Pub Date : 2023-08-08DOI: 10.1088/2631-7990/acee2e
Kui Zhou, Ziqi Jia, Xin-Qi Ma, Wenbiao Niu, Yao Zhou, Ning Huang, Guanglong Ding, Yan Yan, Su‐Ting Han, Vellaisamy A. L. Roy, Ye Zhou
Neuromorphic computing systems can perform memory and computing tasks in parallel on artificial synaptic devices through simulating synaptic functions, which is promising for breaking the conventional von Neumann bottlenecks at hardware level. Artificial optoelectronic synapses enable the synergistic coupling between optical and electrical signals in synaptic modulation, which opens up an innovative path for effective neuromorphic systems. With the advantages of high mobility, optical transparency, ultrawideband tunability, and environmental stability, graphene has attracted tremendous interest for electronic and optoelectronic applications. Recent progress highlights the significance of implementing graphene into artificial synaptic devices. Herein, to better understand the potential of graphene-based synaptic devices, the fabrication technologies of graphene are first presented. Then, the roles of graphene in various synaptic devices are demonstrated. Furthermore, their typical optoelectronic applications in neuromorphic systems are reviewed. Finally, outlooks for development of synaptic devices based on graphene are proposed. This review will provide a comprehensive understanding of graphene fabrication technologies and graphene-based synaptic device for optoelectronic applications, also present an outlook for development of graphene-based synaptic device in future neuromorphic systems.
{"title":"Manufacturing of graphene based synaptic devices for optoelectronic applications","authors":"Kui Zhou, Ziqi Jia, Xin-Qi Ma, Wenbiao Niu, Yao Zhou, Ning Huang, Guanglong Ding, Yan Yan, Su‐Ting Han, Vellaisamy A. L. Roy, Ye Zhou","doi":"10.1088/2631-7990/acee2e","DOIUrl":"https://doi.org/10.1088/2631-7990/acee2e","url":null,"abstract":"Neuromorphic computing systems can perform memory and computing tasks in parallel on artificial synaptic devices through simulating synaptic functions, which is promising for breaking the conventional von Neumann bottlenecks at hardware level. Artificial optoelectronic synapses enable the synergistic coupling between optical and electrical signals in synaptic modulation, which opens up an innovative path for effective neuromorphic systems. With the advantages of high mobility, optical transparency, ultrawideband tunability, and environmental stability, graphene has attracted tremendous interest for electronic and optoelectronic applications. Recent progress highlights the significance of implementing graphene into artificial synaptic devices. Herein, to better understand the potential of graphene-based synaptic devices, the fabrication technologies of graphene are first presented. Then, the roles of graphene in various synaptic devices are demonstrated. Furthermore, their typical optoelectronic applications in neuromorphic systems are reviewed. Finally, outlooks for development of synaptic devices based on graphene are proposed. This review will provide a comprehensive understanding of graphene fabrication technologies and graphene-based synaptic device for optoelectronic applications, also present an outlook for development of graphene-based synaptic device in future neuromorphic systems.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"307 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74205518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-20DOI: 10.1088/2631-7990/ace944
Yiling Lian, Lan Jiang, Jingya Sun, Jiadong Zhou, Yao Zhou
Understanding laser induced ultrafast processes with complex three-dimensional (3D) geometries and extreme property evolution offers a unique opportunity to explore novel physical phenomena and to overcome the manufacturing limitations. Ultrafast imaging offers exceptional spatiotemporal resolution and thus has been considered an effective tool. However, in conventional single-view imaging techniques, 3D information is projected on a two-dimensional plane, which leads to significant information loss that is detrimental to understanding the full ultrafast process. Here, we propose a quasi-3D imaging method to describe the ultrafast process and further analyze spatial asymmetries of laser induced plasma. Orthogonally polarized laser pulses are adopted to illuminate reflection-transmission views, and binarization techniques are employed to extract contours, forming the corresponding two-dimensional matrix. By rotating and multiplying the two-dimensional contour matrices obtained from the dual views, a quasi-3D image can be reconstructed. This successfully reveals dual-phase transition mechanisms and elucidates the diffraction phenomena occurring outside the plasma. Furthermore, the quasi-3D image confirms the spatial asymmetries of the picosecond plasma, which is difficult to achieve with two-dimensional images. Our findings demonstrate that quasi-3D imaging not only offers a more comprehensive understanding of plasma dynamics than previous imaging methods, but also has wide potential in revealing various complex ultrafast phenomena in related fields including strong-field physics, fluid dynamics, and cutting-edge manufacturing.
