Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433007
A. Scheurle, T. Fuchs, K. Kehr, C. Leinenbach, S. Kronmuller, A. Arias, J. Ceballos, M. A. Lagos, J. M. Mora, J. M. Muñoz, A. Ragel, J. Ramos, S. Van Aerde, J. Spengler, A. Mehta, A. Verbist, B. du Bois, A. Witvrouw
This paper describes a monolithically integrated omegaz-gyroscope fabricated in a surface-micromaching technology. As functional structure, a 10 mum thick Silicon-Germanium layer is processed above a standard high voltage 0.35 mum CMOS-ASIC. Drive and Sense of the in plane double wing gyroscope is fully capacitively. Measurement of movement is also done fully capacitively in continuous-time baseband sensing. For characterization, the gyroscope chip is mounted on a breadboard with auxiliary circuits. A noise floor of 0.01 degs/sqrt(Hz) for operation at 3 mBar is achieved.
本文介绍了一种采用表面微加工技术制造的单片集成欧米茄陀螺仪。作为功能结构，在标准高压0.35 μ m CMOS-ASIC上加工了10 μ m厚的硅锗层。飞机双翼陀螺仪的驱动和感应是全电容式的。在连续时间基带传感中，运动测量也是完全电容化的。为了进行表征，陀螺仪芯片被安装在带有辅助电路的面包板上。在3毫巴的工作条件下，噪声底限为0.01度/平方度(Hz)。
{"title":"A 10 μm thick poly-SiGe gyroscope processed above 0.35 μm CMOS","authors":"A. Scheurle, T. Fuchs, K. Kehr, C. Leinenbach, S. Kronmuller, A. Arias, J. Ceballos, M. A. Lagos, J. M. Mora, J. M. Muñoz, A. Ragel, J. Ramos, S. Van Aerde, J. Spengler, A. Mehta, A. Verbist, B. du Bois, A. Witvrouw","doi":"10.1109/MEMSYS.2007.4433007","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433007","url":null,"abstract":"This paper describes a monolithically integrated omegaz-gyroscope fabricated in a surface-micromaching technology. As functional structure, a 10 mum thick Silicon-Germanium layer is processed above a standard high voltage 0.35 mum CMOS-ASIC. Drive and Sense of the in plane double wing gyroscope is fully capacitively. Measurement of movement is also done fully capacitively in continuous-time baseband sensing. For characterization, the gyroscope chip is mounted on a breadboard with auxiliary circuits. A noise floor of 0.01 degs/sqrt(Hz) for operation at 3 mBar is achieved.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1999 1","pages":"39-42"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82792176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433115
W. Song, Z. Ding, C. Son, B. Ziaie
In this paper, we report a new and simple method for manipulating free droplets using ferrofluid dynamics. For the movement of free droplets using ferrofluid, a periodic pattern of ferrofluid is generated by using a strip magnet and dynamically modified using a magnetic stirrer. The dependence of droplet movement on the size of droplets and the rotation speed of the magnetic stirrer is studied. In order to improve the mixing efficiency, a discontinuity in the ferrofluid pattern at the mixing spots is created by adding a smaller strip magnet to the above setup. We demonstrate a reduction in the mixing time at the target spot as compared to the setup without the addition of the smaller strip magnet. A novel aspect of the reported work is the use of ferrofluid dynamics to control the movement and mixing of free microdroplets without sample evaporation and solid surface contact contamination.
