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The impact of junction angle on tunnel FETs 结角对隧道场效应管的影响
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757957
Frank K. H. Kao, A. Verhulst, W. Vandenberghe, G. Groeseneken, K. De Meyer
We derive an analytical model based on circular tunnel paths along the electric field to describe the behavior of a tunnel FET with a junction angle at the source. The model is compared with simulation results and qualitative agreement is observed. We further demonstrate that a small junction angle prevents TFET performance degradation resulting from a high-k spacer. Finally we optimize the junction angle with an encroaching source structure, studying the dependence on oxide thickness and semiconductor material.
我们推导了一个基于沿电场的圆形隧道路径的解析模型来描述在源端有结角的隧道场效应管的行为。将模型与仿真结果进行了比较,得到了定性一致的结果。我们进一步证明了小的结角可以防止高k间隔造成的TFET性能下降。最后,我们用侵占源结构优化了结角,研究了对氧化物厚度和半导体材料的依赖性。
{"title":"The impact of junction angle on tunnel FETs","authors":"Frank K. H. Kao, A. Verhulst, W. Vandenberghe, G. Groeseneken, K. De Meyer","doi":"10.1109/ULIS.2011.5757957","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757957","url":null,"abstract":"We derive an analytical model based on circular tunnel paths along the electric field to describe the behavior of a tunnel FET with a junction angle at the source. The model is compared with simulation results and qualitative agreement is observed. We further demonstrate that a small junction angle prevents TFET performance degradation resulting from a high-k spacer. Finally we optimize the junction angle with an encroaching source structure, studying the dependence on oxide thickness and semiconductor material.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"234 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123304663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Transport properties of spin field-effect transistors built on Si and InAs 硅和InAs自旋场效应晶体管的输运特性
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757998
D. Osintsev, V. Sverdlov, Z. Stanojević, A. Makarov, S. Selberherr
We investigate the properties of ballistic spin field-effect transistors (SpinFETs). First we show that the amplitude of the tunneling magnetoresistance oscillations decreases dramatically with increasing temperature in SpinFETs with the semiconductor channel made of InAs. We also demonstrate that the [100] orientation of the silicon fin is preferred for practical realizations of silicon SpinFETs due to stronger modulation of the conductance as a function of spin-orbit interaction and magnetic field.
研究了弹道自旋场效应晶体管(spinfet)的特性。首先,我们发现在由InAs制成的半导体通道中,隧道磁阻振荡的振幅随着温度的升高而急剧下降。我们还证明了硅翅片的[100]取向对于硅自旋场效应管的实际实现是首选的,因为电导作为自旋轨道相互作用和磁场的函数有更强的调制。
{"title":"Transport properties of spin field-effect transistors built on Si and InAs","authors":"D. Osintsev, V. Sverdlov, Z. Stanojević, A. Makarov, S. Selberherr","doi":"10.1109/ULIS.2011.5757998","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757998","url":null,"abstract":"We investigate the properties of ballistic spin field-effect transistors (SpinFETs). First we show that the amplitude of the tunneling magnetoresistance oscillations decreases dramatically with increasing temperature in SpinFETs with the semiconductor channel made of InAs. We also demonstrate that the [100] orientation of the silicon fin is preferred for practical realizations of silicon SpinFETs due to stronger modulation of the conductance as a function of spin-orbit interaction and magnetic field.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"18 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131091400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
High-temperature perspectives of UTB SOI MOSFETs UTB SOI mosfet的高温透视
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5758013
V. Kilchytska, F. Andrieu, O. Faynot, D. Flandre
In this paper, we analyze, for the first time to our best knowledge, the high-temperature perspectives of Ultra-thin body (UTB) SOI MOSFETs. High-temperature behavior of threshold voltage, subthreshold slope, transconductance maximum and on-current is analyzed in details through measurements and 2D simulations. Particular attention is paid to the effect of buried oxide (BOX) and Si film thicknesses as well as channel doping on the degradation of main device parameters over the temperature range.