{"title":"Ultrafast quasi-three-dimensional imaging","authors":"Yiling Lian, Lan Jiang, Jingya Sun, Jiadong Zhou, Yao Zhou","doi":"10.1088/2631-7990/ace944","DOIUrl":"https://doi.org/10.1088/2631-7990/ace944","url":null,"abstract":"Understanding laser induced ultrafast processes with complex three-dimensional (3D) geometries and extreme property evolution offers a unique opportunity to explore novel physical phenomena and to overcome the manufacturing limitations. Ultrafast imaging offers exceptional spatiotemporal resolution and thus has been considered an effective tool. However, in conventional single-view imaging techniques, 3D information is projected on a two-dimensional plane, which leads to significant information loss that is detrimental to understanding the full ultrafast process. Here, we propose a quasi-3D imaging method to describe the ultrafast process and further analyze spatial asymmetries of laser induced plasma. Orthogonally polarized laser pulses are adopted to illuminate reflection-transmission views, and binarization techniques are employed to extract contours, forming the corresponding two-dimensional matrix. By rotating and multiplying the two-dimensional contour matrices obtained from the dual views, a quasi-3D image can be reconstructed. This successfully reveals dual-phase transition mechanisms and elucidates the diffraction phenomena occurring outside the plasma. Furthermore, the quasi-3D image confirms the spatial asymmetries of the picosecond plasma, which is difficult to achieve with two-dimensional images. Our findings demonstrate that quasi-3D imaging not only offers a more comprehensive understanding of plasma dynamics than previous imaging methods, but also has wide potential in revealing various complex ultrafast phenomena in related fields including strong-field physics, fluid dynamics, and cutting-edge manufacturing.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"25 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85246276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-18DOI: 10.1088/2631-7990/ace863
Dezhi Zhou, B. Dou, F. Kroh, Chuqian Wang, Liliang Ouyang
The introduction of living cells to manufacturing process has enabled the engineering of complex biological tissues in vitro. The recent advances in biofabrication with extremely high resolution (e.g. at single cell level) have greatly enhanced this capacity and opened new avenues for tissue engineering. In this review, we comprehensively overview the current biofabrication strategies with single-cell resolution and categorize them based on the dimension of the single-cell building blocks, i.e. zero-dimensional single-cell droplets, one-dimensional single-cell filaments and two-dimensional single-cell sheets. We provide an informative introduction to the most recent advances in these approaches (e.g. cell trapping, bioprinting, electrospinning, microfluidics and cell sheets) and further illustrated how they can be used in in vitro tissue modelling and regenerative medicine. We highlight the significance of single-cell-level biofabrication and discuss the challenges and opportunities in the field.
