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2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)最新文献

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The efficient DTCO Compact Modeling Solutions to Improve MHC and Reduce TAT 有效的DTCO紧凑型建模解决方案,以提高MHC和降低TAT
Yohan Kim, U. Monga, Jungmin Lee, Minkyoung Kim, Jaesung Park, C. Yoo, Kyungjin Jung, Sungduk Hong, Sung Jin Kim, D. Kim, Hokyu Kang
This paper introduces the recent modeling challenges of the Process Development Kit (PDK) development due to the limitations of transistor scaling and the impact of new process technologies. And a new modeling solution, Agile PDK is presented to break though these development challenges by enabling the Design Technology Co-Optimization (DTCO) activities in the manufacturing levels. A series of advanced algorithms are newly introduced to not only reduce the PDK development time (TAT), but also improve the model accuracies and Model-to-Hardware Correlation (MHC). It is applied to the latest DRAM technology and dramatically reduces the development TAT up to 50% with improved model accuracies.
本文介绍了由于晶体管缩放的限制和新工艺技术的影响而导致的工艺开发套件(PDK)开发的最新建模挑战。提出了一种新的建模解决方案——敏捷PDK,通过在制造层面实现设计技术协同优化(DTCO)活动来突破这些开发挑战。引入了一系列先进的算法,不仅缩短了PDK开发时间(TAT),而且提高了模型精度和模型-硬件相关性(MHC)。它应用于最新的DRAM技术,并大幅降低开发TAT高达50%,提高了模型精度。
{"title":"The efficient DTCO Compact Modeling Solutions to Improve MHC and Reduce TAT","authors":"Yohan Kim, U. Monga, Jungmin Lee, Minkyoung Kim, Jaesung Park, C. Yoo, Kyungjin Jung, Sungduk Hong, Sung Jin Kim, D. Kim, Hokyu Kang","doi":"10.1109/SISPAD.2018.8551725","DOIUrl":"https://doi.org/10.1109/SISPAD.2018.8551725","url":null,"abstract":"This paper introduces the recent modeling challenges of the Process Development Kit (PDK) development due to the limitations of transistor scaling and the impact of new process technologies. And a new modeling solution, Agile PDK is presented to break though these development challenges by enabling the Design Technology Co-Optimization (DTCO) activities in the manufacturing levels. A series of advanced algorithms are newly introduced to not only reduce the PDK development time (TAT), but also improve the model accuracies and Model-to-Hardware Correlation (MHC). It is applied to the latest DRAM technology and dramatically reduces the development TAT up to 50% with improved model accuracies.","PeriodicalId":170070,"journal":{"name":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132493277","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
MSDRAM, A2RAM and Z2-FET performance benchmark for 1T-DRAM applications 用于1T-DRAM应用的MSDRAM、A2RAM和Z2-FET性能基准
J. Lacord, M. Parihar, C. Navarro, François Tcheme Wakam, M. Bawedin, S. Cristoloveanu, F. Gamiz, J. Barbe
In this study, we propose a benchmark of performance between three promising 1T-DRAM device structures on SOI substrate: MSDRAM, A2RAM and $mathrm{Z}^{2} -$FET. For a fair comparison, TCAD simulation with the same basic calibration and typical 28FDSOI technological parameters was used. The merits and limitations of each variant are discussed.
