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2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)最新文献

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Acquisition of PPG signal for diagnosis of parameters related to heart 获取PPG信号诊断心脏相关参数
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260945
Rutuja Laulkar, Nivedita Daimiwal
Optical sensors that use photons as sensing elements are increasingly becoming important and relevant in the field of non-invasive diagnostics. The reason is that they are simple in construction, easy to use and relatively inexpensive in comparison with tools such as EEG, MRI and FMRI that can be used for research purposes without much investment. Among the various optical sensors available, the photoplethysmographic sensors that are capable of measuring the blood volumetric changes in subcutaneous vessels are used in present study. Objective is to diagnose different parameters like heart rate, blood pressure, respiratory rate, with the help of reflectance type PPG sensor. Real time PPG signal is captured from the sensor and with the help of microcontroller and RS 232 serial communication, the real time acquisition of PPG signal is observed on MATLAB. Detailed analysis of frequency spectrum of PPG signal shows a cardiac peak around 1Hz corresponding to 60 pulsations a minute and respiratory peak around 0.25 Hz corresponding to 15 inspiration/expiration cycles per minute. After the analysis of PPG signal, all the parameters are calculated and with the help of graphic user interface (GUI), all the parameters can simultaneously be seen on GUI window.
利用光子作为传感元件的光学传感器在非侵入性诊断领域越来越重要和相关。原因在于,与EEG、MRI和FMRI等工具相比,它们结构简单,使用方便,价格相对便宜,无需太多投资即可用于研究目的。在现有的各种光学传感器中,本研究使用的是能够测量皮下血管血容量变化的光容积脉搏波传感器。目的是利用反射式PPG传感器对心率、血压、呼吸频率等参数进行诊断。从传感器实时采集PPG信号,借助单片机和rs232串行通信,在MATLAB上观察PPG信号的实时采集。对PPG信号频谱的详细分析表明,心脏峰值在1Hz左右,对应每分钟60次脉动,呼吸峰值在0.25 Hz左右,对应每分钟15次吸气/呼气周期。对PPG信号进行分析后,计算出所有参数,并借助图形用户界面(GUI)在GUI窗口上同时显示所有参数。
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引用次数: 11
Optimization and analysis of piezoelectric and electrode materials' thickness effects on the performance of film bulk acoustic resonator 压电材料和电极材料厚度对薄膜体谐振器性能影响的优化与分析
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260916
S. Enjamuri, A. Amsanpally, K. C. James Raju
This paper reports the behavior of the FBAR and its performance due to change of materials and their thicknesses. The resonance of the resonator depends on the thickness of the piezoelectric thin film acoustic resonator. The confinement of the acoustic wave in resonator depends on the electrode thickness and materials. Here such materials effects and the geometric effects are studied. It is found that acoustic properties of all the layers influences the resonator performance, with increased resonance frequency results from thinner electrodes, as it decreases the mass loading effect of resonator's electrodes and uses high longitudinal velocity of the piezoelectric materials.
本文报道了FBAR在材料和厚度变化下的行为及其性能。谐振器的共振取决于压电薄膜声谐振器的厚度。声波在谐振腔中的约束取决于电极的厚度和材料。本文研究了这种材料效应和几何效应。研究发现,各层的声学特性都会影响谐振器的性能,电极越薄,谐振器电极的质量载荷效应越小,谐振频率越高,并且利用了压电材料的高纵向速度。
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引用次数: 4
Focal plane sensors 焦平面传感器
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260880
Y.S. Sarma
Vision ranks highest in hierarchy of human senses. Our perception of the world and things around us are perceived through our eye-sight with limitations such as resolution, speed, wave-length, etc. Sensors are devices used to sense signals of various forms of energy such as electro-magnetic (em) radiation, chemical, thermal, mechanical and magnetic in nature. Sensors used for detection of em radiation are generally termed as ‘detectors’. Detectors used to obtain images with imaging systems (viz., cameras, camcorders, etc) by placing them at their focal planes are termed as ‘Focal Plane Detectors or Focal Plane Sensors’. Any one type of focal plane sensor cannot be made to satisfy all the user needs because of varying requirements for their intended applications and thus often require custom design.
