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2013 International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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Analysis on channel thickness fluctuation scattering in InGaAs-OI MOSFETs InGaAs-OI mosfet沟道厚度波动散射分析
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562632
S. H. Kim, M. Yokoyama, R. Nakane, O. Ichikawa, T. Osada, M. Hata, M. Takenaka, S. Takagi
Effects of channel-thickness-fluctuation scattering on electron mobility have been analyzed and it was found that channel-thickness-fluctuation scattering is important parameters decide mobility in ETB III-V-OI MOSFETs. Also, we have clarified that the introduction of MOS interface buffer layer is effective to enhance mobility through the increase of μfluctuation.
分析了通道厚度波动散射对电子迁移率的影响,发现通道厚度波动散射是决定ETB III-V-OI mosfet迁移率的重要参数。此外,我们还阐明了引入MOS界面缓冲层可以通过增加μ波动来有效地提高迁移率。
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引用次数: 0
High performance modulation doped AlGaAs/InGaAs thermopiles (H-PILEs) for uncooled IR FPA utilizing integrated HEMT-MEMS technology 采用集成HEMT-MEMS技术的高性能调制掺杂AlGaAs/InGaAs热电堆(H-PILEs)用于非制冷红外FPA
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562643
M. Abe, K. Ang, R. Hofstetter, Hong Wang, G. Ng
Novel thermopile based on modulation doped AlGaAs/InGaAs heterostructures is proposed and developed for uncooled infrared FPA (Focal Plane Array) image sensor application. The high sensitivity performance is designed to be the responsivity R of 33,000 V/W with the response time IJ of 8 ms, and the high speed performance is designed to be R of 4,900 V/W with IJ of 110 μs, under the 2 μm design rule. Based on integrated HEMT-MEMS technology, the 32×32 matrix FPA is fabricated to demonstrate its enhanced performances by black body measurement. The technology presented here demonstrates the potential of this approach for low-cost uncooled infrared FPA application.
提出并研制了一种基于调制掺杂AlGaAs/InGaAs异质结构的新型热电堆,用于非制冷红外焦平面阵列(FPA)图像传感器。在2 μm设计规则下,高灵敏度R为3.3万V/W,响应时间IJ为8 ms;高速R为4900 V/W,响应时间IJ为110 μs。基于HEMT-MEMS集成技术,制作了32×32矩阵FPA,并通过黑体测量验证了其增强的性能。本文介绍的技术证明了这种方法在低成本非冷却红外FPA应用中的潜力。
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引用次数: 1
A 1×4 MMI-integrated high-power waveguide photodetector 一种1×4微型集成高功率波导光电探测器
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562571
E. Rouvalis, P. Muller, D. Trommer, J. Stephan, A. Steffan, G. Unterborsch
We report on the design, packaging and experimental characterization of a waveguide photodetector monolithically integrated with a 1×4 MMI coupler and a vertically-tapered spotsize converter. The total device consists of an array of 4 photodiodes connected in parallel in order to increase the saturation current. A 3-dB bandwidth of up to 30 GHz was measured. High output power was achieved with approximately 10 dBm at 10 GHz and 7.5 dBm at 20 GHz. From 1-dB compression measurements at 10 GHz and 2 0 GHz, a saturation photocurrent as high as 40 mA was found. At 10 GHz and 20 GHz a third order intercept point (OIP3) of over 20 dBm was measured for photocurrent levels up to 35 mA.
我们报告了一种波导光电探测器的设计、封装和实验表征,该探测器单片集成了1×4 MMI耦合器和垂直锥形光斑尺寸转换器。整个装置由并联连接的4个光电二极管阵列组成,以增加饱和电流。测量了高达30ghz的3db带宽。高输出功率在10ghz时达到约10dbm,在20ghz时达到7.5 dBm。从10 GHz和20 GHz的1 db压缩测量中,发现了高达40 mA的饱和光电流。在10ghz和20ghz下,在高达35ma的光电流水平下测量到超过20dbm的三阶截距点(OIP3)。
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引用次数: 4
Bandgap wavelength shift in quantum well intermixing using different SiO2 masks for photonic integration 利用不同SiO2掩模进行光子集成的量子阱混合中的带隙波长位移
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562591
Jieun Lee, Y. Yamahara, M. Futami, T. Shindo, T. Amemiya, N. Nishiyama, S. Arai
As a photonic integration method of semiconductor membrane structure, quantum-well-intermixing (QWI) process using O2-sputtered SiO2 mask was investigated by comparing the photoluminescence peak wavelength shift between two sections with/without the SiO2 mask. As the result, a large bandgap wavelength difference of 80 nm (47 meV) was obtained while quite large transient region (90 μm) was observed. Since this fact was considered to be attributed to the temperature gradient along the masked and window regions during the rapid thermal annealing (RTA) process, we deposited CVD SiO2 (which has smaller vacancies than O2-sputtered SiO2 hence the bandgap wavelength shift is smaller) on the entire surface after forming O2-sputtered SiO2 mask pattern and successfully reduced the transient region length to less than 5 μm.
