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High-Order Superconducting Dual-Band Differential Bandpass Filter Using Symmetrical Composite Right-/Left-Handed Resonator With Wide Stopband 使用具有宽截止带的左右手对称复合谐振器的高阶超导双波段差分带通滤波器
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/LMWT.2024.3412756
Baoping Ren;Wenjia Yuan;Xuehui Guan;Xinlei Liu;Xiaoyan Zhang;Haiwen Liu
In this letter, a newly dual-mode composite right-/left-handed (CRLH) resonator with fully symmetrical structure is proposed to design high-order high-temperature superconducting (HTS) dual-band differential bandpass filter (BPF). Based on the conventional CRLH unit cell, a dual-mode symmetrical CRLH resonator is developed for constructing dual-band differential BPF. The resonant properties of the proposed dual-mode resonator are investigated by building differential-mode (DM) and common-mode (CM) equivalent circuits (ECs) and their lumped ECs (LECs). Finally, a fourth-order dual-band HTS differential BPF with two DM passbands that operate at 2.45 and 4.94 GHz is designed. Good agreement between the simulated and measured results validates the proposed structure and the design method.
本文提出了一种具有完全对称结构的新型双模复合左右手(CRLH)谐振器,用于设计高阶高温超导(HTS)双频差分带通滤波器(BPF)。在传统 CRLH 单元的基础上,开发了一种双模对称 CRLH 谐振器,用于构建双频差分带通滤波器。通过构建差模(DM)和共模(CM)等效电路(EC)及其叠加 EC(LEC),研究了所提出的双模谐振器的谐振特性。最后,设计出了具有两个 DM 通带的四阶双频 HTS 差分 BPF,工作频率分别为 2.45 和 4.94 GHz。模拟和测量结果之间的良好一致性验证了所提出的结构和设计方法。
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引用次数: 0
Record 35% Power-Added Efficiency at 170 GHz in 300-nm InP/GaAsSb DHBTs 300 纳米 InP/GaAsSb DHBT 在 170 GHz 的功率附加效率达到创纪录的 35
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/LMWT.2024.3412964
Sara Hamzeloui;Akshay M. Arabhavi;Filippo Ciabattini;Giorgio Bonomo;Mojtaba Ebrahimi;Rimjhim Chaudhary;Markus Müller;Olivier Ostinelli;Michael Schröter;Colombo R. Bolognesi
We report the 170-GHz power performance of multifinger common-emitter (CE) 300-nm indium phosphide (InP)/GaAsSb double heterojunction bipolar transistors (DHBTs). Devices with one-, two-, and four-finger(s) with 7.5-, 10-, or 12.5- $mu $ m-long emitter fingers were simultaneously fabricated. A record power-added efficiency PAE =35% is measured for single-finger 7.5- $mu $ m-long DHBTs with a saturated matched output power $P_{mathrm {OUT,SAT}} =9.5$ dBm. A $P_{mathrm {OUT,SAT}} gt 12$ and >14.5 dBm with peak PAE =25% and 22% is delivered from two- and four-finger 10- $mu $ m-long DHBTs, respectively. To the best of our knowledge, 35% is the highest PAE reported for any PA/PA cell in any transistor technology over the entire G-band range. We attribute the high efficiency achieved in this study to the exceptionally high gain transistors in the (sub)-millimeter-wave (mm-wave) range, as well as the advantageous combination of high breakdown and low knee voltages. This work details the first G-band power characterization of single- and multi-finger GaAsSb-based DHBTs—it is also the first such study in any InP DHBT. An all-technology record Class-A G-band PAE is achieved with a minimal reduction with respect to W-band peak PAE levels. An HICUM-based large-signal model verifies the mm-wave RF measurements.