在本文中,我们首次分析了超薄体(UTB) SOI mosfet的高温视角。通过测量和二维仿真,详细分析了阈值电压、亚阈值斜率、跨导最大值和导通电流的高温行为。特别关注了埋藏氧化物(BOX)和硅膜厚度以及通道掺杂对主要器件参数在温度范围内退化的影响。
{"title":"High-temperature perspectives of UTB SOI MOSFETs","authors":"V. Kilchytska, F. Andrieu, O. Faynot, D. Flandre","doi":"10.1109/ULIS.2011.5758013","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5758013","url":null,"abstract":"In this paper, we analyze, for the first time to our best knowledge, the high-temperature perspectives of Ultra-thin body (UTB) SOI MOSFETs. High-temperature behavior of threshold voltage, subthreshold slope, transconductance maximum and on-current is analyzed in details through measurements and 2D simulations. Particular attention is paid to the effect of buried oxide (BOX) and Si film thicknesses as well as channel doping on the degradation of main device parameters over the temperature range.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132007470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Specific features of fluorination of silicon surface region by RIE in r.f. CF4 plasma — novel method of improving electrical properties of thin PECVD silicon dioxide films r - f - CF4等离子体中硅表面的RIE氟化特性——改善PECVD二氧化硅薄膜电性能的新方法
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757960
M. Kalisz, R. Mroczyński, R. B. Beck
In this study, the comparison of methods of improving electro-physical properties of silicon dioxide (SiO2) by means of silicon substrates fluorination in CF4 in PECVD and RIE reactors, prior to oxide deposition, has been performed. The results proved that, in general, fluorination in RIE is superior to the fluorination in PECVD reactor. The observed effects have been referred to the obtained changes in the electrical properties, resulting from both fluorination methods. As a result of this study, it has been proved, that properties change is fluorine concentration dependent.
在本研究中,比较了在氧化沉积之前,在PECVD和RIE反应器中利用硅衬底氟化CF4改善二氧化硅(SiO2)电物理性能的方法。结果表明,总的来说,RIE的氟化优于PECVD的氟化。所观察到的效应是指两种氟化方法所产生的电性能变化。本研究结果证明,其性质变化与氟浓度有关。
{"title":"Specific features of fluorination of silicon surface region by RIE in r.f. CF4 plasma — novel method of improving electrical properties of thin PECVD silicon dioxide films","authors":"M. Kalisz, R. Mroczyński, R. B. Beck","doi":"10.1109/ULIS.2011.5757960","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757960","url":null,"abstract":"In this study, the comparison of methods of improving electro-physical properties of silicon dioxide (SiO2) by means of silicon substrates fluorination in CF4 in PECVD and RIE reactors, prior to oxide deposition, has been performed. The results proved that, in general, fluorination in RIE is superior to the fluorination in PECVD reactor. The observed effects have been referred to the obtained changes in the electrical properties, resulting from both fluorination methods. As a result of this study, it has been proved, that properties change is fluorine concentration dependent.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"109 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130675743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Source/drain engineered ultra low power analog/RF UTBB MOSFETs 源极/漏极超低功耗模拟/RF UTBB mosfet
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757997
A. Kranti, J. Raskin, G. A. Armstrong
We present a novel optimization technique for ultra-low-power analog/RF Ultra Thin Body BOX (UTBB) MOSFETs. UTBB devices are optimized in bias range corresponding to peak of transconductance-to-current ratio (gm/Ids) and cut-off frequency (fT) product i.e. gmfT/Ids as it represents a “sweet spot” between speed and power. It is demonstrated that the use of underlap source/drain (S/D) architecture in UTBB devices improve gmfT/Ids, intrinsic voltage gain (AVO), cut-off frequency (fT) and linearity (VIP3) with downscaling.
我们提出了一种新的超低功耗模拟/射频超薄体盒(UTBB) mosfet优化技术。UTBB器件在相应于跨导电流比(gm/Ids)峰值和截止频率(fT)产品(即gmfT/Ids)的偏置范围内进行了优化,因为它代表了速度和功率之间的“最佳点”。研究表明,在UTBB器件中使用下接源/漏极(S/D)架构可以通过降阶提高gmfT/Ids、固有电压增益(AVO)、截止频率(fT)和线性度(VIP3)。
{"title":"Source/drain engineered ultra low power analog/RF UTBB MOSFETs","authors":"A. Kranti, J. Raskin, G. A. Armstrong","doi":"10.1109/ULIS.2011.5757997","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757997","url":null,"abstract":"We present a novel optimization technique for ultra-low-power analog/RF Ultra Thin Body BOX (UTBB) MOSFETs. UTBB devices are optimized in bias range corresponding to peak of transconductance-to-current ratio (g<inf>m</inf>/I<inf>ds</inf>) and cut-off frequency (f<inf>T</inf>) product i.e. g<inf>m</inf>f<inf>T</inf>/I<inf>ds</inf> as it represents a “sweet spot” between speed and power. It is demonstrated that the use of underlap source/drain (S/D) architecture in UTBB devices improve g<inf>m</inf>f<inf>T</inf>/I<inf>ds</inf>, intrinsic voltage gain (A<inf>VO</inf>), cut-off frequency (f<inf>T</inf>) and linearity (VIP<inf>3</inf>) with downscaling.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130208163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Performance investigation of short-channel junctionless multigate transistors 短通道无结多栅极晶体管的性能研究
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5758005
P. Razavi, G. Fagas, I. Ferain, N. Akhavan, R. Yu, J. Colinge
We investigate the performance of short channel junctionless gate-all-around (GAA) transistors, by comparing the I_V characteristics, subthreshold swing and drain-induced barrier lowring (DIBL) of junctionless GAA transistors with accumulation-mode GAA transistors. We also compare the I_V characteristics of junctionless GAA transistors for different wafer and transport orientations. MuGFETs are investigated for different wafer and channel orientation.
