Ni51Ti49 at.% bulk was additively manufactured by laser-directed energy deposition (DED) to reveal the microstructure evolution, phase distribution, and mechanical properties. It is found that the localized remelting, reheating, and heat accumulation during DED leads to the spatial heterogeneous distribution of columnar crystal and equiaxed crystal, a gradient distribution of Ni4Ti3 precipitates along the building direction, and preferential formation of Ni4Ti3 precipitates in the columnar zone. The austenite transformation finish temperature (A f) varies from −12.65 °C (Z = 33 mm) to 60.35 °C (Z = 10 mm), corresponding to tensile yield strength (σ 0.2) changed from 120 ± 30 MPa to 570 ± 20 MPa, and functional properties changed from shape memory effect to superelasticity at room temperature. The sample in the Z = 20.4 mm height has the best plasticity of 9.6% and the best recoverable strain of 4.2%. This work provided insights and guidelines for the spatial characterization of DEDed NiTi.
{"title":"Formation mechanism of inherent spatial heterogeneity of microstructure and mechanical properties of NiTi SMA prepared by laser directed energy deposition","authors":"MengJie Luo, Rui-di Li, Dan-dan Zheng, Jin-Kab Kang, Huiting Wu, Shenghua Deng, P. Niu","doi":"10.1088/2631-7990/acd96f","DOIUrl":"https://doi.org/10.1088/2631-7990/acd96f","url":null,"abstract":"Ni51Ti49 at.% bulk was additively manufactured by laser-directed energy deposition (DED) to reveal the microstructure evolution, phase distribution, and mechanical properties. It is found that the localized remelting, reheating, and heat accumulation during DED leads to the spatial heterogeneous distribution of columnar crystal and equiaxed crystal, a gradient distribution of Ni4Ti3 precipitates along the building direction, and preferential formation of Ni4Ti3 precipitates in the columnar zone. The austenite transformation finish temperature (A f) varies from −12.65 °C (Z = 33 mm) to 60.35 °C (Z = 10 mm), corresponding to tensile yield strength (σ 0.2) changed from 120 ± 30 MPa to 570 ± 20 MPa, and functional properties changed from shape memory effect to superelasticity at room temperature. The sample in the Z = 20.4 mm height has the best plasticity of 9.6% and the best recoverable strain of 4.2%. This work provided insights and guidelines for the spatial characterization of DEDed NiTi.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"25 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78496482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-25DOI: 10.1088/2631-7990/acd917
Mitsuru Yamada, Naohiko Soma, Masaya Tsuta, S. Nakamura, N. Ando, Futoshi Matsumoto
Aiming to improve the battery performance of lithium-ion batteries (LIBs), modification of the cathodes and anodes of LIBs using laser beams to prepare through-holes, non-through-holes or ditches arranged in grid and line patterns has been proposed by many researchers and engineers. In this study, a laser processing system attached to rollers, which realizes this modification without large changes in the present mass-production system, was developed. The laser system apparatus comprises roll-to-roll equipment and laser equipment. The roll-to-roll equipment mainly consists of a hollow cylinder with openings on its circumferential surface. Cathode and anode electrodes for LIBs are wound around the cylinder in the longitudinal direction of the electrodes. A pulsed beam reflected from the central axis of the cylinder can continuously open a large number of through-holes in the thin electrodes. Through-holes were formed at a rate of 100 000 holes per second on lithium iron phosphate cathodes and graphite anodes with this system. The through-holed cathodes and anodes prepared with this system exhibited higher C-rate performance than nontreated cathodes and anodes.