我们报告了多指共发射极(CE)300 纳米磷化铟(InP)/砷化镓(GaAs)双异质结双极晶体管(DHBT)的 170-GHz 功率性能。我们同时制造出了具有 7.5、10 或 12.5 英寸长发射极指的单指、双指和四指器件。在饱和匹配输出功率 $P_{mathrm {OUT,SAT}} =9.5 $ dBm 的情况下,单指 7.5 $mu $ m 长 DHBT 测得创纪录的功率附加效率 PAE =35%。P_{mathrm {OUT,SAT}} =9.5$ dBm。gt 12$ 和 >14.5 dBm,峰值 PAE =25% 和 22%,分别由两指和四指 10- $mu $ m 长的 DHBT 提供。据我们所知,在整个 G 波段范围内,35% 是任何晶体管技术的 PA/PA 单元所报告的最高 PAE。我们将这项研究中实现的高效率归功于(亚)毫米波(mm-wave)范围内的超高增益晶体管,以及高击穿电压和低膝部电压的优势组合。这项工作详细介绍了基于砷化镓锑的单指和多指 DHBT 的首次 G 波段功率特性分析,这也是对任何 InP DHBT 的首次此类研究。与 W 波段峰值 PAE 水平相比,G 波段 PAE 降低到了最低水平,创下了所有技术中的最高纪录。基于 HICUM 的大信号模型验证了毫米波射频测量结果。
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引用次数: 0
High-Performance Microwave Heating Device for Tubular Loads Using a Quasi-Coaxial Structure 使用准同轴结构的高性能管状负载微波加热装置
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-03 DOI: 10.1109/LMWT.2024.3404782
Fengming Yang;Yuanyuan Wu;Liaoyuan Xu;Jinghua Ye;Chengzhuo Wang;Yang Yang;Tao Hong;Huacheng Zhu
This letter presents a novel microwave heating method that utilizes tubular loads as a substitute for the inner conductor of a coaxial waveguide, thereby improving heating uniformity and energy coupling efficiency through the TEM mode. First, the effect of replacing the inner conductor of the coaxial waveguide with dielectric on microwave propagation was analyzed. It was found that the microwave still maintains the TEM mode when its dielectric constant exceeds 20. Second, a waveguide-to-coaxial transition is designed, utilizing probe coupling methods with a tapered structure, resulting in a 53% increase in return loss (-10 dB) bandwidth. Finally, a microwave heating device was designed based on this transition. Compared with common microwave ovens, the microwave energy conversion efficiency of this method exceeds 90% for tubular materials with dielectric constants from 20 to 70, and it exhibited higher uniformity. It can be applied to the continuous industrial production of tubular materials.
这封信提出了一种新型微波加热方法,利用管状负载替代同轴波导的内导体,从而通过 TEM 模式改善加热均匀性和能量耦合效率。首先,分析了用电介质替代同轴波导内导体对微波传播的影响。结果发现,当介电常数超过 20 时,微波仍能保持 TEM 模式。其次,利用锥形结构的探针耦合方法,设计了波导到同轴的过渡,使回波损耗(-10 dB)带宽增加了 53%。最后,基于这种过渡设计了一种微波加热装置。与普通微波炉相比,对于介电常数在 20 到 70 之间的管状材料,这种方法的微波能量转换效率超过 90%,而且表现出更高的均匀性。它可以应用于管状材料的连续工业生产。
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引用次数: 0
A 165–260 GHz Broadband Frequency Doubler Using “Hourglass-Shaped” Transmission Matching Technology 使用 "沙漏形 "传输匹配技术的 165-260 GHz 宽带倍频器
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-03 DOI: 10.1109/LMWT.2024.3419246
Li Wang;Dehai Zhang;Jin Meng
This letter presents a broadband frequency doubler that covers the 165–260 GHz range. To achieve the broadband matching of Schottky barrier diodes (SBDs), an “Hourglass-shaped” (H-S) transmission line is applied in this work. Compared to the conventional high-low impedance microstrip matching, the “H-S” transmission line adopts an asymmetric taper of microstrip steps, resulting in lower transmission loss of interstage microstrip according to the small reflection theory. Meanwhile, the “H-S” transmission line is carefully designed to achieve a minimum reflection coefficient from SBDs to the output waveguide, which can expand the operating bandwidth. To verify this concept, we fabricated and measured a broadband frequency doubler. Measured results show that the doubler has an efficiency of 6.02%–12.02% covering the 165–260 GHz frequency band under 95–135 mW input power. The peak output power is 14.9 mW at 181 GHz under the 135 mW input power.
