Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967608
J. Morsey, A. Cangellaris
A methodology is presented for synthesis of passive, broadband equivalent circuits for interconnect multi-ports from measured scattering-parameter data. In addition to the mathematical details of the synthesis process, results from its application to the synthesis of equivalent circuits for multi-GHz bandwidth connectors are used to demonstrate the validity and accuracy of the proposed methodology.
{"title":"PRIME: passive realization of interconnect models from measured data","authors":"J. Morsey, A. Cangellaris","doi":"10.1109/EPEP.2001.967608","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967608","url":null,"abstract":"A methodology is presented for synthesis of passive, broadband equivalent circuits for interconnect multi-ports from measured scattering-parameter data. In addition to the mathematical details of the synthesis process, results from its application to the synthesis of equivalent circuits for multi-GHz bandwidth connectors are used to demonstrate the validity and accuracy of the proposed methodology.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"283 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122690278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967634
S. Chakravorty, S. Min, M. Swaminathan
A study is made of the relative advantages and disadvantages of using power series and Chebyshev polynomials to obtain a rational function representation of the data. This rational function must satisfy both the stability and passivity criteria. The procedures used for obtaining the rational function representation using both Chebyshev polynomials and power series is outlined in the paper. Three test cases have been used to compare the relative performance of the power series and Chebyshev polynomials.
{"title":"Comparison between Chebyshev and power series expansion functions for interpolating data","authors":"S. Chakravorty, S. Min, M. Swaminathan","doi":"10.1109/EPEP.2001.967634","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967634","url":null,"abstract":"A study is made of the relative advantages and disadvantages of using power series and Chebyshev polynomials to obtain a rational function representation of the data. This rational function must satisfy both the stability and passivity criteria. The procedures used for obtaining the rational function representation using both Chebyshev polynomials and power series is outlined in the paper. Three test cases have been used to compare the relative performance of the power series and Chebyshev polynomials.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131105660","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967647
Joong-Ho Kim, M. Swaminathan
This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed.
{"title":"Analysis of multi-layered irregular power distribution planes with vias using transmission matrix method","authors":"Joong-Ho Kim, M. Swaminathan","doi":"10.1109/EPEP.2001.967647","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967647","url":null,"abstract":"This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131307428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967673
M. Yamaguchi, H. Kikuchi, S. Sugimoto, K. Arai, M. Iwanami, A. Nakamura, S. Hoshino
The high frequency carrier type thin-film magnetic field sensor was applied to detect magnetic field over the microstrip line on a PCB. The 100 /spl mu/m long, 5 /spl mu/m wide and 1 /spl mu/m thick CoNbZr thin-film probe could distinguish a meander line with a line pitch of 200 /spl mu/m. Maximum possible signal frequency range was estimated as over 1 GHz.
{"title":"High sensitivity magnetic near field probe based on ferromagnetic thin-film technology","authors":"M. Yamaguchi, H. Kikuchi, S. Sugimoto, K. Arai, M. Iwanami, A. Nakamura, S. Hoshino","doi":"10.1109/EPEP.2001.967673","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967673","url":null,"abstract":"The high frequency carrier type thin-film magnetic field sensor was applied to detect magnetic field over the microstrip line on a PCB. The 100 /spl mu/m long, 5 /spl mu/m wide and 1 /spl mu/m thick CoNbZr thin-film probe could distinguish a meander line with a line pitch of 200 /spl mu/m. Maximum possible signal frequency range was estimated as over 1 GHz.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128156920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967621
K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, R. Tummala
The integration of an antenna with an RF module is an attractive solution for realizing a small size and low cost wireless transceiver. Multi-layer planar antennas for system-on-a-package (SOP) application are presented. Two different types of antennas for the low temperature co-fired ceramic (LTCC) package and the multi-layer organic (MLO) package are developed. For the LTCC package, the cavity-backed patch antenna has been developed, in order to increase bandwidth and to reduce the size of the ground plane. A via feed is used for direct connection with other RF blocks. For the cavity backed patch antenna, bandwidth is increased by 20% and real estate including ground plane is reduced by 50%, compared to the conventional patch antenna. For the MLO package, a lifted slot antenna has been developed. In order to reduce loss at feeding point and to minimize pattern distortion, via feed has been used. The antenna has been designed at 5.8 GHz and has gain of 3.7 dBi and bandwidth of 14%.
{"title":"Development of planar antennas in multi-layer packages for RF-system-on-a-package applications","authors":"K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, R. Tummala","doi":"10.1109/EPEP.2001.967621","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967621","url":null,"abstract":"The integration of an antenna with an RF module is an attractive solution for realizing a small size and low cost wireless transceiver. Multi-layer planar antennas for system-on-a-package (SOP) application are presented. Two different types of antennas for the low temperature co-fired ceramic (LTCC) package and the multi-layer organic (MLO) package are developed. For the LTCC package, the cavity-backed patch antenna has been developed, in order to increase bandwidth and to reduce the size of the ground plane. A via feed is used for direct connection with other RF blocks. For the cavity backed patch antenna, bandwidth is increased by 20% and real estate including ground plane is reduced by 50%, compared to the conventional patch antenna. For the MLO package, a lifted slot antenna has been developed. In order to reduce loss at feeding point and to minimize pattern distortion, via feed has been used. The antenna has been designed at 5.8 GHz and has gain of 3.7 dBi and bandwidth of 14%.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129473516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967610
J. Stamm, T. Sarkar, B. Kolundžija, M. Salazar-Palma
In packaging systems it is necessary to compute radiation from printed circuits. Analysis of radiation from printed circuits is quite difficult because the codes that are generally used for far fast efficient calculation of transients on these systems due to different loads are often not capable of analyzing radiation. On the other hand, dynamic solutions that calculate radiation from printed circuits often require large computational resources as it needs to calculate the electric fields from structures that are very closely spaced and thus require significant computational accuracy. What we show is that using entire domain basis one can provide accurate dynamic solutions for transmission like structures. Because in this expansion one uses an entire domain basis, the charge along the structure is continuous and therefore provides accurate values of the near fields. Typically in using an entire domain basis one can reduce the size of the matrix on large structures typically by a factor of ten. Hence large packaging problems can be solved using modest computational resources quite efficiently. Numerical results are presented to illustrate these principles.
