Pub Date : 2024-07-12DOI: 10.1088/2631-7990/ad62c6
Xingyu Bai, Daixu Wang, Liyun Zhen, Meng Cui, Jingquan Liu, Ning Zhao, Chengkuo Lee, Bin Yang
Piezoelectric ultrasonic transducers have shown great potential in biomedical applications due to their high acoustic-to-electric conversion efficiency and large power capacity. The focusing technique enables the transducer to produce an extremely narrow beam, greatly improving the resolution and sensitivity. In this work, we summarize the fundamental properties and biological effects of the ultrasound field, aiming to establish a correlation for device design and application. Focusing techniques for piezoelectric transducers are highlighted, including material selection and fabrication methods, which determine the final performance of piezoelectric transducers. Numerous examples from ultrasound imaging, neuromodulation, tumor ablation to ultrasonic wireless energy transfer are summarized to highlight the great promise of biomedical applications. Finally, the challenges and opportunities of focused ultrasound transducers are presented. The aim of this review is to bridge the gap between focused ultrasound systems and biomedical applications.
{"title":"Design and micromanufacturing technologies of focused piezoelectric ultrasound transducers for biomedical applications","authors":"Xingyu Bai, Daixu Wang, Liyun Zhen, Meng Cui, Jingquan Liu, Ning Zhao, Chengkuo Lee, Bin Yang","doi":"10.1088/2631-7990/ad62c6","DOIUrl":"https://doi.org/10.1088/2631-7990/ad62c6","url":null,"abstract":"\u0000 Piezoelectric ultrasonic transducers have shown great potential in biomedical applications due to their high acoustic-to-electric conversion efficiency and large power capacity. The focusing technique enables the transducer to produce an extremely narrow beam, greatly improving the resolution and sensitivity. In this work, we summarize the fundamental properties and biological effects of the ultrasound field, aiming to establish a correlation for device design and application. Focusing techniques for piezoelectric transducers are highlighted, including material selection and fabrication methods, which determine the final performance of piezoelectric transducers. Numerous examples from ultrasound imaging, neuromodulation, tumor ablation to ultrasonic wireless energy transfer are summarized to highlight the great promise of biomedical applications. Finally, the challenges and opportunities of focused ultrasound transducers are presented. The aim of this review is to bridge the gap between focused ultrasound systems and biomedical applications.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":16.1,"publicationDate":"2024-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141653789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-24DOI: 10.1088/2631-7990/ad5084
Luhao Yuan, Dongdong Gu, Xin Liu, Keyu Shi, Kaijie Lin, He Liu, Han Zhang, D. Dai, Jianfeng Sun, Wenxin Chen, Jie Wang
Lightweight porous materials with high load-bearing, damage tolerance and energy absorption as well as intelligence of shape recovery after material deformation are beneficial and critical for many applications, e.g., aerospace, automobiles, electronics, etc. Cuttlebone produced in the cuttlefish has evolved vertical walls with the optimal corrugation gradient, enabling stress homogenization, significant load bearing, and damage tolerance to protect the organism from high external pressures in the deep sea. This work illustrated that the complex hybrid wave shape in cuttlebone walls, becoming more tortuous from bottom to top, creates a lightweight, load-bearing structure with progressive failure. By mimicking the cuttlebone, a novel bionic hybrid structure (BHS) was proposed, and as a comparison, a regular corrugated structure (RCS) and a straight wall structure (SWS) were designed. Three types of designed structures have been successfully manufactured by laser powder bed fusion with NiTi powder. The LPBF-processed BHS exhibited a total porosity of 0.042% and a good dimensional accuracy with a peak deviation of 17.4 μm. Microstructural analysis indicated that the LPBF-processed BHS had a strong (001) crystallographic orientation and an average size of 9.85 μm. Mechanical analysis revealed the LPBF-processed BHS could withstand over 25 000 times its weight without significant deformation and had the highest specific energy absorption value (5.32 J/g) due to the absence of stress concentration and progressive wall failure during compression. Cyclic compression testing showed that LPBF-processed BHS possessed superior viscoelastic and elasticity energy dissipation capacity. Importantly, the uniform reversible phase transition from martensite to austenite in the walls enables the structure to largely recover its pre-deformation shape when heated (over 99% recovery rate). These design strategies can serve as valuable references for the development of intelligent components that possess high mechanical efficiency and shape memory capabilities.