{"title":"Development of a roll-to-roll high-speed laser micro processing machine for preparing through-holed anodes and cathodes of lithium-ion batteries","authors":"Mitsuru Yamada, Naohiko Soma, Masaya Tsuta, S. Nakamura, N. Ando, Futoshi Matsumoto","doi":"10.1088/2631-7990/acd917","DOIUrl":"https://doi.org/10.1088/2631-7990/acd917","url":null,"abstract":"Aiming to improve the battery performance of lithium-ion batteries (LIBs), modification of the cathodes and anodes of LIBs using laser beams to prepare through-holes, non-through-holes or ditches arranged in grid and line patterns has been proposed by many researchers and engineers. In this study, a laser processing system attached to rollers, which realizes this modification without large changes in the present mass-production system, was developed. The laser system apparatus comprises roll-to-roll equipment and laser equipment. The roll-to-roll equipment mainly consists of a hollow cylinder with openings on its circumferential surface. Cathode and anode electrodes for LIBs are wound around the cylinder in the longitudinal direction of the electrodes. A pulsed beam reflected from the central axis of the cylinder can continuously open a large number of through-holes in the thin electrodes. Through-holes were formed at a rate of 100 000 holes per second on lithium iron phosphate cathodes and graphite anodes with this system. The through-holed cathodes and anodes prepared with this system exhibited higher C-rate performance than nontreated cathodes and anodes.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"33 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83908971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-25DOI: 10.1088/2631-7990/acd916
C. Zwahr, Nicolas Serey, Lukas Nitschke, C. Bischoff, U. Rädel, A. Meyer, P. Zhu, Wilhelm Pfleging
Direct Laser Interference Patterning (DLIP) is used to texture current collector foils in a roll-to-roll process using a high-power picosecond pulsed laser system operating at either fundamental wavelength of 1064 nm or 2nd harmonic of 532 nm. The raw beam having a diameter of 3 mm @ 1/e 2 is shaped into an elongated top-hat intensity profile using a diffractive so-called FBS®-L element and cylindrical telescopes. The shaped beam is split into its diffraction orders, where the two first orders are parallelized and guided into a galvanometer scanner. The deflected beams inside the scan head are recombined with an F-theta objective on the working position generating the interference pattern. The DLIP spot has a line-like interference pattern with about 15 μm spatial period. Laser fluences of up to 8 J cm−2 were achieved using a maximum pulse energy of 0.6 mJ. Furthermore, an in-house built roll-to-roll machine was developed. Using this setup, aluminum and copper foil of 20 μm and 9 μm thickness, respectively, could be processed. Subsequently to current collector structuring coating of composite electrode material took place. In case of lithium nickel manganese cobalt oxide (NMC 622) cathode deposited onto textured aluminum current collector, an increased specific discharge capacity could be achieved at a C-rate of 1 °C. For the silicon/graphite anode material deposited onto textured copper current collector, an improved rate capability at all C-rates between C/10 and 5 °C was achieved. The rate capability was increased up to 100% compared to reference material. At C-rates between C/2 and 2 °C, the specific discharge capacity was increased to 200 mAh g−1, while the reference electrodes with untextured current collector foils provided a specific discharge capacity of 100 mAh g−1, showing the potential of the DLIP technology for cost-effective production of battery cells with increased cycle lifetime.
采用高功率皮秒脉冲激光系统，在1064nm基波波长或532nm次谐波波长下工作，采用直接激光干涉图案(DLIP)对集流箔进行织制。原始光束的直径为3毫米@ 1/e 2，使用衍射所谓的FBS®-L元件和圆柱形望远镜形成拉长的顶帽强度剖面。成形的光束被分成衍射阶，其中两个第一阶被平行化并引导到振镜扫描仪中。扫描头内部的偏转光束与工作位置上的F-theta物镜重新组合，产生干涉图案。DLIP光斑具有约15 μm空间周期的线状干涉图样。使用0.6 mJ的最大脉冲能量，实现了高达8 J cm−2的激光影响。此外，还开发了内部制造的卷对卷机器。利用该装置可加工厚度分别为20 μm和9 μm的铝箔和铜箔。随后进行了集流器复合电极材料结构涂层的制备。将锂镍锰钴氧化物(NMC 622)阴极沉积在织构铝集流器上，可以在1°C的C速率下实现更高的比放电容量。对于沉积在织构铜集流器上的硅/石墨阳极材料，在C/10和5°C之间的所有C-速率下都实现了提高的速率能力。与标准物质相比，该试剂的倍率提高到100%。在C/2和2°C之间的C倍率下，比放电容量增加到200 mAh g - 1，而具有无纹理集流箔的参考电极提供了100 mAh g - 1的比放电容量，显示了DLIP技术在提高循环寿命的成本效益的电池生产中的潜力。
