2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463395
M. Niessner, R. Dudek, M. Hildebrandt, M. Gehring, Y. Yongbo, A. Piller, G. Schrag
In contrast to the use of lead free solders in most electronic applications, replacement of high-lead materials has not yet been possible for die attach in power electronics. Accordingly, there is still some need for creep data input in related simulations. Several creep models of high-lead soft solder die attach materials were published, which were extracted from macro-scale material samples. However, as it is generally known for soft solders, their creep behavior depends strongly on microstructure and a creep description close to the application is to be preferred. In order to assess the validity of the creep models at micro-scale in a use-scenario, this work uses two recently developed experimental setups with sub-μm warpage measurement capability. The warpage of three-layered samples is measured over temperature and simulated using four different published creep models. The solder models are able to reproduce the measured change in warpage direction with certain accuracy, but also show deviations from the measured behavior of the test samples which requires further investigation.
{"title":"Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling","authors":"M. Niessner, R. Dudek, M. Hildebrandt, M. Gehring, Y. Yongbo, A. Piller, G. Schrag","doi":"10.1109/EUROSIME.2016.7463395","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463395","url":null,"abstract":"In contrast to the use of lead free solders in most electronic applications, replacement of high-lead materials has not yet been possible for die attach in power electronics. Accordingly, there is still some need for creep data input in related simulations. Several creep models of high-lead soft solder die attach materials were published, which were extracted from macro-scale material samples. However, as it is generally known for soft solders, their creep behavior depends strongly on microstructure and a creep description close to the application is to be preferred. In order to assess the validity of the creep models at micro-scale in a use-scenario, this work uses two recently developed experimental setups with sub-μm warpage measurement capability. The warpage of three-layered samples is measured over temperature and simulated using four different published creep models. The solder models are able to reproduce the measured change in warpage direction with certain accuracy, but also show deviations from the measured behavior of the test samples which requires further investigation.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122125982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463370
H. Huang, A. Dasgupta, E. Mirbagheri
The focus of this paper is on a modeling methodology for capturing the complex mechanical behavior of a single layer pressure-sensitive adhesive (PSA) system, based on empirical observations of its stress-strain behavior. This study is motivated by the fact that there is very limited modeling ability to mechanistically predict the bimodal stress-strain curves of single-layer PSAs. Empirical observations verify that this behavior is due to softening caused by nucleation and growth of cavities in the early deformation stage and hardening due to fibrillation during the final deformation stage before terminal debonding from the substrate. The effects of different loading conditions, including loading rate, stress and temperature, on PSA systems are also important. In-depth physics-based understanding of the connection between morphological changes in the joint and mechanical performance (including relevant failure mechanisms) of PSA-bonded assemblies will help to optimize PSA materials and joint architecture for maximum performance and durability. The goal of the mechanical modeling capability proposed in this study is to enable a virtual testing capability with reasonably high fidelity. The proposed modeling approach builds on an existing `block model' methodology [1] and improves the existing approach by modeling each block with a strain-hardening viscoelastic constitutive model to capture the fibrillation process. Results show reasonable agreement between this improved mechanistic `block model' and experiments. Such a mechanistic model can now be used as a virtual-testing tool, to explore how these PSA systems will behave on different substrates under different loading conditions.
{"title":"Mechanistic model for the mechanical behavior of assemblies bonded with pressure-sensitive adhesives","authors":"H. Huang, A. Dasgupta, E. Mirbagheri","doi":"10.1109/EUROSIME.2016.7463370","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463370","url":null,"abstract":"The focus of this paper is on a modeling methodology for capturing the complex mechanical behavior of a single layer pressure-sensitive adhesive (PSA) system, based on empirical observations of its stress-strain behavior. This study is motivated by the fact that there is very limited modeling ability to mechanistically predict the bimodal stress-strain curves of single-layer PSAs. Empirical observations verify that this behavior is due to softening caused by nucleation and growth of cavities in the early deformation stage and hardening due to fibrillation during the final deformation stage before terminal debonding from the substrate. The effects of different loading conditions, including loading rate, stress and temperature, on PSA systems are also important. In-depth physics-based understanding of the connection between morphological changes in the joint and mechanical performance (including relevant failure mechanisms) of PSA-bonded assemblies will help to optimize PSA materials and joint architecture for maximum performance and durability. The goal of the mechanical modeling capability proposed in this study is to enable a virtual testing capability with reasonably high fidelity. The proposed modeling approach builds on an existing `block model' methodology [1] and improves the existing approach by modeling each block with a strain-hardening viscoelastic constitutive model to capture the fibrillation process. Results show reasonable agreement between this improved mechanistic `block model' and experiments. Such a mechanistic model can now be used as a virtual-testing tool, to explore how these PSA systems will behave on different substrates under different loading conditions.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127677801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463309
Vernier Clemence, D. Marc, Seebich Hans-Peter, Wunderle Bernhard
This project aims at evaluating the reliability of a dual-curable adhesive bonded joint used in optical applications. The delamination at the interface adhesive-substrate is one of the most critical failure modes: once a crack is initiated, it propagates catastrophically even at small loads. The fracture toughness is tested statically and cyclically using state of the art methods. In addition, the use of an electrodynamic shaker to increase the collected data is analyzed: testing on the shaker permits testing several samples at a time and is a flexible tool to vary the applied load and frequency. An accurate determination of the material properties and the curing mechanisms is necessary to transfer load capacity values into strength values. It has been shown that the adhesive can be considered as linear visco-elastic up to 10% of the maximum strain. The samples for the shaker can be manufactured reproducibly and a first test gives promising results for the application of this instrument for the study of crack initiation and propagation on several geometries.