{"title":"Design and additive manufacturing of bionic hybrid structure inspired by cuttlebone to achieve superior mechanical properties and shape memory function","authors":"Luhao Yuan, Dongdong Gu, Xin Liu, Keyu Shi, Kaijie Lin, He Liu, Han Zhang, D. Dai, Jianfeng Sun, Wenxin Chen, Jie Wang","doi":"10.1088/2631-7990/ad5084","DOIUrl":"https://doi.org/10.1088/2631-7990/ad5084","url":null,"abstract":"\u0000 Lightweight porous materials with high load-bearing, damage tolerance and energy absorption as well as intelligence of shape recovery after material deformation are beneficial and critical for many applications, e.g., aerospace, automobiles, electronics, etc. Cuttlebone produced in the cuttlefish has evolved vertical walls with the optimal corrugation gradient, enabling stress homogenization, significant load bearing, and damage tolerance to protect the organism from high external pressures in the deep sea. This work illustrated that the complex hybrid wave shape in cuttlebone walls, becoming more tortuous from bottom to top, creates a lightweight, load-bearing structure with progressive failure. By mimicking the cuttlebone, a novel bionic hybrid structure (BHS) was proposed, and as a comparison, a regular corrugated structure (RCS) and a straight wall structure (SWS) were designed. Three types of designed structures have been successfully manufactured by laser powder bed fusion with NiTi powder. The LPBF-processed BHS exhibited a total porosity of 0.042% and a good dimensional accuracy with a peak deviation of 17.4 μm. Microstructural analysis indicated that the LPBF-processed BHS had a strong (001) crystallographic orientation and an average size of 9.85 μm. Mechanical analysis revealed the LPBF-processed BHS could withstand over 25 000 times its weight without significant deformation and had the highest specific energy absorption value (5.32 J/g) due to the absence of stress concentration and progressive wall failure during compression. Cyclic compression testing showed that LPBF-processed BHS possessed superior viscoelastic and elasticity energy dissipation capacity. Importantly, the uniform reversible phase transition from martensite to austenite in the walls enables the structure to largely recover its pre-deformation shape when heated (over 99% recovery rate). These design strategies can serve as valuable references for the development of intelligent components that possess high mechanical efficiency and shape memory capabilities.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141100278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
With the arrival of intelligent terminals, triboelectric nanogenerators (TENGs), as a new kind of energy converter, are considered one of the most important technologies for the next generation of intelligent electronics. As a self-powered sensor, it can greatly reduce the power consumption of the entire sensing system by transforming external mechanical energy to electricity. However, the fabrication method of triboelectric sensors largely determines their functionality and performance. This review provides an overview of various methods used to fabricate triboelectric sensors, with a focus on the processes of micro-electro-mechanical systems (MEMS) technology, three-dimensional (3D) printing, textile methods, template-assisted methods, and material synthesis methods for manufacturing. The working mechanisms and suitable application scenarios of various methods are outlined. Subsequently, the advantages and disadvantages of various methods are summarized, and reference schemes for the subsequent application of these methods are included. Finally, the opportunities and challenges faced by different methods are discussed, as well as their potential for application in various intelligent systems in the Internet of Things (IoT).
