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2013 International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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MOVPE-preparation of Si(111) surfaces for III–V nanowire growth 用于III-V纳米线生长的Si(111)表面的movpe制备
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562590
M. Steidl, A. Paszuk, Weihong Zhao, S. Bruckner, A. Dobrich, O. Supplie, Johannes Luczak, P. Kleinschmidt, H. Doscher, T. Hannappel
We studied the preparation of the clean Si(111) surface in H2 ambient with in situ reflection anisotropy spectroscopy and UHV-based surface science tools after contamination-free transfer. X-ray photoelectron spectroscopy confirmed complete oxide removal after high-temperature annealing. In situ RAS enabled observation of the oxide removal in dependence of process temperature. Monohydride termination was verified by Fourier transform infrared spectroscopy which agrees with a (1×1) surface reconstruction we observed by scanning tunneling microscopy and low energy electron diffraction. By atomic force microscopy analysis of the morphology, we found that wet-chemical pretreatment has an impact on the different silicon surfaces we have prepared, including homoepitaxy and termination of silicon with arsenic.
利用原位反射各向异性光谱和基于uhv的表面科学工具,研究了无污染转移后在H2环境下制备干净的Si(111)表面。x射线光电子能谱证实高温退火后氧化物完全去除。原位RAS可以观察到氧化去除与工艺温度的关系。傅里叶变换红外光谱证实了一氢化物的终止,这与扫描隧道显微镜和低能电子衍射观察到的(1×1)表面重建一致。通过原子力显微镜的形貌分析,我们发现湿化学预处理对我们制备的不同硅表面有影响,包括同外延和硅与砷的终止。
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引用次数: 0
Terahertz GaAs Schottky diode mixer and multiplier MIC's based on e-beam technology 基于电子束技术的太赫兹GaAs肖特基二极管混频器和乘法器
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562606
V. Drakinskiy, P. Sobis, H. Zhao, T. Bryllert, J. Stake
We present the progress of the technological development of a full e-beam based monolithically integrated Schottky diode process applicable for sub-millimetre wave multipliers and mixers. Evaluation of the process has been done in a number of demonstrators showing state-of-the-art performance, including various multiplier circuits up to 200 GHz with a measured flange efficiency of above 35%, as well as heterodyne receiver front-end modules operating at 340 GHz and 557 GHz with a measured receiver DSB noise temperature of below 700 K and 1300 K respectively.
本文介绍了应用于亚毫米波乘法器和混频器的全电子束单片集成肖特基二极管工艺的技术进展。对该工艺的评估已经在许多演示中完成,显示了最先进的性能,包括高达200 GHz的各种倍频电路,测量的法兰盘效率超过35%,以及工作在340 GHz和557 GHz的外差接收器前端模块,测量的接收器DSB噪声温度分别低于700 K和1300 K。
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引用次数: 22
Optimizing the double-cap procedure for InAs/InGaAsP/InP quantum dots by metal-organic chemical vapor deposition 金属有机化学气相沉积法制备InAs/InGaAsP/InP量子点的双帽工艺优化
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562588
S. Luo, H. Ji, Xiaoguang Yang, Tao Yang
We report the optimization of the double-cap (DC) procedure for InAs/InGaAsP/InP quantum dots (QD) grown by metal-organic chemical vapor deposition. By using a combination of optimized thickness of the first cap layer and elevated growth temperature for the second cap layer, the photoluminescence (PL) linewidth of samples with five QD layers is significantly reduced from 124 meV to 87 meV at room temperature. Furthermore, the uniformity of the PL peak intensity and peak energy on the wafer surface is evidently improved. This distribution improvement is especially beneficial for improving device yield per wafer in device fabrication.
