Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707580
Yifeng Fu, Jie-min Zhou, Yingge Yang
In this research, experiments are carried out to investigate the heat transfer between the swirling impinging jets and an iso-heat-flux simulant chip (a heated epoxy resin plate) by inserting twisted strips into round tubes. In some range of flow Reynolds number, the effects of nozzle-to-plate spacement, the geometries of the nozzle and the thread intervals of the twisted strips are examined, then the radial distribution of Nusselt numbers on the target plate are obtained, so are the Nusselt number correlations. Meanwhile, the heat transfer characteristics of the swirling jet in both the stagnation region and the wall jet region are interpreted. In order to verify its heat transfer effect, the swirling jet is compared to the ordinary straight one
{"title":"Experimental research on compulsive cooling of swirling jet impingement","authors":"Yifeng Fu, Jie-min Zhou, Yingge Yang","doi":"10.1109/HDP.2006.1707580","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707580","url":null,"abstract":"In this research, experiments are carried out to investigate the heat transfer between the swirling impinging jets and an iso-heat-flux simulant chip (a heated epoxy resin plate) by inserting twisted strips into round tubes. In some range of flow Reynolds number, the effects of nozzle-to-plate spacement, the geometries of the nozzle and the thread intervals of the twisted strips are examined, then the radial distribution of Nusselt numbers on the target plate are obtained, so are the Nusselt number correlations. Meanwhile, the heat transfer characteristics of the swirling jet in both the stagnation region and the wall jet region are interpreted. In order to verify its heat transfer effect, the swirling jet is compared to the ordinary straight one","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132544351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707599
M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma
The thermal conductivity of a practical isotropic conductive adhesive (ICA) comprising of an epoxy-based binder containing flake-shaped and spherical Ag particles has been studied. The specimens exhibit anisotropy in their thermal conductivities. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are fully cured. Analysis using the Wiedemann-Franz rule indicates that their thermal conductivities increase with increasing contribution from electrical conduction. Curing and annealing conditions that induce a large shrinkage of the adhesive binder lead to decreased electrical resistivity and increased thermal conductivity, because the contacts between the filler particles are enhanced, therefore causing a decrease any interfacial resistances. In order to analyze the thermal conductivity of advanced conductive adhesives, a novel analytical method that includes a reasonable definition of the state of the percolation networks that are formed by the filler particles needs to be developed
{"title":"Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder","authors":"M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma","doi":"10.1109/HDP.2006.1707599","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707599","url":null,"abstract":"The thermal conductivity of a practical isotropic conductive adhesive (ICA) comprising of an epoxy-based binder containing flake-shaped and spherical Ag particles has been studied. The specimens exhibit anisotropy in their thermal conductivities. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are fully cured. Analysis using the Wiedemann-Franz rule indicates that their thermal conductivities increase with increasing contribution from electrical conduction. Curing and annealing conditions that induce a large shrinkage of the adhesive binder lead to decreased electrical resistivity and increased thermal conductivity, because the contacts between the filler particles are enhanced, therefore causing a decrease any interfacial resistances. In order to analyze the thermal conductivity of advanced conductive adhesives, a novel analytical method that includes a reasonable definition of the state of the percolation networks that are formed by the filler particles needs to be developed","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134582128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707568
Lei Han, J. Zhong
Energy for deformation, metamorphism and interconnection of metals, is mainly from high frequency pressure/shear loads via a PZT transducer assembly. Dynamical characteristics of PZT actuated transducer assembly are the key to reliable fine pitch bonding and basic understanding of metal interconnection. By using high frequency recording electronics devices and a powerful Polytec laser Doppler vibrometer, a systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer main body and tool, may be explained by nonlinear features of PZT transducer assembly on its bonding targets. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them from experimental data
