Electronic Materials Letters最新文献

英文中文

Low Voltage a-IGZO Thin Film Transistor Using Tantalum Oxide by Thermal Oxidation 采用热氧化钽的低压a-IGZO薄膜晶体管

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-04-19 DOI: 10.1007/s13391-023-00431-6

E. Yu, Seung Gyun Kim, SeoIk Kang, Hyuk Su Lee, Jong Mo Lee, S. Moon, Byung Seong Bae

引用次数: 0

Suppression of Leakage Currents in Photo-multiplication Photodetectors with Oxidation-Controlled Metal Interfacial Layer 氧化控制金属界面层光倍增光电探测器中泄漏电流的抑制

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-04-13 DOI: 10.1007/s13391-023-00429-0

S. Lim, Ji-young Lee, Tae Hun Lim, Seri Lee, Seung Ho Lee, Gyu Min Kim, S. Oh

引用次数: 0

Effect of Surface Termination on Carrier Dynamics of Metal Halide Perovskites: Ab Initio Quantum Dynamics Study 表面终止对金属卤化物钙钛矿载流子动力学的影响：从头算量子力学研究

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-04-12 DOI: 10.1007/s13391-023-00428-1

Yoonhoo Ha, Yoosang Son, Dooam Paik, Ki-Ha Hong, Hyungjun Kim

Metal halide perovskites (MHPs) have attracted considerable attentions as promising candidates for next-generation optoelectronic devices, such as light-emitting diode (LED), owing to their outstanding photophysical properties. Nanostructuring is considered an essential approach to facilitate the bright emission of MHPs, which entails an increase in the surface domain that can directly affect the carrier dynamics. However, a comprehensive understanding of the surface termination effect on the photodynamic properties of MHPs is still lacking. Herein, we systematically investigate the effect of surface termination on the carrier recombination dynamics of CsPbBr₃ using ab-initio non-adiabatic molecular dynamics simulations. We found separate localizations of electron and hole carriers in the vicinity of the more and less coordinated inorganic polyhedral, respectively, which can be explained by the energy level changes associated with the modifications in Pb–Br bond lengths and their anharmonicity. This leads to the spatial separation of charge carriers, which retards the radiative kinetics more than the non-radiative one, reducing the photoluminescence quantum yield (PLQY). We further found that the homogenous linewidth is broadened upon introduction of surface terminations. Thus, our study suggests a possible LED-performance degradation mechanism due to surface termination, and thereby proposes guidelines for enhancing the light-emission properties of nanostructured MHPs.

Graphical Abstract

金属卤化物钙钛矿(MHPs)由于其优异的光物理性能，作为下一代光电器件(如发光二极管(LED))的有前途的候选者，引起了人们的广泛关注。纳米结构被认为是促进MHPs发光的重要方法，这需要增加表面结构域，这可以直接影响载流子动力学。然而，对表面终止效应对MHPs光动力学性质的影响还缺乏全面的了解。本文采用ab-initio非绝热分子动力学模拟系统地研究了表面终止对CsPbBr3载流子重组动力学的影响。我们发现在多配位和少配位的无机多面体附近分别存在电子和空穴载流子，这可以用Pb-Br键长修饰引起的能级变化和它们的非调和性来解释。这导致了载流子的空间分离，这比非辐射动力学更延迟辐射动力学，降低了光致发光量子产率(PLQY)。我们进一步发现，在引入表面末端后，均匀线宽被拓宽。因此，我们的研究提出了由于表面终止可能导致led性能下降的机制，从而为提高纳米结构MHPs的发光性能提供了指导方针。图形抽象

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引用次数: 0

Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing 尿素缩合法制备化学机械抛光用CeO_2纳米粒子

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-04-10 DOI: 10.1007/s13391-023-00427-2

Zhenyang Wang, Tongqing Wang, Lifei Zhang, Xinchun Lu

The synthesis of CeO₂ nanoparticles for CeO₂ based slurry gains continuous emphasis on improving its performance in the chemical mechanical polishing of dielectric materials. Urea was selected to dominate the growth and morphology during the calcination process. Thermogravimetry experiments were used to analyze the the decomposition behavior. Particle morphology and size were analyzed. Crystalline phase information and surface valence were used to compare the differences in surface physical and chemical properties of ceria by different synthesis process. The CeO₂ nanoparticles synthesized with urea were dispersed in water as slurry. The particle sizes of CeO₂ were measured by dynamic light scattering. The Zeta potential of CeO₂ dispersion were measured to show dispersing performance. The CeO₂ nanoparticles synthesized with urea condensation show good monodisperse properties. The material removal rate of silicon oxide and surface quality after chemical mechanical polishing were selected to evaluate the chemical mechanical polishing performance. The CeO₂ nanoparticles synthesized with urea condensation not only yielded better surface quality results than the commercial slurry but also showed a 153% (pH = 4) and 100% (pH = 10) increase in the material removal rate of silicon oxide compared to commercial.

