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Transport properties of spin field-effect transistors built on Si and InAs 硅和InAs自旋场效应晶体管的输运特性
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757998
D. Osintsev, V. Sverdlov, Z. Stanojević, A. Makarov, S. Selberherr
We investigate the properties of ballistic spin field-effect transistors (SpinFETs). First we show that the amplitude of the tunneling magnetoresistance oscillations decreases dramatically with increasing temperature in SpinFETs with the semiconductor channel made of InAs. We also demonstrate that the [100] orientation of the silicon fin is preferred for practical realizations of silicon SpinFETs due to stronger modulation of the conductance as a function of spin-orbit interaction and magnetic field.
研究了弹道自旋场效应晶体管(spinfet)的特性。首先,我们发现在由InAs制成的半导体通道中,隧道磁阻振荡的振幅随着温度的升高而急剧下降。我们还证明了硅翅片的[100]取向对于硅自旋场效应管的实际实现是首选的,因为电导作为自旋轨道相互作用和磁场的函数有更强的调制。
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引用次数: 2
X-ray absorption studies of elemental and complex transition metal (TM) oxides: Differences between: (i) Chemical, and (ii) Local site symmetry multivalency 单质和复杂过渡金属氧化物的x射线吸收研究:差异:(i)化学,和(ii)局部位置对称多价
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5758000
G. Lucovsky, L. Miotti, D. Zeller, C. Adamo, D. Scholm
Alloy induced multivalency in transition metal oxides increases device functionality. Effects include insulator to metal transitions in the d0 perovskites (i) GdScO3, by substitution of tetravalent Ti trivalent for Sc, and (ii) LaMnO3 by alloy substitution of trivalent La and divalent Sr for trivalent La. Substituion of Ti3+ for Sc3+ on the ScO2 planes leads to hopping induced multivalencey for both Ti and Sc, but only for Ti compositions above a percolation threshold. The formation of La1−xSrxMnO3 alloys leads to mixed valence of the Mn-atoms: Mn3+ in the LaMnO3 fraction, and Mn4+ in the SrMnO3 fraction. Spectroscopic detection is based on charge transfer multiplet theory applied to Ti, Sc and Mn L2,3 spectra were multivalent charge states increase the number of spectral features. Multivalency also occurs suboxide alloys such as TiO2−x in a composition range: TiO2 > TiO2−x > TiO1.5. These alloys have a mix of Ti4+ and Ti3+ local bonding states, but due to hopping transport, the mix includes Ti2+. One important aspect of controlled multivalency is that it provides a way of changing and/or controlling the density of O-vacancy defects. Electrons can be injected into the oxide negative ion states ion states from Si, Ge, and other semiconductors, as well as metals with different offset energies [1]. The two terminal devices with asymmetric current-voltage charateristics providing options for memory devices.
过渡金属氧化物中合金诱导的多价性增加了器件的功能。影响包括绝缘体对钙钛矿中金属过渡的影响(i)用四价Ti代替Sc的GdScO3,以及(ii)用三价La和二价Sr代替三价La的合金代替LaMnO3。在ScO2平面上,Ti3+取代Sc3+会导致Ti和Sc的多价跃迁,但仅限于超过渗透阈值的Ti成分。La1−xSrxMnO3合金的形成导致mn原子的混合价态:LaMnO3分数为Mn3+, SrMnO3分数为Mn4+。光谱检测基于电荷转移多重理论应用于Ti、Sc和Mn L2,3个光谱均为多价电荷态,增加了光谱特征的数量。多价态合金如TiO2 - x的组成范围为:TiO2 > TiO2 - x > TiO1.5。这些合金具有Ti4+和Ti3+的混合局部键合态,但由于跳频输运,混合态包括Ti2+。可控多价的一个重要方面是,它提供了一种改变和/或控制o空位缺陷密度的方法。电子可以注入到Si、Ge等半导体的氧化物负离子态,以及具有不同偏移能量的金属[1]。具有非对称电流-电压特性的两个终端器件为存储器器件提供了选择。
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引用次数: 0
Toy model for the progressive breakdown dynamics of ultrathin gate dielectrics 超薄栅极电介质递进击穿动力学的Toy模型
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5758016
E. Miranda, D. Jiménez, J. Suñé
A simple analytic model for the progressive breakdown (BD) dynamics of ultrathin) gate oxides is presented. It is shown how the interplay between series and parallel resistances that represent the breakdown path and its surroundings leads to a sigmoidal I-t characteristic compatible with experimental data. The analysis is carried out using the Lyapunov exponent and the potential function associated with the logistic equation for the leakage current. The roles played by the initial current value and the system's attractor in the breakdown trajectories are discussed.