本文报道了金属有机化学气相沉积法制备InAs/InGaAsP/InP量子点的双帽(DC)工艺。通过优化第一层帽层厚度和提高第二层帽层生长温度的组合,具有5个QD层的样品的光致发光(PL)线宽在室温下从124 meV显著降低到87 meV。此外,光斑峰强度和峰值能量在晶圆表面的均匀性也得到了明显改善。这种分布的改善对于提高器件制造中每晶圆的器件良率尤其有益。
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引用次数: 0
Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects 使用倒装芯片互连的低串扰和高调制带宽100GbE光发射机
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562619
S. Kanazawa, T. Fujisawa, K. Takahata, A. Ohki, R. Iga, H. Ishii
We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10% to 27% compared with that of a wire interconnection module.
我们开发了第一个紧凑的100GbE光发射器,首次使用倒装芯片互连。倒装芯片互连提供低串扰和高调制带宽。在四通道同时工作下,倒装片互连模块的100GBASE-LR4掩模裕度比线互连模块提高了10% ~ 27%。
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引用次数: 0
Intermixing of highly-stacked InAs/InGaAlAs quantum dots grown on InP (311)B substrate by SiO2 sputtering and annealing technique 用SiO2溅射和退火技术制备InP (311)B衬底上高度堆叠的InAs/InGaAlAs量子点
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562629
A. Matsushita, A. Matsumoto, K. Akahane, Y. Matsushima, K. Utaka
We have studied the intermixing of highly-stacked InAs/InGaAlAs quantum dots grown on InP (311)B substrates by SiO2 sputtering and annealing technique with a low temperature of 650 □ to find a large PL spectral blue-shift by about 60 nm. This result suggests that the low temperature intermixing technique is promising for easy formation of monolithic integrated circuits with the highly-stacked QD structures.
我们研究了在InP (311)B衬底上生长的高度堆叠的InAs/InGaAlAs量子点,采用SiO2溅射和低温650℃退火技术,发现了大约60 nm的大PL光谱蓝移。这一结果表明,低温混合技术很容易形成具有高堆叠量子点结构的单片集成电路。
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引用次数: 2
Monolithic integration of InP-based waveguide photodiodes with MIM capacitors for compact coherent receiver 紧凑相干接收机用inp波导光电二极管与MIM电容的单片集成
Pub Date : 2013-02-13 DOI: 10.1109/ICIPRM.2013.6562573
R. Masuyama, H. Yagi, N. Inoue, Y. Onishi, T. Katsuyama, T. Kikuchi, Y. Yoneda, H. Shoji
We have demonstrated monolithic integration of InP-based waveguide photodiodes (WGPDs) with metal-insulator-metal (MIM) capacitors using the 3-inch diameter wafer process. The uniformity of MIM capacitance and the dielectric breakdown voltage of the capacitor obtained within +/-2 % and over 100 V, respectively. The dark current of WGPDs was less than 3 nA at a reverse voltage of 1.6 V, owing to the InP passivation structure formed on WGPD surface. The fabricated integrated chip size was 2.0 mm × 5.1 mm. These results indicate that integrated WGPDs can provide both smaller and easier assembly for the compact coherent receiver.
我们已经展示了使用3英寸直径晶圆工艺的基于inp的波导光电二极管(wgpd)与金属-绝缘体-金属(MIM)电容器的单片集成。MIM电容的均匀性在+/- 2%以内,电容的介电击穿电压在100 V以上。由于在WGPD表面形成了InP钝化结构,在反向电压为1.6 V时,WGPD的暗电流小于3 nA。所制集成芯片尺寸为2.0 mm × 5.1 mm。这些结果表明,集成wgpd可以为紧凑型相干接收机提供更小、更容易的组装。
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引用次数: 10
Non-blocking 4×4 InAlGaAs/InAlAs Mach-Zehnder-type optical switch fabric 无阻塞4×4 InAlGaAs/InAlAs mach - zehnder型光交换结构
Pub Date : 2013-02-13 DOI: 10.1109/ICIPRM.2013.6562620
N. Koyama, H. Kouketsu, S. Kawasaki, A. Takei, T. Taniguchi, Y. Matsushima, K. Utaka
We demonstrated the full-interport connection of a non-blocking 4x4 InAlGaAs/InAlAs Mach-Zehnder-type optical switch (MZ-OS) fabric. This switch fabric is consisted of six 2x2 MZ-OS elements in a cascading configuration, and it successfully operated with high-extinction ratios of about 20dB and polarization independence.
