Pub Date : 2023-12-14DOI: 10.1088/2631-7990/ad15f5
Rong Chen, Kun Cao, Yanwei Wen, Fan Yang, Jian Wang, Xiao Liu, Bin Shan
Driven by the growing demand for next-generation displays, the evolution of advanced luminescent materials with exceptional photoelectric properties, such as quantum dots and phosphors are accelerating rapidly. Nevertheless, the primary challenge confronting the practical applications of these luminescent materials lie in meeting high durability requirements. This perspective delves into atomic layer deposition (ALD) developed for stabilizing luminescent materials, which is employed in the fabrication of flexible display devices through material modification, surface and interface engineering, encapsulation, cross-scale manufacturing, and simulations. To satisfy low-cost, high-efficiency, and high-reliability manufacturing requirements, equipments such as spatial ALD and fluidized ALD have been developed. The strategic approach establishes the groundwork for the development of ultra-stable luminescent materials, highly efficient LEDs, and thin-film packaging. This significantly enhances their potential applicability in LED illumination and backlight displays, marking a notable advancement in the display industry.
在下一代显示器需求不断增长的推动下，量子点和荧光粉等具有特殊光电特性的先进发光材料正在迅速发展。然而，这些发光材料在实际应用中面临的主要挑战是如何满足高耐久性要求。本视角深入探讨了为稳定发光材料而开发的原子层沉积（ALD）技术，该技术通过材料改性、表面和界面工程、封装、跨尺度制造和模拟，用于制造柔性显示器件。为了满足低成本、高效率和高可靠性的制造要求，人们开发了空间 ALD 和流化 ALD 等设备。这种战略方法为开发超稳定发光材料、高效 LED 和薄膜封装奠定了基础。这大大提高了它们在 LED 照明和背光显示器中的潜在适用性，标志着显示器行业的显著进步。
{"title":"Atomic layer deposition in advanced display technologies: from photoluminescence to encapsulation","authors":"Rong Chen, Kun Cao, Yanwei Wen, Fan Yang, Jian Wang, Xiao Liu, Bin Shan","doi":"10.1088/2631-7990/ad15f5","DOIUrl":"https://doi.org/10.1088/2631-7990/ad15f5","url":null,"abstract":"\u0000 Driven by the growing demand for next-generation displays, the evolution of advanced luminescent materials with exceptional photoelectric properties, such as quantum dots and phosphors are accelerating rapidly. Nevertheless, the primary challenge confronting the practical applications of these luminescent materials lie in meeting high durability requirements. This perspective delves into atomic layer deposition (ALD) developed for stabilizing luminescent materials, which is employed in the fabrication of flexible display devices through material modification, surface and interface engineering, encapsulation, cross-scale manufacturing, and simulations. To satisfy low-cost, high-efficiency, and high-reliability manufacturing requirements, equipments such as spatial ALD and fluidized ALD have been developed. The strategic approach establishes the groundwork for the development of ultra-stable luminescent materials, highly efficient LEDs, and thin-film packaging. This significantly enhances their potential applicability in LED illumination and backlight displays, marking a notable advancement in the display industry.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"15 7","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138972541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In the past decade, there has been tremendous progress in integrating chalcogenide phase-change materials (PCMs) on the silicon photonic platform for non-volatile memory to neuromorphic in-memory computing applications. Especially, these non von Neumann computational elements and systems benefit from mass manufacturing of silicon photonic integrated circuits (PICs) on 8-inch wafers using 130-nm complementary metal-oxide semiconductor (CMOS) line. Chip manufacturing based on the deep-ultraviolet (DUV) lithography and electron-beam lithography (EBL) enable rapid prototyping of PICs, which can be integrated with high-quality PCMs based on the wafer-scale sputtering technique as a back-end-of-line (BEOL) process. In this article, we overview recent advances of waveguide integrated PCM memory cells, functional devices, and neuromorphic systems, with an emphasis on fabrication and integration processes to attain the state-of-the-art device performance. After a short overview of PCM based photonic devices, we discuss the materials properties of the functional layer as well as the progress on the light guiding layer, namely, the silicon and germanium waveguide platforms. Next, we discuss the cleanroom fabrication flow of waveguide devices integrated with thin films and nanowires, silicon waveguide and plasmonic microheaters for electrothermal switching of PCMs and mixed-mode operation. Finally, the fabrication of photonic and photonic-electronic neuromorphic computing systems is reviewed. These systems consist arrays of PCM memory elements for associative learning, matrix-vector multiplication, and pattern recognition. With large-scale integration, neuromorphic photonic computing paradigm holds the promise to outperform digital electronic accelerators by taking the advantages of ultra-high bandwidth, high speed, and energy efficient operation in running machine learning algorithms.
