Pub Date : 2022-08-11DOI: 10.1109/OJSSCS.2022.3198040
Cameron Hill;James F. Buckwalter
This work demonstrates new circuit techniques in distributed-stacked-complimentary (DiSCo) switches that enable picosecond switching speed in RF CMOS SOI switches. By using seriesstacked devices with optimized gate impedance and voltage swing, both high linearity and fast switching are possible. A theoretical analysis and design framework has been developed and verified through simulation and measurement through two broadband, high-linearity passive mixer designs, one optimized for linearity and the other for bandwidth, using a 45-nm SOI CMOS process. The mixers achieve $P_{1dB}{s}$ of 16-22 dBm with $IIP3s$ of 25-34 dBm across a bandwidth from 1 GHz up to 30 GHz. This performance exceeds prior SOI RF and microwave mixer performance by more than an order of magnitude and is comparable to III-V device technologies. The mixers include integrated local oscillator (LO) driving amplifiers for high efficiency operation and low total power consumption. DC power consumption ranges from 250 mW to 1 W for the LO driver. The integrated LO drivers demonstrate a pathway to on-chip LO generation with simplified matching to maximize LO power delivered to the input of the switch.
这项工作展示了分布式堆叠互补（DiSCo）开关中的新电路技术，该技术能够在RF CMOS SOI开关中实现皮秒开关速度。通过使用具有优化栅极阻抗和电压摆动的串联封装器件，可以实现高线性和快速切换。通过使用45nm SOI CMOS工艺的两种宽带、高线性无源混频器设计，一种针对线性进行优化，另一种针对带宽进行优化，通过仿真和测量，开发并验证了理论分析和设计框架。混频器在从1 GHz到30 GHz的带宽上实现16-22 dBm的$P_｛1dB｝｛s｝$和25-34 dBm的IIP3s$。这种性能比现有的SOI RF和微波混频器性能高出一个数量级以上，并且与III-V器件技术相当。混频器包括用于高效率操作和低总功耗的集成本地振荡器（LO）驱动放大器。LO驱动器的DC功率消耗范围从250mW到1W。集成LO驱动器展示了一种通过简化匹配实现片上LO生成的途径，以最大限度地提高传递到开关输入的LO功率。
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Pub Date : 2022-03-17DOI: 10.1109/OJSSCS.2022.3154425
Edoardo Charbon
Depth perception has been and continues to be one of the fastest growing fields of research and development both in academia and industry. There is an abundance of applications requiring 3D vision, from automotive safety and self-driving vehicles to virtual/augmented reality (VR/AR), from high-end imaging to proximity sensing. With the explosion of automated package handling, semi-robotic delivery, and advanced driver-assistance systems (ADAS), the need to safely and accurately reconstruct the environment in 3D is also exploding, along with more demanding requirements for 3D vision cameras in terms of resolution, precision, and speed.