用于CeO2基浆料的CeO2纳米颗粒的合成不断受到重视，提高其在介质材料化学机械抛光中的性能。在煅烧过程中，尿素在生长和形态上起主导作用。采用热重实验对其分解行为进行了分析。分析了颗粒形态和大小。利用晶相信息和表面价态来比较不同合成工艺下氧化铈表面物理化学性质的差异。用尿素合成的CeO2纳米颗粒以浆料的形式分散在水中。采用动态光散射法测定了氧化铈的粒径。通过测定CeO2分散体的Zeta电位来表征其分散性能。尿素缩合法制备的CeO2纳米颗粒具有良好的单分散性能。选择化学机械抛光后氧化硅材料去除率和表面质量来评价化学机械抛光性能。尿素缩合法制备的CeO2纳米颗粒不仅表面质量优于商品料浆，而且对氧化硅的去除率比商品料浆提高了153% (pH = 4)和100% (pH = 10)。

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引用次数: 0

Compressive Sinter Bonding in Air Between Cu Finishes Using Paste Containing Composite Ag2O-Cu Filler 含复合Ag_2O-Cu填料的膏体在铜表面空气中压缩烧结结合

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-04-06 DOI: 10.1007/s13391-023-00430-7

Byeong Jo Han, Jong-Hyun Lee

A Ag₂O-Cu composite filler was adopted as a sintering material between Cu finishes under compression to achieve the high-speed bonding of dies in an air atmosphere via a cost-effective paste and finish process. The commercial Cu particles had an average size of 2 μm, and the synthesized Ag₂O particles were in the submicrometer range with an average size of 210 nm. The Ag₂O particles in the paste started decomposing at ∼150 °C, and the liquid-type reductant in the paste effectively reduced the oxide layers on the Cu particles as well as the upper and lower Cu finishes during bonding. Therefore, the in situ-generated active Ag and fresh Cu surfaces enabled significantly rapid sinter bonding under 5 MPa compression. Only 30 s of bonding at 300 °C was required to achieve an excellent shear strength of 27.8 MPa in the created bond-line, while 90 s of bonding produced a near-full-density structure with a strength of 41.9 MPa despite solid-state sintering when the 3:7 (Cu particles:Ag₂O particles) mixing ratio was used. Well-dispersed Ag₂O particles did not create a non-sintered interface or form large voids upon outgassing during decomposition. The out-diffused Cu was reoxidized after sintering with Ag, forming irregularly dispersed Cu₂O shells that remained in the microstructure of the full-density bond-line.

Graphical Abstract

采用ag20 -Cu复合填料作为压缩Cu饰面之间的烧结材料，通过经济高效的膏体-饰面工艺实现了模具在空气气氛中的高速粘合。商品Cu颗粒的平均尺寸为2 μm，合成的Ag2O颗粒在亚微米范围内，平均尺寸为210 nm。浆料中的Ag2O颗粒在~ 150℃时开始分解，浆料中的液体型还原剂在键合过程中有效地还原了Cu颗粒上的氧化层以及上、下Cu饰面。因此，原位生成的活性Ag和新鲜Cu表面能够在5mpa压缩下显著快速烧结结合。在300℃条件下，只需要30s的键合时间，所建立的键合线剪切强度达到27.8 MPa，而在3:7 (Cu颗粒:Ag2O颗粒)的混合比例下，在90s的键合时间内，即使固相烧结，也能形成接近全密度的结构，强度达到41.9 MPa。分散良好的Ag2O颗粒在分解过程中没有形成非烧结界面或在排气时形成大空隙。向外扩散的Cu与Ag烧结后发生再氧化，形成不规则分散的Cu2O壳层，保留在全密度键合线上的微观结构中。图形抽象

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引用次数: 0

Enhancement in Power Factor of Al-Doped Cu2Se Thermoelectric Compound Prepared by Combustion Synthesis via Spark Plasma Sintering Technique 放电等离子体烧结燃烧合成Al掺杂Cu_2Se热电化合物提高功率因数的研究

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-03-30 DOI: 10.1007/s13391-023-00422-7

N. Thangavel, S. Kumaran

An attempt was made to dope the aluminium in the copper site of the Cu₂Se compound via combustion synthesis during spark plasma sintering. A series of Cu_2−xAl_xSe (x = 0, 0.01, 0.02, 0.03) materials were prepared by combustion synthesis during spark plasma sintering and short annealing. The X-Ray diffraction reports reveal that the prepared materials like Cu₂Se consist of α—Cu₂Se phase, Cu_1.99Al_0.01Se, Cu_1.98Al_0.02Se consist of a mixture of α—Cu₂Se and β—Cu₂Se phases, and Cu_1.97Al_0.03Se consist of β—Cu₂Se phase. The doping of aluminium enhances the electrical conductivity and power factor value. Furthermore, Al-doping causes the Al–Cu secondary phase formation and aluminium cluster, which also significantly affect the electrical properties of the compounds. The sample Cu_1.98Al_0.02Se exhibits a power factor of 13.73 at 700 °C, which is 23.5% higher than the pure Cu₂Se sample prepared.

