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2012 Symposium on VLSI Circuits (VLSIC)最新文献

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An event-driven, alias-free ADC with signal-dependent resolution 一个事件驱动的无别名ADC,具有信号依赖的分辨率
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243773
Colin Weltin-Wu, Y. Tsividis
A clockless 8b ADC in 130nm CMOS uses a time-varying comparison window to dynamically vary resolution, and input-dependent dynamic bias, to maintain SNDR while saving power. Alias-free operation with SNDR in the range of 47-54dB, which partly exceeds the theoretical limit of 8b conventional converters, is achieved over a 20kHz bandwidth with 3-9μW power from a 0.8V supply.
130nm CMOS的无时钟8b ADC采用时变比较窗口来动态改变分辨率和输入相关的动态偏置,在保持SNDR的同时节省功耗。在20kHz带宽和3-9μW功率下,在0.8V电源下实现了47-54dB范围内的无误操作,SNDR部分超过了传统转换器8b的理论极限。
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引用次数: 28
A 1.2V 8.3nJ energy-efficient CMOS humidity sensor for RFID applications 一种用于RFID应用的1.2V 8.3nJ节能CMOS湿度传感器
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243771
Z. Tan, Youngcheol Chae, R. Daamen, A. Humbert, Youri Ponomarev, M. Pertijs
A CMOS fully-integrated humidity sensor for a RFID sensor platform has been realized in 0.16μm CMOS technology. It consists of a top-metal finger capacitor, covered by a humidity-sensitive polyimide layer, and an energy-efficient inverter-based capacitance-to-digital converter (CDC). Measurements show that the CDC performs a 12.5-bit conversion in 0.8ms while consuming only 8.6μA from a 1.2V supply. Together with the co-integrated humidity sensor, this translates into a resolution of 0.05% RH in the range of 30% RH to 90% RH, at an energy consumption of only 8.3nJ per measurement.
采用0.16μm CMOS技术,实现了用于RFID传感器平台的CMOS全集成湿度传感器。它由一个顶部金属手指电容器组成,上面覆盖着一层湿度敏感的聚酰亚胺层,以及一个基于节能逆变器的电容-数字转换器(CDC)。测量表明,CDC在0.8ms内完成12.5位转换,同时从1.2V电源中仅消耗8.6μA。与协集成湿度传感器一起,在30% RH至90% RH的范围内,这转化为0.05% RH的分辨率,每次测量的能耗仅为8.3nJ。
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引用次数: 27
A 260 GHz fully integrated CMOS transceiver for wireless chip-to-chip communication 一个260 GHz完全集成的CMOS收发器,用于无线芯片对芯片通信
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243783
Jung‐Dong Park, Shinwon Kang, S. V. Thyagarajan, E. Alon, A. Niknejad
A fully integrated 260GHz OOK transceiver is demonstrated in 65nm CMOS. Communication at 10Gb/s has been verified over a range of 40 mm. The Tx/Rx dual on-chip antenna array is implemented with half-width leaky wave antennas. Each Tx consists of a quadrupler driven by a class-D-1 PA with a distributed OOK modulator, and outputs +5 dBm of EIRP. The Rx uses a double balanced mixer to down-convert to a V-band IF signal that is amplified with a wideband IF driver and demoduated on-chip.
在65nm CMOS中演示了完全集成的260GHz OOK收发器。在40毫米范围内验证了10Gb/s的通信。Tx/Rx双片上天线阵列采用半宽漏波天线实现。每个Tx由一个带有分布式OOK调制器的d -1类PA驱动的四倍器组成,输出+5 dBm的EIRP。Rx使用双平衡混频器向下转换为v波段中频信号,该信号通过宽带中频驱动器放大并在片上解调。
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引用次数: 169
A fully-digital phase-locked low dropout regulator in 32nm CMOS 32nm CMOS全数字锁相低差稳压器
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243833
A. Raychowdhury, D. Somasekhar, J. Tschanz, V. De
A fully-digital phase-locked low dropout regulator (LDO) has been designed in 32nm CMOS for fine-grained power delivery to multi-Vcc digital circuits. Measurements across a wide range of input voltages and currents exhibit that the LDO offers excellent load regulation and efficiency close to 97% of ideal efficiency at nominal load current conditions (ILOAD=3mA).
