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2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)最新文献

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Simulation of Hot-Electron Effects with Multi-band Semiconductor Devices 多波段半导体器件热电子效应的模拟
L. P. Tatum, Madeline Sciullo, M. Law
In this work, we present a 2-Valley energy band model of electron transport that delivers more accurate solutions compared with the Farahmand model but with improved convergence and a faster solution time for very high electric fields. This was achieved by implementing the Fermi-Dirac integral distribution as a substitution for the Boltzmann exponential, electron carrier temperature due to heat generation and conduction in the semiconductor lattice, and additional electron concentration modeling for a second conduction energy band minima. The model was primarily tuned by varying the electron temperature relaxation time constant. It was tested using a GaN-based High Electron Mobility Transistor using the Finite-Element Quasi Fermi method.
在这项工作中,我们提出了一个电子传递的2谷能带模型,与Farahmand模型相比,它提供了更准确的解,但在非常高的电场下,收敛性得到了改善,求解时间也更快。这是通过实现费米-狄拉克积分分布作为玻尔兹曼指数的替代,半导体晶格中产生热量和传导的电子载流子温度,以及第二个传导能带最小值的附加电子浓度建模来实现的。该模型主要通过改变电子温度弛豫时间常数来调谐。利用基于氮化镓的高电子迁移率晶体管,采用有限元准费米方法对其进行了测试。
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引用次数: 3
Dynamical space partitioning for acceleration of parallelized lattice kinetic Monte Carlo simulations 并行点阵动力学蒙特卡罗模拟加速的动态空间划分
T. Nishimatsu, A. Payet, Byounghak Lee, Yasuyuki Kayama, Kiyoshi Ishikawa, Alexander Schmidt, I. Jang, Dae Sin Kim
A new dynamical space partitioning method is presented in a parallelized lattice kinetic Monte Carlo (kMC) simulator to overcome the loss of parallel efficiency found in other parallelized kMC simulators. The dynamical partitioning of the simulation cell allows better load balancing through all threads hence reducing time consuming events during the simulation. The new method is evaluated against both hypothetical and real cases. In both cases, minimal differences between serial and parallelized simulations are found. In real cases, other code optimizations may be needed to further improve the parallel efficiency.
针对并行化晶格动力学蒙特卡罗(kMC)模拟器存在的并行效率损失问题,提出了一种新的并行化晶格动力学蒙特卡罗(kMC)模拟器的动态空间划分方法。模拟单元的动态分区允许通过所有线程实现更好的负载平衡,从而减少模拟期间的耗时事件。根据假设和实际情况对新方法进行了评估。在这两种情况下,发现串行和并行模拟之间的差异很小。在实际情况下,可能需要其他代码优化来进一步提高并行效率。
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引用次数: 0
Compact Modelling of Single Event Transient in Bulk MOSFET for SPICE: Application to Elementary Circuit 用于SPICE的块体MOSFET单事件瞬态的紧凑建模:在初级电路中的应用
N. Rostand, S. Martinie, J. Lacord, O. Rozeau, O. Billoint, J. Barbe, T. Poiroux, G. Hubert
Single Event Transients (SET) are important issues concerning reliability of CMOS circuits. They lead to occurrence of soft errors in integrated circuits, such as Single Event Upset (SEU) which consists in unexpected bit state switch in SRAM cells [1], [2]. We can find models which describe SET in literature [1], [5] but they are not compact (i e. physical model implemented in Verilog-A). In previous work [6], we proposed a theoretical SET model but the implementation in Verilog-A was still challenging. Here, we describe the implementation in Verilog-A of this model and use it through standard SPICE simulations to study the effect of SET on SRAM cell and shift register.
单事件瞬变(SET)是影响CMOS电路可靠性的重要问题。它们会导致集成电路中出现软错误,例如SRAM单元中意外的位状态切换(Single Event Upset, SEU)[1],[2]。我们可以在文献[1],[5]中找到描述SET的模型,但它们并不紧凑(即在Verilog-A中实现的物理模型)。在之前的工作[6]中,我们提出了一个理论SET模型,但在Verilog-A中实现仍然具有挑战性。在这里,我们描述了该模型在Verilog-A中的实现,并通过标准SPICE模拟来研究SET对SRAM单元和移位寄存器的影响。
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引用次数: 4
Enhancement of Resonance by the Use of Multiple Tunnel Barriers in Bilayer Graphene-Based Interlayer Tunnel Field Effect Transistors 利用多层石墨烯层间隧道场效应晶体管中的多个隧道势垒增强共振
N. Prasad, S. Banerjee, L. Register
Interlayer tunnel field effect transistors (ITFETs) make use of resonant tunneling between two layers of two-dimensional semiconductors to create a negative differential resistance. A narrow resonance allows for lowering the operating voltages in potential circuit applications. The use of multiple tunnel barriers is investigated as a means to obtain a narrow resonance, as the device dimensions are scaled down. For specificity, we analyze a bilayer graphene-based ITFET system.