{"title":"Fabrication and integration of photonic devices for phase-change memory and neuromorphic computing","authors":"Wen Zhou, Xue‐Ying Shen, Xiaolong Yang, Jiangjing Wang, Wei Zhang","doi":"10.1088/2631-7990/ad1575","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1575","url":null,"abstract":"\u0000 In the past decade, there has been tremendous progress in integrating chalcogenide phase-change materials (PCMs) on the silicon photonic platform for non-volatile memory to neuromorphic in-memory computing applications. Especially, these non von Neumann computational elements and systems benefit from mass manufacturing of silicon photonic integrated circuits (PICs) on 8-inch wafers using 130-nm complementary metal-oxide semiconductor (CMOS) line. Chip manufacturing based on the deep-ultraviolet (DUV) lithography and electron-beam lithography (EBL) enable rapid prototyping of PICs, which can be integrated with high-quality PCMs based on the wafer-scale sputtering technique as a back-end-of-line (BEOL) process. In this article, we overview recent advances of waveguide integrated PCM memory cells, functional devices, and neuromorphic systems, with an emphasis on fabrication and integration processes to attain the state-of-the-art device performance. After a short overview of PCM based photonic devices, we discuss the materials properties of the functional layer as well as the progress on the light guiding layer, namely, the silicon and germanium waveguide platforms. Next, we discuss the cleanroom fabrication flow of waveguide devices integrated with thin films and nanowires, silicon waveguide and plasmonic microheaters for electrothermal switching of PCMs and mixed-mode operation. Finally, the fabrication of photonic and photonic-electronic neuromorphic computing systems is reviewed. These systems consist arrays of PCM memory elements for associative learning, matrix-vector multiplication, and pattern recognition. With large-scale integration, neuromorphic photonic computing paradigm holds the promise to outperform digital electronic accelerators by taking the advantages of ultra-high bandwidth, high speed, and energy efficient operation in running machine learning algorithms.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"97 4","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139005524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The traditional von Neumann computing architecture has relatively-low information processing speed and high power consumption, being difficult to meet the computing needs of artificial intelligence (AI). Neuromorphic computing systems, with massively parallel computing capability and low-power consumption, have been considered as an ideal option for data storage and AI computing in the future. Memristor as the fourth basic electronic component besides resistance, capacitance and inductance, could be the most competitive candidate for neuromorphic computing systems benefiting from the simple structure, continuously adjustable conductivity state, ultra-low power consumption, high switching speed and compatibility with existing CMOS technology. The memristor devices with applying MXene-based hybrids have attracted significant attention in recent years. Here, we introduce the latest progress in the synthesis of MXene-based hybrids and summarize the potential applications of MXene-based hybrids in memristor devices and neuromorphological intelligence. We explore the development trend of memristor constructed by combining MXenes with other functional materials and emphatically discuss the potential mechanism of MXenes-based memristor devices. Finally, the future prospects and directions of MXene-based memristors are briefly described.