{"title":"Targeting new ways for large-scale, high-speed surface functionalization using direct laser interference patterning in a roll-to-roll process","authors":"C. Zwahr, Nicolas Serey, Lukas Nitschke, C. Bischoff, U. Rädel, A. Meyer, P. Zhu, Wilhelm Pfleging","doi":"10.1088/2631-7990/acd916","DOIUrl":"https://doi.org/10.1088/2631-7990/acd916","url":null,"abstract":"Direct Laser Interference Patterning (DLIP) is used to texture current collector foils in a roll-to-roll process using a high-power picosecond pulsed laser system operating at either fundamental wavelength of 1064 nm or 2nd harmonic of 532 nm. The raw beam having a diameter of 3 mm @ 1/e 2 is shaped into an elongated top-hat intensity profile using a diffractive so-called FBS®-L element and cylindrical telescopes. The shaped beam is split into its diffraction orders, where the two first orders are parallelized and guided into a galvanometer scanner. The deflected beams inside the scan head are recombined with an F-theta objective on the working position generating the interference pattern. The DLIP spot has a line-like interference pattern with about 15 μm spatial period. Laser fluences of up to 8 J cm−2 were achieved using a maximum pulse energy of 0.6 mJ. Furthermore, an in-house built roll-to-roll machine was developed. Using this setup, aluminum and copper foil of 20 μm and 9 μm thickness, respectively, could be processed. Subsequently to current collector structuring coating of composite electrode material took place. In case of lithium nickel manganese cobalt oxide (NMC 622) cathode deposited onto textured aluminum current collector, an increased specific discharge capacity could be achieved at a C-rate of 1 °C. For the silicon/graphite anode material deposited onto textured copper current collector, an improved rate capability at all C-rates between C/10 and 5 °C was achieved. The rate capability was increased up to 100% compared to reference material. At C-rates between C/2 and 2 °C, the specific discharge capacity was increased to 200 mAh g−1, while the reference electrodes with untextured current collector foils provided a specific discharge capacity of 100 mAh g−1, showing the potential of the DLIP technology for cost-effective production of battery cells with increased cycle lifetime.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"32 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86995459","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-24DOI: 10.1088/2631-7990/acd88f
Annan Chen, Jin Su, Yinjin Li, Haibo Zhang, Yusheng Shi, C. Yan, Jian Lu
Piezoelectricity in native bones has been well recognized as the key factor in bone regeneration. Thus, bio-piezoelectric materials have gained substantial attention in repairing damaged bone by mimicking the tissue’s electrical microenvironment (EM). However, traditional manufacturing strategies still encounter limitations in creating personalized bio-piezoelectric scaffolds, hindering their clinical applications. Three-dimensional (3D)/four-dimensional (4D) printing technology based on the principle of layer-by-layer forming and stacking of discrete materials has demonstrated outstanding advantages in fabricating bio-piezoelectric scaffolds in a more complex-shaped structure. Notably, 4D printing functionality-shifting bio-piezoelectric scaffolds can provide a time-dependent programmable tissue EM in response to external stimuli for bone regeneration. In this review, we first summarize the physicochemical properties of commonly used bio-piezoelectric materials (including polymers, ceramics, and their composites) and representative biological findings for bone regeneration. Then, we discuss the latest research advances in the 3D printing of bio-piezoelectric scaffolds in terms of feedstock selection, printing process, induction strategies, and potential applications. Besides, some related challenges such as feedstock scalability, printing resolution, stress-to-polarization conversion efficiency, and non-invasive induction ability after implantation have been put forward. Finally, we highlight the potential of shape/property/functionality-shifting smart 4D bio-piezoelectric scaffolds in bone tissue engineering (BTE). Taken together, this review emphasizes the appealing utility of 3D/4D printed biological piezoelectric scaffolds as next-generation BTE implants.