提出了超薄栅极氧化物递进击穿动力学的简单解析模型。它显示了串联和并联电阻之间的相互作用,表示击穿路径及其周围环境导致与实验数据兼容的s型I-t特性。利用李雅普诺夫指数和与漏电流逻辑方程相关的势函数进行分析。讨论了初始电流值和系统吸引子在击穿轨迹中的作用。
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引用次数: 0
High-temperature perspectives of UTB SOI MOSFETs UTB SOI mosfet的高温透视
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5758013
V. Kilchytska, F. Andrieu, O. Faynot, D. Flandre
In this paper, we analyze, for the first time to our best knowledge, the high-temperature perspectives of Ultra-thin body (UTB) SOI MOSFETs. High-temperature behavior of threshold voltage, subthreshold slope, transconductance maximum and on-current is analyzed in details through measurements and 2D simulations. Particular attention is paid to the effect of buried oxide (BOX) and Si film thicknesses as well as channel doping on the degradation of main device parameters over the temperature range.
在本文中,我们首次分析了超薄体(UTB) SOI mosfet的高温视角。通过测量和二维仿真,详细分析了阈值电压、亚阈值斜率、跨导最大值和导通电流的高温行为。特别关注了埋藏氧化物(BOX)和硅膜厚度以及通道掺杂对主要器件参数在温度范围内退化的影响。
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引用次数: 4
The effect of the doping concentration on nanoscale field effect diode performance 掺杂浓度对纳米场效应二极管性能的影响
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757992
N. Manavizadeh, F. Raissi, E. Soleimani
The performance of nanoscale Field Effect Diode as a function of doping concentration is investigated. Our numerical results show that the Ion/Ioff ratio which is a significant parameter in digital application can be varied from 101 to 104 as the doping concentration of source/drain regions increased from 1016 to 1021 cm−3. The figures of merit including intrinsic gate delay time and energy-delay product have been studied for the field effect diodes which are interesting candidates for future logic application.
研究了纳米场效应二极管的性能随掺杂浓度的变化规律。数值结果表明,当源极/漏极掺杂浓度从1016 cm−3增加到1021 cm−3时,离子/断流比可以从101变化到104,这是数字应用中的一个重要参数。研究了场效应二极管的本征门延迟时间和能量延迟积等性能指标,为今后的逻辑应用提供了有益的选择。
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引用次数: 3
Performance investigation of short-channel junctionless multigate transistors 短通道无结多栅极晶体管的性能研究
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5758005
P. Razavi, G. Fagas, I. Ferain, N. Akhavan, R. Yu, J. Colinge
We investigate the performance of short channel junctionless gate-all-around (GAA) transistors, by comparing the I_V characteristics, subthreshold swing and drain-induced barrier lowring (DIBL) of junctionless GAA transistors with accumulation-mode GAA transistors. We also compare the I_V characteristics of junctionless GAA transistors for different wafer and transport orientations. MuGFETs are investigated for different wafer and channel orientation.
通过比较无结GAA晶体管与累积型GAA晶体管的I_V特性、亚阈值摆幅和漏极诱导势垒降低(DIBL),研究了短通道无结GAA晶体管的性能。我们还比较了不同晶圆和输运方向下无结GAA晶体管的I_V特性。研究了不同晶圆取向和沟道取向的mugfet。
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引用次数: 16
Source/drain engineered ultra low power analog/RF UTBB MOSFETs 源极/漏极超低功耗模拟/RF UTBB mosfet
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757997
A. Kranti, J. Raskin, G. A. Armstrong
We present a novel optimization technique for ultra-low-power analog/RF Ultra Thin Body BOX (UTBB) MOSFETs. UTBB devices are optimized in bias range corresponding to peak of transconductance-to-current ratio (gm/Ids) and cut-off frequency (fT) product i.e. gmfT/Ids as it represents a “sweet spot” between speed and power. It is demonstrated that the use of underlap source/drain (S/D) architecture in UTBB devices improve gmfT/Ids, intrinsic voltage gain (AVO), cut-off frequency (fT) and linearity (VIP3) with downscaling.
