Pub Date : 2023-12-18DOI: 10.1088/2631-7990/ad16bb
Tianshu Liu, Peng Chen, Feng Qiu, Hong-Yu Yang, Nicholas Yew Jin Tan, Y. Chew, Di Wang, Ruidi Li, Qichuan Jiang, Chaolin Tan
The lightweight aluminum (Al) alloys have been widely used in frontier fields like aerospace and automotive industries, which attracts great interest in additive manufacturing to process high-value Al parts. As a mainstream additive manufacturing technique, laser directed energy deposition (LDED) shows good scalability to meet requirements for large-format components manufacturing and repairing. However, LDED Al alloys are highly challenging due to the inherent poor printability (e.g., low laser absorption, high oxidation sensitivity and cracking tendency). To further promote the development of LDED high-performance Al alloys, this review gains a deep understanding of the challenges and strategies to improve printability in LDED Al alloys. The porosity, cracking, distortion, inclusions, elements evaporation and resultant inferior mechanical properties (than laser powder bed fusion) are the key challenges in LDED Al alloys. Processing parameter optimizations, in-situ alloy design, reinforcing particle addition and field assistance are the efficient approaches to improve the printability and performance of LDED Al alloys. The underlying correlations between processes, alloy innovation, characteristic microstructures, and achievable performances in LDED Al alloys are discussed. The benchmarking mechanical properties and primary strengthening mechanism of LDED Al alloys are summarized. This review aims to provide a critical and in-depth evaluation of current progress in LDED Al alloys. The future opportunities and perspectives in LDED high-performance Al alloys are also outlooked.
轻质铝（Al）合金已广泛应用于航空航天和汽车等前沿领域，这引起了人们对增材制造加工高价值铝零件的极大兴趣。作为一种主流的快速成型制造技术，激光定向能沉积（LDED）显示出良好的可扩展性，可满足大型部件制造和维修的要求。然而，LDED Al 合金由于其固有的打印性能差（如低激光吸收率、高氧化敏感性和开裂倾向），具有很高的挑战性。为了进一步推动 LDED 高性能铝合金的发展，本综述深入探讨了提高 LDED 铝合金可印刷性的挑战和策略。气孔、开裂、变形、夹杂物、元素蒸发以及由此导致的较差机械性能（与激光粉末床融合相比）是 LDED 铝合金面临的主要挑战。优化加工参数、原位合金设计、添加强化颗粒和现场辅助是提高 LDED 铝合金可印刷性和性能的有效方法。本文讨论了 LDED Al 合金的工艺、合金创新、特征微结构和可实现性能之间的内在联系。总结了 LDED Al 合金的基准机械性能和主要强化机制。本综述旨在对 LDED 铝合金的当前进展进行批判性的深入评估。此外，还展望了 LDED 高性能铝合金的未来机遇和前景。
{"title":"Review on Laser Directed Energy Deposited Aluminum Alloys","authors":"Tianshu Liu, Peng Chen, Feng Qiu, Hong-Yu Yang, Nicholas Yew Jin Tan, Y. Chew, Di Wang, Ruidi Li, Qichuan Jiang, Chaolin Tan","doi":"10.1088/2631-7990/ad16bb","DOIUrl":"https://doi.org/10.1088/2631-7990/ad16bb","url":null,"abstract":"\u0000 The lightweight aluminum (Al) alloys have been widely used in frontier fields like aerospace and automotive industries, which attracts great interest in additive manufacturing to process high-value Al parts. As a mainstream additive manufacturing technique, laser directed energy deposition (LDED) shows good scalability to meet requirements for large-format components manufacturing and repairing. However, LDED Al alloys are highly challenging due to the inherent poor printability (e.g., low laser absorption, high oxidation sensitivity and cracking tendency). To further promote the development of LDED high-performance Al alloys, this review gains a deep understanding of the challenges and strategies to improve printability in LDED Al alloys. The porosity, cracking, distortion, inclusions, elements evaporation and resultant inferior mechanical properties (than laser powder bed fusion) are the key challenges in LDED Al alloys. Processing parameter optimizations, in-situ alloy design, reinforcing particle addition and field assistance are the efficient approaches to improve the printability and performance of LDED Al alloys. The underlying correlations between processes, alloy innovation, characteristic microstructures, and achievable performances in LDED Al alloys are discussed. The benchmarking mechanical properties and primary strengthening mechanism of LDED Al alloys are summarized. This review aims to provide a critical and in-depth evaluation of current progress in LDED Al alloys. The future opportunities and perspectives in LDED high-performance Al alloys are also outlooked.