A comparative study of Cl2/Ar and Cl2/O2 inductively coupled plasma etching of (-201) β-Ga2O3 was performed, and the effect of additive gases on the etch characteristics was studied. In both plasma chemistries, as Cl2 content increased, the etch rate continuously increased and the highest etch rates were obtained at 80% Cl2 content. In the 40Cl2/10Ar and 40Cl2/10O2 ICP discharges, the etch rate initially increased with increasing ICP source power up to 600 W and then decreased above 600 W, while the etch rate showed a strong dependence on the rf chuck power. The Cl2/Ar ICP discharges produced significantly higher etch rates than the Cl2/O2 plasmas and maximum etch rates of ~ 97 nm/min and ~ 40 nm/min were obtained in the 40Cl2/10Ar and 40Cl2/10O2 ICP discharges, respectively. Under all plasma compositions investigated, the surfaces etched in the Cl2/Ar plasmas exhibited a constant normalized O/Ga ratio of ~ 0.85, which was somewhat lower than that of the unetched surface. The original stoichiometry was maintained on the Ga2O3 surfaces etched in the 40Cl2/10O2 ICP discharges while a significant preferential desorption of oxygen atoms was observed for the Ga2O3 surfaces etched in the Cl2/O2 ICP discharges with Cl2 content below 60%. Pattern transfer with better anisotropy was achieved with the Cl2/Ar ICP discharges due to energetic Ar+ ion-assisted nature of the etching.
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