{"title":"Nonlinear behaviors of transducer dynamics for thermosonic bonding","authors":"Lei Han, J. Zhong","doi":"10.1109/HDP.2006.1707568","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707568","url":null,"abstract":"Energy for deformation, metamorphism and interconnection of metals, is mainly from high frequency pressure/shear loads via a PZT transducer assembly. Dynamical characteristics of PZT actuated transducer assembly are the key to reliable fine pitch bonding and basic understanding of metal interconnection. By using high frequency recording electronics devices and a powerful Polytec laser Doppler vibrometer, a systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer main body and tool, may be explained by nonlinear features of PZT transducer assembly on its bonding targets. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them from experimental data","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"447 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133501140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707554
XuMei-hua, Chen Zhang-jin, Ran Feng, Cheng Yu-lan
A discrete wavelet packet transform hardware design based on frame-partitioned architecture is presented in this paper. In the design of the processor, a kind of optimization technique of memory-the same address operation is proposed, which can decrease the size of the memory and raise the hardware utility efficiency. A two-buffer structure memory system is evolved to meet the real time request of the outside system, and the adoption of four-stage pipeline increases the real time data processing ability of the system. It is successfully synthesized and simulated with EDA tools and implemented in FPGA of Alter's EP20K200E. It is demonstrated that this kind of wavelet packet transform architecture can carry out the design objectives of real time, universal, parameterized and one-chip feasible
{"title":"Architecture research and VLSI implementation for discrete wavelet packet transform","authors":"XuMei-hua, Chen Zhang-jin, Ran Feng, Cheng Yu-lan","doi":"10.1109/HDP.2006.1707554","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707554","url":null,"abstract":"A discrete wavelet packet transform hardware design based on frame-partitioned architecture is presented in this paper. In the design of the processor, a kind of optimization technique of memory-the same address operation is proposed, which can decrease the size of the memory and raise the hardware utility efficiency. A two-buffer structure memory system is evolved to meet the real time request of the outside system, and the adoption of four-stage pipeline increases the real time data processing ability of the system. It is successfully synthesized and simulated with EDA tools and implemented in FPGA of Alter's EP20K200E. It is demonstrated that this kind of wavelet packet transform architecture can carry out the design objectives of real time, universal, parameterized and one-chip feasible","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"200 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133903760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707571
Fuliang Wang, Junhui Li, Lei Han, J. Zhong
Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength
{"title":"Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern","authors":"Fuliang Wang, Junhui Li, Lei Han, J. Zhong","doi":"10.1109/HDP.2006.1707571","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707571","url":null,"abstract":"Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130107133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707607
B. Jiang, A. Xian
A new test method, called as cycling current pulse method, was developed to evaluate the trend of whisker growth, which the cycling current pulse was first applied for cyclical heating and cooling on the tin coating sample in order to accelerate the whisker growth. The loading current in samples was controlled by the device composed of alpha-simple applied controller and a constant current source, and the working current density varied from 5 times 104A/dm2 to 10 times 104A/dm2. It resulted in temperature of the samples varied from 40 degC to 75 degC, and both heating and cooling dwell time per cycle were 5 min, 0-2200 cycles (about 15 days) were carried out in present work. Tin whisker growth on surface finish is observed by SEM after different cycles; the results showed that the longest fluted whisker about 120 microns in length was observed after 2200 cycles current pulse test. As a comparison with the isothermal condition, there was a relative short incubation period in cycling current pulse test at current density 5 times 104A/dm2. However, at current density of 10 times 104A/dm2, whisker growth was slowdown, the reason is not clear now. Present work shows that the cycling current pulse method is effective to evaluate the trend of whisker growth
{"title":"Tin whisker growth under cycling current pulse","authors":"B. Jiang, A. Xian","doi":"10.1109/HDP.2006.1707607","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707607","url":null,"abstract":"A new test method, called as cycling current pulse method, was developed to evaluate the trend of whisker growth, which the cycling current pulse was first applied for cyclical heating and cooling on the tin coating sample in order to accelerate the whisker growth. The loading current in samples was controlled by the device composed of alpha-simple applied controller and a constant current source, and the working current density varied from 5 times 104A/dm2 to 10 times 104A/dm2. It resulted in temperature of the samples varied from 40 degC to 75 degC, and both heating and cooling dwell time per cycle were 5 min, 0-2200 cycles (about 15 days) were carried out in present work. Tin whisker growth on surface finish is observed by SEM after different cycles; the results showed that the longest fluted whisker about 120 microns in length was observed after 2200 cycles current pulse test. As a comparison with the isothermal condition, there was a relative short incubation period in cycling current pulse test at current density 5 times 104A/dm2. However, at current density of 10 times 104A/dm2, whisker growth was slowdown, the reason is not clear now. Present work shows that the cycling current pulse method is effective to evaluate the trend of whisker growth","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132700280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707566
