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AlGaN/GaN HEMTs on Si by Self-Aligned TaN Contact Ledge for Low-Voltage RF Applications 基于自对准TaN接触架的硅基AlGaN/GaN HEMTs低压射频应用
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-16 DOI: 10.1109/LMWT.2025.3578128
Weiyuan Wang;Jingxiong Chen;Yuanxi Jiang;Xiao Ma;Yuanda Zheng;Hong Wang
We propose a self-aligned contact ledge structure to achieve the small ohmic contact resistance ( $R_{text {c}}$ ) of GaN-based high electron mobility transistors (HEMTs) on Si for low-voltage RF applications. Without additional photolithography processes, the ledge structure is achieved by magnetron sputtering with good particle filling on the sidewall. Due to the good coverage of sputtered Ta, the self-aligned TaN contact ledge not only has a clear boundary after high-temperature annealing but also introduces an additional current path to reduce on-resistance ( ${R} _{text {on}}$ ), which is important for fabricating devices for low-voltage RF applications. Benefiting from the contact ledge structure and the low sheet resistance high Al component Al0.6Ga0.4N/GaN epitaxy, a low ${R} _{text {on}}$ of $1.12~Omega cdot $ mm is obtained and the peak transconductance increased by 13%. At 3.5 GHz and operating voltage 5 V, the power-added efficiency (PAE) is 67.0% and the output power density ( ${P} _{text {out}}$ ) is 0.75 W/mm. The PAE is 8.5% higher than that of noncontact ledge.
我们提出了一种自对齐接触边缘结构,以实现基于硅的氮化镓高电子迁移率晶体管(hemt)的小欧姆接触电阻($R_{text {c}}$),用于低压射频应用。无需额外的光刻工艺,通过磁控溅射在侧壁上填充良好的颗粒来实现壁架结构。由于溅射Ta的良好覆盖,自对准TaN接触壁不仅在高温退火后具有清晰的边界,而且还引入了额外的电流路径以降低导通电阻(${R} _{text {on}}}$),这对于制造用于低压射频应用的器件非常重要。得益于接触架结构和低片阻高Al元件Al0.6Ga0.4N/GaN外延,获得了${R} _{text {on}}$ 1.12~Omega cdot $ mm的低${R} _{text}}$,峰值跨导提高了13%。在3.5 GHz和5v工作电压下,功率增加效率(PAE)为67.0%,输出功率密度(${P} _{text {out}}$)为0.75 W/mm。PAE比非接触式岩架高8.5%。
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引用次数: 0
IEEE Microwave and Wireless Technology Letters publication IEEE微波与无线技术通讯出版
0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-16 DOI: 10.1109/LMWT.2025.3576704
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引用次数: 0
IEEE Microwave and Wireless Technology Letters Information for Authors IEEE微波与无线技术通讯作者信息
0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-16 DOI: 10.1109/LMWT.2025.3576687
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引用次数: 0
IEEE Microwave and Wireless Technology Letters Information for Authors IEEE微波与无线技术通讯作者信息
0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-16 DOI: 10.1109/LMWT.2025.3576706
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引用次数: 0
Synthesis of In-Line Fully Canonical Filters by Solving a Matrix Completion Problem Under AW Ladder Constraints 求解AW阶梯约束下矩阵补全问题的内联全正则滤波器综合
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-11 DOI: 10.1109/LMWT.2025.3573897
Joel Mesas;Jordi Verdú;Pedro de Paco
This work extends a matrix-based numerical methodology to cover fully canonical generalized Chevyshev (GC) transfer functions by reconfiguring canonical filter topologies into dangling inline structures, with a direct impact on the consideration of ladder circuit filters. The transformation matrix that maps a canonical matrix to the dangling inline is defined in such a way that, within a mathematical matrix completion framework, it can nullify the source-load coupling, modify the source and load reactances to accommodate the phase at the first and last extracted-pole sections of the network, and capture the response information in a different size matrix.