通过比较无结GAA晶体管与累积型GAA晶体管的I_V特性、亚阈值摆幅和漏极诱导势垒降低(DIBL),研究了短通道无结GAA晶体管的性能。我们还比较了不同晶圆和输运方向下无结GAA晶体管的I_V特性。研究了不同晶圆取向和沟道取向的mugfet。
{"title":"Performance investigation of short-channel junctionless multigate transistors","authors":"P. Razavi, G. Fagas, I. Ferain, N. Akhavan, R. Yu, J. Colinge","doi":"10.1109/ULIS.2011.5758005","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5758005","url":null,"abstract":"We investigate the performance of short channel junctionless gate-all-around (GAA) transistors, by comparing the I_V characteristics, subthreshold swing and drain-induced barrier lowring (DIBL) of junctionless GAA transistors with accumulation-mode GAA transistors. We also compare the I_V characteristics of junctionless GAA transistors for different wafer and transport orientations. MuGFETs are investigated for different wafer and channel orientation.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129510558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
The effect of the doping concentration on nanoscale field effect diode performance 掺杂浓度对纳米场效应二极管性能的影响
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757992
N. Manavizadeh, F. Raissi, E. Soleimani
The performance of nanoscale Field Effect Diode as a function of doping concentration is investigated. Our numerical results show that the Ion/Ioff ratio which is a significant parameter in digital application can be varied from 101 to 104 as the doping concentration of source/drain regions increased from 1016 to 1021 cm−3. The figures of merit including intrinsic gate delay time and energy-delay product have been studied for the field effect diodes which are interesting candidates for future logic application.
研究了纳米场效应二极管的性能随掺杂浓度的变化规律。数值结果表明,当源极/漏极掺杂浓度从1016 cm−3增加到1021 cm−3时,离子/断流比可以从101变化到104,这是数字应用中的一个重要参数。研究了场效应二极管的本征门延迟时间和能量延迟积等性能指标,为今后的逻辑应用提供了有益的选择。
{"title":"The effect of the doping concentration on nanoscale field effect diode performance","authors":"N. Manavizadeh, F. Raissi, E. Soleimani","doi":"10.1109/ULIS.2011.5757992","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757992","url":null,"abstract":"The performance of nanoscale Field Effect Diode as a function of doping concentration is investigated. Our numerical results show that the I<inf>on</inf>/I<inf>off</inf> ratio which is a significant parameter in digital application can be varied from 10<sup>1</sup> to 10<sup>4</sup> as the doping concentration of source/drain regions increased from 10<sup>16</sup> to 10<sup>21</sup> cm<sup>−3</sup>. The figures of merit including intrinsic gate delay time and energy-delay product have been studied for the field effect diodes which are interesting candidates for future logic application.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"289 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123042824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Open issues for the numerical simulation of silicon solar cells
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757961
R. De Rose, M. Zanuccoli, P. Magnone, E. Sangiorgi, C. Fiegna
The improvement of solar cell efficiency requires device optimization, including the careful design of contacts and doping profiles, and the implementation of light trapping strategies. In this context, electro-optical numerical simulation is essential to analyze the physical mechanisms that limit the cell efficiency and lead to design trade-offs. In this work we discuss the calibration of the relevant physical models for electrical simulation and we put in evidence important limitations of the most common adopted optical simulators.