{"title":"Biofabrication strategies with single-cell resolution: a review","authors":"Dezhi Zhou, B. Dou, F. Kroh, Chuqian Wang, Liliang Ouyang","doi":"10.1088/2631-7990/ace863","DOIUrl":"https://doi.org/10.1088/2631-7990/ace863","url":null,"abstract":"The introduction of living cells to manufacturing process has enabled the engineering of complex biological tissues in vitro. The recent advances in biofabrication with extremely high resolution (e.g. at single cell level) have greatly enhanced this capacity and opened new avenues for tissue engineering. In this review, we comprehensively overview the current biofabrication strategies with single-cell resolution and categorize them based on the dimension of the single-cell building blocks, i.e. zero-dimensional single-cell droplets, one-dimensional single-cell filaments and two-dimensional single-cell sheets. We provide an informative introduction to the most recent advances in these approaches (e.g. cell trapping, bioprinting, electrospinning, microfluidics and cell sheets) and further illustrated how they can be used in in vitro tissue modelling and regenerative medicine. We highlight the significance of single-cell-level biofabrication and discuss the challenges and opportunities in the field.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"18 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90702012","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-11DOI: 10.1088/2631-7990/ace669
Chi Zhang, Junqing Zhao, Zhi Zhang, Tianzhao Bu, Guoxu Liu, Xianpeng Fu
Tribotronics is an emerging research field that focuses on the coupling of triboelectricity and semiconductors. In this review, we summarise and explore three branches of tribotronics. Firstly, we introduce the tribovoltaic effect, which involves direct-current power generation through mechanical friction on semiconductor interfaces. This effect offers significant advantages in terms of high power density compared to traditional insulator-based triboelectric nanogenerators. Secondly, we elaborate on triboelectric modulation, which utilises the triboelectric potential on field-effect transistors. This approach enables active mechanosensation and nanoscale tactile perception. Additionally, we present triboelectric management, which aims to improve energy supply efficiency using semiconductor device technology. This strategy provides an effective microenergy solution for sensors and microsystems. For the interactions between triboelectricity and semiconductors, the research of tribotronics has exhibited the electronics of interfacial friction systems, and the triboelectric technology by electronics. This review demonstrates the promising prospects of tribotronics in the development of new functional devices and self-powered microsystems for intelligent manufacturing, robotic sensing, and the industrial Internet of Things.
{"title":"Tribotronics: an emerging field by coupling triboelectricity and semiconductors","authors":"Chi Zhang, Junqing Zhao, Zhi Zhang, Tianzhao Bu, Guoxu Liu, Xianpeng Fu","doi":"10.1088/2631-7990/ace669","DOIUrl":"https://doi.org/10.1088/2631-7990/ace669","url":null,"abstract":"Tribotronics is an emerging research field that focuses on the coupling of triboelectricity and semiconductors. In this review, we summarise and explore three branches of tribotronics. Firstly, we introduce the tribovoltaic effect, which involves direct-current power generation through mechanical friction on semiconductor interfaces. This effect offers significant advantages in terms of high power density compared to traditional insulator-based triboelectric nanogenerators. Secondly, we elaborate on triboelectric modulation, which utilises the triboelectric potential on field-effect transistors. This approach enables active mechanosensation and nanoscale tactile perception. Additionally, we present triboelectric management, which aims to improve energy supply efficiency using semiconductor device technology. This strategy provides an effective microenergy solution for sensors and microsystems. For the interactions between triboelectricity and semiconductors, the research of tribotronics has exhibited the electronics of interfacial friction systems, and the triboelectric technology by electronics. This review demonstrates the promising prospects of tribotronics in the development of new functional devices and self-powered microsystems for intelligent manufacturing, robotic sensing, and the industrial Internet of Things.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"30 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79915848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-11DOI: 10.1088/2631-7990/ace668
Xiang Li, Wei Peng, Wenwang Wu, Jian Xiong, Yang Lu
Auxetic mechanical metamaterials are artificially architected materials that possess negative Poisson’s ratio, demonstrating transversal contracting deformation under external vertical compression loading. Their physical properties are mainly determined by spatial topological configurations. Traditionally, classical auxetic mechanical metamaterials exhibit relatively lower mechanical stiffness, compared to classic stretching dominated architectures. Nevertheless, in recent years, several novel auxetic mechanical metamaterials with high stiffness have been designed and proposed for energy absorption, load-bearing, and thermal-mechanical coupling applications. In this paper, mechanical design methods for designing auxetic structures with soft and stiff mechanical behavior are summarized and classified. For soft auxetic mechanical metamaterials, classic methods, such as using soft basic material, hierarchical design, tensile braided design, and curved ribs, are proposed. In comparison, for stiff auxetic mechanical metamaterials, design schemes, such as hard base material, hierarchical design, composite design, and adding additional load-bearing ribs, are proposed. Multi-functional applications of soft and stiff auxetic mechanical metamaterials are then reviewed. We hope this study could provide some guidelines for designing programmed auxetics with specified mechanical stiffness and deformation abilities according to demand.
