2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463343
A. Ndieguene, J. Morissette, N. Normand, J. Sylvestre
We propose a method for in-situ measurements of the surface tension of solder joints on microelectronics chips. The method uses actual chips placed in an inert atmosphere, in a heating chamber with a transparent lid. A confocal microscopy probe is used to oberve the top of solder balls through the lid while a piezoelectric actuator induces vibrations in the system. The setup allows the measurement of the resonance frequencies of the balls by comparing the system's response to sweeps in excitation frequency, for temperatures below and above the liquidus temperature of the solder joints. A number of phenomena were observed, such as undercooling during solidification and continuous formation of surface oxydes.
{"title":"In-situ solder surface tension measurements using mechanical resonances","authors":"A. Ndieguene, J. Morissette, N. Normand, J. Sylvestre","doi":"10.1109/EUROSIME.2016.7463343","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463343","url":null,"abstract":"We propose a method for in-situ measurements of the surface tension of solder joints on microelectronics chips. The method uses actual chips placed in an inert atmosphere, in a heating chamber with a transparent lid. A confocal microscopy probe is used to oberve the top of solder balls through the lid while a piezoelectric actuator induces vibrations in the system. The setup allows the measurement of the resonance frequencies of the balls by comparing the system's response to sweeps in excitation frequency, for temperatures below and above the liquidus temperature of the solder joints. A number of phenomena were observed, such as undercooling during solidification and continuous formation of surface oxydes.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129100452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463365
S. Wiese, D. Bruch, M. Elasmi, F. Kraemer, J. Ahmar
This paper presents an approach to adequately design a test setup and specimen in order to perform tensile tests on PCB copper traces for board level packaging. The difficulty to conduct tensile tests on thin pcb copper traces is caused by the requirements of representative specimens. Most of the failure sites on copper interconnect structures in electronic assemblies are characterised by a high aspect ratio between the thickness and width. While the width is on the range of some hundred micrometres to a few millimetres, typical thicknesses are between 1 to 100 micrometres. Therefore specimens that adequately represent the properties of pcb copper are difficult to test in a standard mechanical test setup, which is usually made for compact specimens. The experimental design for determining the deformation behaviour of the PCB copper trace material encompasses two aspects: (1) experimental setup design and (2) specimen design. The two aspects contribute to the accuracy of the later material model for the use in FEM simulation. In order to conduct tests on thin copper film specimens, a test setup was designed, which is characterized by higher compliance of its frame. This way the test setup is able to compensate for misaligned angles of the sample to the load axis of the setup. An optical measurement is used in order provide accurate strain measurements on the sample. The role of specimen design of thin copper foil specimens is crucial for the accuracy of the test. FEM simulations of stress distributions have been carried out on classical dog bone specimens and on stripe specimens. The paper will discuss the inhomogeneous stress distributions of the gauge length of the stripe specimen compared to the dog bone specimen. Another aspect is the sample preparation. The paper will report the difficulties that exist, when the specimen is prepared by milling a copper sheet. The paper will discuss the connection between test setup design and specimen design with respect to the effects on the results of a tensile test on thin copper specimens.