视觉在人类感官中排名最高。我们对世界和周围事物的感知是通过我们的眼睛来感知的,有分辨率、速度、波长等限制。传感器是用来感知各种形式的能量信号的设备,如电磁辐射、化学、热、机械和磁性。用于探测电磁辐射的传感器通常被称为“探测器”。通过将成像系统(即照相机、摄像机等)置于其焦平面上来获取图像的探测器称为“焦平面探测器或焦平面传感器”。任何一种类型的焦平面传感器都不能满足所有用户的需求,因为它们的预期应用要求不同,因此通常需要定制设计。
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引用次数: 0
Low cost fabrication and testing of high isolation RF MEMS switches 高隔离射频MEMS开关的低成本制造和测试
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260917
A. Joshi, S. Gangal, R. Gandhi, K. Natarajan, D. Bodas
RF MEMS switches are key components in lowpower communication system. The present paper reports fabrication of MEMS based series and shunt switches for actuation voltage in the range of 30–50V. Focusing on low cost fabrication approach, Aluminum was chosen as a cost effective alternative for fabrication of transmission line and structural beam. The switches were designed for higher isolation of >25dB and low insertion loss of <0.5dB. The shunt and series switches were investigated for the frequency range of 1–20 GHz. The shunt switch shows an insertion loss of 0.5db and isolation of −28dB @ 20GHz and the series switch shows an insertion loss of 0.7db and isolation of −27dB @ 20GHz. The measured actuation voltage was 30V for shunt switch and 42V for series switch.
射频MEMS开关是低功耗通信系统的关键部件。本论文报道了基于MEMS的驱动电压在30-50V范围内的串联和并联开关的制造。着眼于低成本的制造方法,选择铝作为制造输电线路和结构梁的成本效益替代方案。该开关设计具有更高的隔离度>25dB和低插入损耗<0.5dB。对1 ~ 20ghz频率范围内的并联开关和串联开关进行了研究。并联开关的插入损耗为0.5db,隔离度为−28dB @ 20GHz;串联开关的插入损耗为0.7db,隔离度为−27dB @ 20GHz。测量的驱动电压为并联开关30V,串联开关42V。
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引用次数: 0
Development of a miniature Joule-Thomson refrigerator using LTCC (Low Temperature Co-fired Ceramic) technique 利用低温共烧陶瓷技术研制微型焦耳-汤姆逊制冷机
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260904
R. Hatwar, S. Ambad, M. Kumbhalkar, T. Singh, P. Gandhi, M. Atrey, P. Joshi, S. Joseph, G. Phatak
This paper reports the Simulation, Design, fabrication and preliminary testing results of a single channel, open cycle miniature Joule-Thomson (JT) refrigerator. Miniaturization of the refrigerator is aimed at providing an alternative that would suffice both the requirements of milli watt cooling as well as high portability owing to its light weight. The present work describes the manufacturing details and experimental investigations carried out on the heat exchanger that forms the most important component of such refrigerators. The miniature heat exchanger is made out of micro channels. This paper reports performance of heat exchangers, with varying sample dimensions. The width of the samples was varied keeping the channel dimensions constant and another set of studies with variations in sample length were carried. Out The channel had dimension of 58.5 × 1 (width) × 0.25 mm (depth).
