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2012 Symposium on VLSI Circuits (VLSIC)最新文献

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A 2.4GHz hybrid PPF based BFSK receiver with ±180ppm frequency offset tolerance for wireless sensor networks 一种基于2.4GHz混合PPF的BFSK接收机,频率偏移公差为±180ppm,适用于无线传感器网络
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243779
Ronghua Ni, K. Mayaram, T. Fiez
A low-power 2.4GHz 1Mb/s hybrid polyphase filter (PPF) based BFSK receiver with ±180ppm frequency offset tolerance (FOT) and 40dB adjacent channel rejection (ACR) at a modulation index (MI) of 2 is presented. High FOT at low MI is achieved by a frequency-to-energy conversion architecture using PPFs without any frequency correction. The proposed hybrid topology of the PPF provides an improved ACR at reduced power. The prototype receiver fabricated in a 0.13μm CMOS process, including RF and analog front-ends, consumes 1.95mW from a 1V supply with -84dBm sensitivity.
提出了一种低功耗2.4GHz 1Mb/s混合多相滤波器(PPF) BFSK接收机,在调制指数(MI)为2时具有±180ppm的频偏容限(FOT)和40dB的相邻信道抑制(ACR)。低MI下的高FOT是通过使用ppf的频率-能量转换架构实现的,无需任何频率校正。所提出的PPF混合拓扑在降低功率的情况下提供了改进的ACR。原型接收器采用0.13μm CMOS工艺制作,包括RF和模拟前端,从1V电源消耗1.95mW,灵敏度为-84dBm。
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引用次数: 2
A fully-electronic charge-based DNA sequencing CMOS biochip 全电子电荷DNA测序CMOS生物芯片
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243822
Arun Manickam, Rituraj Singh, Nicholas Wood, Bingling Li, A. Ellington, A. Hassibi
A 90×90 fully-electronic biosensor array for charge-based DNA sequence-by-synthesis is implemented in a 0.18μm standard CMOS process. Each 16 μm × 16 μm pixel consists of an integrated charge-sensing electrode connected to an embedded circuitry capable of detecting DNA polymerization and simultaneously measuring the electrode-electrolyte interface capacitance. The detection dynamic range of this sensor is +90dB while consuming 4 mW from a 3.3V supply when operating at 8.1s/frame.
一个90×90全电子生物传感器阵列,用于基于电荷的DNA合成序列,在0.18μm标准CMOS工艺中实现。每个16 μm × 16 μm像素由一个集成的电荷传感电极组成,该电极连接到一个嵌入式电路,能够检测DNA聚合并同时测量电极-电解质界面电容。该传感器的检测动态范围为+90dB,当工作在8.1s/帧时,从3.3V电源消耗4 mW。
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引用次数: 17
1.22mW/Gb/s 9.6Gb/s data jitter mixing forwarded-clock receiver robust against power noise with 1.92ns latency mismatch between data and clock in 65nm CMOS 1.22mW/Gb/s 9.6Gb/s数据抖动混合前向时钟接收器抗功率噪声,数据和时钟之间的延迟不匹配为1.92ns
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243831
Sang-Hye Chung, L. Kim
This paper presents a data jitter mixing forwarded-clock receiver which is robust against power supply induced jitter (PSIJ) and overcomes 1.92ns latency mismatch between data and clock. The forwarded-clock architecture has a tradeoff between the number of clock channels and the achievable data rate due to the lack of the jitter correlation between data and clock. Moreover, PSIJ due to a long clock distribution network and an injection-locked oscillator reduces the jitter correlation further. The proposed receiver eases this tradeoff, and also increases the jitter correlation reduced by PSIJ. The test chip achieves 9.6Gb/s with 1.22mW/Gb/s and occupies only 0.017mm2 in 65nm CMOS.
提出了一种数据抖动混合前向时钟接收机,该接收机具有抗电源抖动(PSIJ)的鲁棒性,克服了数据与时钟之间1.92ns的时延不匹配。由于缺乏数据和时钟之间的抖动相关性,前向时钟架构在时钟通道数量和可实现的数据速率之间进行了权衡。此外,由于长时钟分配网络和注入锁定振荡器,PSIJ进一步降低了抖动相关性。提出的接收机减轻了这种权衡,也增加了PSIJ减少的抖动相关性。测试芯片以1.22mW/Gb/s的速度达到9.6Gb/s,在65nm CMOS中仅占0.017mm2。
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引用次数: 8
A 13.5mA sub-2.5dB NF multi-band receiver 13.5mA sub-2.5dB NF多波段接收机
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243800
M. Mikhemar, A. Mirzaei, A. Hadji-Abdolhamid, J. Chiu, H. Darabi
An ultra low-power multi-band receiver covering any frequency band in the range 0.7-2.5GHz is fabricated in 40nm CMOS and occupies a total area of 1.5mm2. The receiver achieves a NF of 2.4dB, with -2dBm IIP3, and a peak SNR of 35dB, while consuming 13.5mA from the battery, more than three times power reduction compared to prior art.