{"title":"3D/4D printed bio-piezoelectric smart scaffolds for next-generation bone tissue engineering","authors":"Annan Chen, Jin Su, Yinjin Li, Haibo Zhang, Yusheng Shi, C. Yan, Jian Lu","doi":"10.1088/2631-7990/acd88f","DOIUrl":"https://doi.org/10.1088/2631-7990/acd88f","url":null,"abstract":"Piezoelectricity in native bones has been well recognized as the key factor in bone regeneration. Thus, bio-piezoelectric materials have gained substantial attention in repairing damaged bone by mimicking the tissue’s electrical microenvironment (EM). However, traditional manufacturing strategies still encounter limitations in creating personalized bio-piezoelectric scaffolds, hindering their clinical applications. Three-dimensional (3D)/four-dimensional (4D) printing technology based on the principle of layer-by-layer forming and stacking of discrete materials has demonstrated outstanding advantages in fabricating bio-piezoelectric scaffolds in a more complex-shaped structure. Notably, 4D printing functionality-shifting bio-piezoelectric scaffolds can provide a time-dependent programmable tissue EM in response to external stimuli for bone regeneration. In this review, we first summarize the physicochemical properties of commonly used bio-piezoelectric materials (including polymers, ceramics, and their composites) and representative biological findings for bone regeneration. Then, we discuss the latest research advances in the 3D printing of bio-piezoelectric scaffolds in terms of feedstock selection, printing process, induction strategies, and potential applications. Besides, some related challenges such as feedstock scalability, printing resolution, stress-to-polarization conversion efficiency, and non-invasive induction ability after implantation have been put forward. Finally, we highlight the potential of shape/property/functionality-shifting smart 4D bio-piezoelectric scaffolds in bone tissue engineering (BTE). Taken together, this review emphasizes the appealing utility of 3D/4D printed biological piezoelectric scaffolds as next-generation BTE implants.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"79 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74164002","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-24DOI: 10.1088/2631-7990/acd88e
Jinxiong Li, Gaoda Chai, Xinwei Wang
Atomic layer deposition (ALD) has become an indispensable thin-film technology in the contemporary microelectronics industry. The unique self-limited layer-by-layer growth feature of ALD has outstood this technology to deposit highly uniform conformal pinhole-free thin films with angstrom-level thickness control, particularly on 3D topologies. Over the years, the ALD technology has enabled not only the successful downscaling of the microelectronic devices but also numerous novel 3D device structures. As ALD is essentially a variant of chemical vapor deposition, a comprehensive understanding of the involved chemistry is of crucial importance to further develop and utilize this technology. To this end, we, in this review, focus on the surface chemistry and precursor chemistry aspects of ALD. We first review the surface chemistry of the gas–solid ALD reactions and elaborately discuss the associated mechanisms for the film growth; then, we review the ALD precursor chemistry by comparatively discussing the precursors that have been commonly used in the ALD processes; and finally, we selectively present a few newly-emerged applications of ALD in microelectronics, followed by our perspective on the future of the ALD technology.
{"title":"Atomic layer deposition of thin films: from a chemistry perspective","authors":"Jinxiong Li, Gaoda Chai, Xinwei Wang","doi":"10.1088/2631-7990/acd88e","DOIUrl":"https://doi.org/10.1088/2631-7990/acd88e","url":null,"abstract":"Atomic layer deposition (ALD) has become an indispensable thin-film technology in the contemporary microelectronics industry. The unique self-limited layer-by-layer growth feature of ALD has outstood this technology to deposit highly uniform conformal pinhole-free thin films with angstrom-level thickness control, particularly on 3D topologies. Over the years, the ALD technology has enabled not only the successful downscaling of the microelectronic devices but also numerous novel 3D device structures. As ALD is essentially a variant of chemical vapor deposition, a comprehensive understanding of the involved chemistry is of crucial importance to further develop and utilize this technology. To this end, we, in this review, focus on the surface chemistry and precursor chemistry aspects of ALD. We first review the surface chemistry of the gas–solid ALD reactions and elaborately discuss the associated mechanisms for the film growth; then, we review the ALD precursor chemistry by comparatively discussing the precursors that have been commonly used in the ALD processes; and finally, we selectively present a few newly-emerged applications of ALD in microelectronics, followed by our perspective on the future of the ALD technology.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"5 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72857849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-24DOI: 10.1088/2631-7990/acd88d
Honglei Xue, Wanshuo Gao, Jianwei Gao, G. Schneider, Chen Wang, Wangyang Fu
As one of the most promising platforms for wireless communication, radiofrequency (RF) electronics have been widely advocated for the development of sensing systems. In particular, monolayer and few-layer two-dimensional (2D) materials exhibiting extraordinary electrical properties not only can be integrated to improve the performance of RF circuits, but also to display exceptional sensing capabilities. This review provides an in-depth perspective of current trends and challenges in the application of 2D materials for RF biochemical sensing, including: (i) theoretical bases to achieve different sensing schemes; (ii) unique properties of 2D materials for reasoning their applications in RF sensing; (iii) developments in 2D RF sensors to facilitate the practice of biochemical sensors with ever-demanding sensitivities, as well as their potential uses in meeting the requirements and challenges of biochemical sensors in the Internet-of-Things era.