{"title":"Auxetic mechanical metamaterials: from soft to stiff","authors":"Xiang Li, Wei Peng, Wenwang Wu, Jian Xiong, Yang Lu","doi":"10.1088/2631-7990/ace668","DOIUrl":"https://doi.org/10.1088/2631-7990/ace668","url":null,"abstract":"Auxetic mechanical metamaterials are artificially architected materials that possess negative Poisson’s ratio, demonstrating transversal contracting deformation under external vertical compression loading. Their physical properties are mainly determined by spatial topological configurations. Traditionally, classical auxetic mechanical metamaterials exhibit relatively lower mechanical stiffness, compared to classic stretching dominated architectures. Nevertheless, in recent years, several novel auxetic mechanical metamaterials with high stiffness have been designed and proposed for energy absorption, load-bearing, and thermal-mechanical coupling applications. In this paper, mechanical design methods for designing auxetic structures with soft and stiff mechanical behavior are summarized and classified. For soft auxetic mechanical metamaterials, classic methods, such as using soft basic material, hierarchical design, tensile braided design, and curved ribs, are proposed. In comparison, for stiff auxetic mechanical metamaterials, design schemes, such as hard base material, hierarchical design, composite design, and adding additional load-bearing ribs, are proposed. Multi-functional applications of soft and stiff auxetic mechanical metamaterials are then reviewed. We hope this study could provide some guidelines for designing programmed auxetics with specified mechanical stiffness and deformation abilities according to demand.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"69 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86728032","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Textile electronics have become an indispensable part of wearable applications because of their large flexibility, light-weight, comfort and electronic functionality upon the merge of textiles and microelectronics. As a result, the fabrication of functional fibrous materials and the integration of textile electronic devices have attracted increasing interest in the wearable electronic community. Challenges are encountered in the development of textile electronics in a way that is electrically reliable and durable, without compromising on the deformability and comfort of a garment, including processing multiple materials with great mismatches in mechanical, thermal, and electrical properties and assembling various structures with the disparity in dimensional scales and surface roughness. Equal challenges lie in high-quality and cost-effective processes facilitated by high-level digital technology enabled design and manufacturing methods. This work reviews the manufacturing of textile-shaped electronics via the processing of functional fibrous materials from the perspective of hierarchical architectures, and discusses the heterogeneous integration of microelectronics into normal textiles upon the fabric circuit board and adapted electrical connections, broadly covering both conventional and advanced textile electronic production processes. We summarize the applications and obstacles of textile electronics explored so far in sensors, actuators, thermal management, energy fields, and displays. Finally, the main conclusions and outlook are provided while the remaining challenges of the fabrication and application of textile electronics are emphasized.
