2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463326
P. Altieri-Weimar, W. Yuan, E. S. Annibale, S. Schoemaker, D. Amberger, M. Goken, H. W. Hoppel
In this study the mechanical properties and fatigue behavior of ultra-fine gold wires are investigated by experimental tension fatigue tests and finite element (FE) simulation. Hardening behavior, yield criterion and yield surface of gold wire are determined by tensile tests and force controlled tension fatigue tests. The relationship between plastic strain and loading stress amplitude is determined and the cyclic strain hardening coefficient is calculated. The fatigue data are used to develop a predictive crack model for gold wires bonded in LED packages, based on finite element (FE) stress simulation at temperature cycles (TC). The computer model of the gold wire in the LED package used in the simulation is reconstructed from computer tomography (CT) analysis. The predictive crack model is calibrated using on-line monitoring of LED wire cracks during TC tests. Finally, using the reliability model, the impact of LED package design and material on the wire lifetime is investigated.
{"title":"Reliability model of LED package regarding the fatigue behavior of gold wires","authors":"P. Altieri-Weimar, W. Yuan, E. S. Annibale, S. Schoemaker, D. Amberger, M. Goken, H. W. Hoppel","doi":"10.1109/EUROSIME.2016.7463326","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463326","url":null,"abstract":"In this study the mechanical properties and fatigue behavior of ultra-fine gold wires are investigated by experimental tension fatigue tests and finite element (FE) simulation. Hardening behavior, yield criterion and yield surface of gold wire are determined by tensile tests and force controlled tension fatigue tests. The relationship between plastic strain and loading stress amplitude is determined and the cyclic strain hardening coefficient is calculated. The fatigue data are used to develop a predictive crack model for gold wires bonded in LED packages, based on finite element (FE) stress simulation at temperature cycles (TC). The computer model of the gold wire in the LED package used in the simulation is reconstructed from computer tomography (CT) analysis. The predictive crack model is calibrated using on-line monitoring of LED wire cracks during TC tests. Finally, using the reliability model, the impact of LED package design and material on the wire lifetime is investigated.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132572772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463340
P. Meszmer, K. Hiller, R. D. Rodriguez, E. Sheremet, D. Zahn, M. Hietschold, B. Wunderle
For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.
{"title":"Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor — Experimental setup, data processing, and comparison to numerically obtained results","authors":"P. Meszmer, K. Hiller, R. D. Rodriguez, E. Sheremet, D. Zahn, M. Hietschold, B. Wunderle","doi":"10.1109/EUROSIME.2016.7463340","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463340","url":null,"abstract":"For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125054564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463296
E. Monier-Vinard, B. Rogié, V. Bissuel, N. Laraqi, O. Daniel, Marie-Cécile Kotelon
Latest Computational Fluid Dynamic tools allow modelling more finely the conjugate thermo-fluidic behaviour of a single electronic component mounted on a Printed Wiring Board. A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. So it is possible to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results in order to assess their relevance. The present work shows that the numerical model error is lower than 2% for various boundary conditions. Moreover the practical modelling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were checked and appeared to be very tricky. New approaches must be developed. Further the establishment of a realistic numerical model of electronic components permits to properly apprehend multi-physics design issues.
