilibrium phases nearly pure Sn, Cu6Sn5 and Ag3Sn. However, near the Cu terminals, the local equilibrium involves a much higher Cu content, which leads to the formation of Cu3Sn between the Cu pad and the Cu6Sn5 layer. Also, during aging, the formation of Kirkendall voids between the Cu pad and the Cu3Sn layer can occur. Each propagation path appears with a very specific look, and readily identifiable chemical composition. This paper focuses on providing some guideline on how to identify the relation between crack propagation paths and microstructure on Pb-free solder joints, and what are the visual and chemical characteristics that provide the basis for path identification
裂纹的扩展可以遵循几种不同的路径，这主要取决于与裂纹尖端推进相关的能量。裂纹可以沿单相边界(晶界)、相间边界或沿连续晶格扩展。Sn- ag - cu体系的平衡相为纯Sn、Cu6Sn5和Ag3Sn，其组成和温度范围与焊料合金相同。然而，在Cu末端附近，局部平衡涉及到更高的Cu含量，导致Cu衬垫和Cu6Sn5层之间形成Cu3Sn。在时效过程中，Cu衬垫与Cu3Sn层之间会形成Kirkendall空洞。每个传播路径都有一个非常特殊的外观，并且很容易识别化学成分。本文重点介绍了如何识别无铅焊点裂纹扩展路径与微观组织之间的关系，以及为路径识别提供依据的视觉特征和化学特征
{"title":"Fracture surface analysis of aged and drop tested Sn-Ag-Cu solder joints","authors":"E. Monlevade, T. Reinikainen","doi":"10.1109/HDP.2006.1707602","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707602","url":null,"abstract":"A propagating crack can follow several different paths, depending mainly on the energy associated with the advancing crack tip. The crack can follow single phase boundaries (grain boundaries), interphase boundaries, or propagate across a continuous lattice. The Sn-Ag-Cu system, at the composition and temperature range common for solder alloys, would have as equilibrium phases nearly pure Sn, Cu6Sn5 and Ag3Sn. However, near the Cu terminals, the local equilibrium involves a much higher Cu content, which leads to the formation of Cu3Sn between the Cu pad and the Cu6Sn5 layer. Also, during aging, the formation of Kirkendall voids between the Cu pad and the Cu3Sn layer can occur. Each propagation path appears with a very specific look, and readily identifiable chemical composition. This paper focuses on providing some guideline on how to identify the relation between crack propagation paths and microstructure on Pb-free solder joints, and what are the visual and chemical characteristics that provide the basis for path identification","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127683258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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