{"title":"A dynamic ferrofluid platform for micromanipulation","authors":"W. Song, Z. Ding, C. Son, B. Ziaie","doi":"10.1109/MEMSYS.2007.4433115","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433115","url":null,"abstract":"In this paper, we report a new and simple method for manipulating free droplets using ferrofluid dynamics. For the movement of free droplets using ferrofluid, a periodic pattern of ferrofluid is generated by using a strip magnet and dynamically modified using a magnetic stirrer. The dependence of droplet movement on the size of droplets and the rotation speed of the magnetic stirrer is studied. In order to improve the mixing efficiency, a discontinuity in the ferrofluid pattern at the mixing spots is created by adding a smaller strip magnet to the above setup. We demonstrate a reduction in the mixing time at the target spot as compared to the setup without the addition of the smaller strip magnet. A novel aspect of the reported work is the use of ferrofluid dynamics to control the movement and mixing of free microdroplets without sample evaporation and solid surface contact contamination.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"41 1","pages":"505-508"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90854214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433000
Jongseok Kim, Sangwook Kwon, Hong Youngtack, Hee-Moon Jeong, Sanghoon Lee
A DC contact series MEMS switch for reconfigurable antenna system application is designed, fabricated, and its RF characteristics are measured. Variable pivot seesaw concept is applied because this design minimize the driving voltage and prevent stiction of membrane. The proposed switch structure is fabricated on the Si wafer, a coplanar waveguide(CPW) signal lines and electrodes are fabricated on the glass wafer. Both wafer are bonded by anodic bonding method. The designed chip size is within 2 mmx2 mm and it is actuated by electrostatic force. Low actuation voltage has been achieved by means of small distance between signal line and membrane using the design scheme, switching is executed in the pull-in range. Minimum actuation voltage is about 10-12 V, isolation is around 50 dB and insertion loss is about 0.25 dB at 2 GHz.
{"title":"Variable pivot seesaw actuated RF MEMS switch for reconfigurable system application","authors":"Jongseok Kim, Sangwook Kwon, Hong Youngtack, Hee-Moon Jeong, Sanghoon Lee","doi":"10.1109/MEMSYS.2007.4433000","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433000","url":null,"abstract":"A DC contact series MEMS switch for reconfigurable antenna system application is designed, fabricated, and its RF characteristics are measured. Variable pivot seesaw concept is applied because this design minimize the driving voltage and prevent stiction of membrane. The proposed switch structure is fabricated on the Si wafer, a coplanar waveguide(CPW) signal lines and electrodes are fabricated on the glass wafer. Both wafer are bonded by anodic bonding method. The designed chip size is within 2 mmx2 mm and it is actuated by electrostatic force. Low actuation voltage has been achieved by means of small distance between signal line and membrane using the design scheme, switching is executed in the pull-in range. Minimum actuation voltage is about 10-12 V, isolation is around 50 dB and insertion loss is about 0.25 dB at 2 GHz.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"775-778"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89757427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433054
R. Melamud, Bongsang Kim, M. Hopcroft, S. Chandorkar, M. Agarwal, C. Jha, T. Kenny
This paper presents the design and characterization of a flexural mode composite resonator whose inherent frequency sensitivity to temperature changes is reduced. The resonator is an encapsulated single anchor, double ended tuning fork (DETF) composed of single crystal silicon with a silicon dioxide coating. The frequency variation with temperature of the composite resonator exhibits a turnover temperature at which the frequency does not change with temperature. The turnover temperature can be controlled by varying the thickness of the silicon dioxide. This useful characteristic could be combined with active temperature compensation for more precise timing applications. The fabricated devices show a temperature sensitivity that is comparable to a quartz crystal tuning fork resonator.
{"title":"Composite flexural-mode resonator with controllable turnover temperature","authors":"R. Melamud, Bongsang Kim, M. Hopcroft, S. Chandorkar, M. Agarwal, C. Jha, T. Kenny","doi":"10.1109/MEMSYS.2007.4433054","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433054","url":null,"abstract":"This paper presents the design and characterization of a flexural mode composite resonator whose inherent frequency sensitivity to temperature changes is reduced. The resonator is an encapsulated single anchor, double ended tuning fork (DETF) composed of single crystal silicon with a silicon dioxide coating. The frequency variation with temperature of the composite resonator exhibits a turnover temperature at which the frequency does not change with temperature. The turnover temperature can be controlled by varying the thickness of the silicon dioxide. This useful characteristic could be combined with active temperature compensation for more precise timing applications. The fabricated devices show a temperature sensitivity that is comparable to a quartz crystal tuning fork resonator.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"199-202"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89209942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433174
S. Hsiung, Gwo-Bin Lee
In this study, a new and simple design of a controllable micro-lens structures capable of the enhancement of laser induced fluorescence (LIF) system has been demonstrated. Two pneumatic side-chambers were placed between a micro sample flow channel and an optic fiber channel. The interval between the side-chamber and the micro sample channel was used to form a controllable micro-lens structure. A deformation of the micro-lens structure can be generated after a pressurized index-matching fluid was injected into the pneumatic side-chambers. The side-chambers can be deflected as a convex lens to focus both the laser light source and the fluorescence emission. The profile and the focal length of the micro-lens structure can be adjusted by using different applied pressures accordingly so that bio-samples with a low concentration can be detected. Using low-cost polymeric materials such as polydimethylsiloxane (PDMS), rapid and reliable fabrication techniques involving standard lithography and replication process was employed for the formation of the proposed chip device. Finally, experimental results clearly revealed the micro-lens structure can be deformed as a convex lens to focus the laser light source and the fluorescence signal can be enhanced successfully. The developed device has a great potential to be integrated with other microfluidic devices for further biomedical applications.