{"title":"Preparation of MXene-based Hybrids and Their Application in Neuromorphic Devices","authors":"Zhuohao Xiao, Xiaodong Xiao, Ling Bing Kong, Hongbo Dong, Xiuying Li, Bin He, Shuangchen Ruan, Jianpang Zhai, Kun Zhou, Qin Huang, Liang Chu","doi":"10.1088/2631-7990/ad1573","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1573","url":null,"abstract":"\u0000 The traditional von Neumann computing architecture has relatively-low information processing speed and high power consumption, being difficult to meet the computing needs of artificial intelligence (AI). Neuromorphic computing systems, with massively parallel computing capability and low-power consumption, have been considered as an ideal option for data storage and AI computing in the future. Memristor as the fourth basic electronic component besides resistance, capacitance and inductance, could be the most competitive candidate for neuromorphic computing systems benefiting from the simple structure, continuously adjustable conductivity state, ultra-low power consumption, high switching speed and compatibility with existing CMOS technology. The memristor devices with applying MXene-based hybrids have attracted significant attention in recent years. Here, we introduce the latest progress in the synthesis of MXene-based hybrids and summarize the potential applications of MXene-based hybrids in memristor devices and neuromorphological intelligence. We explore the development trend of memristor constructed by combining MXenes with other functional materials and emphatically discuss the potential mechanism of MXenes-based memristor devices. Finally, the future prospects and directions of MXene-based memristors are briefly described.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"117 21","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139003509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-13DOI: 10.1088/2631-7990/ad1574
Soo Young Cho, D. Ho, S. Jo, Jeong Ho Cho
Recent advances in functionally graded additive manufacturing (FGAM) technology have enabled the seamless hybridization of multiple functionalities in a single structure. Soft robotics can become one of the largest beneficiaries of these advances, through the design of a facile four-dimensional (4D) FGAM process that can grant an intelligent stimuli-responsive mechanical functionality to the printed objects. Herein, we present a simple binder jetting approach for the 4D printing of functionally graded porous multi-materials (FGMM) by introducing rationally designed graded multiphase feeder beds. Compositionally graded cross-linking agents gradually form stable porous network structures within aqueous polymer particles, enabling programmable hygroscopic deformation without complex mechanical designs. Furthermore, a systematic bed design incorporating additional functional agents enables a multi-stimuli-responsive and untethered soft robot with stark stimulus selectivity. The biodegradability of the proposed 4D-printed soft robot further ensures the sustainability of our approach, with immediate degradation rates of 96.6% within 72 h. The proposed 4D printing concept for FGMMs can create new opportunities for intelligent and sustainable additive manufacturing in soft robotics.
{"title":"Direct 4D Printing of Functionally Graded Hydrogel Networks for Biodegradable, Untethered, and Multimorphic Soft Robots","authors":"Soo Young Cho, D. Ho, S. Jo, Jeong Ho Cho","doi":"10.1088/2631-7990/ad1574","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1574","url":null,"abstract":"\u0000 Recent advances in functionally graded additive manufacturing (FGAM) technology have enabled the seamless hybridization of multiple functionalities in a single structure. Soft robotics can become one of the largest beneficiaries of these advances, through the design of a facile four-dimensional (4D) FGAM process that can grant an intelligent stimuli-responsive mechanical functionality to the printed objects. Herein, we present a simple binder jetting approach for the 4D printing of functionally graded porous multi-materials (FGMM) by introducing rationally designed graded multiphase feeder beds. Compositionally graded cross-linking agents gradually form stable porous network structures within aqueous polymer particles, enabling programmable hygroscopic deformation without complex mechanical designs. Furthermore, a systematic bed design incorporating additional functional agents enables a multi-stimuli-responsive and untethered soft robot with stark stimulus selectivity. The biodegradability of the proposed 4D-printed soft robot further ensures the sustainability of our approach, with immediate degradation rates of 96.6% within 72 h. The proposed 4D printing concept for FGMMs can create new opportunities for intelligent and sustainable additive manufacturing in soft robotics.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"8 5","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139004950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-06DOI: 10.1088/2631-7990/ad12d4
Zhiqiang Yu, Motong Li, Bingyang Cao
The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.
{"title":"A comprehensive review on microchannel heat sinks for electronics cooling","authors":"Zhiqiang Yu, Motong Li, Bingyang Cao","doi":"10.1088/2631-7990/ad12d4","DOIUrl":"https://doi.org/10.1088/2631-7990/ad12d4","url":null,"abstract":"\u0000 The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"3 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138594666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Abstract Bio-inspired macrostructure array (MAA, size: submillimeter to millimeter scale) materials with special wettability (MAAMs-SW) have attracted significant research attention due to their outstanding performance in many applications, including oil repellency, liquid/droplet manipulation, anti-icing, heat transfer, water collection, and oil–water separation. In this review, we focus on recent developments in the theory, design, fabrication, and application of bio-inspired MAAMs-SW. We first review the history of the basic theory of special wettability and discuss representative structures and corresponding functions of some biological surfaces, thus setting the stage for the design and fabrication of bio-inspired MAAMs-SW. We then summarize the fabrication methods of special wetting MAAs in terms of three categories: additive manufacturing, subtractive manufacturing, and formative manufacturing, as well as their diverse functional applications, providing insights into the development of these MAAMs-SW. Finally, the challenges and directions of future research on bio-inspired MAAMs-SW are briefly addressed. Worldwide efforts, progress, and breakthroughs from surface engineering to functional applications elaborated herein will promote the practical application of bio-inspired MAAMs-SW.