采用40nm CMOS工艺制作了覆盖0.7-2.5GHz范围内任意频段的超低功耗多波段接收机,总占地面积为1.5mm2。该接收器的NF值为2.4dB, IIP3值为-2dBm,峰值信噪比为35dB,同时电池消耗13.5mA,与现有技术相比,功耗降低了三倍以上。
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引用次数: 5
Dynamic intrinsic chip ID using 32nm high-K/metal gate SOI embedded DRAM 动态内禀芯片ID采用32nm高k /金属栅极SOI嵌入式DRAM
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243832
D. Fainstein, S. Rosenblatt, A. Cestero, N. Robson, T. Kirihata, S. Iyer
A random intrinsic chip ID method generates a pair of 4Kb binary strings using retention fails in 32nm SOI embedded DRAM. Hardware results show ID overlap distance mean=0.58 and σ=0.76 and demonstrate 100% authentication for 346 chips. The analytical model predicts >; 99.999% unique IDs for 106 parts.
在32nm SOI嵌入式DRAM中,随机固有芯片ID方法利用保留故障生成一对4Kb二进制字符串。硬件测试结果表明,ID重叠距离均值为0.58,σ=0.76,对346个芯片进行了100%的认证。解析模型预测>;106个部件的99.999%唯一id。
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引用次数: 11
A SRAM cell array with adaptive leakage reduction scheme for data retention in 28nm high-k metal-gate CMOS 28nm高k金属栅CMOS中具有自适应泄漏减少方案的SRAM单元阵列
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243790
P. Hsu, Yukit Tang, Derek Tao, Ming-Chieh Huang, Min-Jer Wang, C. H. Wu, Q. Lee
1Mbit SRAM macro with adaptive leakage current reduction scheme is implemented in 28nm high-k metal gate CMOS technology. A current limiter that limits cell array leakage current at various process-voltage-temperature (PVT) corners is included in the proposed scheme. The leakage current is reduced by more than 60% at fast process corners by increasing virtual ground voltage (Vvgnd) while maintaining sufficient data retention margin. At low VDD or slow process corners, Vvgnd is lowered to maintain the data integrity in the bitcell.
采用28nm高k金属栅CMOS技术,实现了具有自适应漏电流减小方案的1Mbit SRAM宏。该方案包括一个电流限制器,用于限制电池阵列在不同工艺电压温度(PVT)角处的泄漏电流。通过增加虚拟地电压(Vvgnd),同时保持足够的数据保留余量,在快速工艺拐角处泄漏电流减少了60%以上。在低VDD或慢进程拐角,降低Vvgnd以保持位单元中的数据完整性。
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引用次数: 4
A 3.2fJ/c.-s. 0.35V 10b 100KS/s SAR ADC in 90nm CMOS 一辆3.2陆地/ c。0.35V 10b 100KS/s SAR ADC, 90nm CMOS
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243805
Hung-Yen Tai, Hung-Wei Chen, Hsin-Shu Chen
A low-voltage energy-efficient SAR ADC is presented in this paper with four techniques. Arbitrary weight capacitor array tolerates errors to reduce conversion time. To operate under low voltage, DAC common mode level shift and leakage reduction sample switch with a charge pump are proposed. Differential control logic is used to save its digital power. The prototype ADC consumes 170nW at 100KS/s from a 0.35V supply. It achieves an SNDR of 56.3dB at Nyquist rate and its FOM is 3.2fJ/c.-s.
本文提出了一种采用四种技术的低电压高效SAR ADC。任意重量的电容器阵列容忍误差,以减少转换时间。为了在低电压下工作,提出了带电荷泵的DAC共模电平转换和减漏采样开关。采用差分控制逻辑,节省数字功耗。原型ADC在0.35V电源下以100KS/s的速度消耗170nW。在Nyquist速率下,SNDR为56.3dB, FOM为3.2fJ/c -s。
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引用次数: 25
A 5.2mW, 0.0016% THD up to 20kHz, ground-referenced audio decoder with PSRR-enhanced class-AB 16Ω headphone amplifiers 5.2mW, 0.0016% THD高达20kHz,接地参考音频解码器与psrr增强ab类16Ω耳机放大器
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243769
Shon-Hang Wen, Cheng-Chung Yang
A low-power ground-referenced audio decoder with PSRR-enhanced class-AB headphone amplifiers presents <;0.0016% THD in the whole audio band against the supply ripple by a negative charge-pump. Realized in the 40nm CMOS, the fully-integrated stereo decoder achieves 91dB SNDR and 100dB dynamic range while driving a 16Ω headphone load and consumes 5.2mW from a 1.8V power supply. The core area is 0.093mm2/channel only.