提高太阳能电池效率需要对器件进行优化,包括仔细设计触点和掺杂轮廓,以及实施光捕获策略。在这种情况下,电光数值模拟对于分析限制电池效率和导致设计权衡的物理机制至关重要。在这项工作中,我们讨论了电气仿真的相关物理模型的校准,并提出了最常用的光学模拟器的重要局限性。
{"title":"Open issues for the numerical simulation of silicon solar cells","authors":"R. De Rose, M. Zanuccoli, P. Magnone, E. Sangiorgi, C. Fiegna","doi":"10.1109/ULIS.2011.5757961","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757961","url":null,"abstract":"The improvement of solar cell efficiency requires device optimization, including the careful design of contacts and doping profiles, and the implementation of light trapping strategies. In this context, electro-optical numerical simulation is essential to analyze the physical mechanisms that limit the cell efficiency and lead to design trade-offs. In this work we discuss the calibration of the relevant physical models for electrical simulation and we put in evidence important limitations of the most common adopted optical simulators.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128451170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Influence of annealing temperature on the performance of graphene / SiC transistors with high-k / metal gate 退火温度对高k /金属栅极石墨烯/ SiC晶体管性能的影响
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757955
M. Clavel, T. Poiroux, M. Mouis, L. Becerra, J. Thomassin, A. Zenasni, G. Lapertot, D. Rouchon, D. Lafond, O. Faynot
In this study, we investigate the impact of thermal annealing on the electrical characteristics of epitaxial graphene field effect transistors. Top gated devices were fabricated from graphene obtained on silicon carbide (SiC) substrate. Thanks to an annealing at 300°C, the performance of the devices was enhanced by a factor of 90. The maximal transconductance reached really high values such as 5900µS/µm at VD=3V, corresponding to a carrier mobility of 2230 cm2/V.s.
在本研究中,我们研究了热退火对外延石墨烯场效应晶体管电特性的影响。在碳化硅(SiC)衬底上制备了石墨烯顶门控器件。由于在300°C下退火,器件的性能提高了90倍。在VD=3V时,最大的跨导达到了5900µS/µm,对应的载流子迁移率为2230 cm2/V.s。
{"title":"Influence of annealing temperature on the performance of graphene / SiC transistors with high-k / metal gate","authors":"M. Clavel, T. Poiroux, M. Mouis, L. Becerra, J. Thomassin, A. Zenasni, G. Lapertot, D. Rouchon, D. Lafond, O. Faynot","doi":"10.1109/ULIS.2011.5757955","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757955","url":null,"abstract":"In this study, we investigate the impact of thermal annealing on the electrical characteristics of epitaxial graphene field effect transistors. Top gated devices were fabricated from graphene obtained on silicon carbide (SiC) substrate. Thanks to an annealing at 300°C, the performance of the devices was enhanced by a factor of 90. The maximal transconductance reached really high values such as 5900µS/µm at VD=3V, corresponding to a carrier mobility of 2230 cm2/V.s.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127766000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A surface potential based compact model for lightly doped FD SOI MOSFETs with ultra-thin body 基于表面电位的超薄体轻掺杂FD SOI mosfet紧凑模型
Pub Date : 2011-03-14 DOI: 10.1109/ULIS.2011.5757972
J. E. Husseini, F. Martinez, M. Bawedin, M. Valenza, R. Ritzenthaler, F. Lime, B. Iñíguez
In this paper, a new surface potential based compact model for long channel fully depleted SOI MOSFET with lightly doped ultra-thin body is presented. The 1-D Poisson equation is solved using the appropriate boundary conditions, and a closed-form surface potential solution is proposed for the front and back surface potentials. Finally the model was compared to numerical simulations and a good agreement is observed.
本文提出了一种基于表面电位的轻掺杂超薄体长沟道全耗尽SOI MOSFET紧凑模型。采用适当的边界条件求解了一维泊松方程,并给出了前后表面电位的封闭解。最后将模型与数值模拟结果进行了比较,两者吻合较好。
{"title":"A surface potential based compact model for lightly doped FD SOI MOSFETs with ultra-thin body","authors":"J. E. Husseini, F. Martinez, M. Bawedin, M. Valenza, R. Ritzenthaler, F. Lime, B. Iñíguez","doi":"10.1109/ULIS.2011.5757972","DOIUrl":"https://doi.org/10.1109/ULIS.2011.5757972","url":null,"abstract":"In this paper, a new surface potential based compact model for long channel fully depleted SOI MOSFET with lightly doped ultra-thin body is presented. The 1-D Poisson equation is solved using the appropriate boundary conditions, and a closed-form surface potential solution is proposed for the front and back surface potentials. Finally the model was compared to numerical simulations and a good agreement is observed.","PeriodicalId":146779,"journal":{"name":"Ulis 2011 Ultimate Integration on Silicon","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132743413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
Ulis 2011 Ultimate Integration on Silicon
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