2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463304
J. Magnien, J. Rose, M. Pfeiler-Deutschmann, R. Hammer, L. Mitterhuber, S. Defregger, F. Schrank, E. Kraker
High power light emitting diode (LED) has gained more and more importance over the last decade as a long-life general illumination source. To ensure a long-lasting lifetime of the LED module, knowledge about critical failures has to be generated. However, it is extremely time consuming and complicated to assess the failure mechanisms and the reliability of the whole LED system. In this work the focus lies mainly in the investigation of failure modes generated in wire-bonds of phosphor converted (pc) white LED modules. Therefore an accelerated test method was developed, where the time-consuming electrical switching test was transferred into a fast purely thermo-mechanical test. For this purpose, Finite Element simulations representing the thermal effect of an electrical off-switching cycle were performed to compare thermally induced strains and stresses with equivalent purely mechanical stresses causing similar strain/stress scenarios. The experimental setup consisted of a dynamic mechanical analyzer (DMA), where the electrical switching test was transferred into an equivalent accelerated mechanical compression test. Failure analysis methods such as X-Ray computed tomography (XR-CT) and cross section investigations by light microscopy or scanning electron microscopy (SEM) were used to analyze failure modes and to compare both testing setups (electrical vs. mechanical). Additionally, thermal impedance analysis was used to monitor changes in thermal device performance in a non-destructive way.
{"title":"Accelerated thermo-mechanical test method for LED modules","authors":"J. Magnien, J. Rose, M. Pfeiler-Deutschmann, R. Hammer, L. Mitterhuber, S. Defregger, F. Schrank, E. Kraker","doi":"10.1109/EUROSIME.2016.7463304","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463304","url":null,"abstract":"High power light emitting diode (LED) has gained more and more importance over the last decade as a long-life general illumination source. To ensure a long-lasting lifetime of the LED module, knowledge about critical failures has to be generated. However, it is extremely time consuming and complicated to assess the failure mechanisms and the reliability of the whole LED system. In this work the focus lies mainly in the investigation of failure modes generated in wire-bonds of phosphor converted (pc) white LED modules. Therefore an accelerated test method was developed, where the time-consuming electrical switching test was transferred into a fast purely thermo-mechanical test. For this purpose, Finite Element simulations representing the thermal effect of an electrical off-switching cycle were performed to compare thermally induced strains and stresses with equivalent purely mechanical stresses causing similar strain/stress scenarios. The experimental setup consisted of a dynamic mechanical analyzer (DMA), where the electrical switching test was transferred into an equivalent accelerated mechanical compression test. Failure analysis methods such as X-Ray computed tomography (XR-CT) and cross section investigations by light microscopy or scanning electron microscopy (SEM) were used to analyze failure modes and to compare both testing setups (electrical vs. mechanical). Additionally, thermal impedance analysis was used to monitor changes in thermal device performance in a non-destructive way.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126979640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-19DOI: 10.1109/EUROSIME.2016.7463333
T. Hoang, L. Wu, S. Paquay, J. Golinval, M. Arnst, L. Noels
This work studies the uncertainties of the adhesive contact problems for reduced size structures, e.g. the stiction failure of microelectromechanical systems (MEMS). In MEMS, because of the large surface to volume ratio, the surfaces forces, such as van der Waals forces and capillary forces, are dominant in comparison with the body forces. As these force magnitudes strongly depend on the contact distance, when the two contacting surfaces are rough, the contact distances vary, and the physical contact areas are limited at the highest asperities of the contacting surfaces. Therefore, the adhesive contact forces between two rough surfaces can suffer from a scatter, and the involved structural behaviors can be indeterministic. To numerically predict the probability behaviors of structures involving adhesion in dry environments, in this paper, a computational stochastic model-based multi-scale method developed by the authors is applied. The effects of van der Waals is studied and compared with experimental data as well as with the effects of capillary forces.