本文报道了一种单通道、开式循环的微型焦耳-汤姆逊制冷机的仿真、设计、制造和初步测试结果。冰箱的小型化旨在提供一种替代方案,既能满足毫瓦冷却的要求,又能因其重量轻而具有高便携性。目前的工作描述了制造细节和对热交换器进行的实验研究,热交换器是这种冰箱最重要的组成部分。微型热交换器由微通道组成。本文报道了不同样品尺寸下换热器的性能。在保持通道尺寸不变的情况下,改变样品的宽度,并进行了另一组随样品长度变化的研究。通道尺寸为58.5 × 1(宽)× 0.25 mm(深)。
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引用次数: 0
Coupled numerical analysis of Suspended gate field effect transistor (SGFET) 悬浮栅场效应晶体管(SGFET)的耦合数值分析
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260903
K. Jayaprakash Reddy., C. K. Malhi, R. Pratap, N. Bhat
Suspended gate MOSFETs exist since last few decades. Resonant gate transistors were first demonstrated as a means of getting high Q devices [1]. The advantages of transistor based transduction as compared to the capacitive detection have also been demonstrated [2,3]. The behaviors of SGFETs have been studied using equivalent lumped parameter modeling methodology [4–7]. Numerical simulations involving “hybrid” FEA coupling between two different tools, ANSYS Multiphysics and ISE-DESIS, with the help of an external Perl script have also been tried [8]. Here ANSYS is used for the coupled electrostatic and structural physics calculations and ISE-DESIS provides the correct boundary conditions for the electrostatic domain using semiconductor physics. Another related study [9] solved the beam equation coupled with the Poisson equation numerically using finite difference and Newton Raphson method. Our work presents an easier modeling and analysis of a suspended gate MOSFET in COMSOL, successfully demonstrating a solution of a moving gate type device. In our analysis, we consider the air gap as a deformable continuum and we report the standard Id-Vg characteristics of the transistor. Commercially available packages such as ISE-DESIS specialize in only fixed gap analysis wherein air is also modeled as a material with a known permittivity. In such an analysis the capacitor formed due to the air gap remains fixed. We demonstrate here that this analysis can be easily carried out in COMSOL using its multiphysics features. Using two dimensional analysis involving structural mechanics domain, moving mesh ALE, convection and diffusion, and the electrostatics domain, the effect of moving gate and hence the moving air gap can be modeled and analyzed.
悬栅mosfet已经存在了几十年。谐振栅极晶体管首先被证明是获得高Q器件的一种手段[1]。与电容检测相比,基于晶体管的转导的优势也得到了证明[2,3]。已经使用等效集总参数建模方法研究了sgfet的行为[4-7]。在外部Perl脚本的帮助下,还尝试了涉及两种不同工具ANSYS Multiphysics和ISE-DESIS之间“混合”有限元耦合的数值模拟[8]。本文采用ANSYS进行静电和结构物理耦合计算,ISE-DESIS利用半导体物理为静电域提供了正确的边界条件。另一相关研究[9]采用有限差分法和Newton Raphson法对梁方程与泊松方程耦合进行数值求解。我们的工作在COMSOL中提供了一个更容易的悬栅MOSFET建模和分析,成功地展示了一个移动栅极型器件的解决方案。在我们的分析中,我们认为气隙是一个可变形的连续体,我们报告了晶体管的标准Id-Vg特性。ISE-DESIS等商用封装只专注于固定间隙分析,其中空气也被建模为具有已知介电常数的材料。在这种分析中,由于气隙形成的电容器保持固定。我们在这里证明,这种分析可以很容易地在COMSOL中使用其多物理场特性进行。利用结构力学领域、动网格ALE、对流扩散和静电领域的二维分析,可以对动栅极的影响以及由此产生的动气隙进行建模和分析。
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引用次数: 6
3D packaged camera head for space use 用于空间使用的3D封装相机头
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260879
V. Patel, S. Bhati, Sandip Paul, A. Roy Chowdhury, R. Parmar, Rakesh Vikraman Nair Rema, P. N. Babu, A. K. Lal, R. Dave, D. Samudraiah, A. S. Kiran Kumar, Mathieu Gil
Miniaturization is an essential requirement for development of space-borne electronics hardware. Recently, advancements in the device and packaging technology such as Analog Front End (AFE), FPGA and ASIC has enabled on-board designers to develop space worthy, high reliability miniaturized hardware meeting the functional and performance requirements. HMC, SIP, 3D packaging technology etc. can further miniaturize the hardware by embedding dice, devices, active and passive components. 3D packaging technology, which is ESA qualified, allows us to integrate packaged devices and printed circuit boards (PCB) with high reliability vertical interconnections. It is possible to migrate from existing PCB designs along with the same bill of material to 3D packaging technology. A development of miniaturized camera module consisting of 4K elements linear detector, detector drive electronics, analog video processing and digitizing electronics, timing and control logic along with serial data output has been carried out for space use using 3D packaging. Brief details of this camera hardware, development steps and realization challenges along with test results are given in this paper.