{"title":"State of the art of numerical thermal characterization of electronic component","authors":"E. Monier-Vinard, B. Rogié, V. Bissuel, N. Laraqi, O. Daniel, Marie-Cécile Kotelon","doi":"10.1109/EUROSIME.2016.7463296","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463296","url":null,"abstract":"Latest Computational Fluid Dynamic tools allow modelling more finely the conjugate thermo-fluidic behaviour of a single electronic component mounted on a Printed Wiring Board. A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. So it is possible to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results in order to assess their relevance. The present work shows that the numerical model error is lower than 2% for various boundary conditions. Moreover the practical modelling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were checked and appeared to be very tricky. New approaches must be developed. Further the establishment of a realistic numerical model of electronic components permits to properly apprehend multi-physics design issues.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114057059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463335
Zakriya Mohammed, G. Dushaq, A. Chatterjee, M. Rasras
This paper demonstrates the design and simulation of a 2-axis capacitive accelerometer. The design utilizes a simple comb structure to detect capacitance change with a minimum gap spacing of 0.9 μm. By optimizing the design and anti-gap spacing, the device is designed to yield high capacitance change with the proof mass displacement. Initial simulation results show a displacement sensitivity of 0.02μm/g (g=9.8 m/s2) and a differential capacitance sensitivity (scale factor) of 68 fF/g. The sensitivity achieved is best among the devices of its range (± 5g) and dimensions (2×2mm2). This device is being fabricated by GlobalFoundries-Singapore.
{"title":"Bi-axial highly sensitive ±5g polysilicon based differential capacitive accelerometer","authors":"Zakriya Mohammed, G. Dushaq, A. Chatterjee, M. Rasras","doi":"10.1109/EUROSIME.2016.7463335","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463335","url":null,"abstract":"This paper demonstrates the design and simulation of a 2-axis capacitive accelerometer. The design utilizes a simple comb structure to detect capacitance change with a minimum gap spacing of 0.9 μm. By optimizing the design and anti-gap spacing, the device is designed to yield high capacitance change with the proof mass displacement. Initial simulation results show a displacement sensitivity of 0.02μm/g (g=9.8 m/s2) and a differential capacitance sensitivity (scale factor) of 68 fF/g. The sensitivity achieved is best among the devices of its range (± 5g) and dimensions (2×2mm2). This device is being fabricated by GlobalFoundries-Singapore.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121075391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463375
N. Barth, S. Ahzi, Zaid S. Al Otaibi
An uncoupled thermal and thermo-mechanical modeling of a solar panel is presented. The thermal modeling itself has been previously developed to assess the nominal performance of photovoltaic panels under various service conditions. Within this computational tool, assessing temperatures makes it also possible to analyze the thermal stresses. To study and predict the long-term reliability of the solar panel materials, the thermal cycling due to varying atmospheric conditions is then of particular interest. We undertake such multi-physics approach by taking into account the thermal cycling at the front side of the photovoltaic device packaging, including the solar cells, their antireflective coating, a glass layer and an eventual encapsulating polymer. Even within a simplified modeled design and an elastic constitutive behavior, we can evaluate the threshold to fatigue for most of these materials.
{"title":"Towards thermal fatigue modeling of photovoltaic panels under the gulf region harsh atmospheric conditions","authors":"N. Barth, S. Ahzi, Zaid S. Al Otaibi","doi":"10.1109/EUROSIME.2016.7463375","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463375","url":null,"abstract":"An uncoupled thermal and thermo-mechanical modeling of a solar panel is presented. The thermal modeling itself has been previously developed to assess the nominal performance of photovoltaic panels under various service conditions. Within this computational tool, assessing temperatures makes it also possible to analyze the thermal stresses. To study and predict the long-term reliability of the solar panel materials, the thermal cycling due to varying atmospheric conditions is then of particular interest. We undertake such multi-physics approach by taking into account the thermal cycling at the front side of the photovoltaic device packaging, including the solar cells, their antireflective coating, a glass layer and an eventual encapsulating polymer. Even within a simplified modeled design and an elastic constitutive behavior, we can evaluate the threshold to fatigue for most of these materials.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114784097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463313
R. Chassagne, Fabian Dorfler, M. Guyenot
The requirements for next-generation power electronic modules and devices imply enhanced energy densities, i.e., interconnection packaging technologies have to guarantee enhanced ampacity and robustness with respect to thermo-mechanical loads. Particularly, the interconnection layers of semi-conductor devices (e.g. MOSFET, IGBT, diodes) play a predominant role in the robustness of power electronic modules. Diffusion soldering (aka "HotPowCon", HPC) is a promising alternative with respect to the above mentioned requirements. HPC consists in the infiltration of a solder alloy melt into a porous copper matrix. The resulting intermetallic phases between copper and the soldering alloy have a melting point high above the standard processing and operating temperatures, and hence, a thermo-mechanically stable interconnection layer is formed. A simulation of this infiltration process requires the modeling of wetting dynamics in complex porous structures for which classical computational fluid dynamics (CFD) is limited with respect to computational efficiency. In contrast, the so-called lattice Boltzmann method (LBM), which is an indirect solver of the Navier-Stokes equations based on statistical physics, is numerically far more efficient. In this article, we present a simulation approach based on the LBM in order to model the response of infiltration rates on crucial HPC process parameters like viscosity and wettability of the liquid solder alloy, as well as porosity and geometrical properties of the copper matrix. The simulation results show consistency with the analytic Lucas-Washburn law for capillarity-driven flows in porous media. This can be seen as a proof of concept for the application of the LBM on the HPC infiltration process, and thus, the LBM might be the key-component of a future tool-chain for infiltration process optimization with respect to large-scale production demands.