{"title":"A study of dry stiction phenomenon in MEMS using a computational stochastic multi-scale methodology","authors":"T. Hoang, L. Wu, S. Paquay, J. Golinval, M. Arnst, L. Noels","doi":"10.1109/EUROSIME.2016.7463333","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463333","url":null,"abstract":"This work studies the uncertainties of the adhesive contact problems for reduced size structures, e.g. the stiction failure of microelectromechanical systems (MEMS). In MEMS, because of the large surface to volume ratio, the surfaces forces, such as van der Waals forces and capillary forces, are dominant in comparison with the body forces. As these force magnitudes strongly depend on the contact distance, when the two contacting surfaces are rough, the contact distances vary, and the physical contact areas are limited at the highest asperities of the contacting surfaces. Therefore, the adhesive contact forces between two rough surfaces can suffer from a scatter, and the involved structural behaviors can be indeterministic. To numerically predict the probability behaviors of structures involving adhesion in dry environments, in this paper, a computational stochastic model-based multi-scale method developed by the authors is applied. The effects of van der Waals is studied and compared with experimental data as well as with the effects of capillary forces.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125883073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463311
C. Maj, M. Szermer, A. Napieralski, B. Kirjusha, A. Tchkalov, P. Michalik
Designing of MEMS devices requires modeling step. Many devices combines mechanical and electrical domains. Very often it is desired to use one simulation tool that allows taking into account both domains. Such functionality has CADENCE environment. In this paper we do such simulations using developed macro model of capacitive MEMS accelerometer. The accelerometer is described in Verilog-A language and placed in electrical schematic that consist of read-out circuit. The simulations were performed for the device z-axis CMOS-integrated acceleration sensor that has been developed in UPC Barcelona. The results of simulations were compared to those obtained by measurements of fabricated device.
{"title":"Macro model of capacitive MEMS accelerometer in CADENCE environment","authors":"C. Maj, M. Szermer, A. Napieralski, B. Kirjusha, A. Tchkalov, P. Michalik","doi":"10.1109/EUROSIME.2016.7463311","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463311","url":null,"abstract":"Designing of MEMS devices requires modeling step. Many devices combines mechanical and electrical domains. Very often it is desired to use one simulation tool that allows taking into account both domains. Such functionality has CADENCE environment. In this paper we do such simulations using developed macro model of capacitive MEMS accelerometer. The accelerometer is described in Verilog-A language and placed in electrical schematic that consist of read-out circuit. The simulations were performed for the device z-axis CMOS-integrated acceleration sensor that has been developed in UPC Barcelona. The results of simulations were compared to those obtained by measurements of fabricated device.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125835620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463349
O. Tapaninen, Petri Myohanen, M. Majanen, A. Sitomaniemi, J. Olkkonen, V. Hildenbrand, A. Gielen, F. V. Mackenzie, M. Barink, V. Šmilauer, B. Patzák
This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.
{"title":"Optical and thermal simulation chain for LED package","authors":"O. Tapaninen, Petri Myohanen, M. Majanen, A. Sitomaniemi, J. Olkkonen, V. Hildenbrand, A. Gielen, F. V. Mackenzie, M. Barink, V. Šmilauer, B. Patzák","doi":"10.1109/EUROSIME.2016.7463349","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463349","url":null,"abstract":"This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126704479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463402
R. Poelma, X. Fan, E. Schlangen, H. V. van Zeijl, G. Zhang
Vertically aligned carbon nanotube arrays (CNTs) are a nanoscale material that can be grown from the bottom up in a fast and controlled manner to form large microstructures. Combined with thin conformal coatings, we gain accurate control over the material properties of nano-porous CNT arrays. This paper deals with three topics involving nanoscale materials for microfabrication; (1) microfabrication steps for 3D micro-structures using CNTs arrays and thin conformal coatings, (2) the (in-situ) experimental characterization of the material and (3) a multi-scale modelling approach for analysing the mechanical material properties of CNT pillars.