Hu Yue-li, D. Qian
With the development of IC industry, system-on-chip becomes more and more complicated. Some big systems such as machine vision system require a great deal of operation, which could not be implemented well by only one processor. This paper presents an asymmetry architecture (1 master and 3 slaves) of multiprocessor SoC (MPSoC), and gives an example of its application on the machine vision system to illustrate the features, architecture and the design of this MPSoC. All the 4 processors are connected by the on-chip bus. They could be programmed and compiled separately in advance, and cooperate in the application system. The master is responsible for the control of the whole system, and it doesn't need to know the details of the algorithms, while the slave processors only take charge of different algorithms for certain applications. When the master requires one of these algorithms, it only needs to send a simple super-instruction through the on-chip bus to the related slave. Then the slave will complete that task independently. It is a better way to implement advanced system like machine vision system with classical processors. It will improve the performance/price ratio of the system greatly and it's very easy and convenient for application
{"title":"Design of an architecture for multiprocessor system-on-chip (MPSoC)","authors":"Hu Yue-li, D. Qian","doi":"10.1109/HDP.2006.1707566","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707566","url":null,"abstract":"With the development of IC industry, system-on-chip becomes more and more complicated. Some big systems such as machine vision system require a great deal of operation, which could not be implemented well by only one processor. This paper presents an asymmetry architecture (1 master and 3 slaves) of multiprocessor SoC (MPSoC), and gives an example of its application on the machine vision system to illustrate the features, architecture and the design of this MPSoC. All the 4 processors are connected by the on-chip bus. They could be programmed and compiled separately in advance, and cooperate in the application system. The master is responsible for the control of the whole system, and it doesn't need to know the details of the algorithms, while the slave processors only take charge of different algorithms for certain applications. When the master requires one of these algorithms, it only needs to send a simple super-instruction through the on-chip bus to the related slave. Then the slave will complete that task independently. It is a better way to implement advanced system like machine vision system with classical processors. It will improve the performance/price ratio of the system greatly and it's very easy and convenient for application","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115774840","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707592
M. Varadarajan, K. Lee, S. Bhattacharya, A. Bhattacharjee, L. Wan, R. Pucha, R. Tummala, S. Sitaraman
This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated. Embedded capacitors in this study are made with polymer/ceramic nanocomposite (BaTiO3) material to take advantage of low processing temperature of polymers and relatively high dielectric constant of ceramics and the values of these capacitors range from 50 pF to 1.5 nF with capacitance per area of approximately 1.5 nF/cm . Limited high frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards were carried out. Resistors used in this work have been of three types: 1) carbon ink based polymer thick film (PTF), 2) resistor foils with known sheet resistivities which are laminated to printed wiring board (PWB) during a sequential build-up (SBU) process and 3) thin-film resistor plating by electroless method. Realization of embedded resistors on conventional board-level high-loss epoxy (~0.015 at 1 GHz) and proposed low-loss BCB dielectric (~0.0008 at > 40 GHz) has been explored in this study. Ni-P and Ni-W-P alloys were plated using conventional electroless plating, and NiCr and NiCrAlSi foils were used for the foil transfer process. For the first time, benzocyclobutene (BCB) has been proposed as a board level dielectric for advanced system-on-package (SOP) module primarily due to its attractive low-loss (for RF application) and thin film (for high density wiring) properties