{"title":"Textile electronics for wearable applications","authors":"Junhong Pu, Kitming Ma, Yonghui Luo, Shengyang Tang, Tongyao Liu, Jin Liu, Manyui Leung, Jing Yang, Ruomu Hui, Ying Xiong, Xiaoming Tao","doi":"10.1088/2631-7990/ace66a","DOIUrl":"https://doi.org/10.1088/2631-7990/ace66a","url":null,"abstract":"Textile electronics have become an indispensable part of wearable applications because of their large flexibility, light-weight, comfort and electronic functionality upon the merge of textiles and microelectronics. As a result, the fabrication of functional fibrous materials and the integration of textile electronic devices have attracted increasing interest in the wearable electronic community. Challenges are encountered in the development of textile electronics in a way that is electrically reliable and durable, without compromising on the deformability and comfort of a garment, including processing multiple materials with great mismatches in mechanical, thermal, and electrical properties and assembling various structures with the disparity in dimensional scales and surface roughness. Equal challenges lie in high-quality and cost-effective processes facilitated by high-level digital technology enabled design and manufacturing methods. This work reviews the manufacturing of textile-shaped electronics via the processing of functional fibrous materials from the perspective of hierarchical architectures, and discusses the heterogeneous integration of microelectronics into normal textiles upon the fabric circuit board and adapted electrical connections, broadly covering both conventional and advanced textile electronic production processes. We summarize the applications and obstacles of textile electronics explored so far in sensors, actuators, thermal management, energy fields, and displays. Finally, the main conclusions and outlook are provided while the remaining challenges of the fabrication and application of textile electronics are emphasized.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"76 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83900397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-07DOI: 10.1088/2631-7990/ace56c
Hui Zhu, Cong Yao, Bo-yuan Wei, Chenyu Xu, Xinxin Huang, Yan Liu, Jiankang He, Jianning Zhang, Dichen Li
Three-dimensional (3D) printing technology has opened a new paradigm to controllably and reproducibly fabricate bioengineered neural constructs for potential applications in repairing injured nervous tissues or producing in vitro nervous tissue models. However, the complexity of nervous tissues poses great challenges to 3D-printed bioengineered analogues, which should possess diverse architectural/chemical/electrical functionalities to resemble the native growth microenvironments for functional neural regeneration. In this work, we provide a state-of-the-art review of the latest development of 3D printing for bioengineered neural constructs. Various 3D printing techniques for neural tissue-engineered scaffolds or living cell-laden constructs are summarized and compared in terms of their unique advantages. We highlight the advanced strategies by integrating topographical, biochemical and electroactive cues inside 3D-printed neural constructs to replicate in vivo-like microenvironment for functional neural regeneration. The typical applications of 3D-printed bioengineered constructs for in vivo repair of injured nervous tissues, bio-electronics interfacing with native nervous system, neural-on-chips as well as brain-like tissue models are demonstrated. The challenges and future outlook associated with 3D printing for functional neural constructs in various categories are discussed.
{"title":"3D printing of functional bioengineered constructs for neural regeneration: a review","authors":"Hui Zhu, Cong Yao, Bo-yuan Wei, Chenyu Xu, Xinxin Huang, Yan Liu, Jiankang He, Jianning Zhang, Dichen Li","doi":"10.1088/2631-7990/ace56c","DOIUrl":"https://doi.org/10.1088/2631-7990/ace56c","url":null,"abstract":"Three-dimensional (3D) printing technology has opened a new paradigm to controllably and reproducibly fabricate bioengineered neural constructs for potential applications in repairing injured nervous tissues or producing in vitro nervous tissue models. However, the complexity of nervous tissues poses great challenges to 3D-printed bioengineered analogues, which should possess diverse architectural/chemical/electrical functionalities to resemble the native growth microenvironments for functional neural regeneration. In this work, we provide a state-of-the-art review of the latest development of 3D printing for bioengineered neural constructs. Various 3D printing techniques for neural tissue-engineered scaffolds or living cell-laden constructs are summarized and compared in terms of their unique advantages. We highlight the advanced strategies by integrating topographical, biochemical and electroactive cues inside 3D-printed neural constructs to replicate in vivo-like microenvironment for functional neural regeneration. The typical applications of 3D-printed bioengineered constructs for in vivo repair of injured nervous tissues, bio-electronics interfacing with native nervous system, neural-on-chips as well as brain-like tissue models are demonstrated. The challenges and future outlook associated with 3D printing for functional neural constructs in various categories are discussed.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"21 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84957866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