{"title":"Reliability of a dual-curable adhesive bond","authors":"Vernier Clemence, D. Marc, Seebich Hans-Peter, Wunderle Bernhard","doi":"10.1109/EUROSIME.2016.7463309","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463309","url":null,"abstract":"This project aims at evaluating the reliability of a dual-curable adhesive bonded joint used in optical applications. The delamination at the interface adhesive-substrate is one of the most critical failure modes: once a crack is initiated, it propagates catastrophically even at small loads. The fracture toughness is tested statically and cyclically using state of the art methods. In addition, the use of an electrodynamic shaker to increase the collected data is analyzed: testing on the shaker permits testing several samples at a time and is a flexible tool to vary the applied load and frequency. An accurate determination of the material properties and the curing mechanisms is necessary to transfer load capacity values into strength values. It has been shown that the adhesive can be considered as linear visco-elastic up to 10% of the maximum strain. The samples for the shaker can be manufactured reproducibly and a first test gives promising results for the application of this instrument for the study of crack initiation and propagation on several geometries.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116205948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463399
R. Schlegel, A. Muller, R. Niemeier, P. Gromala
The goal of the documented analysis is the buildup of an appropriate mechanical model and the parameter identification for the shear button test. The test has been performed at different hammer positions in order to identify the shear and tensile strength parameter of the interface between mold compound and copper substrate. The parameter identification process contains a sensitivity analysis and fit-optimization which was carried out with optiSLang. To simulate the crack behavior of the interface and the mold compound the material library multiPlas is applied that uses multi-surface plasticity models at continuum element level. Finally a parameter set has been identified that allows for the fitting of all test shear forces. In addition to the interface and crack properties the contact modeling at the hammer tip has been found as a key factor for a successful identification of the model parameter. Other than expected this is especially true for the high hammer positions and can be explained by a local stress resp. a local contact problem. Here also the strength properties of the mold compound play an important role.
{"title":"Parameter identification for interface delamination processes in molded electronic packages","authors":"R. Schlegel, A. Muller, R. Niemeier, P. Gromala","doi":"10.1109/EUROSIME.2016.7463399","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463399","url":null,"abstract":"The goal of the documented analysis is the buildup of an appropriate mechanical model and the parameter identification for the shear button test. The test has been performed at different hammer positions in order to identify the shear and tensile strength parameter of the interface between mold compound and copper substrate. The parameter identification process contains a sensitivity analysis and fit-optimization which was carried out with optiSLang. To simulate the crack behavior of the interface and the mold compound the material library multiPlas is applied that uses multi-surface plasticity models at continuum element level. Finally a parameter set has been identified that allows for the fitting of all test shear forces. In addition to the interface and crack properties the contact modeling at the hammer tip has been found as a key factor for a successful identification of the model parameter. Other than expected this is especially true for the high hammer positions and can be explained by a local stress resp. a local contact problem. Here also the strength properties of the mold compound play an important role.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124143391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463300
A. Alexeev, W. Cassarly, V. Hildenbrand, O. Tapaninen, A. Sitomaniemi, A. Wondergem
A good understanding of the optical and thermal properties of mid-power LEDs requires an accurate simulation of the light conversion process in the phosphor layer and a good description of the major materials properties. A ray-tracing model for the light conversion process is developed in LightTools® and the output is used as input for the thermal model in ANSYS®. The thermal resistances of the main resistors in the junction to case heat flow path are measured and implemented in the thermal model. The results of the optical and thermal simulations using key parameters are compared with the measured values. Depending on the effort used to calibrate the model, deviations of less than ten percent can be achieved. This is typically within the error margin of the experiments. The main source of error is most likely missing information on the precise optical die properties.
