The reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different pads on print circuit boards (PCBs) was studied through thermal cycling. Three different pads were studied, i.e. bare pads, pads with solder masks and pads with micro-via. After assembly, (Au,Ni)Sn4 intermetallics (IMCs) formed both in the bulk solder and at the interfaces due to the immersion-Au finish on the board side. The (Au,Ni)Sn4 IMCs formed in the solder joints on the pads with micro-via were more abundant than those formed in the solder joints on the pads without micro-via. Results showed that the solder joints on the pads with a micro-via had poor reliability due to insufficient solder volume and the formation of large amounts of (Au,Ni)Sn4 IMCs. For the pads with micro-via, the main location of failure was at the (Au,Ni)Sn4/solder interface on the chip side, and for the solder joints on bare pads and pads with solder mask, the possible failure location was in the bulk solder
{"title":"Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads","authors":"Dezhi Li, Changqing Liu, P. Conway","doi":"10.1115/1.2837522","DOIUrl":"https://doi.org/10.1115/1.2837522","url":null,"abstract":"The reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different pads on print circuit boards (PCBs) was studied through thermal cycling. Three different pads were studied, i.e. bare pads, pads with solder masks and pads with micro-via. After assembly, (Au,Ni)Sn4 intermetallics (IMCs) formed both in the bulk solder and at the interfaces due to the immersion-Au finish on the board side. The (Au,Ni)Sn4 IMCs formed in the solder joints on the pads with micro-via were more abundant than those formed in the solder joints on the pads without micro-via. Results showed that the solder joints on the pads with a micro-via had poor reliability due to insufficient solder volume and the formation of large amounts of (Au,Ni)Sn4 IMCs. For the pads with micro-via, the main location of failure was at the (Au,Ni)Sn4/solder interface on the chip side, and for the solder joints on bare pads and pads with solder mask, the possible failure location was in the bulk solder","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"311 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122091547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707579
Long Zhili, Han Lei, Wu Yunxin, Zhong Jue
As one of the key bonding parameters for thermosonic flip chip bonding, bonding pressure plays an important role for the bonding process. Moreover, as the load of the ultrasonic transducer system, bonding pressure affects directly the process of ultrasonic propagation, so it will influence the bonding quality. In this paper, in the condition that the bonding pressure was tuned regularly, the impedance characteristics of ultrasonic transducer were measured by a impedance analyzer, and the ultrasonic energy was measured by a laser Doppler vibrometer, and the shear bonding strengths at different bonding pressure settings were attained. It is shown that when the bonding pressure increases, the resonance frequency and resistance of transducer will increase, while the conductance and ultrasonic energy will turn down, and a stable and satisfied bondability can be found at a moderate pressure window. The impedance model for ultrasonic transducer was created by an equivalent circuit, and used to analyze the experimental effect of bonding pressure on ultrasonic propagation for transducer
{"title":"Effect of bonding pressure on transducer ultrasonic propagation in thermosonic flip chip bonding","authors":"Long Zhili, Han Lei, Wu Yunxin, Zhong Jue","doi":"10.1109/HDP.2006.1707579","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707579","url":null,"abstract":"As one of the key bonding parameters for thermosonic flip chip bonding, bonding pressure plays an important role for the bonding process. Moreover, as the load of the ultrasonic transducer system, bonding pressure affects directly the process of ultrasonic propagation, so it will influence the bonding quality. In this paper, in the condition that the bonding pressure was tuned regularly, the impedance characteristics of ultrasonic transducer were measured by a impedance analyzer, and the ultrasonic energy was measured by a laser Doppler vibrometer, and the shear bonding strengths at different bonding pressure settings were attained. It is shown that when the bonding pressure increases, the resonance frequency and resistance of transducer will increase, while the conductance and ultrasonic energy will turn down, and a stable and satisfied bondability can be found at a moderate pressure window. The impedance model for ultrasonic transducer was created by an equivalent circuit, and used to analyze the experimental effect of bonding pressure on ultrasonic propagation for transducer","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"298 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128789873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707572
X. Zou, Z. Xiong, Yulin Wang, H. Ding
Due to fine pitch BGA chips, acquiring high quality joints without detrimental effects on other components of chip needs accurate alignment of the unit in packaging technique. We developed an integrated laser-soldering system which combines a computer vision. Based on the analysis of experimental data, we find that lens distortions and assembly angular errors of X-Y stage play a distinct role in introducing positioning errors. For the sake of satisfying positioning accuracy of end-effector and precision specification of packaging technique, an algorithm based on straight line method is built to abate distortions of image, and a compensation algorithm for calibrating positioning of the non-vertical X-Y positioning stage is also developed. Finally, experimental results and comparative data to evaluate the performance of these approaches are reported