As Moore’s law deteriorates, the research and development of new materials system are crucial for transitioning into the post Moore era. Traditional semiconductor materials, such as silicon, have served as the cornerstone of modern technologies for over half a century. This has been due to extensive research and engineering on new techniques to continuously enrich silicon-based materials system and, subsequently, to develop better performed silicon-based devices. Meanwhile, in the emerging post Moore era, layered semiconductor materials, such as transition metal dichalcogenides (TMDs), have garnered considerable research interest due to their unique electronic and optoelectronic properties, which hold great promise for powering the new era of next generation electronics. As a result, techniques for engineering the properties of layered semiconductors have expanded the possibilities of layered semiconductor-based devices. However, there remain significant limitations in the synthesis and engineering of layered semiconductors, impeding the utilization of layered semiconductor-based devices for mass applications. As a practical alternative, heterogeneous integration between layered and traditional semiconductors provides valuable opportunities to combine the distinctive properties of layered semiconductors with well-developed traditional semiconductors materials system. Here, we provide an overview of the comparative coherence between layered and traditional semiconductors, starting with TMDs as the representation of layered semiconductors. We highlight the meaningful opportunities presented by the heterogeneous integration of layered semiconductors with traditional semiconductors, representing an optimal strategy poised to propel the emerging semiconductor research community and chip industry towards unprecedented advancements in the coming decades.
{"title":"Comparative coherence between layered and traditional semiconductors: unique opportunities for heterogeneous integration","authors":"Zhuofan Chen, Xiaonan Deng, Simian Zhang, Yuqi Wang, Yifei Wu, Shengxian Ke, Junshang Zhang, Fucheng Liu, Jianing Liu, Yingjie Liu, Yuchun Lin, A. Hanna, Zhengcao Li, Chen Wang","doi":"10.1088/2631-7990/ace501","DOIUrl":"https://doi.org/10.1088/2631-7990/ace501","url":null,"abstract":"As Moore’s law deteriorates, the research and development of new materials system are crucial for transitioning into the post Moore era. Traditional semiconductor materials, such as silicon, have served as the cornerstone of modern technologies for over half a century. This has been due to extensive research and engineering on new techniques to continuously enrich silicon-based materials system and, subsequently, to develop better performed silicon-based devices. Meanwhile, in the emerging post Moore era, layered semiconductor materials, such as transition metal dichalcogenides (TMDs), have garnered considerable research interest due to their unique electronic and optoelectronic properties, which hold great promise for powering the new era of next generation electronics. As a result, techniques for engineering the properties of layered semiconductors have expanded the possibilities of layered semiconductor-based devices. However, there remain significant limitations in the synthesis and engineering of layered semiconductors, impeding the utilization of layered semiconductor-based devices for mass applications. As a practical alternative, heterogeneous integration between layered and traditional semiconductors provides valuable opportunities to combine the distinctive properties of layered semiconductors with well-developed traditional semiconductors materials system. Here, we provide an overview of the comparative coherence between layered and traditional semiconductors, starting with TMDs as the representation of layered semiconductors. We highlight the meaningful opportunities presented by the heterogeneous integration of layered semiconductors with traditional semiconductors, representing an optimal strategy poised to propel the emerging semiconductor research community and chip industry towards unprecedented advancements in the coming decades.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"09 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86173880","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-07-06DOI: 10.1088/2631-7990/ace090
Zhiyang Lyu, Jinlan Wang, Y. Chen
Four-dimensional printing allows for the transformation capabilities of 3D-printed architectures over time, altering their shape, properties, or function when exposed to external stimuli. This interdisciplinary technology endows the 3D architectures with unique functionalities, which has generated excitement in diverse research fields, such as soft robotics, biomimetics, biomedical devices, and sensors. Understanding the selection of the material, architectural designs, and employed stimuli is crucial to unlocking the potential of smart customization with 4D printing. This review summarizes recent significant developments in 4D printing and establishes links between smart materials, 3D printing techniques, programmable structures, diversiform stimulus, and new functionalities for multidisciplinary applications. We start by introducing the advanced features of 4D printing and the key technological roadmap for its implementation. We then place considerable emphasis on printable smart materials and structural designs, as well as general approaches to designing programmable structures. We also review stimulus designs in smart materials and their associated stimulus-responsive mechanisms. Finally, we discuss new functionalities of 4D printing for potential applications and further development directions.