{"title":"Holistic and localized preparation methods for triboelectric sensors: principles, applications and perspectives","authors":"Zhenqiu Gao, Shaokuan Wu, Yihan Wei, Mervat Ibrahim, Hani Nasser Abdelhamid, Guyu Jiang, Jun Cao, Xuhui Sun, Zhen Wen","doi":"10.1088/2631-7990/ad4fca","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4fca","url":null,"abstract":"\u0000 With the arrival of intelligent terminals, triboelectric nanogenerators (TENGs), as a new kind of energy converter, are considered one of the most important technologies for the next generation of intelligent electronics. As a self-powered sensor, it can greatly reduce the power consumption of the entire sensing system by transforming external mechanical energy to electricity. However, the fabrication method of triboelectric sensors largely determines their functionality and performance. This review provides an overview of various methods used to fabricate triboelectric sensors, with a focus on the processes of micro-electro-mechanical systems (MEMS) technology, three-dimensional (3D) printing, textile methods, template-assisted methods, and material synthesis methods for manufacturing. The working mechanisms and suitable application scenarios of various methods are outlined. Subsequently, the advantages and disadvantages of various methods are summarized, and reference schemes for the subsequent application of these methods are included. Finally, the opportunities and challenges faced by different methods are discussed, as well as their potential for application in various intelligent systems in the Internet of Things (IoT).","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141105579","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The advent of the Internet of Things (IoT) has catalyzed wireless communication's evolution towards multi-band and multi-area utilization. Notably, forthcoming sixth-generation (6G) communication standards, incorporating terahertz (THz) frequencies alongside existing gigahertz (GHz) modes, drive the need for a versatile multi-band electromagnetic wave absorbing and shielding material. This study introduces a pivotal advance via a new strategy, called Ultrafast Laser-Induced Thermal-Chemical Transformation and Encapsulation of Nanoalloys (LITEN). Employing Multivariate Metal−Organic Frameworks (MTV-MOFs), this approach tailors a porous, multifunctional graphene-encased magnetic nanoalloy (GEMN). By fine-tuning pulse laser parameters and material components, the resulting GEMN excels in low-frequency absorption and THz shielding. GEMN achieves a breakthrough with a minimal reflection loss of -50.6 dB at the optimal low-frequency C-band (around 4.98 GHz). Computational evidence reinforces GEMN’ efficacy in reducing radar cross sections. Additionally, GEMN demonstrates superior electromagnetic interference (EMI) shielding, reaching 98.92 dB in the THz band, with an average terahertz shielding of 55.47 dB (0.1~2THz). These accomplishments underscore GEMN's potential for 6G signal shielding. In summary, LITEN yields the remarkable EM wave controlling performance, holding promise in both GHz and THz frequency domains. This contribution heralds a paradigm shift in EM absorption and shielding materials, establishing a universally applicable framework with profound implications for future pursuits.
{"title":"Laser-Forged Transformation and Encapsulation of Nanoalloys: Pioneering Robust Wideband Electromagnetic Wave Absorption and Shielding from GHz to THz","authors":"Shizhuo Zhang, Senlin Rao, Yunfan Li, Shuai Wang, Dingyue Sun, Feng Liu, G. Cheng","doi":"10.1088/2631-7990/ad4f31","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4f31","url":null,"abstract":"\u0000 The advent of the Internet of Things (IoT) has catalyzed wireless communication's evolution towards multi-band and multi-area utilization. Notably, forthcoming sixth-generation (6G) communication standards, incorporating terahertz (THz) frequencies alongside existing gigahertz (GHz) modes, drive the need for a versatile multi-band electromagnetic wave absorbing and shielding material. This study introduces a pivotal advance via a new strategy, called Ultrafast Laser-Induced Thermal-Chemical Transformation and Encapsulation of Nanoalloys (LITEN). Employing Multivariate Metal−Organic Frameworks (MTV-MOFs), this approach tailors a porous, multifunctional graphene-encased magnetic nanoalloy (GEMN). By fine-tuning pulse laser parameters and material components, the resulting GEMN excels in low-frequency absorption and THz shielding. GEMN achieves a breakthrough with a