{"title":"Modeling of the HPC infiltration process by means of the lattice Boltzmann method","authors":"R. Chassagne, Fabian Dorfler, M. Guyenot","doi":"10.1109/EUROSIME.2016.7463313","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463313","url":null,"abstract":"The requirements for next-generation power electronic modules and devices imply enhanced energy densities, i.e., interconnection packaging technologies have to guarantee enhanced ampacity and robustness with respect to thermo-mechanical loads. Particularly, the interconnection layers of semi-conductor devices (e.g. MOSFET, IGBT, diodes) play a predominant role in the robustness of power electronic modules. Diffusion soldering (aka \"HotPowCon\", HPC) is a promising alternative with respect to the above mentioned requirements. HPC consists in the infiltration of a solder alloy melt into a porous copper matrix. The resulting intermetallic phases between copper and the soldering alloy have a melting point high above the standard processing and operating temperatures, and hence, a thermo-mechanically stable interconnection layer is formed. A simulation of this infiltration process requires the modeling of wetting dynamics in complex porous structures for which classical computational fluid dynamics (CFD) is limited with respect to computational efficiency. In contrast, the so-called lattice Boltzmann method (LBM), which is an indirect solver of the Navier-Stokes equations based on statistical physics, is numerically far more efficient. In this article, we present a simulation approach based on the LBM in order to model the response of infiltration rates on crucial HPC process parameters like viscosity and wettability of the liquid solder alloy, as well as porosity and geometrical properties of the copper matrix. The simulation results show consistency with the analytic Lucas-Washburn law for capillarity-driven flows in porous media. This can be seen as a proof of concept for the application of the LBM on the HPC infiltration process, and thus, the LBM might be the key-component of a future tool-chain for infiltration process optimization with respect to large-scale production demands.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114950132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463363
A. Mazloum-Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L. Weiss
In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad package was investigated by numerical and experimental means. The aim was to develop a methodology for fast evaluation of the packages, with focus on wire bond fatigue, by combining FEA and mechanical fatigue testing. The investigations included the following steps: (i) simulation of the warpage induced displacements in the encapsulated LQFP-176-Epad package due to temperature changes, (ii) reproducing the thermally induced stresses in the wire bond loops in an unmolded (non-encapsulated) LQFP package using an accelerated multiaxial mechanical fatigue testing set-up under the displacement amplitudes determined in case (i) and determination of the loading cycles to failure (Nf), (iii) FEA of the experiments performed in (ii) based on the boundary conditions determined in (i) to calculate the states of stress and strain in the wire bonds subjected to multiaxial mechanical cyclic loading. Our investigations confirm that thermal and mechanical cyclic loading results in occurrence of high plastic strains at the heat affected zone (HAZ) above the nail-head, which may lead to fatigue failure of the wire bonds in the packages. The lifetime of wire bonds show a proportional relation between the location and angle of the wire bond to the direction of loading. The calculated accumulated plastic strain in the HAZ was correlated to the experimentally determined Nf values based on the volume weighted averaging (VWA) approach and presented in a lifetime diagram (Δd - Nf) for reliability assessment of Cu wire bonds. The described accelerated test method could be used as a rapid qualification test for the determination of the lifetimes of wire bonds at different positions on the chip as well as for related improvements of package design.