在这项研究中,我们提出了在SOI衬底上三种有前途的1T-DRAM器件结构之间的性能基准:MSDRAM, A2RAM和$ mathm {Z}^{2} -$FET。为了公平比较,使用具有相同基本校准和典型28FDSOI技术参数的TCAD仿真。讨论了每种变体的优点和局限性。
{"title":"MSDRAM, A2RAM and Z2-FET performance benchmark for 1T-DRAM applications","authors":"J. Lacord, M. Parihar, C. Navarro, François Tcheme Wakam, M. Bawedin, S. Cristoloveanu, F. Gamiz, J. Barbe","doi":"10.1109/SISPAD.2018.8551674","DOIUrl":"https://doi.org/10.1109/SISPAD.2018.8551674","url":null,"abstract":"In this study, we propose a benchmark of performance between three promising 1T-DRAM device structures on SOI substrate: MSDRAM, A2RAM and $mathrm{Z}^{2} -$FET. For a fair comparison, TCAD simulation with the same basic calibration and typical 28FDSOI technological parameters was used. The merits and limitations of each variant are discussed.","PeriodicalId":170070,"journal":{"name":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128627978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Predictive TCAD of Cu2 ZnSnS4(CZTS) Solar Cells Cu2 ZnSnS4(CZTS)太阳能电池的预测TCAD
Sundara Murthy Mopurisetty, M. Bajaj, S. Ganguly
We demonstrate the application of a calibrated simulation deck for Cu2ZnSnS4 (CZTS) solar cells developed by us for predictive device modeling. Specifically, we study the effect of nonidealities - series resistance (RS), carrier lifetime (τ), surface recombination velocity (SRV) - as well as that of novel transparent conductor materials.
我们演示了我们开发的Cu2ZnSnS4 (CZTS)太阳能电池的校准模拟平台的应用,用于预测器件建模。具体来说,我们研究了非理想性-串联电阻(RS),载流子寿命(τ),表面复合速度(SRV) -以及新型透明导体材料的影响。
{"title":"Predictive TCAD of Cu2 ZnSnS4(CZTS) Solar Cells","authors":"Sundara Murthy Mopurisetty, M. Bajaj, S. Ganguly","doi":"10.1109/SISPAD.2018.8551619","DOIUrl":"https://doi.org/10.1109/SISPAD.2018.8551619","url":null,"abstract":"We demonstrate the application of a calibrated simulation deck for Cu2ZnSnS4 (CZTS) solar cells developed by us for predictive device modeling. Specifically, we study the effect of nonidealities - series resistance (RS), carrier lifetime (τ), surface recombination velocity (SRV) - as well as that of novel transparent conductor materials.","PeriodicalId":170070,"journal":{"name":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116787503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Field-free Fast Reliable Deterministic Switching in Perpendicular Spin-Orbit Torque MRAM Cells 垂直自旋-轨道转矩MRAM单元的无场快速可靠确定性切换
A. Makarov, V. Sverdlov, S. Selberherr
We demonstrate that the spin-orbit torques generated by two orthogonal consecutive current pulses enable reliable and deterministic switching of a perpendicularly magnetized free magnetic layer without applying an external magnetic field. The switching current can be reduced by allowing the wire through which the second pulse is delivered to overlap only partly with the free layer. Surprisingly, the partial overlap makes the switching faster and 100% robust.
我们证明了由两个正交的连续电流脉冲产生的自旋轨道转矩可以在不施加外磁场的情况下可靠和确定地切换垂直磁化的自由磁层。通过允许第二脉冲通过的导线仅部分地与自由层重叠,可以减小开关电流。令人惊讶的是,部分重叠使切换更快,并且100%健壮。
{"title":"Field-free Fast Reliable Deterministic Switching in Perpendicular Spin-Orbit Torque MRAM Cells","authors":"A. Makarov, V. Sverdlov, S. Selberherr","doi":"10.1109/SISPAD.2018.8551716","DOIUrl":"https://doi.org/10.1109/SISPAD.2018.8551716","url":null,"abstract":"We demonstrate that the spin-orbit torques generated by two orthogonal consecutive current pulses enable reliable and deterministic switching of a perpendicularly magnetized free magnetic layer without applying an external magnetic field. The switching current can be reduced by allowing the wire through which the second pulse is delivered to overlap only partly with the free layer. Surprisingly, the partial overlap makes the switching faster and 100% robust.","PeriodicalId":170070,"journal":{"name":"2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116805209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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