minimal reflection loss of -50.6 dB at the optimal low-frequency C-band (around 4.98 GHz). Computational evidence reinforces GEMN’ efficacy in reducing radar cross sections. Additionally, GEMN demonstrates superior electromagnetic interference (EMI) shielding, reaching 98.92 dB in the THz band, with an average terahertz shielding of 55.47 dB (0.1~2THz). These accomplishments underscore GEMN's potential for 6G signal shielding. In summary, LITEN yields the remarkable EM wave controlling performance, holding promise in both GHz and THz frequency domains. This contribution heralds a paradigm shift in EM absorption and shielding materials, establishing a universally applicable framework with profound implications for future pursuits.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141112431","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-22DOI: 10.1088/2631-7990/ad4f32
Zekun Li, Aifang Yu, Qing Zhang, Junyi Zhai
Triboelectric nanogenerators (TENGs), which can efficaciously convert high entropy energy in our daily lives into electricity, are a presumable and promising micro/nano energy source to drive a profusion of sensor nodes in the era of the Internet of Things. The TENG has been attracting a great deal of research attention since its inception and has been the subject of many striking developments, including defining the fundamental physical mechanisms, expanding application scenarios, and boosting surface charge density. Particularly, manufacturing TENGs with high surface charge density is crucial to further expanding their application range and accelerating their industrialization. Here, an overview of recent advances, including material optimization, circuit design, and strategy conjunction, in fabricating TENGs with high surface charge density is provided. In these topics, different strategies are retrospected in terms of enhancement mechanisms, merits, limitations, and technological development lines. Additionally, the current challenges in high-performance TENG research and the orientation of future endeavors in this field are discussed, which may shed new light on the next stage of TENG development.
三电纳米发电机(TENGs)可以有效地将我们日常生活中的高能量转化为电能,是物联网时代驱动大量传感器节点的一种前景广阔的微型/纳米能源。自诞生以来,TENG 一直备受研究关注,并取得了许多令人瞩目的发展,包括确定基本物理机制、拓展应用场景和提高表面电荷密度。特别是,制造具有高表面电荷密度的 TENG 对于进一步扩大其应用范围和加速其产业化至关重要。本文概述了制造高表面电荷密度 TENG 的最新进展,包括材料优化、电路设计和策略组合。在这些主题中,从增强机制、优点、局限性和技术发展路线等方面回顾了不同的策略。此外,还讨论了高性能 TENG 研究目前面临的挑战以及该领域未来努力的方向,这可能会为 TENG 的下一阶段发展带来新的启示。
{"title":"Recent Advances in Fabricating High-Performance Triboelectric Nanogenerators via Modulating Surface Charge Density","authors":"Zekun Li, Aifang Yu, Qing Zhang, Junyi Zhai","doi":"10.1088/2631-7990/ad4f32","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4f32","url":null,"abstract":"\u0000 Triboelectric nanogenerators (TENGs), which can efficaciously convert high entropy energy in our daily lives into electricity, are a presumable and promising micro/nano energy source to drive a profusion of sensor nodes in the era of the Internet of Things. The TENG has been attracting a great deal of research attention since its inception and has been the subject of many striking developments, including defining the fundamental physical mechanisms, expanding application scenarios, and boosting surface charge density. Particularly, manufacturing TENGs with high surface charge density is crucial to further expanding their application range and accelerating their industrialization. Here, an overview of recent advances, including material optimization, circuit design, and strategy conjunction, in fabricating TENGs with high surface charge density is provided. In these topics, different strategies are retrospected in terms of enhancement mechanisms, merits, limitations, and technological development lines. Additionally, the current challenges in high-performance TENG research and the orientation of future endeavors in this field are discussed, which may shed new light on the next stage of TENG development.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141111973","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-21DOI: 10.1088/2631-7990/ad4eb0
Lu Xu, Jingchao Tao, Zhuguo Li, Guo He, Dongshi Zhang