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":" 48","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138994896","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Metal additive manufacturing (AM) has been extensively studied in recent decades. Despite the significant progress achieved in manufacturing complex shapes and structures, challenges such as severe cracking when using existing alloys for laser powder bed fusion (L-PBF) AM persisted. This is due to the fact that commercial alloys are primarily designed for conventional casting or forging processes, without considering the fast cooling rates, steep temperature gradients, and multiple thermal cycles of L-PBF. To address this, there is an urgent need to develop novel alloys specifically tailored for L-PBF technologies. This review provides a comprehensive summary of the strategies employed in alloy design for L-PBF. It aims to guide future research on designing novel alloys dedicated to L-PBF instead of adapting the existing alloys for L-PBF. The review begins by discussing the features of L-PBF processes, focusing on rapid solidification and intrinsic heat treatment. Next, the printability of the four main existing alloys (Fe-, Ni-, Al-, and Ti-based alloys) is critically assessed, with a comparison to their conventional weldability. It was found that the weldability criteria are not always applicable in estimating printability. Furthermore, the review presents recent advances in alloy development and associated strategies, categorizing them into crack mitigation-oriented, microstructure manipulation-oriented, and machine learning-assisted approaches. Lastly, an outlook and suggestions are given to highlight the issues that need be addressed in future work.
{"title":"Alloy design for laser powder bed fusion additive manufacturing: a critical review","authors":"Zhuangzhuang Liu, Qihang Zhou, Xiaokang Liang, Xiebin Wang, Guichuan Li, Kim Vanmeensel, Jianxin Xie","doi":"10.1088/2631-7990/ad1657","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1657","url":null,"abstract":"\u0000 Metal additive manufacturing (AM) has been extensively studied in recent decades. Despite the significant progress achieved in manufacturing complex shapes and structures, challenges such as severe cracking when using existing alloys for laser powder bed fusion (L-PBF) AM persisted. This is due to the fact that commercial alloys are primarily designed for conventional casting or forging processes, without considering the fast cooling rates, steep temperature gradients, and multiple thermal cycles of L-PBF. To address this, there is an urgent need to develop novel alloys specifically tailored for L-PBF technologies. This review provides a comprehensive summary of the strategies employed in alloy design for L-PBF. It aims to guide future research on designing novel alloys dedicated to L-PBF instead of adapting the existing alloys for L-PBF. The review begins by discussing the features of L-PBF processes, focusing on rapid solidification and intrinsic heat treatment. Next, the printability of the four main existing alloys (Fe-, Ni-, Al-, and Ti-based alloys) is critically assessed, with a comparison to their conventional weldability. It was found that the weldability criteria are not always applicable in estimating printability. Furthermore, the review presents recent advances in alloy development and associated strategies, categorizing them into crack mitigation-oriented, microstructure manipulation-oriented, and machine learning-assisted approaches. Lastly, an outlook and suggestions are given to highlight the issues that need be addressed in future work.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"76 2","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138998812","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-14DOI: 10.1088/2631-7990/ad15f5
Rong Chen, Kun Cao, Yanwei Wen, Fan Yang, Jian Wang, Xiao Liu, Bin Shan
Driven by the growing demand for next-generation displays, the evolution of advanced luminescent materials with exceptional photoelectric properties, such as quantum dots and phosphors are accelerating rapidly. Nevertheless, the primary challenge confronting the practical applications of these luminescent materials lie in meeting high durability requirements. This perspective delves into atomic layer deposition (ALD) developed for stabilizing luminescent materials, which is employed in the fabrication of flexible display devices through material modification, surface and interface engineering, encapsulation, cross-scale manufacturing, and simulations. To satisfy low-cost, high-efficiency, and high-reliability manufacturing requirements, equipments such as spatial ALD and fluidized ALD have been developed. The strategic approach establishes the groundwork for the development of ultra-stable luminescent materials, highly efficient LEDs, and thin-film packaging. This significantly enhances their potential applicability in LED illumination and backlight displays, marking a notable advancement in the display industry.