Graphical Abstract

采用火花等离子烧结燃烧合成的方法，尝试在Cu2Se化合物的铜部位掺杂铝。采用火花等离子烧结和短时间退火相结合的燃烧合成方法制备了一系列Cu2−xAlxSe (x = 0,0.01, 0.02, 0.03)材料。x射线衍射结果表明，制备的Cu2Se为α-Cu2Se相，Cu1.99Al0.01Se、Cu1.98Al0.02Se为α-Cu2Se和β-Cu2Se相的混合物，Cu1.97Al0.03Se为β-Cu2Se相。铝的掺杂提高了电导率和功率因数值。此外，al掺杂导致Al-Cu二次相的形成和铝团簇，也显著影响了化合物的电学性能。在700℃时，Cu1.98Al0.02Se样品的功率因数为13.73，比制备的纯Cu2Se样品高23.5%。图形抽象

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引用次数: 0

Thermal Management Performance of Epoxy Composites with Boron Nitride and Boron Phosphide Hybrid Fillers 氮化硼和磷化硼混合填料环氧树脂复合材料的热管理性能

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-03-30 DOI: 10.1007/s13391-023-00425-4

Yi Wang, Kai Wang, Jiajun Hu, Kang Si, Hongyan Xia

Thermal interface materials with high thermal conductivity are the best choice to solve the current overheating problem of electronic devices, and the choice of thermal conductive filler is a key factor affecting the performance of thermal interface composites. Hexagonal boron nitride sheet is considered to be ideal thermal conductive filler, but the thermal conductive effect of single filler is still insufficient to meet actual needs. Here, a new type of hybrid filler mixed with boron nitride sheet and boron phosphide particles is used to prepare epoxy based composites. When the filler volume fraction is 40%, the thermal conductivity of composites reaches 3.18 W m⁻¹ K⁻¹. Under the same content, the thermal conductivity of the composites with mixed fillers outperforms those with boron nitride sheet alone. At the same time, the composite material shows high breakdown strength of 46 kV mm⁻¹. This work provides a new way to prepare thermal interface materials with high thermal conductivity for modern electronic packaging.

Graphical Abstract

具有高导热系数的热界面材料是解决当前电子器件过热问题的最佳选择，而导热填料的选择是影响热界面复合材料性能的关键因素。六方氮化硼片被认为是理想的导热填料，但单一填料的导热效果仍不足以满足实际需要。本文采用氮化硼片与磷化硼颗粒混合的新型杂化填料制备环氧基复合材料。当填料体积分数为40%时，复合材料的导热系数达到3.18 W m−1 K−1。在相同含量下，掺加氮化硼片的复合材料导热性能优于单纯掺加氮化硼片的复合材料。同时，复合材料的击穿强度高达46 kV mm−1。本工作为现代电子封装提供了制备高导热界面材料的新途径。图形抽象

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引用次数: 1

Enhanced Lithium Storage Properties of High Sulfur Doped Hard Carbon Derived from Thiophene-Containing Conjugated Microporous Polymer 含噻吩共轭微孔聚合物高硫掺杂硬碳增强锂存储性能

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-03-30 DOI: 10.1007/s13391-023-00426-3

Qingtang Zhang, Fei Lian, Ya Zhang, Xiaomei Wang

The development of hard carbon with high capacity and long cycling stability is a significant issue for lithium ion batteries. Herein, thiophene-containing conjugated microporous polymer (SCMP) was synthesized using 1,3,5-triethynylbenzene 2,5-dibromothiophene by Sonogashira-Hagihara crosscoupling reactions. Then, high sulfur doped hard carbon (SHC) and KOH activated SHC (SHC-K) are prepared by direct carbonization and KOH-assisted carbonization of SCMP, respectively. Both samples were then investigated by SEM, elemental analysis, FTIR, XPS and Nitrogen adsorption/desorption. Taking advantages of sulfur content and abundant porosity, SHC-K delivers a first charge specific capacity of 842.2 mAh g⁻¹ at 0.1 A g⁻¹ and a specific charge capacity of 565.9 mAh g⁻¹ after 500 cycles at 0.6 A g⁻¹.