采用32nm CMOS设计了一种全数字锁相低差稳压器(LDO),用于向多vcc数字电路提供细粒度功率。在广泛的输入电压和电流范围内的测量表明,LDO具有出色的负载调节能力,在标称负载电流条件下(ILOAD=3mA),其效率接近理想效率的97%。
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引用次数: 16
A 7b, 3.75ps resolution two-step time-to-digital converter in 65nm CMOS using pulse-train time amplifier 一个7b, 3.75ps分辨率的65纳米CMOS两步时间-数字转换器,使用脉冲序列时间放大器
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243855
KwangSeok Kim, Young-Hwa Kim, Wonsik Yu, Seonghwan Cho
This paper presents a time-to-digital converter (TDC) using a novel pulse-train time amplifier. The proposed TDC exploits repetitive pulses with gated delay-lines for a calibration-free and programmable time amplification and quantization. Using this circuit, a 7-bit two-step time-to-digital converter is implemented. The prototype chip fabricated in 65nm CMOS process achieves 3.75ps of time resolution at 200Msps while consuming 3.6mW and occupying 0.02mm2.
提出了一种采用新型脉冲串时间放大器的时间-数字转换器(TDC)。所提出的TDC利用具有门控延迟线的重复脉冲进行免校准和可编程的时间放大和量化。利用该电路实现了一个7位两步时间-数字转换器。采用65nm CMOS工艺制作的原型芯片在200Msps下,功耗3.6mW,占用0.02mm2,时间分辨率为3.75ps。
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引用次数: 55
A 32.4 ppm/°C 3.2-1.6V self-chopped relaxation oscillator with adaptive supply generation 一个32.4 ppm/°C 3.2-1.6V自切碎弛豫振荡器,具有自适应电源产生
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243766
Keng-Jan Hsiao
A self-chopped relaxation oscillator with adaptive supply generation provides the stable output clock against variations in temperature and supply voltages. The frequency drift is less than ±0.1% for the supply voltage changing from 1.6 to 3.2 V and ±0.1% for a temperature range from -20 to 100°C, which is reduced by 83% with the self-chopped technique. This relaxation oscillator is implemented in a 60-nm CMOS technology with its active area equals to 0.048 mm2. It consumes 2.8 uA from a 1.6-V supply.
具有自适应电源产生的自斩波弛豫振荡器提供稳定的输出时钟,以抵抗温度和电源电压的变化。当电源电压在1.6 ~ 3.2 V范围内变化时,频率漂移小于±0.1%,当温度在-20 ~ 100℃范围内变化时,频率漂移小于±0.1%,采用自斩波技术后,频率漂移减小了83%。该弛豫振荡器采用60纳米CMOS技术实现,其有源面积为0.048 mm2。它从1.6 v电源消耗2.8 uA。
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引用次数: 66
A 0.41µA standby leakage 32Kb embedded SRAM with Low-Voltage resume-standby utilizing all digital current comparator in 28nm HKMG CMOS 一个0.41µA待机泄漏32Kb嵌入式SRAM,采用28nm HKMG CMOS全数字电流比较器,具有低压恢复待机功能
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243788
N. Maeda, S. Komatsu, M. Morimoto, Y. Shimazaki
A high-performance and low-leakage current embedded SRAM for mobile phones is proposed. The proposed SRAM has a low-voltage resume-standby mode to reduce the standby leakage. An all digital current comparator is also proposed to choose a suitable standby mode. A test chip was fabricated using 28 nm HKMG CMOS technology. The proposed 32 Kb SRAM achives 0.41 μA standby leakage which is half of the conventional value, with 420 ps access.