{"title":"Laser soldering system calibration based on computer vision","authors":"X. Zou, Z. Xiong, Yulin Wang, H. Ding","doi":"10.1109/HDP.2006.1707572","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707572","url":null,"abstract":"Due to fine pitch BGA chips, acquiring high quality joints without detrimental effects on other components of chip needs accurate alignment of the unit in packaging technique. We developed an integrated laser-soldering system which combines a computer vision. Based on the analysis of experimental data, we find that lens distortions and assembly angular errors of X-Y stage play a distinct role in introducing positioning errors. For the sake of satisfying positioning accuracy of end-effector and precision specification of packaging technique, an algorithm based on straight line method is built to abate distortions of image, and a compensation algorithm for calibrating positioning of the non-vertical X-Y positioning stage is also developed. Finally, experimental results and comparative data to evaluate the performance of these approaches are reported","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126031559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707555
Hu Yue-li, Xiong Bing
This paper presents a method of designing an on-chip debug support module based on an 8051 architecture microcontroller. It is implemented by embedding a hardware debug module named on-chip debugger (OCD) into an 8-bit high performance microcontroller. Thus, this MCU can do such debugging work as setting hardware breakpoint, single stepping, monitoring and modifying the internal registers, internal or external memories of the CPU, etc. In the paper, the architecture and implementation of OCD has been presented, which is supported by the simulation results. According to the results, it is proved that the in circuit emulation and debugging aiming at the embedded systems are accomplishable with the help of this OCD module. Furthermore, it won't sacrifice the performance of the MCU
{"title":"Design of an embedded on-chip debug support module of a MCU","authors":"Hu Yue-li, Xiong Bing","doi":"10.1109/HDP.2006.1707555","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707555","url":null,"abstract":"This paper presents a method of designing an on-chip debug support module based on an 8051 architecture microcontroller. It is implemented by embedding a hardware debug module named on-chip debugger (OCD) into an 8-bit high performance microcontroller. Thus, this MCU can do such debugging work as setting hardware breakpoint, single stepping, monitoring and modifying the internal registers, internal or external memories of the CPU, etc. In the paper, the architecture and implementation of OCD has been presented, which is supported by the simulation results. According to the results, it is proved that the in circuit emulation and debugging aiming at the embedded systems are accomplishable with the help of this OCD module. Furthermore, it won't sacrifice the performance of the MCU","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127932880","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707577
Jing-yu Fan, Yan Zhang, Johan Liu
A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface
{"title":"On the heat transfer enhancement based on micro-scale air impinging jets with microstructure heat sink in electronics cooling","authors":"Jing-yu Fan, Yan Zhang, Johan Liu","doi":"10.1109/HDP.2006.1707577","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707577","url":null,"abstract":"A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"22 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132756835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707615
B. Zhang, V. Murugesan, N. Billstrom, P. Stenquist, Johan Liu
Increased packaging demands in wireless communications, and military electronics has led to the use of flip-chips for RF and microwave applications. For a reliable bonding of flip-chip interconnection, proper knowledge of bonding parameters and bonding ability to different substrates is important. This paper depicts a comparative analysis of flip-chip bonding of GaAs MMIC (monolithic microwave integrated circuit) to thick/thin film metallization on ceramic substrates (hereinafter thick-film and thin-film), and organic substrates using anisotropic conductive film (ACF), thermo-compression (TC) bonding methods with different bonding parameters. The results from the optimization study of the parameter settings for mechanical reliability of ACF and TC with different substrates are presented
{"title":"Analysis of mechanical strength for flip-chip bonding of GaAs MMIC","authors":"B. Zhang, V. Murugesan, N. Billstrom, P. Stenquist, Johan Liu","doi":"10.1109/HDP.2006.1707615","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707615","url":null,"abstract":"Increased packaging demands in wireless communications, and military electronics has led to the use of flip-chips for RF and microwave applications. For a reliable bonding of flip-chip interconnection, proper knowledge of bonding parameters and bonding ability to different substrates is important. This paper depicts a comparative analysis of flip-chip bonding of GaAs MMIC (monolithic microwave integrated circuit) to thick/thin film metallization on ceramic substrates (hereinafter thick-film and thin-film), and organic substrates using anisotropic conductive film (ACF), thermo-compression (TC) bonding methods with different bonding parameters. The results from the optimization study of the parameter settings for mechanical reliability of ACF and TC with different substrates are presented","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133363695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707578