{"title":"Radiofrequency sensing systems based on emerging two-dimensional materials and devices","authors":"Honglei Xue, Wanshuo Gao, Jianwei Gao, G. Schneider, Chen Wang, Wangyang Fu","doi":"10.1088/2631-7990/acd88d","DOIUrl":"https://doi.org/10.1088/2631-7990/acd88d","url":null,"abstract":"As one of the most promising platforms for wireless communication, radiofrequency (RF) electronics have been widely advocated for the development of sensing systems. In particular, monolayer and few-layer two-dimensional (2D) materials exhibiting extraordinary electrical properties not only can be integrated to improve the performance of RF circuits, but also to display exceptional sensing capabilities. This review provides an in-depth perspective of current trends and challenges in the application of 2D materials for RF biochemical sensing, including: (i) theoretical bases to achieve different sensing schemes; (ii) unique properties of 2D materials for reasoning their applications in RF sensing; (iii) developments in 2D RF sensors to facilitate the practice of biochemical sensors with ever-demanding sensitivities, as well as their potential uses in meeting the requirements and challenges of biochemical sensors in the Internet-of-Things era.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"110 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80724570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Surface nanopatterning of semiconductor optoelectronic devices is a powerful way to improve their quality and performance. However, photoelectric devices’ inherent stress sensitivity and inevitable warpage pose a huge challenge on fabricating nanostructures large-scale. Electric-driven flexible-roller nanoimprint lithography for nanopatterning the optoelectronic wafer is proposed in this study. The flexible nanoimprint template twining around a roller is continuously released and recovered, controlled by the roller’s simple motion. The electric field applied to the template and substrate provides the driving force. The contact line of the template and the substrate gradually moves with the roller to enable scanning and adapting to the entire warped substrate, under the electric field. In addition, the driving force generated from electric field is applied to the surface of substrate, so that the substrate is free from external pressure. Furthermore, liquid resist completely fills in microcavities on the template by powerful electric field force, to ensure the fidelity of the nanostructures. The proposed nanoimprint technology is validated on the prototype. Finally, nano-grating structures are fabricated on a gallium nitride light-emitting diode chip adopting the solution, achieving polarization of the light source.