层间隧道场效应晶体管(itfet)利用两层二维半导体之间的共振隧道来产生负差分电阻。窄谐振允许在潜在的电路应用中降低工作电压。当器件尺寸缩小时,研究了使用多个隧道势垒作为获得窄共振的手段。具体来说,我们分析了一个基于石墨烯的双层ITFET系统。
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引用次数: 1
Methodology to Generate Approximate Circuits to Reduce Process Induced Degradation in CNFET Based Circuits 在CNFET电路中产生近似电路以减少过程诱导退化的方法
K. Sheikh, Lan Wei
A systematic methodology is presented to generate approximate circuits with fewer nodes and shorter paths to reduce process induced degradation due to imperfect process in emerging technologies such as CNFET. In a 16-bit CNFET adder example, at PCNTopen =5%, two resulted approximate adders achieve 80.5% and 90.2% circuit-level pass rate with a penalty of 3.3% and 24.0% in relative logic error, respectively, in comparison with 12.5% pass rate for the precision counterpart. The study paves the path to practically utilize such technology for error-resilient applications.
在CNFET等新兴技术中,提出了一种系统的方法来生成具有较少节点和较短路径的近似电路,以减少由于过程不完善而引起的过程退化。在一个16位CNFET加法器的例子中,当PCNTopen =5%时,两个近似加法器分别达到80.5%和90.2%的电路级通过率,相对逻辑误差分别为3.3%和24.0%,而精密加法器的通过率为12.5%。该研究为实际利用这种技术进行容错应用铺平了道路。
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引用次数: 0
Intelligent DTCO (iDTCO) for next generation logic path-finding 下一代逻辑寻径的智能DTCO (iDTCO)
U. Kwon, T. Okagaki, Young-seok Song, Sungyeol Kim, Yohan Kim, Minkyoung Kim, A. Kim, Saetbyeol Ahn, Jihye Shin, Yonghee Park, Jongchol Kim, D. Kim, Weiyi Qi, Yang Lu, Nuo Xu, Hong-hyun Park, J. Wang, W. Choi
Intelligent design technology co-optimization (iDTCO) methodology for next generation logic architecture pathfinding and its application results are presented in this paper. There are 2 major steps in our iDTCO framework; standard cell (STC)-level iDTCO and block-level iDTCO. STC-level iDTCO, the main focus of this paper, consists of 4 major components; (1) full 3D process emulation with litho contour of standard cell (STC) layout, (2) auto-extraction of transistor compact model & parasitic RC extraction (PEX) in 3D, (3) performance-power-yield (PPY) analyzer, (4) multi-objective optimization of layout & process assumption (PA) to get best PPY. Applying our STC-level iDTCO flow to logic arch pathfinding, we could speed up our PPY analysis TAT by 5$sim$10 times with good accuracy of >95%.
介绍了下一代逻辑体系结构寻路的智能设计技术协同优化方法及其应用效果。我们的iDTCO框架有两个主要步骤;标准单元(STC)级iDTCO和块级iDTCO。本文主要研究的stc级iDTCO由4个主要组成部分组成;(1)采用标准电池(STC)布局的光刻轮廓进行全三维工艺仿真;(2)晶体管紧凑模型的自动提取与三维寄生RC提取(PEX);(3)性能功率产率(PPY)分析仪;(4)布局与工艺假设(PA)的多目标优化以获得最佳PPY。将我们的stc级iDTCO流应用于逻辑arch寻径,我们可以将我们的PPY分析TAT速度提高5$sim$10倍,准确率>95%。
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引用次数: 0
Investigation of adsorbed small-molecule on boron nitride nanotube (BNNT) based on first-principles calculations 基于第一性原理计算的氮化硼纳米管吸附小分子研究
Nianduan Lu, Wei Wei, X. Chuai, Yuhan Mei, Ling Li, Ming Liu
Based on the first-principles calculations, we have investigated the structure and electronic property of adsorbed small-molecules on boron nitride nanotubes (BNNTs). It is found thatthe sites of LUMO and HOMO would be changed after BNNTs absorbed the different small moleculesThe energy gap of BNNTs decreases with increasing the distance between small molecule and BNNTThe adsorption effect of BNNT will be optimal as the distance between the small molecule and BNNT is from 1 to 1.5 Å. The potential application of BNNT as highly sensitive gas sensor for N-based small molecules has also been discussed.