{"title":"A controllable micro-lens structure for bio-analytical applications","authors":"S. Hsiung, Gwo-Bin Lee","doi":"10.1109/MEMSYS.2007.4433174","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433174","url":null,"abstract":"In this study, a new and simple design of a controllable micro-lens structures capable of the enhancement of laser induced fluorescence (LIF) system has been demonstrated. Two pneumatic side-chambers were placed between a micro sample flow channel and an optic fiber channel. The interval between the side-chamber and the micro sample channel was used to form a controllable micro-lens structure. A deformation of the micro-lens structure can be generated after a pressurized index-matching fluid was injected into the pneumatic side-chambers. The side-chambers can be deflected as a convex lens to focus both the laser light source and the fluorescence emission. The profile and the focal length of the micro-lens structure can be adjusted by using different applied pressures accordingly so that bio-samples with a low concentration can be detected. Using low-cost polymeric materials such as polydimethylsiloxane (PDMS), rapid and reliable fabrication techniques involving standard lithography and replication process was employed for the formation of the proposed chip device. Finally, experimental results clearly revealed the micro-lens structure can be deformed as a convex lens to focus the laser light source and the fluorescence signal can be enhanced successfully. The developed device has a great potential to be integrated with other microfluidic devices for further biomedical applications.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"763-766"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83617696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433103
R. Modlinski, R. Puers, I. De Wolf
Measuring mechanical properties at the microscale is essential to understand and fabricate reliable MEMS. In this paper we present a tensile testing system and test samples on the microscale. The test samples have a dog-bone like structure. They were designed to mimic fundamental and standardized macro-tensile test samples. The micro-tensile tests were used to characterize 1.7mum thick AlCuMgMn films. This alloy was selected because it is a very promising material for use in RF-MEMS switches due to its high resistance to creep. We show that the mechanical properties of the AlCuMgMn film depend not only on the alloying components but also on the material's microstructure: grain sizes, distribution, strength and density of the precipitates, etc. We show a direct relation between the film's mechanical properties and the coherence, size and spacing of precipitates as observed by SEM and TEM in the alloy.
{"title":"Micro-tensile tests to characterize MEMS","authors":"R. Modlinski, R. Puers, I. De Wolf","doi":"10.1109/MEMSYS.2007.4433103","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433103","url":null,"abstract":"Measuring mechanical properties at the microscale is essential to understand and fabricate reliable MEMS. In this paper we present a tensile testing system and test samples on the microscale. The test samples have a dog-bone like structure. They were designed to mimic fundamental and standardized macro-tensile test samples. The micro-tensile tests were used to characterize 1.7mum thick AlCuMgMn films. This alloy was selected because it is a very promising material for use in RF-MEMS switches due to its high resistance to creep. We show that the mechanical properties of the AlCuMgMn film depend not only on the alloying components but also on the material's microstructure: grain sizes, distribution, strength and density of the precipitates, etc. We show a direct relation between the film's mechanical properties and the coherence, size and spacing of precipitates as observed by SEM and TEM in the alloy.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"255-258"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79908456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433011
A. Isozaki, A. Nakai, K. Matsumoto, I. Shimoyama
We propose a nanocrystalline porous silicon (nc-PS) ultrasonic transmitter with a variable directional pattern. The directional pattern is realized by using an interference effect. An ultrasonic wave is emitted from electrodes on the nc-PS layer according to the applied electrical current. The emission areas of the transmitter were patterned in order to use the interference between the emitted ultrasonic waves. To observe the interference effect, our device was designed to have two emission areas. The directional pattern induced by the interference effect depends on the distance between the emission areas, and the frequency and the phase difference of the currents applied to the emission areas. We confirmed that the sharpness and the lobe number of the directional pattern can be changed by the phase difference between two emission areas. We also confirmed that the direction of the main lobe can be changed by the phase difference. With the characteristics of the designable and controllable directional pattern, the proposed device is suitable for distance sensors, especially for proximity sensors.