这封信介绍了一种覆盖 165-260 GHz 范围的宽带倍频器。为实现肖特基势垒二极管(SBD)的宽带匹配,本研究采用了 "沙漏形"(H-S)传输线。与传统的高低阻抗微带匹配相比,"H-S "传输线采用了非对称的微带阶梯锥度,根据小反射理论,可以降低级间微带的传输损耗。同时,"H-S "传输线经过精心设计,可实现从 SBD 到输出波导的最小反射系数,从而扩大工作带宽。为了验证这一概念,我们制作并测量了一个宽带倍频器。测量结果表明,在 95-135 mW 输入功率下,倍频器在 165-260 GHz 频段的效率为 6.02%-12.02%。在 135 mW 输入功率下,181 GHz 的峰值输出功率为 14.9 mW。
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引用次数: 0
20-THz Far-Infrared Imaging Using an Antenna-Coupled Schottky Barrier Diode in a Foundry CMOS 在代工 CMOS 中使用天线耦合肖特基势垒二极管进行 20-THz 远红外成像
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-01 DOI: 10.1109/LMWT.2024.3418455
Behnam Pouya
This letter presents the implementation of a 20-terahertz (THz) far-infrared (FIR) imager using an antenna-coupled Schottky barrier diode (SBD) structure fabricated in a 130-nm foundry CMOS process without any process modifications. The detector’s performance is characterized using a 15.1- $mu $ m quantum-cascade laser (QCL) source. At a modulation frequency of 13 Hz, the detector achieves a peak optical responsivity ( $R_{v}$ ) of 35.2 V/W, which is ~six times higher than that of CMOS detectors operating in a similar frequency range. The measured shot-noise limited noise equivalent power (NEP) is 1.8 nW/ $surd $ Hz, which is comparable to that of commercially available thermopile detectors that are 47000 times larger in area.
本文介绍了一种 20 太赫兹(THz)远红外(FIR)成像器的实现情况,该成像器采用天线耦合肖特基势垒二极管(SBD)结构,在 130 纳米晶圆代工 CMOS 工艺中制造而成,无需对工艺进行任何修改。使用 15.1- $mu $ m 量子级联激光器(QCL)光源对探测器的性能进行了鉴定。在 13 Hz 的调制频率下,该探测器的峰值光响应率($R_{v}$ )达到 35.2 V/W,是在类似频率范围内工作的 CMOS 探测器的六倍。测得的射噪限制噪声等效功率(NEP)为 1.8 nW/ $surd $ Hz,与面积大 47000 倍的市售热电堆探测器相当。
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引用次数: 0
W-Band Asymmetric CMOS Switch Using Inductive Matching Technique 使用电感匹配技术的 W 波段不对称 CMOS 开关
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-28 DOI: 10.1109/LMWT.2024.3416490
Jaehyun Kwon;Changkun Park
In this study, we designed a W-band asymmetric single-pole double-throw (SPDT) switch using a 65-nm RFCMOS process. In order to secure the power-handling capability of the switch, all transistors constituting the switch were designed to be in the on-state in the transmit (Tx) mode. In addition, the designed switch was matched in the Tx mode and achieved compact size using the property of the inductor. In the receive (Rx) mode, four LC resonators were used to achieve both wide and high isolation and low insertion loss. At 70–90 GHz, the isolations in the Tx and Rx modes were measured higher than 17.5 and 22.5 dB, respectively. The insertion losses in the Tx and Rx modes were measured less than 3.71 and 3.11 dB, respectively, in the frequency range of 70–90 GHz. The measured input 1-dB compression points (IP1dBs) at 80 GHz were >18.5 dBm and 7.5 dBm in the Tx and Rx modes, respectively. The core size of the designed SPDT switch is 0.057 mm2.