Graphical Abstract

开发高容量、长循环稳定性的硬碳是锂离子电池的重要课题。以1,3,5-三乙基苯2,5-二溴噻吩为原料，通过Sonogashira-Hagihara交联反应合成了含噻吩的共轭微孔聚合物(SCMP)。然后分别采用直接炭化和KOH辅助炭化法制备高硫掺杂硬碳(SHC)和KOH活化硬碳(SHC- k)。然后用SEM、元素分析、FTIR、XPS和氮气吸附/解吸对两种样品进行了研究。利用硫含量和丰富的孔隙度，SHC-K在0.1 ag−1下的首次充电比容量为842.2 mAh g−1，在0.6 ag−1下循环500次后的充电比容量为565.9 mAh g−1。图形抽象

引用次数: 1

Effects of Bath Composition and Current Density on the Electrodeposition Behavior of Fe–Ni Invar Alloy 镀液成分和电流密度对Fe-Ni Invar合金电沉积行为的影响

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-03-28 DOI: 10.1007/s13391-023-00413-8

Na-Young Kang, Jae-Ho Lee

Fe–Ni invar alloy (Fe 64–Ni 36 wt%) has a very low coefficient of thermal expansion (CTE) than any other metals. For this reason, it has been used as fine metal mask (FMM) in RGB patterning of OLED manufacture process. However, as the resolution of OLED display is getting higher, the thickness of FMM is getting thinner and then the conventional extruded invar sheet cannot be used directly. The electrodeposition of invar can be the alternative for fabrication of thin FMM. In this study, the Fe–Ni alloy were electrodeposited varying bath compositions and current density. Also, the effects of ferric ion (Fe³⁺), produced during electrodeposition on inert anode, on the behavior of deposition were investigated. Finally, the Fe–Ni alloy with 36–40 wt% Ni were obtained at 50 mA/cm² in 0.30 M Fe²⁺ bath. The back side and front side composition of the deposits were analyzed to evaluate the composition uniformity of the Fe–Ni alloys. Generally, the Fe content of back side of the deposits were higher than that of front side.

Graphical Abstract

Fe - ni invar合金(Fe 64-Ni 36 wt%)的热膨胀系数(CTE)比任何其他金属都低。因此，它已被用作OLED制造过程中RGB图案的精细金属掩模(FMM)。然而，随着OLED显示器分辨率的不断提高，FMM的厚度也越来越薄，传统的挤压成型invar片无法直接使用。电沉积invar可作为制造薄FMM的替代方法。在本研究中，电沉积Fe-Ni合金，改变镀液成分和电流密度。同时，研究了在惰性阳极上电沉积过程中产生的铁离子(Fe3+)对沉积行为的影响。最后，在0.30 M的Fe2+浴中，以50 mA/cm2的温度获得了Ni含量为36-40 wt%的Fe-Ni合金。分析了镀层的正面和背面成分，评价了Fe-Ni合金的成分均匀性。一般情况下，矿床背面的铁含量高于正面。图形抽象

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引用次数: 1

Physical Effects of 2PACz Layers as Hole-Transport Material on the Performance of Perovskite Solar Cell 空穴传输材料2PACz层对钙钛矿太阳能电池性能的物理影响

IF 2.4 4区材料科学 Q2 Materials Science

Electronic Materials Letters

Pub Date : 2023-03-23 DOI: 10.1007/s13391-023-00424-5

Doo-Hwan Kim, Seri Lee, Gyu Min Kim, Se Young Oh

Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT: PSS) is widely used as a hole-transport layer (HTL) in perovskite solar cells (PSCs) with inverted (p-i-n) structures. However, problems associated with the corrosivity of PEDOT:PSS prevent the commercialization of such PSCs. To solve this problem, we fabricated inverted PSCs using [2-(9H-carbazol-9-yl)ethyl]phosphonic acid (2PACz) as HTL. We used a mixture of N-methyl-2-pyrrolidone and N, N-dimethylformamide in the perovskite precursor, which reduced the amount of the antisolvent chlorobenzene. We investigated the physical effects of the amount of antisolvent used. In addition, we suggest a method to improve the performance of inverted PSCs using 2PACz as the HTL, thereby achieving higher performance.

Graphical Abstract

聚(3,4-乙烯二氧噻吩):聚(苯乙烯磺酸盐)(PEDOT: PSS)广泛用于具有倒(p-i-n)结构的钙钛矿太阳能电池(PSCs)。然而，与PEDOT:PSS的腐蚀性相关的问题阻碍了这种PSCs的商业化。为了解决这一问题，我们以[2-(9h -咔唑-9-基)乙基]膦酸(2PACz)为HTL制备了倒置PSCs。我们在钙钛矿前驱体中加入N-甲基-2-吡咯烷酮和N, N-二甲基甲酰胺的混合物，减少了抗溶剂氯苯的用量。考察了抗溶剂用量的物理效应。此外，我们提出了一种使用2PACz作为html来提高反转psc性能的方法，从而实现更高的性能。图形抽象

引用次数: 0

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