Rongzhi Gao, Lei Han, J. Zhong
The bonding pressure is one of the most important factors to the bonding strength in ultrasonic wire bonding. The relations between bonding pressure and bonding strength of 0.3 mm Al wire were experimentally studied. The bonding pressure of the U3000 ultrasonic wedge bonder was calibrated; the influence on the voltage, current was studied. The result show that only moderate conditions of bonding pressure leads to the largest bonding strength
{"title":"Experimental studies on bonding pressure in wire bonding","authors":"Rongzhi Gao, Lei Han, J. Zhong","doi":"10.1109/HDP.2006.1707578","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707578","url":null,"abstract":"The bonding pressure is one of the most important factors to the bonding strength in ultrasonic wire bonding. The relations between bonding pressure and bonding strength of 0.3 mm Al wire were experimentally studied. The bonding pressure of the U3000 ultrasonic wedge bonder was calibrated; the influence on the voltage, current was studied. The result show that only moderate conditions of bonding pressure leads to the largest bonding strength","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122727876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707581
S. Lee, C. H. Lau, S. Chan, K. Ma, M. Ng, Y. W. Ng, K.H. Lee, J. Lo
Light emitting diodes (LEDs) have been widely used for a long period of time in various applications such as instrumentation signals, message displays, traffic signals, decoration and personal lighting. With the increase in power rating and the improvement in optical efficiency, LEDs have demonstrated high potential for general lighting applications. In recent years, people became interested in using high brightness LEDs (HB-LEDs) as light sources to replace conventional fluorescent light tubes and lamps. Industrial forecasting indicated that the luminous efficiency of HB-LEDs will be greatly improved in the near future. In addition to increasing luminous efficiency, HB-LEDs have other advantages such as ultra long life, relatively low power consumption, and no UV radiation. These superior properties give HB-LEDs an extra edge over conventional lighting sources. In this study, the coating process for generating white light from blue LEDs was investigated. Furthermore, a prototype of HB-LED array module was fabricated to demonstrate the feasibility of such a lighting device. The outcome of the present study shows that HB-LED array modules should have good potential to replace conventional fluorescent light tubes for indoor solid state lighting (SSL)
{"title":"Development and prototyping of a HB-LED array module for indoor solid state lighting","authors":"S. Lee, C. H. Lau, S. Chan, K. Ma, M. Ng, Y. W. Ng, K.H. Lee, J. Lo","doi":"10.1109/HDP.2006.1707581","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707581","url":null,"abstract":"Light emitting diodes (LEDs) have been widely used for a long period of time in various applications such as instrumentation signals, message displays, traffic signals, decoration and personal lighting. With the increase in power rating and the improvement in optical efficiency, LEDs have demonstrated high potential for general lighting applications. In recent years, people became interested in using high brightness LEDs (HB-LEDs) as light sources to replace conventional fluorescent light tubes and lamps. Industrial forecasting indicated that the luminous efficiency of HB-LEDs will be greatly improved in the near future. In addition to increasing luminous efficiency, HB-LEDs have other advantages such as ultra long life, relatively low power consumption, and no UV radiation. These superior properties give HB-LEDs an extra edge over conventional lighting sources. In this study, the coating process for generating white light from blue LEDs was investigated. Furthermore, a prototype of HB-LED array module was fabricated to demonstrate the feasibility of such a lighting device. The outcome of the present study shows that HB-LED array modules should have good potential to replace conventional fluorescent light tubes for indoor solid state lighting (SSL)","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125265322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707606
C. Andersson, P. Sun, Johan Liu
Solder joints of Sn-37Pb, Sn-3.5Ag, Sn-4.0Ag-0.5Cu and Sn-8Zn-3Bi (all compositions in wt%) were tested by means of isothermal low cycle mechanical fatigue at room temperature over a wide range of strain ranges (1%-10%). The eutectic Sn-37wt%Pb was used as a reference. Single lap shear samples with solder joints 0.45mm in height and 1.6mm in diameter were used. The testing was executed in a displacement-controlled mode, at three different amplitudes namely, 30, 40 and 50mum. The frequency used was 0.2Hz. The displacement waveform was triangular, due to its constant strain rate. The Coffin-Manson law was compared to the Morrow's energy model and both the energy density value and the plastic strain range values were calculated in different ways to analyse the uncertainty in the calculation methodology of fatigue life. According to the results, the solder alloy with the best isothermal fatigue properties is the ternary Sn-4.0Ag-0.5Ag. The Sn-3.5Ag-3Bi exhibited quite poor fatigue properties, worse than all the other alloys tested. Regarding the model used for fatigue life prediction, both methods gave consistent results