在这项研究中,我们采用 65 纳米 RFCMOS 工艺设计了一种 W 波段非对称单刀双掷 (SPDT) 开关。为了确保开关的功率处理能力,构成开关的所有晶体管都被设计为在发送(Tx)模式下处于导通状态。此外,所设计的开关在 Tx 模式下是匹配的,并利用电感器的特性实现了紧凑的尺寸。在接收 (Rx) 模式中,使用了四个 LC 谐振器来实现宽、高隔离度和低插入损耗。在 70-90 GHz 时,Tx 和 Rx 模式的隔离度分别高于 17.5 和 22.5 dB。在 70-90 GHz 频率范围内,Tx 和 Rx 模式的插入损耗分别低于 3.71 和 3.11 dB。在 80 GHz 时,Tx 和 Rx 模式下测得的输入 1 dB 压缩点(IP1dB)分别大于 18.5 dBm 和 7.5 dBm。所设计的 SPDT 开关的磁芯尺寸为 0.057 mm2。
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引用次数: 0
Wideband Three-Way FPD With Unequal Division Ratio Based on Coaxial-to-RWG Transition 基于同轴到 RWG 转换的不等分频比宽带三路 FPD
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-26 DOI: 10.1109/LMWT.2024.3416435
Jian-Xin Chen;Yu-Xing Yan;Ye-Xin Huang;Wei Yu;Yunli Li
A simple design approach of wideband three-way filtering power divider (FPD) with unequal division ratio based on coaxial-to-rectangular waveguide (RWG) transition is investigated. The bandpass filtering response is achieved using high-pass characteristic of RGW and bandgap characteristic of coaxial-to-RWG transition improved by loading T-type resonators. The allocation of power depends solely on the distance between the outputs and the central plane of the rectangular cavity. Meanwhile, the filtering functions and power splitting are independent of each other, achieving sharped roll-off of the upper stopband and unequal power division ratio. For validation, a wideband unequal FPD with center frequency at 4.1 GHz and with 3-dB fractional bandwidth (FBW) of 58.5% is designed, simulated, and fabricated. The insertion loss (IL) of all three outputs is less than 0.4 dB (excluding ideal loss), demonstrating the advantage of low loss in the rectangular cavity.
研究了一种基于同轴到矩形波导(RWG)过渡的不等分频比宽带三路滤波功率分配器(FPD)的简单设计方法。利用 RGW 的高通特性和同轴到 RWG 过渡的带隙特性(通过加载 T 型谐振器加以改进)实现了带通滤波响应。功率分配完全取决于输出端与矩形腔中心平面之间的距离。同时,滤波功能和功率分配相互独立,实现了上阻带的急剧衰减和不等功率分配比例。为进行验证,设计、仿真和制造了一个中心频率为 4.1 GHz、3-dB 分数带宽(FBW)为 58.5%的宽带不等分 FPD。所有三个输出端的插入损耗(IL)均小于 0.4 dB(不包括理想损耗),显示了矩形腔低损耗的优势。
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引用次数: 0
Design of Multistate Cavity Diplexers Based on Coaxial Resonators 基于同轴谐振器的多态腔双工器设计
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-26 DOI: 10.1109/LMWT.2024.3416545
Yu-Ming Li;Hong-Ji Li;Chao Wu;Sai-Wai Wong
The design approach for multistate diplexers based on coaxial resonators is presented for the first time in this letter. By partitioning a large cylindrical cavity into multiple sections, a wide range of frequency channels is established, enabling the formation of different states for the diplexer through the selection of specific frequency channels. By introducing cross coupling in the resonators, a transmission zero is achieved within each channel, resulting in sharp out-of-band rejection skirts. The proposed multistate diplexers exhibit improved performance along with compact structures. A third-order four-state diplexer (FSD) is designed and presented, and the same methodology can be applied to create the mth-order and n-state diplexers. To validate this concept, the FSD is fabricated and measured, with the measurement results exhibiting good agreement with the simulation results.