{"title":"Reliability analysis of Cu wire bonds in microelectronic packages","authors":"A. Mazloum-Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L. Weiss","doi":"10.1109/EUROSIME.2016.7463363","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463363","url":null,"abstract":"In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad package was investigated by numerical and experimental means. The aim was to develop a methodology for fast evaluation of the packages, with focus on wire bond fatigue, by combining FEA and mechanical fatigue testing. The investigations included the following steps: (i) simulation of the warpage induced displacements in the encapsulated LQFP-176-Epad package due to temperature changes, (ii) reproducing the thermally induced stresses in the wire bond loops in an unmolded (non-encapsulated) LQFP package using an accelerated multiaxial mechanical fatigue testing set-up under the displacement amplitudes determined in case (i) and determination of the loading cycles to failure (Nf), (iii) FEA of the experiments performed in (ii) based on the boundary conditions determined in (i) to calculate the states of stress and strain in the wire bonds subjected to multiaxial mechanical cyclic loading. Our investigations confirm that thermal and mechanical cyclic loading results in occurrence of high plastic strains at the heat affected zone (HAZ) above the nail-head, which may lead to fatigue failure of the wire bonds in the packages. The lifetime of wire bonds show a proportional relation between the location and angle of the wire bond to the direction of loading. The calculated accumulated plastic strain in the HAZ was correlated to the experimentally determined Nf values based on the volume weighted averaging (VWA) approach and presented in a lifetime diagram (Δd - Nf) for reliability assessment of Cu wire bonds. The described accelerated test method could be used as a rapid qualification test for the determination of the lifetimes of wire bonds at different positions on the chip as well as for related improvements of package design.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"184 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116268059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463301
Martin Putnik, Stefano Cardanobile, C. Hoppner, J. Mehner
Doubly-clamped beams offer an ideal structure for studying nonlinear mechanical coupling between different vibrational modes. Until now, there is lack of experimental data concerning the stiffening of higher modes induced by the ground mode. In this paper, we construct virtual experimental data for the nonlinear mechanical coupling of in- and out-of-plane modes of a doubly-clamped beam resonator using full transient FEM simulations. We find a very good agreement of the simulation results with a formula derived for in-plane modes by Owers-Bradley, Lulla et al. Finally, we generalize the formula to include out-of-plane modes, and show that also this case can be correctly described.
{"title":"Stiffening of higher modes in doubly-clamped beam resonators depending on ground state amplitude","authors":"Martin Putnik, Stefano Cardanobile, C. Hoppner, J. Mehner","doi":"10.1109/EUROSIME.2016.7463301","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463301","url":null,"abstract":"Doubly-clamped beams offer an ideal structure for studying nonlinear mechanical coupling between different vibrational modes. Until now, there is lack of experimental data concerning the stiffening of higher modes induced by the ground mode. In this paper, we construct virtual experimental data for the nonlinear mechanical coupling of in- and out-of-plane modes of a doubly-clamped beam resonator using full transient FEM simulations. We find a very good agreement of the simulation results with a formula derived for in-plane modes by Owers-Bradley, Lulla et al. Finally, we generalize the formula to include out-of-plane modes, and show that also this case can be correctly described.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122387751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463358
T. Tilford, S. Stoyanov, G. Tourloukis, C. Bailey
In this paper, a computational approach for the analysis of microscale droplet impact dynamics is presented. The approach is intended to support a condition based monitoring system to enhance quality and reliability of inkjet printed electronics components. The Smoothed Particle Hydrodynamics (SPH) approach of Lucy and Gingold and Monaghan has been used as the basis for the model, with the 5-SPH terms of Marrone et al used to improve handling of the dynamic impact events and the gradient correction terms of Belytschko used to improve the accuracy of interface dynamics. Model validation has been performed through comparison against a macroscale dam break problem and through a microscale analysis designed to determine accurate surface tension-pressure behaviour based on the Young-Laplace relation. The model is used to assess impact of a single drop on a uniform surface and the three dimensional formation of multi-drop layers.