在下一代显示器需求不断增长的推动下，量子点和荧光粉等具有特殊光电特性的先进发光材料正在迅速发展。然而，这些发光材料在实际应用中面临的主要挑战是如何满足高耐久性要求。本视角深入探讨了为稳定发光材料而开发的原子层沉积（ALD）技术，该技术通过材料改性、表面和界面工程、封装、跨尺度制造和模拟，用于制造柔性显示器件。为了满足低成本、高效率和高可靠性的制造要求，人们开发了空间 ALD 和流化 ALD 等设备。这种战略方法为开发超稳定发光材料、高效 LED 和薄膜封装奠定了基础。这大大提高了它们在 LED 照明和背光显示器中的潜在适用性，标志着显示器行业的显著进步。
{"title":"Atomic layer deposition in advanced display technologies: from photoluminescence to encapsulation","authors":"Rong Chen, Kun Cao, Yanwei Wen, Fan Yang, Jian Wang, Xiao Liu, Bin Shan","doi":"10.1088/2631-7990/ad15f5","DOIUrl":"https://doi.org/10.1088/2631-7990/ad15f5","url":null,"abstract":"\u0000 Driven by the growing demand for next-generation displays, the evolution of advanced luminescent materials with exceptional photoelectric properties, such as quantum dots and phosphors are accelerating rapidly. Nevertheless, the primary challenge confronting the practical applications of these luminescent materials lie in meeting high durability requirements. This perspective delves into atomic layer deposition (ALD) developed for stabilizing luminescent materials, which is employed in the fabrication of flexible display devices through material modification, surface and interface engineering, encapsulation, cross-scale manufacturing, and simulations. To satisfy low-cost, high-efficiency, and high-reliability manufacturing requirements, equipments such as spatial ALD and fluidized ALD have been developed. The strategic approach establishes the groundwork for the development of ultra-stable luminescent materials, highly efficient LEDs, and thin-film packaging. This significantly enhances their potential applicability in LED illumination and backlight displays, marking a notable advancement in the display industry.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"15 7","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138972541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In the past decade, there has been tremendous progress in integrating chalcogenide phase-change materials (PCMs) on the silicon photonic platform for non-volatile memory to neuromorphic in-memory computing applications. Especially, these non von Neumann computational elements and systems benefit from mass manufacturing of silicon photonic integrated circuits (PICs) on 8-inch wafers using 130-nm complementary metal-oxide semiconductor (CMOS) line. Chip manufacturing based on the deep-ultraviolet (DUV) lithography and electron-beam lithography (EBL) enable rapid prototyping of PICs, which can be integrated with high-quality PCMs based on the wafer-scale sputtering technique as a back-end-of-line (BEOL) process. In this article, we overview recent advances of waveguide integrated PCM memory cells, functional devices, and neuromorphic systems, with an emphasis on fabrication and integration processes to attain the state-of-the-art device performance. After a short overview of PCM based photonic devices, we discuss the materials properties of the functional layer as well as the progress on the light guiding layer, namely, the silicon and germanium waveguide platforms. Next, we discuss the cleanroom fabrication flow of waveguide devices integrated with thin films and nanowires, silicon waveguide and plasmonic microheaters for electrothermal switching of PCMs and mixed-mode operation. Finally, the fabrication of photonic and photonic-electronic neuromorphic computing systems is reviewed. These systems consist arrays of PCM memory elements for associative learning, matrix-vector multiplication, and pattern recognition. With large-scale integration, neuromorphic photonic computing paradigm holds the promise to outperform digital electronic accelerators by taking the advantages of ultra-high bandwidth, high speed, and energy efficient operation in running machine learning algorithms.