{"title":"Nanocrystalline porous silicon ultrasonic transmitter with patterned emission area","authors":"A. Isozaki, A. Nakai, K. Matsumoto, I. Shimoyama","doi":"10.1109/MEMSYS.2007.4433011","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433011","url":null,"abstract":"We propose a nanocrystalline porous silicon (nc-PS) ultrasonic transmitter with a variable directional pattern. The directional pattern is realized by using an interference effect. An ultrasonic wave is emitted from electrodes on the nc-PS layer according to the applied electrical current. The emission areas of the transmitter were patterned in order to use the interference between the emitted ultrasonic waves. To observe the interference effect, our device was designed to have two emission areas. The directional pattern induced by the interference effect depends on the distance between the emission areas, and the frequency and the phase difference of the currents applied to the emission areas. We confirmed that the sharpness and the lobe number of the directional pattern can be changed by the phase difference between two emission areas. We also confirmed that the direction of the main lobe can be changed by the phase difference. With the characteristics of the designable and controllable directional pattern, the proposed device is suitable for distance sensors, especially for proximity sensors.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"72 1","pages":"55-58"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86255777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433016
X. Zhuang, Der-song Lin, O. Oralkan, B. Khuri-Yakub
This paper reports on a method to fabricate flexible one-dimensional (1D) and two-dimensional (2D) micromachined transducer arrays that are electrically connected to flip-chip bond pads on the back side of the array. In our case, the transducers are capacitive micromachined ultrasonic transducers (CMUT) intended for medical ultrasound imaging. For ultrasound imaging, flexible arrays conform to the body part being imaged. Flexible arrays are also desired for certain catheter and fixed-focus array geometries. Electrical connection to bond pads on the back side of the array is provided for flip-chip bonding to an integrated circuit or flexible PCB. The arrays are made flexible by etching through-wafer trenches and filling the trenches with polydimethylsiloxane (PDMS). The flexibility of the substrate is demonstrated by wrapping it around a needle tip with a radius of 650 mum (French catheter size of 4).
{"title":"Flexible transducer arrays with through-wafer electrical interconnects based on trench refilling with PDMS","authors":"X. Zhuang, Der-song Lin, O. Oralkan, B. Khuri-Yakub","doi":"10.1109/MEMSYS.2007.4433016","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433016","url":null,"abstract":"This paper reports on a method to fabricate flexible one-dimensional (1D) and two-dimensional (2D) micromachined transducer arrays that are electrically connected to flip-chip bond pads on the back side of the array. In our case, the transducers are capacitive micromachined ultrasonic transducers (CMUT) intended for medical ultrasound imaging. For ultrasound imaging, flexible arrays conform to the body part being imaged. Flexible arrays are also desired for certain catheter and fixed-focus array geometries. Electrical connection to bond pads on the back side of the array is provided for flip-chip bonding to an integrated circuit or flexible PCB. The arrays are made flexible by etching through-wafer trenches and filling the trenches with polydimethylsiloxane (PDMS). The flexibility of the substrate is demonstrated by wrapping it around a needle tip with a radius of 650 mum (French catheter size of 4).","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"36 1","pages":"73-76"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88400134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433108
T. Ozaki, K. Sugano, T. Tsuchiya, O. Tabata
We propose a method of sub-micro particle pattern formation with high productivity, flexibility and accuracy of pattern. The proposed process is composed of template-assisted self-assembly (TASA) for particle self-assembly and subsequent two-step transfer of the assembled particles. In the self-assembly process, the pattern of 70% was successfully self-assembled. In the first transfer step, the transfer yield of 79% was obtained by SAM (self-assembled monolayer) coated carrier substrate. In the second transfer step, the transfer temperature of 115degC provided the maximum transfer yield of 85%. The overall process yield of 48% was achieved by optimized process parameters and it was successfully demonstrated that the proposed method fabricates any sub-micro particle pattern.