Exsolution, as an effective approach to construct particle-decorated interfaces, is still challenging to yield interfacial films rather than isolated particles. Inspired by in vivo near infrared laser photothermal therapy (PTT), using 3 mol.% Y2O3 stabilized tetragonal zirconia polycrystals (3Y-TZP) as host oxide matrix and iron-oxide (Fe3O4/γ-Fe2O3/α-Fe2O3) materials as photothermal modulator and exsolution resource, femtosecond laser ultrafast exsolution approach is presented enabling to conquer this challenge. The key is to trigger photothermal annealing behavior via femtosecond laser ablation to initialize phase transition into tetragonal zirconia (t-ZrO2) and induce columnar crystal growth, where Fe-ions rapidly segregate along grain boundaries and diffuse towards the outmost surface, becoming “frozen” there, highlighting the potential to use photothermal materials and ultrafast heating/quenching behaviors of femtosecond laser ablation for interfacial modification via exsolution. Triggering interfacial iron-oxide coloring exsolution is composition and concentration dependent, indicating photothermal materials themselves and corresponding photothermal transition capacity play a crucial role, initializing at 5wt%, 2wt%, and and 3wt% for Fe3O4-/γ-Fe2O3/α-Fe2O3 embedded 3Y-TZP samples. Due to different photothermal effects, exsolution states of ablated 5wt% Fe3O4-/γ-Fe2O3/α-Fe2O3-embedded 3Y-TZP samples are completely different, complete coverage, exhaustion (ablated away) and partial exsolution (rich in the crystal boundaries of sublayers). This novel exsolution is uniquely featured by up to now the deepest microscale (10 μm from 5 wt%-Fe3O4-3Y-TZP sample) Fe-elemental deficient layer for exsolution and the whole coverage of exsolved materials rather than formation of isolated exsolved particles by other methods. It is believed that femtosecond laser ultrafast photothermal exsolution may pave a good way to modulate interfacial properties for extensive applications in the fields of biology, optics/photonics, energy, catalysis, environment, etc.
{"title":"Femtosecond laser ultrafast photothermal exsolution","authors":"Lu Xu, Jingchao Tao, Zhuguo Li, Guo He, Dongshi Zhang","doi":"10.1088/2631-7990/ad4eb0","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4eb0","url":null,"abstract":"\u0000 Exsolution, as an effective approach to construct particle-decorated interfaces, is still challenging to yield interfacial films rather than isolated particles. Inspired by in vivo near infrared laser photothermal therapy (PTT), using 3 mol.% Y2O3 stabilized tetragonal zirconia polycrystals (3Y-TZP) as host oxide matrix and iron-oxide (Fe3O4/γ-Fe2O3/α-Fe2O3) materials as photothermal modulator and exsolution resource, femtosecond laser ultrafast exsolution approach is presented enabling to conquer this challenge. The key is to trigger photothermal annealing behavior via femtosecond laser ablation to initialize phase transition into tetragonal zirconia (t-ZrO2) and induce columnar crystal growth, where Fe-ions rapidly segregate along grain boundaries and diffuse towards the outmost surface, becoming “frozen” there, highlighting the potential to use photothermal materials and ultrafast heating/quenching behaviors of femtosecond laser ablation for interfacial modification via exsolution. Triggering interfacial iron-oxide coloring exsolution is composition and concentration dependent, indicating photothermal materials themselves and corresponding photothermal transition capacity play a crucial role, initializing at 5wt%, 2wt%, and and 3wt% for Fe3O4-/γ-Fe2O3/α-Fe2O3 embedded 3Y-TZP samples. Due to different photothermal effects, exsolution states of ablated 5wt% Fe3O4-/γ-Fe2O3/α-Fe2O3-embedded 3Y-TZP samples are completely different, complete coverage, exhaustion (ablated away) and partial exsolution (rich in the crystal boundaries of sublayers). This novel exsolution is uniquely featured by up to now the deepest microscale (10 μm from 5 wt%-Fe3O4-3Y-TZP sample) Fe-elemental deficient layer for exsolution and the whole coverage of exsolved materials rather than formation of isolated exsolved particles by other methods. It is believed that femtosecond laser ultrafast photothermal exsolution may pave a good way to modulate interfacial properties for extensive applications in the fields of biology, optics/photonics, energy, catalysis, environment, etc.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141113538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-20DOI: 10.1088/2631-7990/ad4e1d
Da Guo, Rubén Lambert-Garcia, Samy Hocine, Xianqiang Fan, Henry Greenhalgh, ravi shahani, Marta Majkut, A. Rack, Peter D. Lee, C. L. Leung