{"title":"IEEE Open Journal of the Solid-State Circuits Society Special Section on Imagers for 3D Vision","authors":"Edoardo Charbon","doi":"10.1109/OJSSCS.2022.3154425","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3154425","url":null,"abstract":"Depth perception has been and continues to be one of the fastest growing fields of research and development both in academia and industry. There is an abundance of applications requiring 3D vision, from automotive safety and self-driving vehicles to virtual/augmented reality (VR/AR), from high-end imaging to proximity sensing. With the explosion of automated package handling, semi-robotic delivery, and advanced driver-assistance systems (ADAS), the need to safely and accurately reconstruct the environment in 3D is also exploding, along with more demanding requirements for 3D vision cameras in terms of resolution, precision, and speed.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2022-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/09737148.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-02-09DOI: 10.1109/OJSSCS.2022.3150291
Luis A. Valenzuela;Yujie Xia;Aaron Maharry;Hector Andrade;Clint L. Schow;James F. Buckwalter
This paper describes the energy-efficient realization of a QPSK optical receiver (CoRX) for short-reach intra-datacenter interconnects based on analog coherent detection. The CoRX comprises inphase and quadrature channels for each polarization and a high-speed phase-frequency detector (PFD) that provides feedback to stabilize an optical local oscillator (LO) and maintain coherence with the received optical signal. Each receive (RX) channel consists of a transimpedance amplifier (TIA) based on a Cherry-Hooper emitter follower (CHEF). The electronic RX is implemented in a 130-nm SiGe HBT technology ( $f_{T} = 300$ GHz), consumes 534 mW of DC power for a total electrical RX energy efficiency of 5.34 pJ/bit, and occupies 2.8 $mm^{2}$ . Electrical characterization of the CoRX on an FR-4 PCB assembly demonstrates operation up to 60 GBaud with a bit error rate (BER) of less than 10 −12 . A co-packaged optical/electrical CoRX assembly with a silicon photonic receiver is characterized using a commercial-off-the-shelf quadrature phase-shift keying (QPSK) transmitter for constellations up to 50 GBaud (100 Gbps) at BER below KP4-FEC ( $2.2times 10^{-4}$ ).
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Pub Date : 2022-01-01DOI: 10.1109/OJSSCS.2022.3164490
{"title":"Sensor Interfaces Meeting 2022","authors":"","doi":"10.1109/OJSSCS.2022.3164490","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3164490","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"302-302"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094270.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50327145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/OJSSCS.2022.3155919
{"title":"IEEE Open Journal of the Solid-State Circuits Society Publication Information","authors":"","doi":"10.1109/OJSSCS.2022.3155919","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3155919","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094267.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/OJSSCS.2021.3136369
{"title":"BioCas 2021","authors":"","doi":"10.1109/OJSSCS.2021.3136369","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3136369","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"301-301"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094287.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/OJSSCS.2023.3265562
{"title":"2022 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 2","authors":"","doi":"10.1109/OJSSCS.2023.3265562","DOIUrl":"https://doi.org/10.1109/OJSSCS.2023.3265562","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"305-312"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10097449.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50327144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/OJSSCS.2022.3218838
{"title":"Call for Papers: RFIC 2023","authors":"","doi":"10.1109/OJSSCS.2022.3218838","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3218838","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"303-304"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094275.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/OJSSCS.2023.3234383
These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal.
这些说明为编写本出版物的论文提供了指导。为在本期刊上发表文章的作者提供信息。
{"title":"IEEE Open Journal of the Solid-State Circuits Society Instructions for Authors","authors":"","doi":"10.1109/OJSSCS.2023.3234383","DOIUrl":"https://doi.org/10.1109/OJSSCS.2023.3234383","url":null,"abstract":"These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"C3-C4"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10006346.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-12-14DOI: 10.1109/OJSSCS.2021.3130313
Firooz Aflatouni
Electronic-photonic co-design, where the large bandwidth available around the optical carrier, high quality factor optical resonators, low-loss optical interconnects and signal distribution, and highly sensitive photonic sensors are concurrently utilized with sophisticated analog, radio frequency, digital, and mixed signal electronic circuits has improved the performance of many systems for applications ranging from sensing and imaging to communication and computation.
{"title":"Guest Editorial Special Section on Electronic–Photonic Integrated Circuits (EPIC)","authors":"Firooz Aflatouni","doi":"10.1109/OJSSCS.2021.3130313","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3130313","url":null,"abstract":"Electronic-photonic co-design, where the large bandwidth available around the optical carrier, high quality factor optical resonators, low-loss optical interconnects and signal distribution, and highly sensitive photonic sensors are concurrently utilized with sophisticated analog, radio frequency, digital, and mixed signal electronic circuits has improved the performance of many systems for applications ranging from sensing and imaging to communication and computation.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"1 ","pages":"196-197"},"PeriodicalIF":0.0,"publicationDate":"2021-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/8816720/09650620.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67861565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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