{"title":"Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling","authors":"R. Poelma, X. Fan, E. Schlangen, H. V. van Zeijl, G. Zhang","doi":"10.1109/EUROSIME.2016.7463402","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463402","url":null,"abstract":"Vertically aligned carbon nanotube arrays (CNTs) are a nanoscale material that can be grown from the bottom up in a fast and controlled manner to form large microstructures. Combined with thin conformal coatings, we gain accurate control over the material properties of nano-porous CNT arrays. This paper deals with three topics involving nanoscale materials for microfabrication; (1) microfabrication steps for 3D micro-structures using CNTs arrays and thin conformal coatings, (2) the (in-situ) experimental characterization of the material and (3) a multi-scale modelling approach for analysing the mechanical material properties of CNT pillars.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129892480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463299
Jian Hao, Qiang Sun, L. Jing, Yao Wang, Jian Zhao, Hongxin Zhang, Hong-liang Ke, Qun Gao, Xiao-xun Wang, Yanchao Zhang
In order to investigate the difference of the lifetime predictions between LED lamps and light source modules, different types of accelerated aging tests have been done in this paper. The accelerated temperatures are 85 °C, 80 °C and 60 °C for three aging tests, respectively. Luminous flux, as evaluation criteria of degradation, is measured at accelerated aging temperatures. Fitted by the exponential decay law of luminous flux, decay rate of each sample is acquired. Under the condition of Weibull distribution, two-stage method is used to solve the degradation model and to calculate the accelerated lifetimes of LED. The lifetimes at room temperature of 25 °C are then calculated by use of the Arrhenius model. It is shown that the widths of confidence intervals of parameters of Weibull distribution are improved greatly by the second stage of simulation. The averaged confidence interval of shape parameter is about 3% of that in the first stage of estimate. The medium lifetime at room temperature of LED lamp declines by 5.6% as compared with light source module. This implies that the aging of driver module has small influence on lifetime of LED lamp.
{"title":"Comparison of lifetime predictions with LED lamps and light source modules in accelerated aging tests","authors":"Jian Hao, Qiang Sun, L. Jing, Yao Wang, Jian Zhao, Hongxin Zhang, Hong-liang Ke, Qun Gao, Xiao-xun Wang, Yanchao Zhang","doi":"10.1109/EUROSIME.2016.7463299","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463299","url":null,"abstract":"In order to investigate the difference of the lifetime predictions between LED lamps and light source modules, different types of accelerated aging tests have been done in this paper. The accelerated temperatures are 85 °C, 80 °C and 60 °C for three aging tests, respectively. Luminous flux, as evaluation criteria of degradation, is measured at accelerated aging temperatures. Fitted by the exponential decay law of luminous flux, decay rate of each sample is acquired. Under the condition of Weibull distribution, two-stage method is used to solve the degradation model and to calculate the accelerated lifetimes of LED. The lifetimes at room temperature of 25 °C are then calculated by use of the Arrhenius model. It is shown that the widths of confidence intervals of parameters of Weibull distribution are improved greatly by the second stage of simulation. The averaged confidence interval of shape parameter is about 3% of that in the first stage of estimate. The medium lifetime at room temperature of LED lamp declines by 5.6% as compared with light source module. This implies that the aging of driver module has small influence on lifetime of LED lamp.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114637425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463345
M. Benedikt, S. Thonhofer
The implementation of a modular system development approach offers great opportunities for distributed modelling and analysis of mechatronic systems. Signal-flow based subsystem models are frequently used for this purpose, especially within Co-Simulation scenarios. They are usually masked such that sharing the model is possible without granting access to internal details of the implementation. However, this lack of knowledge about the internal structure of a model can lead to modelling mistakes: especially problems originating from neglected energy exchange between models can happen. Such problems can be avoided if physical interaction based models are used for defining the interfaces of the models. This contribution highlights typically occuring problems according to modular system simulation leading to modelling guidelines, demonstrated on a simple theoretical example.
{"title":"Guidelines for enabling modular simulations according to signal-based subsystem modelling","authors":"M. Benedikt, S. Thonhofer","doi":"10.1109/EUROSIME.2016.7463345","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463345","url":null,"abstract":"The implementation of a modular system development approach offers great opportunities for distributed modelling and analysis of mechatronic systems. Signal-flow based subsystem models are frequently used for this purpose, especially within Co-Simulation scenarios. They are usually masked such that sharing the model is possible without granting access to internal details of the implementation. However, this lack of knowledge about the internal structure of a model can lead to modelling mistakes: especially problems originating from neglected energy exchange between models can happen. Such problems can be avoided if physical interaction based models are used for defining the interfaces of the models. This contribution highlights typically occuring problems according to modular system simulation leading to modelling guidelines, demonstrated on a simple theoretical example.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131458837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463390
Massar Wade, G. Duchamp, T. Dubois, I. B. Majek
Passive components embedded into printed circuit boards (PCBs) are of great interest to enhance the size reduction, the integration density increase and the number of functionalities of electronic circuits. This technology enables to increase the operating frequency towards higher frequencies and improve the reliability. A large number of passive components used on an electronic board are capacitive. So their study involves the biggest challenge for burying into PCBs due to the large range of capacitance required and the large frequency domain of applications. This paper deals with the high frequency characterization and the determination of the frequency dependence of the permittivity of innovative dielectric nanocomposite materials involved in capacitive structures, based on simulations and measurements.