{"title":"Low cycle fatigue of Sn-based lead-free solder joints and the analysis of fatigue life prediction uncertainty","authors":"C. Andersson, P. Sun, Johan Liu","doi":"10.1109/HDP.2006.1707606","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707606","url":null,"abstract":"Solder joints of Sn-37Pb, Sn-3.5Ag, Sn-4.0Ag-0.5Cu and Sn-8Zn-3Bi (all compositions in wt%) were tested by means of isothermal low cycle mechanical fatigue at room temperature over a wide range of strain ranges (1%-10%). The eutectic Sn-37wt%Pb was used as a reference. Single lap shear samples with solder joints 0.45mm in height and 1.6mm in diameter were used. The testing was executed in a displacement-controlled mode, at three different amplitudes namely, 30, 40 and 50mum. The frequency used was 0.2Hz. The displacement waveform was triangular, due to its constant strain rate. The Coffin-Manson law was compared to the Morrow's energy model and both the energy density value and the plastic strain range values were calculated in different ways to analyse the uncertainty in the calculation methodology of fatigue life. According to the results, the solder alloy with the best isothermal fatigue properties is the ternary Sn-4.0Ag-0.5Ag. The Sn-3.5Ag-3Bi exhibited quite poor fatigue properties, worse than all the other alloys tested. Regarding the model used for fatigue life prediction, both methods gave consistent results","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124085919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-06-27DOI: 10.1109/HDP.2006.1707601
Chen Xiangyang, Zhou Dejian
The electronic packaging and assembly technology is developing to high-density, fine-pitch and micromation. At the same time, an ever increasing need has developed for a lead-free solder joint interconnection due to the restrictions on the use of lead, and the upward spiraling market demand of green products. As a result the reliability of solder joint has attracted a great deal of attention, especially the lead-free solder joint. In this study, the three-dimensional (3D) shape of bottom leaded plastic (BLP) solder joints are predicted by the surface evolver software tool based on the minimum energy theory. And the geometrical models for reliability analysis are built directly from 3D shape models of BLP solder joints predicted by surface evolver using interface software of model converting. The lead-free solders considered are 96.5Sn3.5Ag and 95.5Sn3.8Ag0.7Cu. The 63Sn37Pb and 62Sn36Pb2Ag leaded solders are also considered to establish baselines. The Anand unified viscoplastic constitutive law is applied to represent the viscoplastic deformation behaviors for these solder alloys. Time-temperature-dependent nonlinear analysis of BLP solder joints on printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented using ANSYS finite element simulation software tool. The stress distribution, strain distribution and failure location of BLP-I and BLP-II solder joints are presented. The comparisons of Von Mises stress time history and equivalent plastic strain time history between different solder joints are provided also. The thermal fatigue life of BLP solder joints is predicted by the modified Coffin-Manson model based on the equivalent plastic strain range. Also, the effects of various solders and solder joint shape on BLP solder joint reliability are provided
{"title":"Modeling and reliability analysis of lead-free solder joints of bottom leaded plastic (BLP) package","authors":"Chen Xiangyang, Zhou Dejian","doi":"10.1109/HDP.2006.1707601","DOIUrl":"https://doi.org/10.1109/HDP.2006.1707601","url":null,"abstract":"The electronic packaging and assembly technology is developing to high-density, fine-pitch and micromation. At the same time, an ever increasing need has developed for a lead-free solder joint interconnection due to the restrictions on the use of lead, and the upward spiraling market demand of green products. As a result the reliability of solder joint has attracted a great deal of attention, especially the lead-free solder joint. In this study, the three-dimensional (3D) shape of bottom leaded plastic (BLP) solder joints are predicted by the surface evolver software tool based on the minimum energy theory. And the geometrical models for reliability analysis are built directly from 3D shape models of BLP solder joints predicted by surface evolver using interface software of model converting. The lead-free solders considered are 96.5Sn3.5Ag and 95.5Sn3.8Ag0.7Cu. The 63Sn37Pb and 62Sn36Pb2Ag leaded solders are also considered to establish baselines. The Anand unified viscoplastic constitutive law is applied to represent the viscoplastic deformation behaviors for these solder alloys. Time-temperature-dependent nonlinear analysis of BLP solder joints on printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented using ANSYS finite element simulation software tool. The stress distribution, strain distribution and failure location of BLP-I and BLP-II solder joints are presented. The comparisons of Von Mises stress time history and equivalent plastic strain time history between different solder joints are provided also. The thermal fatigue life of BLP solder joints is predicted by the modified Coffin-Manson model based on the equivalent plastic strain range. Also, the effects of various solders and solder joint shape on BLP solder joint reliability are provided","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128169473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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