{"title":"Experimental design for tensile tests on PCB copper traces for board level packaging","authors":"S. Wiese, D. Bruch, M. Elasmi, F. Kraemer, J. Ahmar","doi":"10.1109/EUROSIME.2016.7463365","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463365","url":null,"abstract":"This paper presents an approach to adequately design a test setup and specimen in order to perform tensile tests on PCB copper traces for board level packaging. The difficulty to conduct tensile tests on thin pcb copper traces is caused by the requirements of representative specimens. Most of the failure sites on copper interconnect structures in electronic assemblies are characterised by a high aspect ratio between the thickness and width. While the width is on the range of some hundred micrometres to a few millimetres, typical thicknesses are between 1 to 100 micrometres. Therefore specimens that adequately represent the properties of pcb copper are difficult to test in a standard mechanical test setup, which is usually made for compact specimens. The experimental design for determining the deformation behaviour of the PCB copper trace material encompasses two aspects: (1) experimental setup design and (2) specimen design. The two aspects contribute to the accuracy of the later material model for the use in FEM simulation. In order to conduct tests on thin copper film specimens, a test setup was designed, which is characterized by higher compliance of its frame. This way the test setup is able to compensate for misaligned angles of the sample to the load axis of the setup. An optical measurement is used in order provide accurate strain measurements on the sample. The role of specimen design of thin copper foil specimens is crucial for the accuracy of the test. FEM simulations of stress distributions have been carried out on classical dog bone specimens and on stripe specimens. The paper will discuss the inhomogeneous stress distributions of the gauge length of the stripe specimen compared to the dog bone specimen. Another aspect is the sample preparation. The paper will report the difficulties that exist, when the specimen is prepared by milling a copper sheet. The paper will discuss the connection between test setup design and specimen design with respect to the effects on the results of a tensile test on thin copper specimens.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130223394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463376
Lin Dong, N. Barth, J. Correia, S. Ahzi
Selective Laser Sintering (SLS) is an important branch of additive manufacturing ("3D printing") technologies. The SLS machines are processing powders so that they are selectively sintered by a CO2 or Nd:YAG laser beam. The SLS process was initially developed to produce polymer-based components. Then, SLS had a breakthrough toward the producing of structurally perfect parts directly from metal powders. The high intensity of the laser beam makes it possible to rapidly heat a small region, inducing a disequilibrium of the temperature distribution and large temperature gradients. The numerical simulation is important for the process of laser sintering since it tackles the comprehension of such local heat accumulation. This, in turn, drives the choice of the process parameters in accordance with the processed material characteristics and with the quality aimed for the final sintered product. In the present paper, we use our three-dimensional transient finite element model to study the SLS process applied to amorphous polycarbonate and titanium powders.
{"title":"Modeling and numerical simulation of selective laser sintering","authors":"Lin Dong, N. Barth, J. Correia, S. Ahzi","doi":"10.1109/EUROSIME.2016.7463376","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463376","url":null,"abstract":"Selective Laser Sintering (SLS) is an important branch of additive manufacturing (\"3D printing\") technologies. The SLS machines are processing powders so that they are selectively sintered by a CO2 or Nd:YAG laser beam. The SLS process was initially developed to produce polymer-based components. Then, SLS had a breakthrough toward the producing of structurally perfect parts directly from metal powders. The high intensity of the laser beam makes it possible to rapidly heat a small region, inducing a disequilibrium of the temperature distribution and large temperature gradients. The numerical simulation is important for the process of laser sintering since it tackles the comprehension of such local heat accumulation. This, in turn, drives the choice of the process parameters in accordance with the processed material characteristics and with the quality aimed for the final sintered product. In the present paper, we use our three-dimensional transient finite element model to study the SLS process applied to amorphous polycarbonate and titanium powders.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"188 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121989578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463391
Bo Sun, Xuejun Fan, W. V. van Driel, T. Michel, Jiang Zhou, Guoqi Zhang
Lumen decay of LEDs is affected by time, junction temperature and input current. In LED lamps, both temperature and input current vary with time due to driver's degradation and temperature change of lamps. This paper proposes a lumen decay prediction method which considers effects of operation time, temperature and current by taking the interaction of LED and driver performance into account. In particular, a lumen decay model for LED source with consideration of the ever changing current and temperature is developed and validated experimentally. Several scenarios are analyzed theoretically by applying different assumptions.