这项工作扩展了基于矩阵的数值方法,通过将规范滤波器拓扑重新配置为悬垂的内联结构,以覆盖完全规范的广义Chevyshev (GC)传递函数,并对阶梯电路滤波器的考虑产生直接影响。将规范矩阵映射到悬垂内联的转换矩阵以这样一种方式定义,即在数学矩阵完成框架内,它可以取消源-负载耦合,修改源和负载电抗以适应网络的第一个和最后一个提取极部分的相位,并在不同大小的矩阵中捕获响应信息。
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引用次数: 0
A Large Chip-Width TMICs Packaging Solution for THz Applications 一种用于太赫兹应用的大芯片宽度tmic封装解决方案
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-11 DOI: 10.1109/LMWT.2025.3575467
Ze Du;Zhi-Yu Duan;Ke Zhan;Zhen-Hua Wu;Ji-Sheng Chen;Hu Li;Ming-Zhou Zhan
In this letter, a large chip-width terahertz monolithic integrated circuits (TMICs) packaging solution at terahertz (THz) frequencies is presented. The proposed electromagnetic bandgap (EBG) structure in this design can effectively suppress various interference modes generated when the slit width increases. The mode conversion and interconnection between coplanar waveguide with ground (CPWG) and waveguide are realized using integrated on-chip dipole antenna transition model. To verify the proposed solution, a packaging structure accommodating a chip width of 3760 $mu $ m and an on-chip integrated dipole antenna transition model were designed and fabricated. The test results show that in the frequency range of 214–242 GHz, the return loss is better than 9 dB and the insertion loss is better than 4 dB, the de-embedded average loss is less than 1 dB.
在这封信中,提出了一种在太赫兹(THz)频率下的大芯片宽度太赫兹单片集成电路(tmic)封装解决方案。本设计提出的电磁带隙(EBG)结构可以有效抑制狭缝宽度增大时产生的各种干扰模式。采用集成片上偶极子天线转换模型实现了带地共面波导与波导之间的模式转换和互连。为了验证所提出的解决方案,设计并制作了芯片宽度为3760 μ m的封装结构和片上集成偶极子天线过渡模型。测试结果表明,在214 ~ 242 GHz频率范围内,回波损耗优于9 dB,插入损耗优于4 dB,去嵌入平均损耗小于1 dB。
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引用次数: 0
Deep Learning Approach for Microwave Imaging in Broad Frequency Band Based on Physics-Driven Loss and Deep Convolutional V-Net Structure 基于物理驱动损失和深度卷积V-Net结构的宽带微波成像深度学习方法
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-11 DOI: 10.1109/LMWT.2025.3575160
Xingyue Guo;He Ming Yao;Yuan’an Liu;Michael Ng;Shiji Song
This article proposes a novel deep learning (DL) approach to realize quantitative real-time microwave imaging (MWI) in the extremely broad frequency band. The proposed DL approach is based on the deep convolutional V-net structure, which employs the residual block and deep convolutional operation to improve its generality and performance. To integrate the physics-based prior to DL model, the inverse-forward closed-loop training framework is introduced to compute the training loss, which comprises two fundamental components: 1) the inverse process for computing data-driven loss, which directly quantifies the dissimilarity between the predictions of our proposed V-net and the actual target contrasts and 2) the forward process for computing physics-driven loss, which evaluates the distinctions between the input EM scattered field and the computed EM scattered field derived from the prediction of V-net. Consequently, the proposed DL method can work with excellent accuracy even for heterogeneous and high-contrast targets, only requiring the single-frequency far-field-measured EM scattered field at the arbitrary frequency in the extremely broad frequency band. Moreover, the proposed DL method can present satisfactory robust on the extremely broad frequency band and provide nearly the same excellent inversion performance on totally different frequencies for one target scatterer. Numerical benchmarks illustrate the feasibility of this proposed DL method.
本文提出了一种新的深度学习(DL)方法来实现极宽频段的定量实时微波成像(MWI)。本文提出的深度学习方法基于深度卷积V-net结构,采用残差块和深度卷积运算来提高其通用性和性能。为了整合基于物理的先验深度学习模型,引入了反向闭环训练框架来计算训练损失,该框架包括两个基本组成部分:1)计算数据驱动损耗的逆向过程,直接量化我们提出的V-net预测与实际目标对比之间的差异;2)计算物理驱动损耗的正向过程,评估输入电磁散射场与由V-net预测得出的计算电磁散射场之间的差异。因此,所提出的DL方法即使在非均匀和高对比度的目标上也能以优异的精度工作,只需要在极宽的频带内任意频率的单频远场测量的EM散射场。此外,所提出的深度学习方法在极宽的频带上具有令人满意的鲁棒性,并且在同一目标散射体的完全不同频率上具有几乎相同的优异反演性能。数值实验验证了该方法的可行性。
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引用次数: 0
General Method for Characterizing Switchable Elements for RIS Using De-Embedding Structures 利用去嵌入结构表征RIS可切换元件的一般方法
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-11 DOI: 10.1109/LMWT.2025.3574501
Mehmet Emin Arslan;Ulrich Nordmeyer;Niels Neumann
Reconfigurable intelligent surfaces (RISs) play a significant role in 6G wireless communications by dynamically controlling the reflections of electromagnetic (EM) waves. In this work, p-i-n diodes are used to achieve the necessary phase shifts in the 1-bit RIS unit cells. In order to characterize these diodes over a frequency range from 10 to 30 GHz, de-embedding structures are carefully designed and analytically modeled. By de-embedding the test structure and matching the model parameters with empirical measurements, the behavior of p-i-n diodes within RIS unit cells is accurately determined. The developed characterization method can be easily adapted to other RF measurement tasks involving complex designs at high frequencies, thus broadening its applicability.