我们提出了一种新的超低功耗模拟/射频超薄体盒(UTBB) mosfet优化技术。UTBB器件在相应于跨导电流比(gm/Ids)峰值和截止频率(fT)产品(即gmfT/Ids)的偏置范围内进行了优化,因为它代表了速度和功率之间的“最佳点”。研究表明,在UTBB器件中使用下接源/漏极(S/D)架构可以通过降阶提高gmfT/Ids、固有电压增益(AVO)、截止频率(fT)和线性度(VIP3)。
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引用次数: 4
Influence of annealing temperature on the performance of graphene / SiC transistors with high-k / metal gate 退火温度对高k /金属栅极石墨烯/ SiC晶体管性能的影响
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757955
M. Clavel, T. Poiroux, M. Mouis, L. Becerra, J. Thomassin, A. Zenasni, G. Lapertot, D. Rouchon, D. Lafond, O. Faynot
In this study, we investigate the impact of thermal annealing on the electrical characteristics of epitaxial graphene field effect transistors. Top gated devices were fabricated from graphene obtained on silicon carbide (SiC) substrate. Thanks to an annealing at 300°C, the performance of the devices was enhanced by a factor of 90. The maximal transconductance reached really high values such as 5900µS/µm at VD=3V, corresponding to a carrier mobility of 2230 cm2/V.s.
在本研究中,我们研究了热退火对外延石墨烯场效应晶体管电特性的影响。在碳化硅(SiC)衬底上制备了石墨烯顶门控器件。由于在300°C下退火,器件的性能提高了90倍。在VD=3V时,最大的跨导达到了5900µS/µm,对应的载流子迁移率为2230 cm2/V.s。
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引用次数: 3
Open issues for the numerical simulation of silicon solar cells
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757961
R. De Rose, M. Zanuccoli, P. Magnone, E. Sangiorgi, C. Fiegna
The improvement of solar cell efficiency requires device optimization, including the careful design of contacts and doping profiles, and the implementation of light trapping strategies. In this context, electro-optical numerical simulation is essential to analyze the physical mechanisms that limit the cell efficiency and lead to design trade-offs. In this work we discuss the calibration of the relevant physical models for electrical simulation and we put in evidence important limitations of the most common adopted optical simulators.
提高太阳能电池效率需要对器件进行优化,包括仔细设计触点和掺杂轮廓,以及实施光捕获策略。在这种情况下,电光数值模拟对于分析限制电池效率和导致设计权衡的物理机制至关重要。在这项工作中,我们讨论了电气仿真的相关物理模型的校准,并提出了最常用的光学模拟器的重要局限性。
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引用次数: 21
A surface potential based compact model for lightly doped FD SOI MOSFETs with ultra-thin body 基于表面电位的超薄体轻掺杂FD SOI mosfet紧凑模型
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757972
J. E. Husseini, F. Martinez, M. Bawedin, M. Valenza, R. Ritzenthaler, F. Lime, B. Iñíguez
In this paper, a new surface potential based compact model for long channel fully depleted SOI MOSFET with lightly doped ultra-thin body is presented. The 1-D Poisson equation is solved using the appropriate boundary conditions, and a closed-form surface potential solution is proposed for the front and back surface potentials. Finally the model was compared to numerical simulations and a good agreement is observed.
本文提出了一种基于表面电位的轻掺杂超薄体长沟道全耗尽SOI MOSFET紧凑模型。采用适当的边界条件求解了一维泊松方程,并给出了前后表面电位的封闭解。最后将模型与数值模拟结果进行了比较,两者吻合较好。
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Ulis 2011 Ultimate Integration on Silicon
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