{"title":"Fabrication and integration of photonic devices for phase-change memory and neuromorphic computing","authors":"Wen Zhou, Xue‐Ying Shen, Xiaolong Yang, Jiangjing Wang, Wei Zhang","doi":"10.1088/2631-7990/ad1575","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1575","url":null,"abstract":"\u0000 In the past decade, there has been tremendous progress in integrating chalcogenide phase-change materials (PCMs) on the silicon photonic platform for non-volatile memory to neuromorphic in-memory computing applications. Especially, these non von Neumann computational elements and systems benefit from mass manufacturing of silicon photonic integrated circuits (PICs) on 8-inch wafers using 130-nm complementary metal-oxide semiconductor (CMOS) line. Chip manufacturing based on the deep-ultraviolet (DUV) lithography and electron-beam lithography (EBL) enable rapid prototyping of PICs, which can be integrated with high-quality PCMs based on the wafer-scale sputtering technique as a back-end-of-line (BEOL) process. In this article, we overview recent advances of waveguide integrated PCM memory cells, functional devices, and neuromorphic systems, with an emphasis on fabrication and integration processes to attain the state-of-the-art device performance. After a short overview of PCM based photonic devices, we discuss the materials properties of the functional layer as well as the progress on the light guiding layer, namely, the silicon and germanium waveguide platforms. Next, we discuss the cleanroom fabrication flow of waveguide devices integrated with thin films and nanowires, silicon waveguide and plasmonic microheaters for electrothermal switching of PCMs and mixed-mode operation. Finally, the fabrication of photonic and photonic-electronic neuromorphic computing systems is reviewed. These systems consist arrays of PCM memory elements for associative learning, matrix-vector multiplication, and pattern recognition. With large-scale integration, neuromorphic photonic computing paradigm holds the promise to outperform digital electronic accelerators by taking the advantages of ultra-high bandwidth, high speed, and energy efficient operation in running machine learning algorithms.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"97 4","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139005524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-13DOI: 10.1088/2631-7990/ad1574
Soo Young Cho, D. Ho, S. Jo, Jeong Ho Cho
Recent advances in functionally graded additive manufacturing (FGAM) technology have enabled the seamless hybridization of multiple functionalities in a single structure. Soft robotics can become one of the largest beneficiaries of these advances, through the design of a facile four-dimensional (4D) FGAM process that can grant an intelligent stimuli-responsive mechanical functionality to the printed objects. Herein, we present a simple binder jetting approach for the 4D printing of functionally graded porous multi-materials (FGMM) by introducing rationally designed graded multiphase feeder beds. Compositionally graded cross-linking agents gradually form stable porous network structures within aqueous polymer particles, enabling programmable hygroscopic deformation without complex mechanical designs. Furthermore, a systematic bed design incorporating additional functional agents enables a multi-stimuli-responsive and untethered soft robot with stark stimulus selectivity. The biodegradability of the proposed 4D-printed soft robot further ensures the sustainability of our approach, with immediate degradation rates of 96.6% within 72 h. The proposed 4D printing concept for FGMMs can create new opportunities for intelligent and sustainable additive manufacturing in soft robotics.
{"title":"Direct 4D Printing of Functionally Graded Hydrogel Networks for Biodegradable, Untethered, and Multimorphic Soft Robots","authors":"Soo Young Cho, D. Ho, S. Jo, Jeong Ho Cho","doi":"10.1088/2631-7990/ad1574","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1574","url":null,"abstract":"\u0000 Recent advances in functionally graded additive manufacturing (FGAM) technology have enabled the seamless hybridization of multiple functionalities in a single structure. Soft robotics can become one of the largest beneficiaries of these advances, through the design of a facile four-dimensional (4D) FGAM process that can grant an intelligent stimuli-responsive mechanical functionality to the printed objects. Herein, we present a simple binder jetting approach for the 4D printing of functionally graded porous multi-materials (FGMM) by introducing rationally designed graded multiphase feeder beds. Compositionally graded cross-linking agents gradually form stable porous network structures within aqueous polymer particles, enabling programmable hygroscopic deformation without complex mechanical designs. Furthermore, a systematic bed design incorporating additional functional agents enables a multi-stimuli-responsive and untethered soft robot with stark stimulus selectivity. The biodegradability of the proposed 4D-printed soft robot further ensures the sustainability of our approach, with immediate degradation rates of 96.6% within 72 h. The proposed 4D printing concept for FGMMs can create new opportunities for intelligent and sustainable additive manufacturing in soft robotics.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"8 5","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139004950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The traditional von Neumann computing architecture has relatively-low information processing speed and high power consumption, being difficult to meet the computing needs of artificial intelligence (AI). Neuromorphic computing systems, with massively parallel computing capability and low-power consumption, have been considered as an ideal option for data storage and AI computing in the future. Memristor as the fourth basic electronic component besides resistance, capacitance and inductance, could be the most competitive candidate for neuromorphic computing systems benefiting from the simple structure, continuously adjustable conductivity state, ultra-low power consumption, high switching speed and compatibility with existing CMOS technology. The memristor devices with applying MXene-based hybrids have attracted significant attention in recent years. Here, we introduce the latest progress in the synthesis of MXene-based hybrids and summarize the potential applications of MXene-based hybrids in memristor devices and neuromorphological intelligence. We explore the development trend of memristor constructed by combining MXenes with other functional materials and emphatically discuss the potential mechanism of MXenes-based memristor devices. Finally, the future prospects and directions of MXene-based memristors are briefly described.