{"title":"Recent Progress in Bio-Inspired Macrostructure Array Materials with Special Wettability − From Surface Engineering to Functional Applications","authors":"Zhongxu Lian, Jianhui Zhou, Wanfei Ren, Faze Chen, Jinkai Xu, Yanling Tian, Huadong Yu","doi":"10.1088/2631-7990/ad0471","DOIUrl":"https://doi.org/10.1088/2631-7990/ad0471","url":null,"abstract":"Abstract Bio-inspired macrostructure array (MAA, size: submillimeter to millimeter scale) materials with special wettability (MAAMs-SW) have attracted significant research attention due to their outstanding performance in many applications, including oil repellency, liquid/droplet manipulation, anti-icing, heat transfer, water collection, and oil–water separation. In this review, we focus on recent developments in the theory, design, fabrication, and application of bio-inspired MAAMs-SW. We first review the history of the basic theory of special wettability and discuss representative structures and corresponding functions of some biological surfaces, thus setting the stage for the design and fabrication of bio-inspired MAAMs-SW. We then summarize the fabrication methods of special wetting MAAs in terms of three categories: additive manufacturing, subtractive manufacturing, and formative manufacturing, as well as their diverse functional applications, providing insights into the development of these MAAMs-SW. Finally, the challenges and directions of future research on bio-inspired MAAMs-SW are briefly addressed. Worldwide efforts, progress, and breakthroughs from surface engineering to functional applications elaborated herein will promote the practical application of bio-inspired MAAMs-SW.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"85 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135087725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-03DOI: 10.1088/2631-7990/ad01fe
Zhiwen Shu, Bo Feng, Peng Liu, Lei Chen, Huikang Liang, Yiqin Chen, Jianwu Yu, Huigao Duan
Abstract There is an urgent need for novel processes that can integrate different functional nanostructures onto specific substrates, so as to meet the fast-growing need for broad applications in nanoelectronics, nanophotonics, and flexible optoelectronics. Existing direct-lithography methods are difficult to use on flexible, nonplanar, and biocompatible surfaces. Therefore, this fabrication is usually accomplished by nanotransfer printing. However, large-scale integration of multiscale nanostructures with unconventional substrates remains challenging because fabrication yields and quality are often limited by the resolution, uniformity, adhesivity, and integrity of the nanostructures formed by direct transfer. Here, we proposed a resist-based transfer strategy enabled by near-zero adhesion, which was achieved by molecular modification to attain a critical surface energy interval. This approach enabled the intact transfer of wafer-scale, ultrathin-resist nanofilms onto arbitrary substrates with mitigated cracking and wrinkling, thereby facilitating the in situ fabrication of nanostructures for functional devices. Applying this approach, fabrication of three-dimensional-stacked multilayer structures with enhanced functionalities, nanoplasmonic structures with ∼10 nm resolution, and MoS 2 -based devices with excellent performance was demonstrated on specific substrates. These results collectively demonstrated the high stability, reliability, and throughput of our strategy for optical and electronic device applications.
{"title":"Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates","authors":"Zhiwen Shu, Bo Feng, Peng Liu, Lei Chen, Huikang Liang, Yiqin Chen, Jianwu Yu, Huigao Duan","doi":"10.1088/2631-7990/ad01fe","DOIUrl":"https://doi.org/10.1088/2631-7990/ad01fe","url":null,"abstract":"Abstract There is an urgent need for novel processes that can integrate different functional nanostructures onto specific substrates, so as to meet the fast-growing need for broad applications in nanoelectronics, nanophotonics, and flexible optoelectronics. Existing direct-lithography methods are difficult to use on flexible, nonplanar, and biocompatible surfaces. Therefore, this fabrication is usually accomplished by nanotransfer printing. However, large-scale integration of multiscale nanostructures with unconventional substrates remains challenging because fabrication yields and quality are often limited by the resolution, uniformity, adhesivity, and integrity of the nanostructures formed by direct transfer. Here, we proposed a resist-based transfer strategy enabled by near-zero adhesion, which was achieved by molecular modification to attain a critical surface energy interval. This approach enabled the intact transfer of wafer-scale, ultrathin-resist nanofilms onto arbitrary substrates with mitigated cracking and wrinkling, thereby facilitating the in situ fabrication of nanostructures for functional devices. Applying this approach, fabrication of three-dimensional-stacked multilayer structures with enhanced functionalities, nanoplasmonic structures with ∼10 nm resolution, and MoS 2 -based devices with excellent performance was demonstrated on specific substrates. These results collectively demonstrated the high stability, reliability, and throughput of our strategy for optical and electronic device applications.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"178 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135775279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Highlights High-energy ball milling was proposed to construct oxygen vacancy defects. Scaffold with individualized shape and porous structure was fabricated by selective laser sintering. Antibacterial material was used to adsorb H 2 O 2 to the site of bacterial infection. The accumulated H 2 O 2 could amplify the Fenton reaction efficiency to induce more ·OH. The scaffold possessed matched mechanical properties and good biocompatibility.