本文首次介绍了基于同轴谐振器的多态双工器的设计方法。通过将一个大型圆柱形腔体分割成多个部分,建立了广泛的频率信道,从而能够通过选择特定频率信道形成双工器的不同状态。通过在谐振器中引入交叉耦合,在每个信道内实现零传输,从而产生尖锐的带外抑制裙边。所提出的多态双工器性能提高,结构紧凑。设计并展示了一个三阶四态双工器(FSD),同样的方法可用于创建 mth 阶和 n 阶双工器。为了验证这一概念,对 FSD 进行了制造和测量,测量结果与模拟结果显示出良好的一致性。
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引用次数: 0
A Distributed Theory for Contactless Interconnects at Terahertz Frequencies 太赫兹频率下非接触式互连的分布式理论
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-25 DOI: 10.1109/LMWT.2024.3412592
Nicholas R. Jungwirth;Bryan T. Bosworth;Aaron M. Hagerstrom;Meagan C. Papac;Eric J. Marksz;Jerome Cheron;Kassiopeia Smith;Angela C. Stelson;Ari Feldman;Dylan F. Williams;Christian J. Long;Nathan D. Orloff
We test a multimodal analytical model for distributed contactless interconnects by comparing it to 3-D full-wave simulations. In comparison to 3-D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating and optimizing the interconnect’s performance. The model predicts the performance of four distributed contactless interconnects and finds good agreement between with 3-D simulations up to 1 THz. All the interconnects have less than 1-dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.
我们将分布式非接触互连的多模态分析模型与三维全波模拟进行了比较,从而对该模型进行了测试。与三维仿真相比,该模型能够深入了解互连的工作原理,并降低估算和优化互连性能的计算成本。该模型预测了四种分布式非接触互连的性能,并发现其与三维仿真之间在 1 THz 以下的性能有很好的一致性。所有互连器件在其首通频带的插入损耗均小于 1dB,突出了非接触式互连器件提供的机会。
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引用次数: 0
A 9-V Wireless Power Receiver IC With 74.2% Power Conversion Efficiency and Integrated Bidirectional Telemetries for Implantable Neurostimulation Systems in Standard CMOS 标准 CMOS 中用于植入式神经刺激系统的 9 V 无线电源接收器集成电路,具有 74.2% 的电源转换效率和集成的双向遥测功能
N/A ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-24 DOI: 10.1109/LMWT.2024.3411572
Yi Ding;Tianyi Li;Xinqin Guo;Hongming Lyu
This letter presents a 9-V wireless power and data receiver IC in a standard CMOS process technology. A transistor-stacking scheme is employed for accommodating active circuits in a high-voltage domain that exceeds the transistor’s voltage tolerance. The IC successfully generates 9-V through a 21-stage cross-coupled rectifier and regulated 6- and 3-V supplies with low-dropout regulators (LDOs) delivering a maximum power of 27 mW with a peak power conversion efficiency (PCE) of 74.2%. Forward telemetry at 200 kbit/s and backward telemetry at 10 kbit/s are achieved based on on-off keying (OOK) and load-shift keying (LSK) modulation schemes, respectively, which negligibly affect the generated voltage domains. The IC serves as a wireless power solution for batteryless and high-voltage-required medical implants.
这封信介绍了一种采用标准 CMOS 工艺技术的 9 V 无线电源和数据接收器集成电路。该集成电路采用晶体管堆叠方案,可在超出晶体管耐压能力的高压域中容纳有源电路。该集成电路通过 21 级交叉耦合整流器成功产生 9 V 电压,并利用低压差稳压器 (LDO) 调节 6 V 和 3 V 电源,提供 27 mW 的最大功率,峰值功率转换效率 (PCE) 为 74.2%。基于开关键控(OOK)和负载移动键控(LSK)调制方案,分别实现了 200 kbit/s 的前向遥测和 10 kbit/s 的后向遥测,对所产生的电压域的影响可忽略不计。该集成电路可作为无电池和需要高电压的医疗植入物的无线供电解决方案。
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引用次数: 0
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IEEE microwave and wireless technology letters
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