我们演示了非阻塞4x4 InAlGaAs/InAlAs mach - zehnder型光开关(MZ-OS)结构的全端口连接。该开关结构由6个2x2 MZ-OS单元级联组成,具有20dB左右的高消光比和偏振无关性。
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引用次数: 4
Analysis of photoluminescent properties of InAs/InGaAsP/InP quantum dots structure InAs/InGaAsP/InP量子点结构的光致发光特性分析
Pub Date : 2013-02-13 DOI: 10.1109/ICIPRM.2013.6562586
R. Sato, M. Nakamura, H. Imai
We measured photoluminescence (PL) spectra of InAs/InGaAsP/InP quantum dots structures. We examined the PL peak shift changing the polarization of excitation light from p-polarization to s-polarization and the excitation light power. From the results, we estimated that the phonon emission according to the increase in TM component of the p-polarization.
我们测量了InAs/InGaAsP/InP量子点结构的光致发光光谱。我们研究了激发光的偏振从p偏振到s偏振以及激发光功率的变化。根据实验结果,我们估计声子发射随p极化TM分量的增加而增加。
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引用次数: 0
Terahertz oscillators using resonant tunneling diodes with InAlGaAs/InP composite collector 采用谐振隧道二极管和InAlGaAs/InP复合集电极的太赫兹振荡器
Pub Date : 2013-02-13 DOI: 10.1109/ICIPRM.2013.6562603
R. Sogabe, K. Shizuno, H. Kanaya, S. Suzuki, M. Asada, H. Sugiyama, H. Yokoyama
We proposed a resonant tunneling diode (RTD) with InAlGaAs/InP composite collector for reduction in transit delay caused by the gamma to L valley transition at the collector depletion region. Terahertz oscillators fabricated with this RTD show room-temperature fundamental oscillations of 680-770 GHz with the RTD areas of 1-1.5 square microns. Higher frequency will be possible by reducing the RTD area.
我们提出了一种具有InAlGaAs/InP复合集热器的谐振隧道二极管(RTD),以减少集热器耗尽区由γ到L谷跃迁引起的传输延迟。用该RTD制备的太赫兹振荡器显示出680-770 GHz的室温基本振荡,RTD面积为1-1.5平方微米。通过减小RTD面积,可以获得更高的频率。
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引用次数: 0
Asymmetric dual-grating gate InGaAs/InAlAs/InP HEMTs for ultrafast and ultrahigh sensitive terahertz detection 用于超快和超高灵敏度太赫兹探测的非对称双光栅栅极InGaAs/InAlAs/InP hemt
Pub Date : 2012-06-18 DOI: 10.1109/DRC.2012.6256927
T. Otsuji, Takayuki Watanabe, S. Boubanga-Tombet, T. Suemitsu, D. Coquillat, W. Knap, D. Fateev, V. Popov
This paper reviews recent advances in ultrafast and ultrahigh sensitive broadband terahertz detection utilizsing asymmetric double-grating-gate InP-based high-electron-mobility transistors, demonstrating a record responsivity of 2.2 kV/W at 1 THz under drain-unbiased conditions with a superior low noise equivalent power of 15 pW/√Hz and 6.4 kV/W even at 1.5 THz under drain-biased conditions.
本文综述了利用非对称双栅inp基高电子迁移率晶体管在超快和超高灵敏度宽带太赫兹检测方面的最新进展,证明了在漏极偏置条件下,在1太赫兹处的响应率达到了2.2 kV/W,在漏极偏置条件下,在1.5太赫兹处的等效低噪声功率为15 pW/√Hz和6.4 kV/W。
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引用次数: 5
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2013 International Conference on Indium Phosphide and Related Materials (IPRM)
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