Pub Date : 2024-11-18DOI: 10.1109/OJSSCS.2024.3499967
Makoto Nagata;Takuji Miki
Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the entire backside without being hampered by physical obstacles as well as applying invasive treatments. Physical side channels (SCs), e.g., voltage potentials, current flows, electromagnetic (EM) waves, and photons, are transparent through Si substrate and attributed to the operation of security ICs. An attacker measures SCs using probes as well as antennas and correlates them with secret information, such as secret key bytes, used in a cryptographic processor or analog quantities at the frontend of Internet of Things (IoT) gadgets. This article defines and elucidates the emerging threats of Si-substrate backside attacks on flipped IC chips, demonstrates attacks and proposes countermeasures.
{"title":"Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging","authors":"Makoto Nagata;Takuji Miki","doi":"10.1109/OJSSCS.2024.3499967","DOIUrl":"https://doi.org/10.1109/OJSSCS.2024.3499967","url":null,"abstract":"Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the entire backside without being hampered by physical obstacles as well as applying invasive treatments. Physical side channels (SCs), e.g., voltage potentials, current flows, electromagnetic (EM) waves, and photons, are transparent through Si substrate and attributed to the operation of security ICs. An attacker measures SCs using probes as well as antennas and correlates them with secret information, such as secret key bytes, used in a cryptographic processor or analog quantities at the frontend of Internet of Things (IoT) gadgets. This article defines and elucidates the emerging threats of Si-substrate backside attacks on flipped IC chips, demonstrates attacks and proposes countermeasures.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"4 ","pages":"365-375"},"PeriodicalIF":0.0,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10755152","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142937953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-18DOI: 10.1109/OJSSCS.2024.3501975
Ahmad Khairi;Amir Laufer;Ilia Radashkevich;Yoel Krupnik;Jihwan Kim;Tali Warshavsky Grafi;Ajay Balankutty;Yaniv Sabag;Yoav Segal;Udi Virobnik;Mike Peng Li;Itamar Levin;Yosef Ben Ezra;Ariel Cohen
System considerations, circuit architecture, and design implementation of wireline and linear optics transceivers capable of supporting data-rates beyond 200 Gb/s are presented. We showcase the silicon results of a transceiver designed in the advanced 3-nm CMOS process, which supports long-reach channels with up to 40 dB of loss at Nyquist. These results demonstrate the technology’s benefits of doubling the data rate of transceivers while achieving efficiency gains in power consumption and silicon area. This article highlights several key circuits architecture, such as hybrid continuous-time linear equalizer, inductive peaking clock routing, and one stage TX driver based on grounded switches. The proof-of-concept demonstration of 224 Gb/s with linear optics opens the avenue for power-efficient, low-latency future optical communication. This is crucial for high-performance computing (HPC) networking as well as emerging applications in high-end FPGA.
{"title":"Beyond 200-Gb/s PAM4 ADC and DAC-Based Transceiver for Wireline and Linear Optics Applications","authors":"Ahmad Khairi;Amir Laufer;Ilia Radashkevich;Yoel Krupnik;Jihwan Kim;Tali Warshavsky Grafi;Ajay Balankutty;Yaniv Sabag;Yoav Segal;Udi Virobnik;Mike Peng Li;Itamar Levin;Yosef Ben Ezra;Ariel Cohen","doi":"10.1109/OJSSCS.2024.3501975","DOIUrl":"https://doi.org/10.1109/OJSSCS.2024.3501975","url":null,"abstract":"System considerations, circuit architecture, and design implementation of wireline and linear optics transceivers capable of supporting data-rates beyond 200 Gb/s are presented. We showcase the silicon results of a transceiver designed in the advanced 3-nm CMOS process, which supports long-reach channels with up to 40 dB of loss at Nyquist. These results demonstrate the technology’s benefits of doubling the data rate of transceivers while achieving efficiency gains in power consumption and silicon area. This article highlights several key circuits architecture, such as hybrid continuous-time linear equalizer, inductive peaking clock routing, and one stage TX driver based on grounded switches. The proof-of-concept demonstration of 224 Gb/s with linear optics opens the avenue for power-efficient, low-latency future optical communication. This is crucial for high-performance computing (HPC) networking as well as emerging applications in high-end FPGA.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"4 ","pages":"265-276"},"PeriodicalIF":0.0,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10756610","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142844490","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This article proposes an mm-wave fractional-N all-digital phase-locked loop (ADPLL) employing a reference-waveform oversampling (ROS) phase detector (PD) that increases its effective rate four times, consequently improving jitter at lower power consumption while using a low-frequency reference of 50 MHz. The passive oversampling PD utilizes a zero-forcing technique for voltage-domain presetting and compensation for both the fractional phase and reference spurs induced by imperfections in the reference waveform and reference-waveform oversampling PD (ROS-PD). The ROS-PD eliminates the conventional power-hungry low-noise buffer for the reference input and reduces the PD noise by increasing the loop correction speed. This promotes low jitter and high efficiency in advanced mm-wave PLLs without relying on the increase of the reference clock frequency to several hundred MHz. The imperfections in the reference waveform and ROS-PD, i.e., harmonic distortion, differential path mismatches, and other nonideality factors, can be programmably compensated by the proposed digital manifold calibration scheme, resulting in low reference spurs. A class-F3 oscillator is used to generate a ~10-GHz signal for the feedback divider along with its third harmonic for the harmonic extractor to generate the ~30-GHz output. The proposed ADPLL is implemented in TSMC 28-nm LP CMOS. The prototype generates a 24–31-GHz output carrier with rms jitter of 237 fs while consuming only 12 mW. This corresponds to a state-of-the-art ADPLL ${mathrm {FoM}}_{text {jitter-N}}$