小型化是星载电子硬件发展的基本要求。最近,器件和封装技术的进步,如模拟前端(AFE)、FPGA和ASIC,使板上设计人员能够开发出符合功能和性能要求的空间价值高、高可靠性的小型化硬件。HMC、SIP、3D封装技术等可以通过嵌入骰子、器件、有源和无源元件,进一步实现硬件的小型化。3D封装技术通过ESA认证,使我们能够将封装设备和印刷电路板(PCB)集成在一起,具有高可靠性的垂直互连。有可能从现有的PCB设计以及相同的材料清单迁移到3D封装技术。利用3D封装技术,开发了由4K线性探测器、探测器驱动电子器件、模拟视频处理和数字化电子器件、时序和控制逻辑以及串行数据输出组成的小型化相机模块,用于空间使用。本文简要介绍了该摄像机的硬件结构、开发步骤和实现难点,并给出了测试结果。
{"title":"3D packaged camera head for space use","authors":"V. Patel, S. Bhati, Sandip Paul, A. Roy Chowdhury, R. Parmar, Rakesh Vikraman Nair Rema, P. N. Babu, A. K. Lal, R. Dave, D. Samudraiah, A. S. Kiran Kumar, Mathieu Gil","doi":"10.1109/ISPTS.2012.6260879","DOIUrl":"https://doi.org/10.1109/ISPTS.2012.6260879","url":null,"abstract":"Miniaturization is an essential requirement for development of space-borne electronics hardware. Recently, advancements in the device and packaging technology such as Analog Front End (AFE), FPGA and ASIC has enabled on-board designers to develop space worthy, high reliability miniaturized hardware meeting the functional and performance requirements. HMC, SIP, 3D packaging technology etc. can further miniaturize the hardware by embedding dice, devices, active and passive components. 3D packaging technology, which is ESA qualified, allows us to integrate packaged devices and printed circuit boards (PCB) with high reliability vertical interconnections. It is possible to migrate from existing PCB designs along with the same bill of material to 3D packaging technology. A development of miniaturized camera module consisting of 4K elements linear detector, detector drive electronics, analog video processing and digitizing electronics, timing and control logic along with serial data output has been carried out for space use using 3D packaging. Brief details of this camera hardware, development steps and realization challenges along with test results are given in this paper.","PeriodicalId":6431,"journal":{"name":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80333728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Embedded e-nose for food inspection 用于食品检查的嵌入式电子鼻
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260955
A. Kumbhar, D. Gharpure, B. Botre, S. Sadistap
This paper details development of a low cost, small size, portable embedded electronic nose (e-nose). The odor Sensor array is composed of commercially available metal oxide semiconductor sensors by Figaro. The embedded E-nose consists of PIC18F4520 and has an RS 232 interface to Desktop PC for data acquisition, storage and analysis of the odor signals. The developed system is used to analyze odors of onions and oranges. The paper presents the response of the array and results obtained.
本文详细介绍了一种低成本、小尺寸、便携式嵌入式电子鼻的研制。气味传感器阵列由费加罗公司市售的金属氧化物半导体传感器组成。嵌入式电子鼻由PIC18F4520芯片组成,通过rs232接口与台式电脑连接,实现对气味信号的数据采集、存储和分析。所开发的系统用于分析洋葱和橙子的气味。文中给出了该阵列的响应和得到的结果。
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引用次数: 3
Humidity sensor based on synthesized pure WO3 and WO3-SnO2 nanocomposite 基于合成纯WO3和WO3- sno2纳米复合材料的湿度传感器
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260899
N. K. Pandey, A. Roy, K. Tiwari, A. Mishra, A. Rai, S. Jayaswal, M. Rashmi, A. Govindan
In this paper we report humidity sensing studies of undoped and SnO2 doped WO3. Sensitivity is 13.48 MΩ/%RH for WO3-SnO2 nanocomposite. Hysteresis is less than 3% for WO3-SnO2 nanocomposite. Aging for WO3-SnO2 nanocomposite is 5.7%. Activation energy for conduction obtained from Arrhenius graph are 0.127 eV in 27°C to 200°C and 0.547 eV in 200°C to 600°C temperature range . Response time and recovery time for sample WO3-SnO2 nanocomposite are 117 s and 411 s respectively, while that for sample WO3 are 172 s and 557 s respectively. Average grain size calculated from SEM micrographs for WO3 and WO3-SnO2 nanocomposite are 135 nm and 150 nm respectively.