基于第一性原理计算,我们研究了氮化硼纳米管(BNNTs)上吸附小分子的结构和电子性质。研究发现,BNNT吸附不同小分子后,LUMO和HOMO的位置会发生变化,BNNT的能隙随着小分子与BNNT之间距离的增加而减小,当BNNT与小分子之间距离为1 ~ 1.5 Å时,BNNT的吸附效果最佳。本文还讨论了BNNT作为n基小分子高灵敏度气体传感器的潜在应用。
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引用次数: 3
Negative-Capacitance FinFETs: Numerical Simulation, Compact Modeling and Circuit Evaluation 负电容finfet:数值模拟,紧凑建模和电路评估
J. Duarte, Y.-K. Lin, Y. Liao, A. Sachid, M. Kao, H. Agarwal, P. Kushwaha, K. Chatterjee, D. Kwon, H.-L. Chang, S. Salahuddin, C. Hu
A complete simulation framework is presented for Negative Capacitance FinFETs including Numerical Simulation, Compact Modeling, and Circuit Evaluation. A 2D Numerical Simulation for FinFETs coupled with the Landau’s Ferroelectric Model captures device characteristics. A new version of the distributed Negative-Capacitance FinFET Compact Model is also presented in this work, where influence of short-channel effects in Ferroelectric voltage amplification are newly incorporated. Finally, a detailed analysis, from an energy perspective, is presented for the gate voltage amplification of Negative Capacitance FinFETs in ring-oscillator circuits.
提出了一个完整的负电容finfet仿真框架,包括数值仿真、紧凑建模和电路评估。结合朗道铁电模型的finfet二维数值模拟捕获了器件特性。本文还提出了一个新版本的分布式负电容FinFET紧凑模型,其中新纳入了铁电电压放大中的短通道效应的影响。最后,从能量的角度详细分析了环振电路中负电容finfet的栅极电压放大。
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引用次数: 9
Impact of Strain on S/D tunneling in FinFETs: a MS-EMC study 应变对FinFETs /D隧穿的影响:MS-EMC研究
C. Medina-Bailón, C. Sampedro, J. Padilla, A. Godoy, L. Donetti, V. Georgiev, F. Gámiz, A. Asenov
As device dimensions are scaled down, the use of strained channels as performance booster becomes of special relevance. Moreover, the inclusion of quantum effects in the transport direction is imperative to predict the performance of future transistors. In particular, Source-to-Drain tunneling (S/D tunneling) is presented as a scaling limit in sub-10nm nodes. In this work, a Multi-Subband Ensemble Monte Carlo (MS-EMC) study of the impact of S/D tunneling in relaxed and biaxially strained channel FinFETs is presented.
随着设备尺寸的缩小,使用应变通道作为性能增强器变得特别重要。此外,在输运方向上包含量子效应对于预测未来晶体管的性能是必要的。特别地,源-漏隧道(S/D隧道)在10nm以下的节点中作为缩放限制被提出。在这项工作中,多子带集成蒙特卡罗(MS-EMC)研究了松弛和双轴应变通道finfet中S/D隧穿的影响。
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引用次数: 1
Evidence of fast and low-voltage A2RAM ‘1’ state programming 快速和低电压A2RAM ' 1 '状态编程的证据
F. T. Wakam, J. Lacord, M. Bawedin, S. Martinie, S. Cristoloveanu, J. Barbe
For the first time, we demonstrate a new concept for programming the ‘1’ state in A2RAM based on the impact ionization in the bridge, which can be assisted by the band-to-band tunneling effect in the top part of the silicon film. This new programming method reduces the programming voltage and writing time, making the A2RAM suitable as 1T-DRAM. Evidenced through TCAD simulation, the feasibility in matrix environment is also demonstrated.
我们首次展示了一种基于电桥中的冲击电离在A2RAM中编程“1”态的新概念,这可以通过硅膜顶部的带对带隧道效应来辅助。这种新的编程方法降低了编程电压和写入时间,使A2RAM适用于1T-DRAM。通过TCAD仿真验证了该方法在矩阵环境下的可行性。
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引用次数: 2
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2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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