{"title":"Simulating light conversion in mid-power LEDs","authors":"A. Alexeev, W. Cassarly, V. Hildenbrand, O. Tapaninen, A. Sitomaniemi, A. Wondergem","doi":"10.1109/EUROSIME.2016.7463300","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463300","url":null,"abstract":"A good understanding of the optical and thermal properties of mid-power LEDs requires an accurate simulation of the light conversion process in the phosphor layer and a good description of the major materials properties. A ray-tracing model for the light conversion process is developed in LightTools® and the output is used as input for the thermal model in ANSYS®. The thermal resistances of the main resistors in the junction to case heat flow path are measured and implemented in the thermal model. The results of the optical and thermal simulations using key parameters are compared with the measured values. Depending on the effort used to calibrate the model, deviations of less than ten percent can be achieved. This is typically within the error margin of the experiments. The main source of error is most likely missing information on the precise optical die properties.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134265113","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463398
X. Qiu, J. Lo, Andrew W. Shang, S. Lee
Conventional packaging materials for light-emitting diodes (LED) are susceptible to UV radiation and high temperature. Therefore, for developing UV LED packages, new materials with better UV and high temperature resistance are required. There are two candidates, namely, epoxy molding compound (EMC) and silicone molding compound (SMC), being considered by the industry. This paper focuses on the change in reflectance of EMC and SMC over time as a measure of reliability. Aging was performed on EMC and SMC culls under high temperature, and combination of UV exposure and high temperature simultaneously. Reflectance of EMC and SMC culls before and after aging were compared. It was concluded that both EMC and SMC degrade under simultaneous UV radiation and high temperature aging, and that SMC is more UV and thermally resistant than EMC based on change in reflectance, surface morphology, and roughness.
{"title":"Investigation of reliability of EMC and SMC on reflectance for UV LED applications","authors":"X. Qiu, J. Lo, Andrew W. Shang, S. Lee","doi":"10.1109/EUROSIME.2016.7463398","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463398","url":null,"abstract":"Conventional packaging materials for light-emitting diodes (LED) are susceptible to UV radiation and high temperature. Therefore, for developing UV LED packages, new materials with better UV and high temperature resistance are required. There are two candidates, namely, epoxy molding compound (EMC) and silicone molding compound (SMC), being considered by the industry. This paper focuses on the change in reflectance of EMC and SMC over time as a measure of reliability. Aging was performed on EMC and SMC culls under high temperature, and combination of UV exposure and high temperature simultaneously. Reflectance of EMC and SMC culls before and after aging were compared. It was concluded that both EMC and SMC degrade under simultaneous UV radiation and high temperature aging, and that SMC is more UV and thermally resistant than EMC based on change in reflectance, surface morphology, and roughness.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"50 49","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113957712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463380
Liuyang Zhang, Yuanqing Cheng, W. Kang, Youguang Zhang, L. Torres, Weisheng Zhao, A. Todri-Sanial
Spin transfer torque magnetic random access memory (STT-MRAM) is a potential candidate for next generation universal memory technology, which possesses the high density and cost benefits of DRAM, the high access speed of SRAM, the non-volatility of Flash, compatibility with CMOS and essentially unlimited endurance. However, STT-MRAM commercialization is hampered by the reliability issues, especially its poor thermal reliability. Generally, the elevated ambient temperature and Joule heating cause the thermal reliability issues of STT-MRAM. These effects result in many failures such as data cannot be written into the cell or read out from the cell correctly. Therefore, reliability issues of STT-MRAM has long been the design challenge under thermal fluctuation due to their thermal sensitivity property. In the paper, a series of simulation experiments are carried out to evaluate the reliability and performance of STT-MRAM in terms of operation error rate, delay and energy consumption. These simulation experiments are performed in Cadence with a compact spice model of PMA (Perpendicular Magnetic Anisotropy) MTJ (Magnetic Tunnel Junction), which is developed by our group and used widely. The information obtained from these experiments would provide foundation for probing the enhancing strategies of reliability and performance for STT-MRAM.