{"title":"Electric-driven flexible-roller nanoimprint lithography on the stress-sensitive warped wafer","authors":"Yu Fan, Chunhui Wang, Jiaxing Sun, Xiaogang Peng, Hongmiao Tian, Xiangming Li, Xiaoliang Chen, Xiaoming Chen, Jinyou Shao","doi":"10.1088/2631-7990/acd827","DOIUrl":"https://doi.org/10.1088/2631-7990/acd827","url":null,"abstract":"Surface nanopatterning of semiconductor optoelectronic devices is a powerful way to improve their quality and performance. However, photoelectric devices’ inherent stress sensitivity and inevitable warpage pose a huge challenge on fabricating nanostructures large-scale. Electric-driven flexible-roller nanoimprint lithography for nanopatterning the optoelectronic wafer is proposed in this study. The flexible nanoimprint template twining around a roller is continuously released and recovered, controlled by the roller’s simple motion. The electric field applied to the template and substrate provides the driving force. The contact line of the template and the substrate gradually moves with the roller to enable scanning and adapting to the entire warped substrate, under the electric field. In addition, the driving force generated from electric field is applied to the surface of substrate, so that the substrate is free from external pressure. Furthermore, liquid resist completely fills in microcavities on the template by powerful electric field force, to ensure the fidelity of the nanostructures. The proposed nanoimprint technology is validated on the prototype. Finally, nano-grating structures are fabricated on a gallium nitride light-emitting diode chip adopting the solution, achieving polarization of the light source.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"305 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79813882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Additive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature, high conductivity and high resolution remains a challenge. In this paper, a hybrid AM method combining the fused deposition modeling (FDM) and hydrophobic treatment assisted laser activation metallization (LAM) was proposed for manufacturing the polyetheretherketone (PEEK)-based 3D electronics, by which the conformal copper patterns were deposited on the 3D-printed PEEK parts, and the adhesion between them reached the 5B high level. Moreover, the 3D components could support the thermal cycling test from −55 °C to 125 °C for more than 100 cycles. Particularly, the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface, not affected by the inevitable printing borders and pores in the FDM-printed parts, then making the resolution of the electroless plated copper lines improved significantly. In consequence, Cu lines with width and spacing of only 60 µm and 100 µm were obtained on both as-printed and after-polished PEEK substrates. Finally, the potential of this technique to fabricate 3D conformal electronics was demonstrated.
{"title":"Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method","authors":"Liexin Wu, Li Meng, Yue-yun Wang, Mingli Lv, Taoyuan Ouyang, Yilin Wang, X. Zeng","doi":"10.1088/2631-7990/acd826","DOIUrl":"https://doi.org/10.1088/2631-7990/acd826","url":null,"abstract":"Additive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature, high conductivity and high resolution remains a challenge. In this paper, a hybrid AM method combining the fused deposition modeling (FDM) and hydrophobic treatment assisted laser activation metallization (LAM) was proposed for manufacturing the polyetheretherketone (PEEK)-based 3D electronics, by which the conformal copper patterns were deposited on the 3D-printed PEEK parts, and the adhesion between them reached the 5B high level. Moreover, the 3D components could support the thermal cycling test from −55 °C to 125 °C for more than 100 cycles. Particularly, the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface, not affected by the inevitable printing borders and pores in the FDM-printed parts, then making the resolution of the electroless plated copper lines improved significantly. In consequence, Cu lines with width and spacing of only 60 µm and 100 µm were obtained on both as-printed and after-polished PEEK substrates. Finally, the potential of this technique to fabricate 3D conformal electronics was demonstrated.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"34 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89181249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Optical fibers are typically used in telecommunications services for data transmission, where the use of fiber tags is essential to distinguish between the different transmission fibers or channels and thus ensure the working functionality of the communication system. Traditional physical entity marking methods for fiber labeling are bulky, easily confused, and, most importantly, the label information can be accessed easily by all potential users. This work proposes an encrypted optical fiber tag based on an encoded fiber Bragg grating (FBG) array that is fabricated using a point-by-point femtosecond laser pulse chain inscription method. Gratings with different resonant wavelengths and reflectivities are realized by adjusting the grating period and the refractive index modulations. It is demonstrated that a binary data sequence carried by a fiber tag can be inscribed into the fiber core in the form of an FBG array, and the tag data can be encrypted through appropriate design of the spatial distributions of the FBGs with various reflection wavelengths and reflectivities. The proposed fiber tag technology can be used for applications in port identification, encrypted data storage, and transmission in fiber networks.