{"title":"Numerical analysis of droplet deposition in inkjet printed electronics assembly","authors":"T. Tilford, S. Stoyanov, G. Tourloukis, C. Bailey","doi":"10.1109/EUROSIME.2016.7463358","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463358","url":null,"abstract":"In this paper, a computational approach for the analysis of microscale droplet impact dynamics is presented. The approach is intended to support a condition based monitoring system to enhance quality and reliability of inkjet printed electronics components. The Smoothed Particle Hydrodynamics (SPH) approach of Lucy and Gingold and Monaghan has been used as the basis for the model, with the 5-SPH terms of Marrone et al used to improve handling of the dynamic impact events and the gradient correction terms of Belytschko used to improve the accuracy of interface dynamics. Model validation has been performed through comparison against a macroscale dam break problem and through a microscale analysis designed to determine accurate surface tension-pressure behaviour based on the Young-Laplace relation. The model is used to assess impact of a single drop on a uniform surface and the three dimensional formation of multi-drop layers.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130686808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463352
D. Kozic, R. Treml, V. Maier-Kiener, R. Schongrundner, R. Brunner, D. Kiener, T. Antretter, Hans-Peter Ganser
Nanoscale, multi-material thin film structures are commonly used in the design of microelectronic devices. Composites like these have the advantage of occupying a small volume in a specific device which makes a realization of 3D integrated circuits easier. Nonetheless, an arbitrarily fabricated thin film component will not automatically meet the requirements concerning its reliability and persistent functionality. In this paper, we investigate the fracture behavior of a micro-cantilever, where a copper (Cu) layer is sandwiched between two tungsten (W) layers on a silicon (Si) substrate. The crack driving forces through the layer structure are calculated for linear elastic and elastic-plastic material behavior with and without hardening and will crucially depend on the used material properties. This is especially the case when the crack tip is located in the vicinity of a sharp interface, where the material properties will change abruptly. The stress-strain relation for W and Cu is calculated by fitting simulation results to data from spherical nanoindentation experiments. Due to the arrangement and material properties of the material layers, a crack oriented perpendicular to the interfaces and propagating through the thin film system will be arrested in the Cu-interlayer.
{"title":"Fracture and material behavior of thin film composites","authors":"D. Kozic, R. Treml, V. Maier-Kiener, R. Schongrundner, R. Brunner, D. Kiener, T. Antretter, Hans-Peter Ganser","doi":"10.1109/EUROSIME.2016.7463352","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463352","url":null,"abstract":"Nanoscale, multi-material thin film structures are commonly used in the design of microelectronic devices. Composites like these have the advantage of occupying a small volume in a specific device which makes a realization of 3D integrated circuits easier. Nonetheless, an arbitrarily fabricated thin film component will not automatically meet the requirements concerning its reliability and persistent functionality. In this paper, we investigate the fracture behavior of a micro-cantilever, where a copper (Cu) layer is sandwiched between two tungsten (W) layers on a silicon (Si) substrate. The crack driving forces through the layer structure are calculated for linear elastic and elastic-plastic material behavior with and without hardening and will crucially depend on the used material properties. This is especially the case when the crack tip is located in the vicinity of a sharp interface, where the material properties will change abruptly. The stress-strain relation for W and Cu is calculated by fitting simulation results to data from spherical nanoindentation experiments. Due to the arrangement and material properties of the material layers, a crack oriented perpendicular to the interfaces and propagating through the thin film system will be arrested in the Cu-interlayer.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130701858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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