Spatter during laser powder bed fusion (LPBF) can induce surface defects, impacting the fatigue performance of the fabricated components. Here, we reveal and explain the links between vapour depression shape and spatter dynamics during LPBF of an Al-Fe-Zr aluminium alloy using high-speed synchrotron X-ray imaging. We quantify the number, trajectory angle, velocity, and kinetic energy of the spatter as a function of vapour depression zone/keyhole morphology under industry-relevant processing conditions. The depression zone/keyhole morphology was found to influence the spatter ejection angle in keyhole versus conduction melting modes: (i) the vapour-pressure driven plume in conduction mode with a quasi-semi-circular depression zone leads to backward spatter whereas (ii) the keyhole rear wall redirects the gas/vapour flow to cause vertical spatter ejection and rear rim droplet spatter. Increasing the opening of the keyhole or vapour depression zone can reduce entrainment of solid spatter. We discover a spatter-induced crater mechanism in which small spatter particles are accelerated towards the powder bed after laser-spatter interaction, inducing powder denudation and cavities on the printed surface. By quantifying these laser-spatter interactions, we suggest a printing strategy for minimising defects and improving the surface quality of LPBF parts.
{"title":"Correlative spatter and vapour depression dynamics during laser powder bed fusion of an Al-Fe-Zr alloy","authors":"Da Guo, Rubén Lambert-Garcia, Samy Hocine, Xianqiang Fan, Henry Greenhalgh, ravi shahani, Marta Majkut, A. Rack, Peter D. Lee, C. L. Leung","doi":"10.1088/2631-7990/ad4e1d","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4e1d","url":null,"abstract":"\u0000 Spatter during laser powder bed fusion (LPBF) can induce surface defects, impacting the fatigue performance of the fabricated components. Here, we reveal and explain the links between vapour depression shape and spatter dynamics during LPBF of an Al-Fe-Zr aluminium alloy using high-speed synchrotron X-ray imaging. We quantify the number, trajectory angle, velocity, and kinetic energy of the spatter as a function of vapour depression zone/keyhole morphology under industry-relevant processing conditions. The depression zone/keyhole morphology was found to influence the spatter ejection angle in keyhole versus conduction melting modes: (i) the vapour-pressure driven plume in conduction mode with a quasi-semi-circular depression zone leads to backward spatter whereas (ii) the keyhole rear wall redirects the gas/vapour flow to cause vertical spatter ejection and rear rim droplet spatter. Increasing the opening of the keyhole or vapour depression zone can reduce entrainment of solid spatter. We discover a spatter-induced crater mechanism in which small spatter particles are accelerated towards the powder bed after laser-spatter interaction, inducing powder denudation and cavities on the printed surface. By quantifying these laser-spatter interactions, we suggest a printing strategy for minimising defects and improving the surface quality of LPBF parts.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141121827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-15DOI: 10.1088/2631-7990/ad4c29
Okin Song, Youngwook Cho, Soo-Yeon Cho, Joohoon Kang
Artificial sensory systems have emerged as pivotal technologies to bridge the gap between the virtual and real-world, replicating human senses to interact intelligently with external stimuli. To practically apply artificial sensory systems in the real-world, it is essential to mass-produce nanomaterials with ensured sensitivity and selectivity, purify them for desired functions, and integrate them into large-area sensory devices through assembly techniques. A comprehensive understanding of each process parameter from material processing to device assembly is crucial for achieving a high-performing artificial sensory system. This review provides a technological framework for fabricating high-performance artificial sensory systems, covering material processing to device integrations. We introduce recent approaches for dispersing and purifying various nanomaterials including 0D, 1D, and 2D nanomaterials. We then highlight advanced coating and printing techniques of the solution-processed nanomaterials based on representative three methods including i) evaporation-based assembly, ii) assisted assembly, and iii) direct patterning. We explore the application and performances of these solution-processed materials and printing methods in fabricating sensory devices mimicking five human senses including vision, olfaction, gustation, hearing, and tactile perception. Finally, we suggest an outlook for possible future research directions to solve the remaining challenges of the artificial sensory systems such as ambient stability, device consistency, and integration with AI-based software.