{"title":"Lumen decay prediction in LED lamps","authors":"Bo Sun, Xuejun Fan, W. V. van Driel, T. Michel, Jiang Zhou, Guoqi Zhang","doi":"10.1109/EUROSIME.2016.7463391","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463391","url":null,"abstract":"Lumen decay of LEDs is affected by time, junction temperature and input current. In LED lamps, both temperature and input current vary with time due to driver's degradation and temperature change of lamps. This paper proposes a lumen decay prediction method which considers effects of operation time, temperature and current by taking the interaction of LED and driver performance into account. In particular, a lumen decay model for LED source with consideration of the ever changing current and temperature is developed and validated experimentally. Several scenarios are analyzed theoretically by applying different assumptions.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127881035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463366
Zhibo Chen, Wei Huang, Xinfeng Zhang, M. Yuen
Elastomeric electric-contact pressure sensors in wearable devices for monitoring physiological signals have much broader potential. In order to design and develop better pressure sensors, the simulation of the electric contact - pressure response is very important. However, due to the large deformation of the patterned surface, it is difficult to model the specific contact surface by using the conventional electric-contact theory only. In the present study, a hybrid electromechanical-contact resistance model was developed to study the strain and stress distributions on the microstructured elastomeric electric-contact surface subjected to pressure. In our new model, the contact resistance in an epidermal pressure sensor can be modeled easily and accurately with a better result. Our model can be used to optimize the sensor design and evaluate the sensing performance of pressure sensors.
{"title":"Modeling and simulation of electromechanical-contact based elastomeric pressure sensor","authors":"Zhibo Chen, Wei Huang, Xinfeng Zhang, M. Yuen","doi":"10.1109/EUROSIME.2016.7463366","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463366","url":null,"abstract":"Elastomeric electric-contact pressure sensors in wearable devices for monitoring physiological signals have much broader potential. In order to design and develop better pressure sensors, the simulation of the electric contact - pressure response is very important. However, due to the large deformation of the patterned surface, it is difficult to model the specific contact surface by using the conventional electric-contact theory only. In the present study, a hybrid electromechanical-contact resistance model was developed to study the strain and stress distributions on the microstructured elastomeric electric-contact surface subjected to pressure. In our new model, the contact resistance in an epidermal pressure sensor can be modeled easily and accurately with a better result. Our model can be used to optimize the sensor design and evaluate the sensing performance of pressure sensors.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130072632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463310
P. Poncet, F. Casset, A. Latour, F. D. Santos, S. Pawlak, R. Gwoziecki, S. Fanget
This article deals with the development of force actuator buttons for haptic feedback applications. Finite Element Method (FEM) models were used to design high performances piezoelectric actuators able to promote force restitution that can be sensed by a finger. We present first a comparison between analytical modeling and displacement measurement of cantilevers based on electroactive polymer (EAP) actuator. This calibration step leads to model optimization, through material data base precision. Then force buttons were studied by adjusting the ratio between actuator and membrane radius in order to obtain the largest force restitution, at least 50 mN/cm2. It has been shown that an actuator radius equal to 60% of the membrane radius exhibits the best performances. We also studied actuator stacking in order to increase the force restitution that can be promoted by a circular button. FEM models predict that a stack of 20 actuators is needed to match the aimed force restitution at 50V, however when the voltage is increased to 200V, only 5 actuators stacked are necessary.
{"title":"Design and realization of electroactive polymer actuators for transparent and flexible haptic feedback interfaces","authors":"P. Poncet, F. Casset, A. Latour, F. D. Santos, S. Pawlak, R. Gwoziecki, S. Fanget","doi":"10.1109/EUROSIME.2016.7463310","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463310","url":null,"abstract":"This article deals with the development of force actuator buttons for haptic feedback applications. Finite Element Method (FEM) models were used to design high performances piezoelectric actuators able to promote force restitution that can be sensed by a finger. We present first a comparison between analytical modeling and displacement measurement of cantilevers based on electroactive polymer (EAP) actuator. This calibration step leads to model optimization, through material data base precision. Then force buttons were studied by adjusting the ratio between actuator and membrane radius in order to obtain the largest force restitution, at least 50 mN/cm2. It has been shown that an actuator radius equal to 60% of the membrane radius exhibits the best performances. We also studied actuator stacking in order to increase the force restitution that can be promoted by a circular button. FEM models predict that a stack of 20 actuators is needed to match the aimed force restitution at 50V, however when the voltage is increased to 200V, only 5 actuators stacked are necessary.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134260062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463324
C. Sart, R. Estevez, V. Fiori, S. Lhostis, G. Parry, R. Gonella
Among the numerous ways to process 3D stacking of integrated circuits, a promising method is the use of Cu/SiO2 hybrid bonding, which enables simultaneous mechanical and electrical connections with an interconnection pitch limited only by photolithography resolution and alignment accuracy. In this work, we present a finite element model of the bonding of Cu/SiO2 patterned surfaces with the aim of identifying the main design and process parameters thought to affect the bonding quality, namely the pad size, shape and layout, dishing, and misalignment. We show that metal pad design induces local perturbations in the propagation of the bonding front and that the bonding quality is governed by the metal density, while pad shape, size and distribution are of little influence. This finding would allow to feed the design rules manual for hybrid bonding interconnects with drawing specifications. This analysis enables to identify the most influent factors and provide guidelines to improve bonding quality at room temperature and thereby help secure integration of 3D stacked IC products.