作为半导体膜结构的一种光子集成方法,通过比较有/无SiO2掩膜两段的光致发光峰波长移,研究了二氧化氧溅射SiO2掩膜的量子阱混合(QWI)过程。结果表明,在90 μm的瞬态区中,获得了80 nm (47 meV)的大带隙波长差。考虑到快速热退火(RTA)过程中沿掩蔽区和窗口区的温度梯度,我们在形成o2溅射SiO2掩模图案后,在整个表面上沉积CVD SiO2(其空位比o2溅射SiO2小,因此带隙波长位移较小),并成功地将瞬态区长度减小到小于5 μm。
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引用次数: 1
Single-photon emission in telecommunication band from an InAs quantum dot in a pillar structure 柱状结构中InAs量子点在电信波段的单光子发射
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562567
X. Liu, N. Kobayashi, K. Akahane, M. Sasaki, H. Kumano, I. Suemune
We report on the experimental demonstration of single-photon source based on a single InAs quantum dot emitting in the telecommunication band. The low-density quantum dots grown by epitaxial method are embedded in an asetched pillar structure. Photoluminescence spectrum of a single InAs quantum dot exhibits intense and narrow emission lines. Photon antibunching behavior is clearly observed using superconducting single-photon detectors with high sensitivity, which indicates the single-photon emission.
本文报道了基于单InAs量子点在电信波段发射的单光子源的实验演示。采用外延法生长的低密度量子点嵌入在蚀刻柱结构中。单个InAs量子点的光致发光光谱表现出强而窄的发射线。利用高灵敏度的超导单光子探测器,可以清楚地观察到光子的反聚束行为,这表明存在单光子发射。
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引用次数: 0
1540 to 1645 nm continuous VCSEL emission based on quantum dashes 基于量子破折号的1540 ~ 1645 nm连续VCSEL发射
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562594
C. Paranthoen, C. Levallois, J. Gauthier, F. Taleb, N. Chevalier, M. Perrin, Y. Léger, O. de Sagazan, A. Le Corre
We report on an optically excited InAs quantum dash vertical cavity surface emitting lasers (VCSEL) on InP substrate. By introducing a wedge microcavity design, we obtain a spatial dependence of the resonant wavelength along the wafer, enabling us to monitor the gain material bandwidth. In this paper we show a continuously variable VCSEL emission from 1645 down to 1540 nm all across the wafer, a consequence of the important and wide gain afforded by the use of optimized quantum dashes.
报道了一种基于InP衬底的光激发InAs量子冲刺垂直腔面发射激光器。通过引入楔形微腔设计,我们获得了沿晶圆谐振波长的空间依赖性,使我们能够监测增益材料带宽。在本文中,我们展示了在整个晶圆上从1645 nm到1540 nm的连续可变VCSEL发射,这是使用优化量子划提供的重要和宽增益的结果。
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引用次数: 0
Carrier-transport, optical and structural properties of large area ELOG InP on Si using conventional optical lithography 采用常规光刻技术制备大面积ELOG InP的载流子输运、光学和结构特性
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562592
H. Kataria, W. Metaferia, M. Nagarajan, C. Junesand, Y. Sun, S. Lourdudoss
We present the carrier-transport, optical and structural properties of InP deposited on Si by Epitaxial Lateral Overgrowth (ELOG) in a Low Pressure-Hydride Vapor phase epitaxy (LP-HVPE). Hall measurements, micro photoluminescence (μ-PL) and X-ray diffraction (XRD) were used to study the above-mentioned respective properties at room temperature. It is the first time that electrical properties of ELOG InP on Si are studied by Hall measurements. Prior to ELOG, etching of patterned silicon dioxide (SiO2) mask leading to a high aspect ratio, i. e. mask thickness to opening width >2 was optimized to eliminate defect propagation even above the opening. Dense high aspect ratio structures were fabricated in SiO2 to obtain ELOG InP on Si, coalesced over large area, making it feasible to perform Hall measurements. We examine this method and study Hall mobility, strain and optical quality of large area ELOG InP on Si.