{"title":"Preparation of MXene-based Hybrids and Their Application in Neuromorphic Devices","authors":"Zhuohao Xiao, Xiaodong Xiao, Ling Bing Kong, Hongbo Dong, Xiuying Li, Bin He, Shuangchen Ruan, Jianpang Zhai, Kun Zhou, Qin Huang, Liang Chu","doi":"10.1088/2631-7990/ad1573","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1573","url":null,"abstract":"\u0000 The traditional von Neumann computing architecture has relatively-low information processing speed and high power consumption, being difficult to meet the computing needs of artificial intelligence (AI). Neuromorphic computing systems, with massively parallel computing capability and low-power consumption, have been considered as an ideal option for data storage and AI computing in the future. Memristor as the fourth basic electronic component besides resistance, capacitance and inductance, could be the most competitive candidate for neuromorphic computing systems benefiting from the simple structure, continuously adjustable conductivity state, ultra-low power consumption, high switching speed and compatibility with existing CMOS technology. The memristor devices with applying MXene-based hybrids have attracted significant attention in recent years. Here, we introduce the latest progress in the synthesis of MXene-based hybrids and summarize the potential applications of MXene-based hybrids in memristor devices and neuromorphological intelligence. We explore the development trend of memristor constructed by combining MXenes with other functional materials and emphatically discuss the potential mechanism of MXenes-based memristor devices. Finally, the future prospects and directions of MXene-based memristors are briefly described.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"117 21","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139003509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-06DOI: 10.1088/2631-7990/ad12d4
Zhiqiang Yu, Motong Li, Bingyang Cao
The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.
{"title":"A comprehensive review on microchannel heat sinks for electronics cooling","authors":"Zhiqiang Yu, Motong Li, Bingyang Cao","doi":"10.1088/2631-7990/ad12d4","DOIUrl":"https://doi.org/10.1088/2631-7990/ad12d4","url":null,"abstract":"\u0000 The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"3 1","pages":""},"PeriodicalIF":14.7,"publicationDate":"2023-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138594666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Abstract Bio-inspired macrostructure array (MAA, size: submillimeter to millimeter scale) materials with special wettability (MAAMs-SW) have attracted significant research attention due to their outstanding performance in many applications, including oil repellency, liquid/droplet manipulation, anti-icing, heat transfer, water collection, and oil–water separation. In this review, we focus on recent developments in the theory, design, fabrication, and application of bio-inspired MAAMs-SW. We first review the history of the basic theory of special wettability and discuss representative structures and corresponding functions of some biological surfaces, thus setting the stage for the design and fabrication of bio-inspired MAAMs-SW. We then summarize the fabrication methods of special wetting MAAs in terms of three categories: additive manufacturing, subtractive manufacturing, and formative manufacturing, as well as their diverse functional applications, providing insights into the development of these MAAMs-SW. Finally, the challenges and directions of future research on bio-inspired MAAMs-SW are briefly addressed. Worldwide efforts, progress, and breakthroughs from surface engineering to functional applications elaborated herein will promote the practical application of bio-inspired MAAMs-SW.
{"title":"Recent Progress in Bio-Inspired Macrostructure Array Materials with Special Wettability − From Surface Engineering to Functional Applications","authors":"Zhongxu Lian, Jianhui Zhou, Wanfei Ren, Faze Chen, Jinkai Xu, Yanling Tian, Huadong Yu","doi":"10.1088/2631-7990/ad0471","DOIUrl":"https://doi.org/10.1088/2631-7990/ad0471","url":null,"abstract":"Abstract Bio-inspired macrostructure array (MAA, size: submillimeter to millimeter scale) materials with special wettability (MAAMs-SW) have attracted significant research attention due to their outstanding performance in many applications, including oil repellency, liquid/droplet manipulation, anti-icing, heat transfer, water collection, and oil–water separation. In this review, we focus on recent developments in the theory, design, fabrication, and application of bio-inspired MAAMs-SW. We first review the history of the basic theory of special wettability and discuss representative structures and corresponding functions of some biological surfaces, thus setting the stage for the design and fabrication of bio-inspired MAAMs-SW. We then summarize the fabrication methods of special wetting MAAs in terms of three categories: additive manufacturing, subtractive manufacturing, and formative manufacturing, as well as their diverse functional applications, providing insights into the development of these MAAMs-SW. Finally, the challenges and directions of future research on bio-inspired MAAMs-SW are briefly addressed. Worldwide efforts, progress, and breakthroughs from surface engineering to functional applications elaborated herein will promote the practical application of bio-inspired MAAMs-SW.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"85 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135087725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-03DOI: 10.1088/2631-7990/ad01fe