{"title":"Versatile method of sub-micro particle pattern formation using self-assembly and two-step transfer","authors":"T. Ozaki, K. Sugano, T. Tsuchiya, O. Tabata","doi":"10.1109/MEMSYS.2007.4433108","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433108","url":null,"abstract":"We propose a method of sub-micro particle pattern formation with high productivity, flexibility and accuracy of pattern. The proposed process is composed of template-assisted self-assembly (TASA) for particle self-assembly and subsequent two-step transfer of the assembled particles. In the self-assembly process, the pattern of 70% was successfully self-assembled. In the first transfer step, the transfer yield of 79% was obtained by SAM (self-assembled monolayer) coated carrier substrate. In the second transfer step, the transfer temperature of 115degC provided the maximum transfer yield of 85%. The overall process yield of 48% was achieved by optimized process parameters and it was successfully demonstrated that the proposed method fabricates any sub-micro particle pattern.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"34 1","pages":"353-356"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88783960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433140
M. Ogawa, Y. Isono
This paper describes a novel shear testing technique for MEMS materials based on an asymmetrical four-point bending (AFPB) method (Izumi and Ping, 2005). This research has newly developed a shear tester and a AFPB test specimen that are able to apply simple shear stress loading to a micro single crystal silicon (SCS) specimen with "U" shaped notches (U-notches), in order to estimate shear strength and to observed fracture behavior for the SCS specimens under shear stressing. Consequently, we have, for the first time, succeeded in evaluating the shear strength and shear strain of SCS on a microscale. Averaged shear modulus of SCS was obtained 53.7 GPa in [112] direction on (110) plane, which was close to theoretical value. The shear strength of SCS ranged from 1.0 to 1.3 GPa. The fracture behavior under the shear stressing was observed. The crack initiated on the slip plane at the bottom of U-notches, whereas it propagated perpendicularly to the maximum principal stress direction predicted by FEM.
本文描述了一种基于非对称四点弯曲(AFPB)方法的新型MEMS材料剪切测试技术(Izumi and Ping, 2005)。本研究开发了一种能够对带有“U”形缺口的微单晶硅(SCS)试样施加简单剪应力加载的剪切测试仪和AFPB试样，以估计SCS试样在剪应力作用下的抗剪强度和断裂行为。因此，我们首次成功地在微观尺度上评价了SCS的抗剪强度和剪切应变。在(110)平面上，SCS在[112]方向上的平均剪切模量为53.7 GPa，接近理论值。SCS的抗剪强度在1.0 ~ 1.3 GPa之间。观察了剪切应力作用下的断裂行为。裂纹在u形缺口底部滑移面上萌生，沿有限元预测的最大主应力方向垂直扩展。
{"title":"Novel shear strength evaluation of MEMS materials using asymmetrical four-point bending technique","authors":"M. Ogawa, Y. Isono","doi":"10.1109/MEMSYS.2007.4433140","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433140","url":null,"abstract":"This paper describes a novel shear testing technique for MEMS materials based on an asymmetrical four-point bending (AFPB) method (Izumi and Ping, 2005). This research has newly developed a shear tester and a AFPB test specimen that are able to apply simple shear stress loading to a micro single crystal silicon (SCS) specimen with \"U\" shaped notches (U-notches), in order to estimate shear strength and to observed fracture behavior for the SCS specimens under shear stressing. Consequently, we have, for the first time, succeeded in evaluating the shear strength and shear strain of SCS on a microscale. Averaged shear modulus of SCS was obtained 53.7 GPa in [112] direction on (110) plane, which was close to theoretical value. The shear strength of SCS ranged from 1.0 to 1.3 GPa. The fracture behavior under the shear stressing was observed. The crack initiated on the slip plane at the bottom of U-notches, whereas it propagated perpendicularly to the maximum principal stress direction predicted by FEM.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"121 1","pages":"259-262"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77573888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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