本文报道了未掺杂和SnO2掺杂WO3的湿度传感研究。WO3-SnO2纳米复合材料的灵敏度为13.48 MΩ/%RH。WO3-SnO2纳米复合材料的磁滞率小于3%。WO3-SnO2纳米复合材料的时效率为5.7%。由Arrhenius图得到的传导活化能在27℃~ 200℃范围内为0.127 eV,在200℃~ 600℃范围内为0.547 eV。WO3- sno2纳米复合材料样品的响应时间和恢复时间分别为117 s和411 s, WO3样品的响应时间和恢复时间分别为172 s和557 s。SEM显微图计算得到WO3和WO3- sno2纳米复合材料的平均晶粒尺寸分别为135 nm和150 nm。
{"title":"Humidity sensor based on synthesized pure WO3 and WO3-SnO2 nanocomposite","authors":"N. K. Pandey, A. Roy, K. Tiwari, A. Mishra, A. Rai, S. Jayaswal, M. Rashmi, A. Govindan","doi":"10.1109/ISPTS.2012.6260899","DOIUrl":"https://doi.org/10.1109/ISPTS.2012.6260899","url":null,"abstract":"In this paper we report humidity sensing studies of undoped and SnO<inf>2</inf> doped WO<inf>3</inf>. Sensitivity is 13.48 MΩ/%RH for WO<inf>3</inf>-SnO<inf>2</inf> nanocomposite. Hysteresis is less than 3% for WO<inf>3</inf>-SnO<inf>2</inf> nanocomposite. Aging for WO<inf>3</inf>-SnO<inf>2</inf> nanocomposite is 5.7%. Activation energy for conduction obtained from Arrhenius graph are 0.127 eV in 27°C to 200°C and 0.547 eV in 200°C to 600°C temperature range . Response time and recovery time for sample WO<inf>3</inf>-SnO<inf>2</inf> nanocomposite are 117 s and 411 s respectively, while that for sample WO<inf>3</inf> are 172 s and 557 s respectively. Average grain size calculated from SEM micrographs for WO<inf>3</inf> and WO<inf>3</inf>-SnO<inf>2</inf> nanocomposite are 135 nm and 150 nm respectively.","PeriodicalId":6431,"journal":{"name":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2012-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75802859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Spirometric data analysis by support vector machine 支持向量机的肺活量测量数据分析
Pub Date : 2012-03-07 DOI: 10.1109/ISPTS.2012.6260897
Jitendra Khubani, M. Mhetre
A spirometer is an apparatus for measuring the volume of air inspired and expired by the lungs. Spirometry is one of the most widely applied clinical tests in respiratory medicine to diagnose obstructive and to rule out restrictive pulmonary diseases. In this work, attempt has been made to predict pattern recognition accuracy using support vector regression in order to enhance the spirometric investigations. Support vector machine constructs a hyperplane or set of hyperplanes in a high-or infinite- dimensional space, which can be used for classification, regression, or other tasks. We have collected data from different hospitals. The acquired data are then used to predict pattern recognition accuracy. Since this method is useful in diagnosing the pulmonary abnormalities with incomplete data and data with poor recording. We applied the SVM to construct the prediction model and select Polynomial Function as the kernel function.
肺活量计是一种测量肺部吸入和呼出空气量的仪器。肺量测定法是呼吸医学中应用最广泛的诊断阻塞性肺疾病和排除限制性肺疾病的临床检测方法之一。在这项工作中,尝试使用支持向量回归来预测模式识别的准确性,以增强肺活量测定的研究。支持向量机在高维或无限维空间中构造一个或一组超平面,可用于分类、回归或其他任务。我们从不同的医院收集了数据。然后使用获取的数据来预测模式识别的准确性。由于该方法对资料不完整或资料记录不佳的肺部异常的诊断是有用的。应用支持向量机构建预测模型,选择多项式函数作为核函数。
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引用次数: 2
期刊
2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)
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