Zhiwen Shu, Bo Feng, Peng Liu, Lei Chen, Huikang Liang, Yiqin Chen, Jianwu Yu, Huigao Duan
Abstract There is an urgent need for novel processes that can integrate different functional nanostructures onto specific substrates, so as to meet the fast-growing need for broad applications in nanoelectronics, nanophotonics, and flexible optoelectronics. Existing direct-lithography methods are difficult to use on flexible, nonplanar, and biocompatible surfaces. Therefore, this fabrication is usually accomplished by nanotransfer printing. However, large-scale integration of multiscale nanostructures with unconventional substrates remains challenging because fabrication yields and quality are often limited by the resolution, uniformity, adhesivity, and integrity of the nanostructures formed by direct transfer. Here, we proposed a resist-based transfer strategy enabled by near-zero adhesion, which was achieved by molecular modification to attain a critical surface energy interval. This approach enabled the intact transfer of wafer-scale, ultrathin-resist nanofilms onto arbitrary substrates with mitigated cracking and wrinkling, thereby facilitating the in situ fabrication of nanostructures for functional devices. Applying this approach, fabrication of three-dimensional-stacked multilayer structures with enhanced functionalities, nanoplasmonic structures with ∼10 nm resolution, and MoS 2 -based devices with excellent performance was demonstrated on specific substrates. These results collectively demonstrated the high stability, reliability, and throughput of our strategy for optical and electronic device applications.
{"title":"Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates","authors":"Zhiwen Shu, Bo Feng, Peng Liu, Lei Chen, Huikang Liang, Yiqin Chen, Jianwu Yu, Huigao Duan","doi":"10.1088/2631-7990/ad01fe","DOIUrl":"https://doi.org/10.1088/2631-7990/ad01fe","url":null,"abstract":"Abstract There is an urgent need for novel processes that can integrate different functional nanostructures onto specific substrates, so as to meet the fast-growing need for broad applications in nanoelectronics, nanophotonics, and flexible optoelectronics. Existing direct-lithography methods are difficult to use on flexible, nonplanar, and biocompatible surfaces. Therefore, this fabrication is usually accomplished by nanotransfer printing. However, large-scale integration of multiscale nanostructures with unconventional substrates remains challenging because fabrication yields and quality are often limited by the resolution, uniformity, adhesivity, and integrity of the nanostructures formed by direct transfer. Here, we proposed a resist-based transfer strategy enabled by near-zero adhesion, which was achieved by molecular modification to attain a critical surface energy interval. This approach enabled the intact transfer of wafer-scale, ultrathin-resist nanofilms onto arbitrary substrates with mitigated cracking and wrinkling, thereby facilitating the in situ fabrication of nanostructures for functional devices. Applying this approach, fabrication of three-dimensional-stacked multilayer structures with enhanced functionalities, nanoplasmonic structures with ∼10 nm resolution, and MoS 2 -based devices with excellent performance was demonstrated on specific substrates. These results collectively demonstrated the high stability, reliability, and throughput of our strategy for optical and electronic device applications.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"178 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135775279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Highlights High-energy ball milling was proposed to construct oxygen vacancy defects. Scaffold with individualized shape and porous structure was fabricated by selective laser sintering. Antibacterial material was used to adsorb H 2 O 2 to the site of bacterial infection. The accumulated H 2 O 2 could amplify the Fenton reaction efficiency to induce more ·OH. The scaffold possessed matched mechanical properties and good biocompatibility.
{"title":"Oxygen vacancy boosting Fenton reaction in bone scaffold towards fighting bacterial infection","authors":"cijun shuai, Xiaoxin Shi, Feng Yang, Haifeng Tian, Pei Feng","doi":"10.1088/2631-7990/ad01fd","DOIUrl":"https://doi.org/10.1088/2631-7990/ad01fd","url":null,"abstract":"Highlights High-energy ball milling was proposed to construct oxygen vacancy defects. Scaffold with individualized shape and porous structure was fabricated by selective laser sintering. Antibacterial material was used to adsorb H 2 O 2 to the site of bacterial infection. The accumulated H 2 O 2 could amplify the Fenton reaction efficiency to induce more ·OH. The scaffold possessed matched mechanical properties and good biocompatibility.","PeriodicalId":52353,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135513672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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