{"title":"Solution-Processing Approach of Nanomaterials Toward an Artificial Sensory System","authors":"Okin Song, Youngwook Cho, Soo-Yeon Cho, Joohoon Kang","doi":"10.1088/2631-7990/ad4c29","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4c29","url":null,"abstract":"\u0000 Artificial sensory systems have emerged as pivotal technologies to bridge the gap between the virtual and real-world, replicating human senses to interact intelligently with external stimuli. To practically apply artificial sensory systems in the real-world, it is essential to mass-produce nanomaterials with ensured sensitivity and selectivity, purify them for desired functions, and integrate them into large-area sensory devices through assembly techniques. A comprehensive understanding of each process parameter from material processing to device assembly is crucial for achieving a high-performing artificial sensory system. This review provides a technological framework for fabricating high-performance artificial sensory systems, covering material processing to device integrations. We introduce recent approaches for dispersing and purifying various nanomaterials including 0D, 1D, and 2D nanomaterials. We then highlight advanced coating and printing techniques of the solution-processed nanomaterials based on representative three methods including i) evaporation-based assembly, ii) assisted assembly, and iii) direct patterning. We explore the application and performances of these solution-processed materials and printing methods in fabricating sensory devices mimicking five human senses including vision, olfaction, gustation, hearing, and tactile perception. Finally, we suggest an outlook for possible future research directions to solve the remaining challenges of the artificial sensory systems such as ambient stability, device consistency, and integration with AI-based software.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140975442","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-11DOI: 10.1088/2631-7990/ad4a2c
Jianxiang Cheng, Shouyi Yu, Rong Wang, Qi Ge
Multimaterial (MM) 3D printing shows great potential for application in metamaterials, flexible electronics, biomedical devices and robots, since it can seamlessly integrate distinctive materials into one printed structure. Among numerous MM 3D printing technologies, digital light processing (DLP) MM 3D printing is compatible with a wide range of materials from hydrogels to ceramics, and can print MM 3D structures with high resolution, high complexity and fast speed. This paper introduces the fundamental mechanisms of DLP 3D printing, and reviews the recent advances of DLP MM 3D printing technologies with emphasis on material switching methods and material contamination issues. It also summarizes a number of typical examples of DLP MM 3D printing systems developed in the past decade, and introduces their system structures, working principles, material switching methods, residual resin removal methods, printing steps, as well as the representative structures and applications. Finally, we provide perspectives on the directions of the further development of DLP MM 3D printing technology.