{"title":"Numerical and experimental investigations on the hybrid bonding of Cu/SiÜ2 patterned surfaces using a cohesive model","authors":"C. Sart, R. Estevez, V. Fiori, S. Lhostis, G. Parry, R. Gonella","doi":"10.1109/EUROSIME.2016.7463324","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463324","url":null,"abstract":"Among the numerous ways to process 3D stacking of integrated circuits, a promising method is the use of Cu/SiO2 hybrid bonding, which enables simultaneous mechanical and electrical connections with an interconnection pitch limited only by photolithography resolution and alignment accuracy. In this work, we present a finite element model of the bonding of Cu/SiO2 patterned surfaces with the aim of identifying the main design and process parameters thought to affect the bonding quality, namely the pad size, shape and layout, dishing, and misalignment. We show that metal pad design induces local perturbations in the propagation of the bonding front and that the bonding quality is governed by the metal density, while pad shape, size and distribution are of little influence. This finding would allow to feed the design rules manual for hybrid bonding interconnects with drawing specifications. This analysis enables to identify the most influent factors and provide guidelines to improve bonding quality at room temperature and thereby help secure integration of 3D stacked IC products.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131112453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463318
Dongyue Liu, Zhiqin Ru, Fang Liu, Chenzhao Zhang, Jie Huang
Until now, there has not yet been a standardized method for the LED module thermal resistance measurements. This directly affects the lifetime assessment of the LED modules. By testing and studying the temperature coefficient of the LED modules with different structures, it is found that the temperature coefficient of the LED module follows a linear relationship with voltage when an appropriate test current is applied. In this paper, we investigate the feasibility of measuring the thermal resistance of the LED module as a whole. Furthermore, we propose a method to estimate the junction temperature of the LED module based on the thermal resistances of each of its individual LED and the module itself. This method provides an important basis for the junction temperature calculation in the assessment of the lifetimes of the LED module. However, since the LED module usually has a large surface, the uncertainties existing in the materials and fabricating process will result in a distributed temperature within the LED module. And in most cases, the first failure occurs in the chip with the highest junction temperature. Therefore, the next step of our research will focus on the evaluation of the maximum junction temperature of the LED module based on the proposed method.
{"title":"Research on test method of thermal resistance and junction temperature for LED modules","authors":"Dongyue Liu, Zhiqin Ru, Fang Liu, Chenzhao Zhang, Jie Huang","doi":"10.1109/EUROSIME.2016.7463318","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463318","url":null,"abstract":"Until now, there has not yet been a standardized method for the LED module thermal resistance measurements. This directly affects the lifetime assessment of the LED modules. By testing and studying the temperature coefficient of the LED modules with different structures, it is found that the temperature coefficient of the LED module follows a linear relationship with voltage when an appropriate test current is applied. In this paper, we investigate the feasibility of measuring the thermal resistance of the LED module as a whole. Furthermore, we propose a method to estimate the junction temperature of the LED module based on the thermal resistances of each of its individual LED and the module itself. This method provides an important basis for the junction temperature calculation in the assessment of the lifetimes of the LED module. However, since the LED module usually has a large surface, the uncertainties existing in the materials and fabricating process will result in a distributed temperature within the LED module. And in most cases, the first failure occurs in the chip with the highest junction temperature. Therefore, the next step of our research will focus on the evaluation of the maximum junction temperature of the LED module based on the proposed method.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132901789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463381
Matteo Bruggi, V. Zega, A. Corigliano
Complex inertial Micro Electro Mechanical Systems (MEMS) usually require the simultaneous motion of the masses in more than one direction and an overall linear behavior. Furthermore, since it is usually very difficult to actuate the device in all the required directions, complex spring configurations for the conversion of the motion are needed. Here we present possible solutions to this problem through auxetic structures. The goal of the work is to propose a new topology optimization procedure which can be used as a tool during the design phase of the optimal auxetic structure, that is completely compatible with the MEMS fabrication processes available so far and that allows the motion conversion in a MEMS device without entering the nonlinear regime.