本文研究了在低压氢化物气相外延(LP-HVPE)中通过外延横向过度生长(ELOG)沉积在Si上的InP的载流子输运、光学和结构性质。采用霍尔测量、微光致发光(μ-PL)和x射线衍射(XRD)等方法研究了上述材料在室温下的性能。这是首次用霍尔测量方法研究了ELOG InP在Si上的电学性质。在ELOG之前,对图案二氧化硅(SiO2)掩模的蚀刻进行了优化,导致高长宽比,即掩模厚度与开口宽度>2,以消除甚至在开口以上的缺陷传播。在SiO2上制备致密的高纵横比结构,得到大面积聚结的ELOG InP on Si,使霍尔测量成为可能。我们检验了这种方法,并研究了大面积ELOG InP的霍尔迁移率、应变和光学质量。
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引用次数: 1
AlGaInAs selective area growth for high-speed EAM-based PIC sources 高速eam型PIC源的AlGaInAs选择性面积生长
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562625
J. Decobert, P. Lagrée, H. Guerault, C. Kazmierski
We present a generic integration platform based on the SAG of AlGaInAs/InP MQW material. For efficient bandgap engineering of the different areas of the PICs, active and passive function heterostructures are precisely modeled and characterized in the SAG zones. This approach has allowed to design novel high-speed InP-based PIC.
提出了一种基于AlGaInAs/InP MQW材料SAG的通用集成平台。为了有效地进行带隙工程,在带隙区精确地模拟和表征了主动和被动功能异质结构。这种方法可以设计出基于inp的新型高速PIC。
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引用次数: 6
Selective area MOVPE of InGaAsP and InGaN systems as process analytical and design tools for OEICs InGaAsP和InGaN系统作为OEICs的工艺分析和设计工具的选择性区域MOVPE
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562576
Y. Shimogaki, M. Sugiyama, Y. Nakano
Numerical simulation on growth rate non-uniformity of selective area growth (SAG) in metal-organic vapor phase epitaxy (MOVPE) is an effective method to examine the surface reaction kinetics, which is normally hindered by mass transport rate of precursors. SAG is also an effective tool to fabricate opto-electronic integrated circuits (OEICs) to reduce the process steps. In the present talk, the kinetic analyses on InGaAsP and InGaN MOVPE processes using SAG will be presented.
金属-有机气相外延(MOVPE)中选择性面积生长(SAG)生长速率非均匀性的数值模拟是研究表面反应动力学的有效方法,通常受前驱体的传质速率的阻碍。SAG也是制造光电集成电路(oeic)的有效工具,可以减少工艺步骤。在本次演讲中,将介绍使用SAG对InGaAsP和InGaN MOVPE过程的动力学分析。
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引用次数: 2
Design of multi-functional GaInAsP/Si hybrid semiconductor optical amplifier array with AlInAs-oxide current confinement layer 具有AlInAs-oxide电流约束层的多功能GaInAsP/Si混合半导体光放大器阵列设计
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562621
Y. Hayashi, K. Fukuda, R. Osabe, Jun-ichi Suzuki, Y. Atsumi, Joonhyun Kang, N. Nishiyama, S. Arai
Novel configuration of multi-functional SOA array by III-V/Si hybrid technique using one-time III-V/Si wafer bonding is proposed. A III-V/Si hybrid structure can realize multi-functional SOA array with different gain characteristics by tuning Si waveguide width.
提出了一种基于III-V/Si晶圆键合的III-V/Si混合技术的多功能SOA阵列结构。III-V/Si混合结构可以通过调整Si波导宽度来实现具有不同增益特性的多功能SOA阵列。
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2013 International Conference on Indium Phosphide and Related Materials (IPRM)
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