{"title":"Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process","authors":"M. Varadarajan, K. Lee, S. Bhattacharya, A. Bhattacharjee, L. Wan, R. Pucha, R. Tummala, S. Sitaraman","doi":"10.1109/HDP.2006.1707592","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707592","url":null,"abstract":"This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated. Embedded capacitors in this study are made with polymer/ceramic nanocomposite (BaTiO3) material to take advantage of low processing temperature of polymers and relatively high dielectric constant of ceramics and the values of these capacitors range from 50 pF to 1.5 nF with capacitance per area of approximately 1.5 nF/cm . Limited high frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards were carried out. Resistors used in this work have been of three types: 1) carbon ink based polymer thick film (PTF), 2) resistor foils with known sheet resistivities which are laminated to printed wiring board (PWB) during a sequential build-up (SBU) process and 3) thin-film resistor plating by electroless method. Realization of embedded resistors on conventional board-level high-loss epoxy (~0.015 at 1 GHz) and proposed low-loss BCB dielectric (~0.0008 at > 40 GHz) has been explored in this study. Ni-P and Ni-W-P alloys were plated using conventional electroless plating, and NiCr and NiCrAlSi foils were used for the foil transfer process. For the first time, benzocyclobutene (BCB) has been proposed as a board level dielectric for advanced system-on-package (SOP) module primarily due to its attractive low-loss (for RF application) and thin film (for high density wiring) properties","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116330718","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707560
Liang Liu, W. Zheng, Li Chen
A non-linear parameterized model of a sub-mini helicopter is created. By linearizing the non-linear model in hover, a linear attitude motion model about physical parameters is derived. At last, subspace method based on its discrete state space model is introduced to conduct linear system identification experiments. The simulation results show that the method used can quite correctly identify linear model of the sub-mini helicopter in hover, and the system's main structure parameters can also been obtained
{"title":"Modeling and identification of a sub-mini helicopter","authors":"Liang Liu, W. Zheng, Li Chen","doi":"10.1109/HDP.2006.1707560","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707560","url":null,"abstract":"A non-linear parameterized model of a sub-mini helicopter is created. By linearizing the non-linear model in hover, a linear attitude motion model about physical parameters is derived. At last, subspace method based on its discrete state space model is introduced to conduct linear system identification experiments. The simulation results show that the method used can quite correctly identify linear model of the sub-mini helicopter in hover, and the system's main structure parameters can also been obtained","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128111143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707597
An Bing, Chu Hua-bin, He Jing-qiang, Wang Jia, Hua Li, Wu Feng-shun, Wu Yi-ping
The most urgent issue on the way of popularizing the smart labels is cutting their cost. Various ways have been explored to approach this goal, but the cost of a smart label is still hanging around decades of cents. Attaching a RFID flip chip on a paper or plastic substrate is one of the most competitive technologies for low cost smart label manufacturing. Anisotropically conductive adhesive (ACA) and semiautomatic heat-sealing machine were developed to accomplish the smart label inlay assembly process by interconnecting the RFID flip chip on aluminum antenna/plastic substrate. Fast cure of ACA in seconds at low temperatures enables to speed up the assembly processing, as well as to utilize the low-cost temperature-sensitive substrate like PET. Advantages of this environmentally friendly process make it quite possible to be applied in a high speed roll-to-roll smart label line. Reliability assessment on the electric and mechanic properties demonstrated that the products exceeded the specification requirements
{"title":"Low cost smart labels assembled by anisotropically conductive adhesive","authors":"An Bing, Chu Hua-bin, He Jing-qiang, Wang Jia, Hua Li, Wu Feng-shun, Wu Yi-ping","doi":"10.1109/HDP.2006.1707597","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707597","url":null,"abstract":"The most urgent issue on the way of popularizing the smart labels is cutting their cost. Various ways have been explored to approach this goal, but the cost of a smart label is still hanging around decades of cents. Attaching a RFID flip chip on a paper or plastic substrate is one of the most competitive technologies for low cost smart label manufacturing. Anisotropically conductive adhesive (ACA) and semiautomatic heat-sealing machine were developed to accomplish the smart label inlay assembly process by interconnecting the RFID flip chip on aluminum antenna/plastic substrate. Fast cure of ACA in seconds at low temperatures enables to speed up the assembly processing, as well as to utilize the low-cost temperature-sensitive substrate like PET. Advantages of this environmentally friendly process make it quite possible to be applied in a high speed roll-to-roll smart label line. Reliability assessment on the electric and mechanic properties demonstrated that the products exceeded the specification requirements","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124272904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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