提出了一种高性能、低漏电流的手机嵌入式SRAM。所提出的SRAM具有低电压恢复-待机模式,以减少待机泄漏。还提出了一种全数字电流比较器,以选择合适的待机模式。采用28nm HKMG CMOS工艺制作了测试芯片。所提出的32 Kb SRAM在420 ps的访问下实现了0.41 μA的待机泄漏,是常规值的一半。
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引用次数: 8
Isolated Preset Architecture for a 32nm SOI embedded DRAM macro 32纳米SOI嵌入式DRAM宏的隔离预置架构
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243814
J. Barth, D. Plass, Adis Vehabovic, R. Joshi, R. Kanj, S. Burns, T. Weaver
The Isolated Preset Architecture (IPA) improves retention characteristics by implementing a weak read `1' Isolation scheme, allowing a lower stored `1' level to be sensed. The architecture also reduces sub-array area by 15% and bit-line activation power by 2× compared to previous design, without impacting performance. The architecture was implemented in IBM's 32nm High-K/Metal SOI embedded DRAM technology. Hardware results confirm 1.8ns random cycle and 2× improved retention characteristic with optimized Analog reference tuning.
隔离预置架构(IPA)通过实现弱读“1”隔离方案来改善保留特性,允许感知较低的存储“1”级别。与之前的设计相比,该架构还减少了15%的子阵列面积和2倍的位线激活功率,而不会影响性能。该架构采用IBM的32nm High-K/Metal SOI嵌入式DRAM技术实现。硬件结果证实了1.8ns随机周期和2倍改进的保留特性与优化的模拟参考调谐。
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引用次数: 0
A 28nm high-k metal-gate SRAM with Asynchronous Cross-Couple Read Assist (AC2RA) circuitry achieving 3x reduction on speed variation for single ended arrays 28nm高k金属门SRAM,具有异步交叉偶读辅助(AC2RA)电路,可将单端阵列的速度变化降低3倍
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243791
Robin Lee, Jung-Ping Yang, Chia-En Huang, Chih-Chieh Chiu, Wei-Shuo Kao, Hong-Chen Cheng, H. Liao, Jonathan Chang
Asynchronous Cross-Couple Read Assist (AC2RA) circuitry scheme was invented for single-ended sensing to minimize speed variation in 28nm HKMG process. It improves SRAM array speed variation by 63.3% which is adequate to cover 6σ variation. Access time is also boosted by faster sensing.
为减少28nm HKMG工艺的速度变化,设计了单端异步交叉偶读辅助(AC2RA)电路方案。它使SRAM阵列的速度变化提高了63.3%,足以覆盖6σ的变化。更快的传感也提高了访问时间。
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引用次数: 3
A 2.98nW bandgap voltage reference using a self-tuning low leakage sample and hold 一个2.98nW带隙基准电压,采用自调谐低漏采样和保持器
Pub Date : 2012-06-13 DOI: 10.1109/VLSIC.2012.6243859
Yen-Po Chen, Matthew R. Fojtik, D. Blaauw, D. Sylvester
A novel low power bandgap voltage reference using a sample and hold circuit with self-calibrating duty cycle and leakage compensation is presented. Measurements of 0.18μm CMOS test chips show a temperature coefficient of 24.7ppm/°C and power consumption of 2.98nW, marking a 251× power reduction over the previous lowest power bandgap reference.
提出了一种新型的低功耗带隙基准电压,采用自校准占空比和漏损补偿的采样保持电路。0.18μm CMOS测试芯片的温度系数为24.7ppm/°C,功耗为2.98nW,与之前的最低功耗带隙基准相比,功耗降低了251倍。
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引用次数: 31
期刊
2012 Symposium on VLSI Circuits (VLSIC)
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