{"title":"Reliability and performance evaluation for STT-MRAM under temperature variation","authors":"Liuyang Zhang, Yuanqing Cheng, W. Kang, Youguang Zhang, L. Torres, Weisheng Zhao, A. Todri-Sanial","doi":"10.1109/EUROSIME.2016.7463380","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463380","url":null,"abstract":"Spin transfer torque magnetic random access memory (STT-MRAM) is a potential candidate for next generation universal memory technology, which possesses the high density and cost benefits of DRAM, the high access speed of SRAM, the non-volatility of Flash, compatibility with CMOS and essentially unlimited endurance. However, STT-MRAM commercialization is hampered by the reliability issues, especially its poor thermal reliability. Generally, the elevated ambient temperature and Joule heating cause the thermal reliability issues of STT-MRAM. These effects result in many failures such as data cannot be written into the cell or read out from the cell correctly. Therefore, reliability issues of STT-MRAM has long been the design challenge under thermal fluctuation due to their thermal sensitivity property. In the paper, a series of simulation experiments are carried out to evaluate the reliability and performance of STT-MRAM in terms of operation error rate, delay and energy consumption. These simulation experiments are performed in Cadence with a compact spice model of PMA (Perpendicular Magnetic Anisotropy) MTJ (Magnetic Tunnel Junction), which is developed by our group and used widely. The information obtained from these experiments would provide foundation for probing the enhancing strategies of reliability and performance for STT-MRAM.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122532740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463339
R. Schwerz, M. Roellig, B. Frankenstein
The market increasingly demands remote monitoring sensors and electronics for safety-related industrial equipment, transport vehicles and also building structures. In these applications the robustness of the electronics and the reliability of the packaging technology are key factors. Reliability requirements are for electronic modules are derived from environmental and operational loads. This leads to general requirements for the system concept to ensure their operation and thus system reliability. Most frequently the focus is set on thermomechanical design issues. The presented work however includes, investigations for a different loading scenario - long-term use under constant media exposure in a maritime environment in seawater. The application scenario is monitoring of the foundation structure for offshore wind turbines. Specific requirements to protect the sensors and sensor electronics from the surrounding medium sea-water and permanent pressure load of 3 to 6 bar in the application of water depth between 20 to 50 meters. Other environmental conditions are occurring minerals and microorganisms which can attack the package system in long term. The permanent installation of electronics requires a system design with lifetimes in the range of the test structure itself, which is set to 10 years. The presented work include characterizations of organic potting compounds for this purpose. Emphasis has been put into the materials resistances to media absorption and diffusion properties. Furthermore, aging effects in sea water and fuel mix and their impact towards mechanical stability of the polymer systems are presented. These include displacements of the characteristic glass transition and the variation of the elastic modulus. Unfilled epoxy material has been successfully modified to achieve increased media resistance. Higher polymer cross-linking has been shown to increase resistance. Dynamic-mechanical measurements have shown, that aging causes softening of material and shift of glass transition towards lower temperatures. The general tendency polar polymers are degrading in polar solvents (EP and PUR) according to contained molecular group. Ester group in basic medium, ether in acid medium. Other properties strongly depend on the individual recipe of the polymer product (e.g. hardener system). The investigated polyurethane has shown to be only conditionally useful for encapsulation. Comparatively the PCB materials have shown very good media resistance properties. Overall a full protection with polymer is hardly possible and measures to adjust layout component placement and pcb design are to be done also to ensure longtime reliability. As potential life-reducing mechanisms unwanted material changes through media storage and path formation within the polymer system have been identified. Possible starting areas for crack initiations have to be minimized. This means the reduction of air inclusions or de-lamination potential at interfaces. Based on t
{"title":"Robust and reliable encapsulation of electronics for underwater applications","authors":"R. Schwerz, M. Roellig, B. Frankenstein","doi":"10.1109/EUROSIME.2016.7463339","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463339","url":null,"abstract":"The market increasingly demands remote monitoring sensors and electronics for safety-related industrial equipment, transport vehicles and also building structures. In these applications the robustness of the electronics and the reliability of the packaging technology are key factors. Reliability requirements are for electronic modules are derived from environmental and operational loads. This leads to general requirements for the system concept to ensure their operation and thus system reliability. Most frequently the focus is set on thermomechanical design issues. The presented work however includes, investigations for a different loading scenario - long-term use under constant media exposure in a maritime environment in seawater. The application scenario is monitoring of the foundation structure for offshore wind turbines. Specific requirements to protect the sensors and sensor electronics from the surrounding medium sea-water and permanent pressure load of 3 to 6 bar in the application of water depth between 20 to 50 meters. Other environmental conditions are occurring minerals and microorganisms which can attack the package system in long term. The permanent installation of electronics requires a system design with lifetimes in the range of the test structure itself, which is set