{"title":"Analysis of transmission line structures using a dynamic analysis through WIPL-D","authors":"J. Stamm, T. Sarkar, B. Kolundžija, M. Salazar-Palma","doi":"10.1109/EPEP.2001.967610","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967610","url":null,"abstract":"In packaging systems it is necessary to compute radiation from printed circuits. Analysis of radiation from printed circuits is quite difficult because the codes that are generally used for far fast efficient calculation of transients on these systems due to different loads are often not capable of analyzing radiation. On the other hand, dynamic solutions that calculate radiation from printed circuits often require large computational resources as it needs to calculate the electric fields from structures that are very closely spaced and thus require significant computational accuracy. What we show is that using entire domain basis one can provide accurate dynamic solutions for transmission like structures. Because in this expansion one uses an entire domain basis, the charge along the structure is continuous and therefore provides accurate values of the near fields. Typically in using an entire domain basis one can reduce the size of the matrix on large structures typically by a factor of ten. Hence large packaging problems can be solved using modest computational resources quite efficiently. Numerical results are presented to illustrate these principles.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129604670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967631
Ling Yang, Ching-Chao Huang, J. Feng
This paper shows a generalized optimizer that interacts with an external circuit simulator to extract frequency-dependent lossy coupled transmission line models from TDR or VNA measurements. The optimizer's architectural flow, and such concepts as global and local iterations, weighting function, time-windowing and piecewise-linear source models are mentioned. Several examples, including a complex BGA package model, are used to demonstrate its effectiveness in extracting model parameters and correlating waveforms.
{"title":"Model extraction and waveform correlation via a generalized frequency- and time-domain optimizer","authors":"Ling Yang, Ching-Chao Huang, J. Feng","doi":"10.1109/EPEP.2001.967631","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967631","url":null,"abstract":"This paper shows a generalized optimizer that interacts with an external circuit simulator to extract frequency-dependent lossy coupled transmission line models from TDR or VNA measurements. The optimizer's architectural flow, and such concepts as global and local iterations, weighting function, time-windowing and piecewise-linear source models are mentioned. Several examples, including a complex BGA package model, are used to demonstrate its effectiveness in extracting model parameters and correlating waveforms.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"67 30","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114005506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967616
M. Tsuk
For many years, partial inductances have been used in circuit models for signal integrity. However, the author's experience has indicated that partial inductances have more drawbacks than benefits for such work. This paper describes these drawbacks, and proposes a different method of including inductive effects in signal integrity modeling, based on loop inductances. A discussion of the theory and an example are given.
{"title":"The use of loop inductances in signal integrity modeling","authors":"M. Tsuk","doi":"10.1109/EPEP.2001.967616","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967616","url":null,"abstract":"For many years, partial inductances have been used in circuit models for signal integrity. However, the author's experience has indicated that partial inductances have more drawbacks than benefits for such work. This paper describes these drawbacks, and proposes a different method of including inductive effects in signal integrity modeling, based on loop inductances. A discussion of the theory and an example are given.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122042383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967632
Heeseok Lee, Hyungsoo Kim, Jingook Kim, Y. Jeong, Joungho Kim
We rigorously present a time-domain simulation method for the prediction of the simultaneous switching noise (SSN) in high-speed digital systems, using power/ground plane modeling of an arbitrarily shaped board or package.
{"title":"Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane","authors":"Heeseok Lee, Hyungsoo Kim, Jingook Kim, Y. Jeong, Joungho Kim","doi":"10.1109/EPEP.2001.967632","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967632","url":null,"abstract":"We rigorously present a time-domain simulation method for the prediction of the simultaneous switching noise (SSN) in high-speed digital systems, using power/ground plane modeling of an arbitrarily shaped board or package.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115281981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-29DOI: 10.1109/EPEP.2001.967613
Shih-Yen Lee, Y. Yeo, M. Yeo, M. Iyer, N. Do, Wui-Weng Wong
A 2-layered power plane modelling methodology based on transmission lines (TL) is used to model a commercial microprocessor package up to 10 GHz. Subsequently, a 3-layered power plane model is proposed. This model was further modified to model 3-layered power distribution planes with vias. Comparisons with the measurements showed that the modified model was able to offer accurate simulation results up to 10 GHz.
{"title":"Modelling of multi-layered power supply planes with vias","authors":"Shih-Yen Lee, Y. Yeo, M. Yeo, M. Iyer, N. Do, Wui-Weng Wong","doi":"10.1109/EPEP.2001.967613","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967613","url":null,"abstract":"A 2-layered power plane modelling methodology based on transmission lines (TL) is used to model a commercial microprocessor package up to 10 GHz. Subsequently, a 3-layered power plane model is proposed. This model was further modified to model 3-layered power distribution planes with vias. Comparisons with the measurements showed that the modified model was able to offer accurate simulation results up to 10 GHz.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130817857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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