{"title":"4D printing: interdisciplinary integration of smart materials, structural design, and new functionality","authors":"Zhiyang Lyu, Jinlan Wang, Y. Chen","doi":"10.1088/2631-7990/ace090","DOIUrl":"https://doi.org/10.1088/2631-7990/ace090","url":null,"abstract":"Four-dimensional printing allows for the transformation capabilities of 3D-printed architectures over time, altering their shape, properties, or function when exposed to external stimuli. This interdisciplinary technology endows the 3D architectures with unique functionalities, which has generated excitement in diverse research fields, such as soft robotics, biomimetics, biomedical devices, and sensors. Understanding the selection of the material, architectural designs, and employed stimuli is crucial to unlocking the potential of smart customization with 4D printing. This review summarizes recent significant developments in 4D printing and establishes links between smart materials, 3D printing techniques, programmable structures, diversiform stimulus, and new functionalities for multidisciplinary applications. We start by introducing the advanced features of 4D printing and the key technological roadmap for its implementation. We then place considerable emphasis on printable smart materials and structural designs, as well as general approaches to designing programmable structures. We also review stimulus designs in smart materials and their associated stimulus-responsive mechanisms. Finally, we discuss new functionalities of 4D printing for potential applications and further development directions.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"82 5 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80059052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-06-30DOI: 10.1088/2631-7990/acdf2d
Shiqi Hu, Xiao Huan, Yu Liu, Sixi Cao, Zhuoran Wang, Ji Tae Kim
The continual demand for modern optoelectronics with a high integration degree and customized functions has increased requirements for nanofabrication methods with high resolution, freeform, and mask-free. Meniscus-on-demand three-dimensional (3D) printing is a high-resolution additive manufacturing technique that exploits the ink meniscus formed on a printer nozzle and is suitable for the fabrication of micro/nanoscale 3D architectures. This method can be used for solution-processed 3D patterning of materials at a resolution of up to 100 nm, which provides an excellent platform for fundamental scientific studies and various practical applications. This review presents recent advances in meniscus-on-demand 3D printing, together with historical perspectives and theoretical background on meniscus formation and stability. Moreover, this review highlights the capabilities of meniscus-on-demand 3D printing in terms of printable materials and potential areas of application, such as electronics and photonics.
{"title":"Recent advances in meniscus-on-demand three-dimensional micro- and nano-printing for electronics and photonics","authors":"Shiqi Hu, Xiao Huan, Yu Liu, Sixi Cao, Zhuoran Wang, Ji Tae Kim","doi":"10.1088/2631-7990/acdf2d","DOIUrl":"https://doi.org/10.1088/2631-7990/acdf2d","url":null,"abstract":"The continual demand for modern optoelectronics with a high integration degree and customized functions has increased requirements for nanofabrication methods with high resolution, freeform, and mask-free. Meniscus-on-demand three-dimensional (3D) printing is a high-resolution additive manufacturing technique that exploits the ink meniscus formed on a printer nozzle and is suitable for the fabrication of micro/nanoscale 3D architectures. This method can be used for solution-processed 3D patterning of materials at a resolution of up to 100 nm, which provides an excellent platform for fundamental scientific studies and various practical applications. This review presents recent advances in meniscus-on-demand 3D printing, together with historical perspectives and theoretical background on meniscus formation and stability. Moreover, this review highlights the capabilities of meniscus-on-demand 3D printing in terms of printable materials and potential areas of application, such as electronics and photonics.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"86 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89117269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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