{"title":"Encrypted optical fiber tag based on encoded fiber Bragg grating array","authors":"Zhihao Cai, Bozhe Li, Zhiyong Bai, Dejun Liu, Kaiming Yang, Bonan Liu, Cong Zhao, Mengqiang Zou, Jie Zhou, Shan Jiang, Jingyi Huang, Li Liu, Xuming Zhang, Junle Qu, Yiping Wang, C. Liao","doi":"10.1088/2631-7990/acd825","DOIUrl":"https://doi.org/10.1088/2631-7990/acd825","url":null,"abstract":"Optical fibers are typically used in telecommunications services for data transmission, where the use of fiber tags is essential to distinguish between the different transmission fibers or channels and thus ensure the working functionality of the communication system. Traditional physical entity marking methods for fiber labeling are bulky, easily confused, and, most importantly, the label information can be accessed easily by all potential users. This work proposes an encrypted optical fiber tag based on an encoded fiber Bragg grating (FBG) array that is fabricated using a point-by-point femtosecond laser pulse chain inscription method. Gratings with different resonant wavelengths and reflectivities are realized by adjusting the grating period and the refractive index modulations. It is demonstrated that a binary data sequence carried by a fiber tag can be inscribed into the fiber core in the form of an FBG array, and the tag data can be encrypted through appropriate design of the spatial distributions of the FBGs with various reflection wavelengths and reflectivities. The proposed fiber tag technology can be used for applications in port identification, encrypted data storage, and transmission in fiber networks.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"6 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80750084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-04DOI: 10.1088/2631-7990/acd285
Ziqi Gao, J. Yin, P. Liu, Qi Li, Runan Zhang, Huayong Yang, Hongzhao Zhou
In order to mimic the natural heterogeneity of native tissue and provide a better microenvironment for cell culturing, multi-material bioprinting has become a common solution to construct tissue models in vitro. With the embedded printing method, complex 3D structure can be printed using soft biomaterials with reasonable shape fidelity. However, the current sequential multi-material embedded printing method faces a major challenge, which is the inevitable trade-off between the printed structural integrity and printing precision. Here, we propose a simultaneous multi-material embedded printing method. With this method, we can easily print firmly attached and high-precision multilayer structures. With multiple individually controlled nozzles, different biomaterials can be precisely deposited into a single crevasse, minimizing uncontrolled squeezing and guarantees no contamination of embedding medium within the structure. We analyse the dynamics of the extruded bioink in the embedding medium both analytically and experimentally, and quantitatively evaluate the effects of printing parameters including printing speed and rheology of embedding medium, on the 3D morphology of the printed filament. We demonstrate the printing of double-layer thin-walled structures, each layer less than 200 μm, as well as intestine and liver models with 5% gelatin methacryloyl that are crosslinked and extracted from the embedding medium without significant impairment or delamination. The peeling test further proves that the proposed method offers better structural integrity than conventional sequential printing methods. The proposed simultaneous multi-material embedded printing method can serve as a powerful tool to support the complex heterogeneous structure fabrication and open unique prospects for personalized medicine.
{"title":"Simultaneous multi-material embedded printing for 3D heterogeneous structures","authors":"Ziqi Gao, J. Yin, P. Liu, Qi Li, Runan Zhang, Huayong Yang, Hongzhao Zhou","doi":"10.1088/2631-7990/acd285","DOIUrl":"https://doi.org/10.1088/2631-7990/acd285","url":null,"abstract":"In order to mimic the natural heterogeneity of native tissue and provide a better microenvironment for cell culturing, multi-material bioprinting has become a common solution to construct tissue models in vitro. With the embedded printing method, complex 3D structure can be printed using soft biomaterials with reasonable shape fidelity. However, the current sequential multi-material embedded printing method faces a major challenge, which is the inevitable trade-off between the printed structural integrity and printing precision. Here, we propose a simultaneous multi-material embedded printing method. With this method, we can easily print firmly attached and high-precision multilayer structures. With multiple individually controlled nozzles, different biomaterials can be precisely deposited into a single crevasse, minimizing uncontrolled squeezing and guarantees no contamination of embedding medium within the structure. We analyse the dynamics of the extruded bioink in the embedding medium both analytically and experimentally, and quantitatively evaluate the effects of printing parameters including printing speed and rheology of embedding medium, on the 3D morphology of the printed filament. We demonstrate the printing of double-layer thin-walled structures, each layer less than 200 μm, as well as intestine and liver models with 5% gelatin methacryloyl that are crosslinked and extracted from the embedding medium without significant impairment or delamination. The peeling test further proves that the proposed method offers better structural integrity than conventional sequential printing methods. The proposed simultaneous multi-material embedded printing method can serve as a powerful tool to support the complex heterogeneous structure fabrication and open unique prospects for personalized medicine.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"25 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-05-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85929042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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