{"title":"High frequency characterization of nanocomposite materials based on simulation and measurement of buried capacitors","authors":"Massar Wade, G. Duchamp, T. Dubois, I. B. Majek","doi":"10.1109/EUROSIME.2016.7463390","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463390","url":null,"abstract":"Passive components embedded into printed circuit boards (PCBs) are of great interest to enhance the size reduction, the integration density increase and the number of functionalities of electronic circuits. This technology enables to increase the operating frequency towards higher frequencies and improve the reliability. A large number of passive components used on an electronic board are capacitive. So their study involves the biggest challenge for burying into PCBs due to the large range of capacitance required and the large frequency domain of applications. This paper deals with the high frequency characterization and the determination of the frequency dependence of the permittivity of innovative dielectric nanocomposite materials involved in capacitive structures, based on simulations and measurements.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"293 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114379128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463330
A. Faria, J. Fontaínhas, D. Araujo, J. Cabral, L. Rocha
Over the past few years, magnetic position sensors have increasingly been chosen over other products and technologies as a result of their high durability, reliability and their ability to be integrated into very small form factors. However, the use of magnetic based sensors is susceptible to interferences when placed in electric vehicles, due to the increasing number of cables. As the electric cables generate stray magnetic fields, especially the ones carrying the high currents from battery to the motor, wrong readings from the magnetic sensors occur, since the amount of external magnetic fields is greater than the maximum disturbance supported by the sensor [1]. The effect of magnetic shielding on an angular position sensor is studied here using an electro-magnetic FEM model (ANSYS Workbench [2]). Permanent magnet, magnetic sensor and disturbance source are modeled and the effect of shielding is extracted from the simulations. Simulation results show that shielding can be achieved using a highly permeable plastic casing.
{"title":"Study of the shielding of angular position sensors with magnetic transduction","authors":"A. Faria, J. Fontaínhas, D. Araujo, J. Cabral, L. Rocha","doi":"10.1109/EUROSIME.2016.7463330","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463330","url":null,"abstract":"Over the past few years, magnetic position sensors have increasingly been chosen over other products and technologies as a result of their high durability, reliability and their ability to be integrated into very small form factors. However, the use of magnetic based sensors is susceptible to interferences when placed in electric vehicles, due to the increasing number of cables. As the electric cables generate stray magnetic fields, especially the ones carrying the high currents from battery to the motor, wrong readings from the magnetic sensors occur, since the amount of external magnetic fields is greater than the maximum disturbance supported by the sensor [1]. The effect of magnetic shielding on an angular position sensor is studied here using an electro-magnetic FEM model (ANSYS Workbench [2]). Permanent magnet, magnetic sensor and disturbance source are modeled and the effect of shielding is extracted from the simulations. Simulation results show that shielding can be achieved using a highly permeable plastic casing.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117060945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-04-18DOI: 10.1109/EUROSIME.2016.7463327
T. Bechtold, D. Hohlfeld
This work presents a general simulation approach for all relevant physical effects in electro-optical circuit boards. Such printed circuit boards integrate electrical components and connections together with optical wave-guides as signal lines for applications in data transmission and sensing. The proposed modelling approach includes a calculation of heat distribution based on convective cooling and the thermally induced mechanical stress. We also present results on mode shapes within straight and uniformly curved waveguides as well as a consideration of ray tracing.
{"title":"Multi-physical simulation of high performance computing platform integrating polymer waveguides","authors":"T. Bechtold, D. Hohlfeld","doi":"10.1109/EUROSIME.2016.7463327","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463327","url":null,"abstract":"This work presents a general simulation approach for all relevant physical effects in electro-optical circuit boards. Such printed circuit boards integrate electrical components and connections together with optical wave-guides as signal lines for applications in data transmission and sensing. The proposed modelling approach includes a calculation of heat distribution based on convective cooling and the thermally induced mechanical stress. We also present results on mode shapes within straight and uniformly curved waveguides as well as a consideration of ray tracing.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125170898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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