{"title":"Optimization of auxetic structures for MEMS applications","authors":"Matteo Bruggi, V. Zega, A. Corigliano","doi":"10.1109/EUROSIME.2016.7463381","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463381","url":null,"abstract":"Complex inertial Micro Electro Mechanical Systems (MEMS) usually require the simultaneous motion of the masses in more than one direction and an overall linear behavior. Furthermore, since it is usually very difficult to actuate the device in all the required directions, complex spring configurations for the conversion of the motion are needed. Here we present possible solutions to this problem through auxetic structures. The goal of the work is to propose a new topology optimization procedure which can be used as a tool during the design phase of the optimal auxetic structure, that is completely compatible with the MEMS fabrication processes available so far and that allows the motion conversion in a MEMS device without entering the nonlinear regime.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121395769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463393
R. Dudek, R. Doring, M. Hildebrandt, S. Rzepka, S. Stegmeier, S. Kiefl, Volkmar Sommer, G. Mitic, K. Weidner
Theoretical analyses on the thermo-mechanical behavior of power modules designed in a new buildup and interconnection technology based on silver sintering and electroplated copper interconnects have been made. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects and the high voltage applicability of the resulting modules. A high voltage and temperature resistant polymeric foil provides the insulation in this high voltage planar interconnect technology. Electrical connection is made by structured electro-deposited copper structures, which allow additional heat spreading from top of the dies. This interconnection technology is raising new questions concerning the constitutive behavior of the materials involved in the power stack as well as the closely linked questions concerning their thermo-mechanical reliability. Investigations on characteristics of dielectric materials and copper plated interconnects are reported. For the latter, a significant dependence on microstructure is seen. FE-analyses were made to study the thermal and mechanical loadings. Both passive and power cycling were investigated for a prototype converter module substrate designed by HVPT. Transient power cycling induced loading was studied using electric-thermal-mechanical coupling. Significant change in the potential failure modes of such an assembly are to be expected, in particular metallization delamination failure at different interfaces can occur.
{"title":"Analyses of thermo-mechanical reliability issues for power modules designed in planar technology","authors":"R. Dudek, R. Doring, M. Hildebrandt, S. Rzepka, S. Stegmeier, S. Kiefl, Volkmar Sommer, G. Mitic, K. Weidner","doi":"10.1109/EUROSIME.2016.7463393","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463393","url":null,"abstract":"Theoretical analyses on the thermo-mechanical behavior of power modules designed in a new buildup and interconnection technology based on silver sintering and electroplated copper interconnects have been made. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects and the high voltage applicability of the resulting modules. A high voltage and temperature resistant polymeric foil provides the insulation in this high voltage planar interconnect technology. Electrical connection is made by structured electro-deposited copper structures, which allow additional heat spreading from top of the dies. This interconnection technology is raising new questions concerning the constitutive behavior of the materials involved in the power stack as well as the closely linked questions concerning their thermo-mechanical reliability. Investigations on characteristics of dielectric materials and copper plated interconnects are reported. For the latter, a significant dependence on microstructure is seen. FE-analyses were made to study the thermal and mechanical loadings. Both passive and power cycling were investigated for a prototype converter module substrate designed by HVPT. Transient power cycling induced loading was studied using electric-thermal-mechanical coupling. Significant change in the potential failure modes of such an assembly are to be expected, in particular metallization delamination failure at different interfaces can occur.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124766549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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