{"title":"Oxygen vacancy boosting Fenton reaction in bone scaffold towards fighting bacterial infection","authors":"cijun shuai, Xiaoxin Shi, Feng Yang, Haifeng Tian, Pei Feng","doi":"10.1088/2631-7990/ad01fd","DOIUrl":"https://doi.org/10.1088/2631-7990/ad01fd","url":null,"abstract":"Highlights High-energy ball milling was proposed to construct oxygen vacancy defects. Scaffold with individualized shape and porous structure was fabricated by selective laser sintering. Antibacterial material was used to adsorb H 2 O 2 to the site of bacterial infection. The accumulated H 2 O 2 could amplify the Fenton reaction efficiency to induce more ·OH. The scaffold possessed matched mechanical properties and good biocompatibility.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135513672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-10-18DOI: 10.1088/2631-7990/ad0472
Bo Yao, Nan KANG, Xiangyu Li, Dou Li, Mohamed El Mansori, Jing Chen, Haiou Yang, Hua Tan, Xin LIN
Abstract Nd-Fe-B permanent magnets are critical components for energy conversion and electronic devices. The key magnetic properties of Nd-Fe-B magnets, especially the coercivity and remanent magnetization, are strongly dependent on the phase characteristics and microstructure. In this work, Nd-Fe-B magnets were prepared using vacuum induction melting (VIM), laser directed energy deposition (LDED) and laser powder bed fusion (LPBF) technologies. The microstructure evolution and phase selection of Nd-Fe-B magnets were clarified in detail. The results indicated that the solidification velocity (V) and cooling rate (R) are key factors in determining the phase selection. In terms of the VIM-casting Nd-Fe-B magnet, a large volume fraction of the soft magnetic α-Fe phase (39.7 vol.%) and Nd2Fe17Bx metastable phase (34.7 vol.%) are formed due to the low R (2.3×10-1 ℃/s), while the hard magnetic Nd2Fe14B phase is only 5.15 vol.%. With increasing V (<10-2 m/s) and R (5.06×103 ℃/s), part of the soft magnetic α-Fe phase (31.7 vol.%) was suppressed, more Nd2Fe17Bx metastable phases (47.5 vol.%) were formed in the LDED-processed Nd-Fe-B magnet, and the hard magnetic Nd2Fe14B phase also had a low value (3.4 vol.%). As a result, the casting- and LDED-processed Nd-Fe-B magnets exhibit poor magnetic properties. In contrast, the high V (>10-2 m/s) and R (1.45×106 ℃/s) led to the formation of the hard magnetic Nd2Fe14B phase (55.8 vol.%) from liquid, and the α-Fe phase and Nd2Fe17Bx phase precipitation were suppressed in the LPBF-processed Nd-Fe-B magnet. Furthermore, the strong crystallographic texture on the {001} crystal plane is another reason for the remanence enhancement in the LPBF-processed Nd-Fe-B magnets. Consequently, a coercivity of 656 kA/m, a remanence of 0.79 T and maximum energy product of 71.5 kJ/m3 was achieved in the LPBF-processed Nd-Fe-B magnet, which indicated excellent magnetic performance, comparable to other additive manufacturing processed Nd-Fe-B magnets from MQP (Nd-lean) Nd-Fe-B powder.