多材料(MM)三维打印在超材料、柔性电子器件、生物医学设备和机器人领域具有巨大的应用潜力,因为它可以将不同的材料无缝集成到一个打印结构中。在众多多材料三维打印技术中,数字光处理(DLP)多材料三维打印技术可兼容从水凝胶到陶瓷等多种材料,并能打印出高分辨率、高复杂度和高速度的多材料三维结构。本文介绍了 DLP 三维打印的基本机理,回顾了 DLP MM 三维打印技术的最新进展,重点介绍了材料切换方法和材料污染问题。本文还总结了近十年来开发的一些 DLP MM 三维打印系统的典型实例,介绍了它们的系统结构、工作原理、材料切换方法、残留树脂去除方法、打印步骤以及具有代表性的结构和应用。最后,我们对 DLP MM 三维打印技术的进一步发展方向进行了展望。
{"title":"Digital light processing based multimaterial 3D printing: challenges, solutions and perspectives","authors":"Jianxiang Cheng, Shouyi Yu, Rong Wang, Qi Ge","doi":"10.1088/2631-7990/ad4a2c","DOIUrl":"https://doi.org/10.1088/2631-7990/ad4a2c","url":null,"abstract":"\u0000 Multimaterial (MM) 3D printing shows great potential for application in metamaterials, flexible electronics, biomedical devices and robots, since it can seamlessly integrate distinctive materials into one printed structure. Among numerous MM 3D printing technologies, digital light processing (DLP) MM 3D printing is compatible with a wide range of materials from hydrogels to ceramics, and can print MM 3D structures with high resolution, high complexity and fast speed. This paper introduces the fundamental mechanisms of DLP 3D printing, and reviews the recent advances of DLP MM 3D printing technologies with emphasis on material switching methods and material contamination issues. It also summarizes a number of typical examples of DLP MM 3D printing systems developed in the past decade, and introduces their system structures, working principles, material switching methods, residual resin removal methods, printing steps, as well as the representative structures and applications. Finally, we provide perspectives on the directions of the further development of DLP MM 3D printing technology.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140988457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-09DOI: 10.1088/2631-7990/ad492e
J. Lee, Jeong Eun Ju, Chanwoo Lee, Sang Min Won, Ki Jun Yu
Flexible electronics offer a multitude of advantages, such as flexibility, lightweight properties, portability, and high durability. These unique properties allow for seamless applications to curved and soft surfaces, leading to extensive utilization across a wide range of fields in consumer electronics. These applications, for example, span integrated circuits, solar cells, batteries, wearable devices, bio-implants, soft robotics, and biomimetic applications. Recently, flexible electronic devices have been developed using a variety of materials such as organic, carbon-based, and inorganic semiconducting materials. Silicon (Si) owing to its mature fabrication process, excellent electrical, optical, thermal properties, and cost-efficiency, remains a compelling material choice for flexible electronics. Consequently, the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays. The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain, thereby enhancing flexibility while preserving its exceptional properties. This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications.
{"title":"Novel Fabrication Techniques for Ultra-thin Silicon Based Flexible Electronics","authors":"J. Lee, Jeong Eun Ju, Chanwoo Lee, Sang Min Won, Ki Jun Yu","doi":"10.1088/2631-7990/ad492e","DOIUrl":"https://doi.org/10.1088/2631-7990/ad492e","url":null,"abstract":"\u0000 Flexible electronics offer a multitude of advantages, such as flexibility, lightweight properties, portability, and high durability. These unique properties allow for seamless applications to curved and soft surfaces, leading to extensive utilization across a wide range of fields in consumer electronics. These applications, for example, span integrated circuits, solar cells, batteries, wearable devices, bio-implants, soft robotics, and biomimetic applications. Recently, flexible electronic devices have been developed using a variety of materials such as organic, carbon-based, and inorganic semiconducting materials. Silicon (Si) owing to its mature fabrication process, excellent electrical, optical, thermal properties, and cost-efficiency, remains a compelling material choice for flexible electronics. Consequently, the research on ultra-thin Si in the context of flexible electronics is studied rigorously nowadays. The thinning of Si is crucially important for flexible electronics as it reduces its bending stiffness and the resultant bending strain, thereby enhancing flexibility while preserving its exceptional properties. This review provides a comprehensive overview of the recent efforts in the fabrication techniques for forming ultra-thin Si using top-down and bottom-up approaches and explores their utilization in flexible electronics and their applications.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":null,"pages":null},"PeriodicalIF":14.7,"publicationDate":"2024-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140994369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}