采用psrr增强的ab类耳机放大器的低功耗地参考音频解码器在整个音频频带中对负电荷泵的电源纹波的THD < 0.0016%。在40nm CMOS中实现的全集成立体声解码器在驱动16Ω耳机负载的同时实现了91dB SNDR和100dB动态范围,并从1.8V电源消耗5.2mW。核心区域仅为0.093mm2/通道。
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引用次数: 10
A 50nA quiescent current asynchronous digital-LDO with PLL-modulated fast-DVS power management in 40nm CMOS for 5.6 times MIPS performance 采用40nm CMOS的50nA静态电流异步数字ldo,具有锁相环调制的快速dvs电源管理,具有5.6倍MIPS性能
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243848
Yu-Huei Lee, S. Peng, A. C. Wu, Chao-Chang Chiu, Yao-Yi Yang, Ming-Hsin Huang, Ke-Horng Chen, Ying-Hsi Lin, Shih-Wei Wang, Ching-Yuan Yeh, Chen-Chih Huang, Chao-Cheng Lee
A 50nA quiescent current asynchronous digital-LDO (DLDO) integrated with the PLL-modulated switching regulator (SWR) exhibits the hybrid power management operation. The proposed bidirectional asynchronous wave pipeline (BAWP) in the asynchronous DLDO realizes the Fast-DVS (F-DVS) operation within tens of nano-seconds. The SWR with the leading phase amplifier achieves on-the-fly DVS and 94% peak efficiency, as well as improves 5.6 times MIPS performance through hybrid operation. The fabricated chip occupies 1.04mm2 in 40nm CMOS.
结合锁相调制开关稳压器(SWR)的50nA静态电流异步数字ldo (DLDO)具有混合电源管理功能。本文提出的双向异步波管道(BAWP)在异步DLDO中实现了几十纳秒内的快速分布式交换机(F-DVS)操作。前置相位放大器的SWR实现了动态DVS和94%的峰值效率,并通过混合操作提高了5.6倍的MIPS性能。制作的芯片在40nm CMOS中占地1.04mm2。
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引用次数: 13
Integrated all-silicon thin-film power electronics on flexible sheets for ubiquitous wireless charging stations based on solar-energy harvesting 基于太阳能收集的无所不在的无线充电站的柔性片上集成全硅薄膜电力电子器件
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243858
Liechao Huang, W. Rieutort-Louis, Yingzhe Hu, J. Sanz-Robinson, S. Wagner, J. Sturm, N. Verma
With the explosion in the number of battery-powered portable devices, ubiquitous powering stations that exploit energy harvesting can provide an extremely compelling means of charging. We present a system on a flexible sheet that, for the first time, integrates the power electronics using the same thin-film amorphous-silicon (a-Si) technology as that used for established flexible photovoltaics. This demonstrates a key step towards future large-area flexible sheets which could cover everyday objects, to convert them into wireless charging stations. In this work, we combine the thin-film circuits with flexible solar cells to provide embedded power inversion, harvester control, and power amplification. This converts DC outputs from the solar modules to AC power for wireless device charging through patterned capacitive antennas. With 0.5-2nF transfer antennas and solar modules of 100cm2, the system provides 47-120μW of power at 11-22% overall power-transfer efficiency under indoor lighting.
随着电池供电的便携式设备数量的激增,利用能量收集的无处不在的发电站可以提供一种极具吸引力的充电方式。我们提出了一个柔性片上的系统,该系统首次使用与已建立的柔性光伏电池相同的非晶硅薄膜(a- si)技术集成了电力电子器件。这是迈向未来的关键一步,它可以覆盖日常物品,并将其转化为无线充电站。在这项工作中,我们将薄膜电路与柔性太阳能电池结合起来,提供嵌入式功率反转,收割机控制和功率放大。这将太阳能模块的直流输出转换为交流电源,通过图案电容天线为无线设备充电。系统采用0.5-2nF传输天线和100cm2的太阳能模块,在室内照明条件下可提供47-120μW的功率,总功率传输效率为11% -22%。
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引用次数: 15
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2012 Symposium on VLSI Circuits (VLSIC)
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