{"title":"Toward understanding the microstructure characteristics, phase selection and magnetic properties of laser additive manufactured Nd-Fe-B permanent magnets","authors":"Bo Yao, Nan KANG, Xiangyu Li, Dou Li, Mohamed El Mansori, Jing Chen, Haiou Yang, Hua Tan, Xin LIN","doi":"10.1088/2631-7990/ad0472","DOIUrl":"https://doi.org/10.1088/2631-7990/ad0472","url":null,"abstract":"Abstract Nd-Fe-B permanent magnets are critical components for energy conversion and electronic devices. The key magnetic properties of Nd-Fe-B magnets, especially the coercivity and remanent magnetization, are strongly dependent on the phase characteristics and microstructure. In this work, Nd-Fe-B magnets were prepared using vacuum induction melting (VIM), laser directed energy deposition (LDED) and laser powder bed fusion (LPBF) technologies. The microstructure evolution and phase selection of Nd-Fe-B magnets were clarified in detail. The results indicated that the solidification velocity (V) and cooling rate (R) are key factors in determining the phase selection. In terms of the VIM-casting Nd-Fe-B magnet, a large volume fraction of the soft magnetic α-Fe phase (39.7 vol.%) and Nd2Fe17Bx metastable phase (34.7 vol.%) are formed due to the low R (2.3×10-1 ℃/s), while the hard magnetic Nd2Fe14B phase is only 5.15 vol.%. With increasing V (<10-2 m/s) and R (5.06×103 ℃/s), part of the soft magnetic α-Fe phase (31.7 vol.%) was suppressed, more Nd2Fe17Bx metastable phases (47.5 vol.%) were formed in the LDED-processed Nd-Fe-B magnet, and the hard magnetic Nd2Fe14B phase also had a low value (3.4 vol.%). As a result, the casting- and LDED-processed Nd-Fe-B magnets exhibit poor magnetic properties. In contrast, the high V (>10-2 m/s) and R (1.45×106 ℃/s) led to the formation of the hard magnetic Nd2Fe14B phase (55.8 vol.%) from liquid, and the α-Fe phase and Nd2Fe17Bx phase precipitation were suppressed in the LPBF-processed Nd-Fe-B magnet. Furthermore, the strong crystallographic texture on the {001} crystal plane is another reason for the remanence enhancement in the LPBF-processed Nd-Fe-B magnets. Consequently, a coercivity of 656 kA/m, a remanence of 0.79 T and maximum energy product of 71.5 kJ/m3 was achieved in the LPBF-processed Nd-Fe-B magnet, which indicated excellent magnetic performance, comparable to other additive manufacturing processed Nd-Fe-B magnets from MQP (Nd-lean) Nd-Fe-B powder.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135824453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Highlights WE43 parts with favorable forming quality are fabricated by laser-beam powder bed fusion and the interaction between laser beam and powder is revealed. After suitable heat treatment, the anisotropic microstructure is eliminated, with nano-scaled Mg 24 Y 5 particles homogeneously precipitated. The yield strength and ultimate tensile strength are improved to (250.2 ± 3.5) MPa and (312 ± 3.7) MPa, respectively, while the elongation still maintains at high level of 15.2%. Homogenized microstructure inhibits the micro galvanic corrosion and promotes the development of passivation film, thus decreasing the degradation rate by an order of magnitude. The porous WE43 scaffolds offer a favorable environment for cell growth.
{"title":"Influence of heat treatment on microstructure, mechanical and corrosion behavior of WE43 alloy fabricated by laser-beam powder bed fusion","authors":"chenrong ling, qiang li, zhe zhang, Youwen Yang, wenhao zhou, wenlong chen, zhi dong, chunrong pan, cijun shuai","doi":"10.1088/2631-7990/acfad5","DOIUrl":"https://doi.org/10.1088/2631-7990/acfad5","url":null,"abstract":"Highlights WE43 parts with favorable forming quality are fabricated by laser-beam powder bed fusion and the interaction between laser beam and powder is revealed. After suitable heat treatment, the anisotropic microstructure is eliminated, with nano-scaled Mg 24 Y 5 particles homogeneously precipitated. The yield strength and ultimate tensile strength are improved to (250.2 ± 3.5) MPa and (312 ± 3.7) MPa, respectively, while the elongation still maintains at high level of 15.2%. Homogenized microstructure inhibits the micro galvanic corrosion and promotes the development of passivation film, thus decreasing the degradation rate by an order of magnitude. The porous WE43 scaffolds offer a favorable environment for cell growth.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"14 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135944111","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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