可重构智能表面(RISs)通过动态控制电磁波的反射,在6G无线通信中发挥着重要作用。在这项工作中,p-i-n二极管用于在1位RIS单元中实现必要的相移。为了在10至30 GHz的频率范围内表征这些二极管,仔细设计了去嵌入结构并对其进行了分析建模。通过去嵌入测试结构并将模型参数与经验测量相匹配,可以准确地确定RIS单元胞内p-i-n二极管的行为。所开发的表征方法可以很容易地适用于涉及复杂设计的其他高频射频测量任务,从而扩大了其适用性。
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引用次数: 0
Multipassband and Wide-Stopband Filters via Independent Tuning of High-Order SSPP Modes 通过独立调谐高阶SSPP模式的多通带和宽阻带滤波器
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-10 DOI: 10.1109/LMWT.2025.3575715
Fachun He;Shuang Liu;Longfang Ye;Huali Zhu;Dan Lei;Jun Yan
We propose a novel F-fold spoof surface plasmon polaritons (SSPPs) unit with independently tunable high-order rejection bands. The dispersion characteristics of the proposed F-fold SSPPs are analyzed. The results show that the cutoff frequencies of Modes 2 and 3 can be precisely adjusted through structural parameters, enabling independent control of the stopband position formed by these two modes, without affecting the fundamental mode (Mode 0) or Mode 1. Therefore, the passband number, bandwidth, and stopband width can be flexibly manipulated for the design of multiple passband filters. For verification, a tri-passband, quad-passband filter, and wide stopband filter are designed, fabricated, and measured. The wide stopband filter achieves a 547% increase in the stopband width compared to the tri-passband filter. Good agreement between the simulations and measurements confirms the feasibility of the proposed structure and design method.
我们提出了一种具有独立可调高阶抑制带的新型f折叠欺骗表面等离子激元(SSPPs)单元。分析了所提出的F-fold SSPPs的色散特性。结果表明,模态2和模态3的截止频率可以通过结构参数精确调节,在不影响基模(模0)和模1的情况下,可以独立控制两模形成的阻带位置。因此,可以灵活地控制通带数、带宽和阻带宽度,用于设计多通带滤波器。为了验证,设计,制造和测量了三通带,四通带滤波器和宽阻带滤波器。与三通带滤波器相比,宽阻带滤波器的阻带宽度增加了547%。仿真结果与实测结果吻合良好,证实了所提出的结构和设计方法的可行性。
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引用次数: 0
Manufacture-Friendly Millimeter-Wave Filter Based on Double-Folded SIW Resonators 基于双折叠SIW谐振器的制造友好型毫米波滤波器
IF 3.4 0 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-06-09 DOI: 10.1109/LMWT.2025.3565314
Li Qian;Liyu Zhu;Jun Xu;Weiheng Chen;Zhiqiang Yu;Jianyi Zhou;Wei Hong
This letter proposes manufacture-friendly millimeter-wave (mm-Wave) bandpass filter (BPF) based on double-folded substrate integrated waveguide (DFSIW) cavities. Using an incompletely folded structure and parallel rectangular slots as coupling structures, the BPF achieves reduced insertion loss (IL) and enhanced robustness against processing errors. Furthermore, the compact space between adjacent folded slots was transformed into a cross-coupling structure, which significantly improves frequency selectivity without introducing additional radiation loss. In addition, high-quality (Q) factor layer stacking is implemented to further minimize IL. A Ka-band filter prototype based on the multilayer printed circuit board (PCB) is fabricated and measured to confirm the feasibility.
这封信提出了基于双折叠衬底集成波导(DFSIW)腔的制造友好型毫米波(mm-Wave)带通滤波器(BPF)。采用不完全折叠结构和平行矩形槽作为耦合结构,降低了插入损耗,增强了对处理误差的鲁棒性。此外,相邻折叠槽之间的紧凑空间转化为交叉耦合结构,在不引入额外辐射损失的情况下显著提高了频率选择性。此外,还实现了高质量(Q)因子层堆叠,以进一步减少IL。制作了基于多层印刷电路板(PCB)的ka波段滤波器原型,并进行了测量以确认其可行性。
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引用次数: 0
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IEEE microwave and wireless technology letters
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