to 10 years. The presented work include characterizations of organic potting compounds for this purpose. Emphasis has been put into the materials resistances to media absorption and diffusion properties. Furthermore, aging effects in sea water and fuel mix and their impact towards mechanical stability of the polymer systems are presented. These include displacements of the characteristic glass transition and the variation of the elastic modulus. Unfilled epoxy material has been successfully modified to achieve increased media resistance. Higher polymer cross-linking has been shown to increase resistance. Dynamic-mechanical measurements have shown, that aging causes softening of material and shift of glass transition towards lower temperatures. The general tendency polar polymers are degrading in polar solvents (EP and PUR) according to contained molecular group. Ester group in basic medium, ether in acid medium. Other properties strongly depend on the individual recipe of the polymer product (e.g. hardener system). The investigated polyurethane has shown to be only conditionally useful for encapsulation. Comparatively the PCB materials have shown very good media resistance properties. Overall a full protection with polymer is hardly possible and measures to adjust layout component placement and pcb design are to be done also to ensure longtime reliability. As potential life-reducing mechanisms unwanted material changes through media storage and path formation within the polymer system have been identified. Possible starting areas for crack initiations have to be minimized. This means the reduction of air inclusions or de-lamination potential at interfaces. Based on t","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124685818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463397
Umar A. Albalawi, S. Mohanty, E. Kougianos
This paper proposes a hardware architecture for a Secure Digital Camera (SDC) integrated with Secure Better Portable Graphics (SBPG) compression algorithm. The proposed architecture is suitable for high performance imaging in the Internet of Things (IoT). The objectives of this paper are twofold. On the one hand, the proposed SBPG architecture offers double-layer protection: encryption and watermarking. On the other hand, the paper proposes SDC integrated with secure BPG compression for real time intelligent traffic surveillance (ITS). The experimental results prove that the new compression technique BPG outperforms JPEG in terms of compression quality and size of the compression file. As the visual quality of the watermarked and compressed images improves with larger values of PSNR, the results show that the proposed SBPG substantially increases the quality of the watermarked compressed images. To achieve a high performance architecture three techniques are considered: first, using the center portion of the image to insert the encrypted signature. Second, watermarking is done in the frequency domain using block-wise DCT size 8×8. Third, in BPG encoder, the proposed architecture uses inter and intra prediction to reduce the temporal and spatial redundancy.
{"title":"SBPG: A secure better portable graphics compression architecture for high speed trusted image communication in the IoT","authors":"Umar A. Albalawi, S. Mohanty, E. Kougianos","doi":"10.1109/EUROSIME.2016.7463397","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463397","url":null,"abstract":"This paper proposes a hardware architecture for a Secure Digital Camera (SDC) integrated with Secure Better Portable Graphics (SBPG) compression algorithm. The proposed architecture is suitable for high performance imaging in the Internet of Things (IoT). The objectives of this paper are twofold. On the one hand, the proposed SBPG architecture offers double-layer protection: encryption and watermarking. On the other hand, the paper proposes SDC integrated with secure BPG compression for real time intelligent traffic surveillance (ITS). The experimental results prove that the new compression technique BPG outperforms JPEG in terms of compression quality and size of the compression file. As the visual quality of the watermarked and compressed images improves with larger values of PSNR, the results show that the proposed SBPG substantially increases the quality of the watermarked compressed images. To achieve a high performance architecture three techniques are considered: first, using the center portion of the image to insert the encrypted signature. Second, watermarking is done in the frequency domain using block-wise DCT size 8×8. Third, in BPG encoder, the proposed architecture uses inter and intra prediction to reduce the temporal and spatial redundancy.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128470717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463372
A. Sasi, P. Gromala
The present paper illustrates moisture diffusion using advanced thermal-moisture analogy approach. Experimental procedure to measure the diffusivity and solubility of epoxy based encapsulation material to be implemented in simulation has been discussed. The moisture weight gain of the sample is measured till its saturated state over time at 5 different relative humidity (RH%) and temperature combination. Then %weight gain as a function of time results are fitted with the analytical solution of 3-D diffusion equation using nonlinear regression analysis to obtain the diffusivity property. Since the saturated concentration at the boundary of the polymer can be described by Henry's law i.e. Csat = SPvp, where S is solubility (kg /m3/ Pa) and Pvp is the ambient vapor pressure (Pa), which is related to RH% and the saturated vapor pressure Pvp, sat as Pvp=RH% Pvp, sat; this relation is used to obtain modified solubility and solubility at each temperature. The temperature dependence of solubility and diffusivity are described by Arrhenius relation. The results are utilized in Finite Element (FE) analysis of the moisture diffusion model. Only Fickian moisture absorption has been attempted to be modeled. It has been shown that the moisture diffusion properties obtained from such characterization technique fits satisfactorily with the experimental results. Further the analogy scheme's degree of simplicity, boundary conditions and applicable situations have been highlighted.
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