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1993 (5th) International Conference on Indium Phosphide and Related Materials最新文献

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Etching of low loss mirrors for photonic ICs 光子集成电路低损耗反射镜的蚀刻
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380568
S. Ojha, S. Clements
The requirements for etching low loss mirrors and the dry etching techniques used for realizing these mirrors in photonic devices are reviewed. The effect of carbon dioxide and nitrous oxide additions to CH/sub 4//H/sub 2/ on the etch characteristics of double heterostructure layers is discussed. Vertical mirror profiles were obtained by using a CO/sub 2/ based etch process. Parabolic mirror elements having 1.2 dB loss were etched in an integrated InGaAsP/InP demultiplexer by using a CH/sub 4//H/sub 2//CO/sub 2/ reactive ion etching process. Loading effects were found to be dominant in methane/hydrogen based processes and were found to affect verticality of the quaternary layers.<>
综述了在光子器件中蚀刻低损耗反射镜的要求和用于实现这些反射镜的干式蚀刻技术。讨论了CH/sub - 4/ H/sub - 2/中添加二氧化碳和氧化亚氮对双异质结构层蚀刻特性的影响。采用CO/ sub2 /基蚀刻工艺获得了垂直镜面轮廓。采用CH/sub 4//H/sub 2//CO/sub 2/反应离子刻蚀工艺,在集成InGaAsP/InP解复用器中刻蚀了损耗为1.2 dB的抛物面镜元件。加载效应在甲烷/氢基过程中占主导地位,并影响第四系地层的垂直度。
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引用次数: 2
Selective MOVPE growth and its applications to optical devices 选择性MOVPE生长及其在光学器件中的应用
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380714
T. Sasaki, M. Kitamura, I. Mito
Selective metalorganic vapor phase epitaxial growth of InGaAsP/InP structures on mask-patterned planar InP substrates was studied. Ridge structures with widths around 2 /spl mu/m were selectively formed on open stripe regions between pairs of mask stripes. For such narrow regions, not only lateral gas phase diffusion but also surface migration contribute to enhanced growth rate compared to growth on unmasked wafers. The surface migration processes of metalorganic species were investigated to obtain flat top surfaces in the ridge structures. Selectively grown InGaAs/InGaAsP MQW structures with flat interfaces were obtained. Composition shifts in selectively grown InGaAs layers provided an additional bandgap energy shift in thickness-modulated InGaAs quantum wells. A shift as large as 200 nm in the photoluminescence peak wavelength was obtained for simultaneously grown multiple quantum well ridge structures while maintaining flat interfaces.<>
研究了InGaAsP/InP结构在掩模平面InP衬底上的选择性金属有机气相外延生长。在掩膜条纹对之间的开放条纹区选择性地形成宽度约为2 /spl mu/m的脊状结构。在这种狭窄的区域中,除了横向气相扩散外,表面迁移也有助于提高晶圆的生长速度。研究了金属有机物质的表面迁移过程,以获得脊状结构中的平顶表面。获得了具有平面接口的选择性生长InGaAs/InGaAsP MQW结构。选择性生长的InGaAs层中的成分位移在厚度调制的InGaAs量子阱中提供了额外的带隙能量位移。在保持平面界面的情况下,同时生长的多量子阱脊结构的光致发光峰值波长偏移达200 nm
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引用次数: 0
InP-based quantum wells for electro-optic waveguide circuits 电光波导电路中基于inp的量子阱
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380607
J. Zucker
The author discusses some of the device issues that arise when InP-based quantum wells (QWs) are incorporated in guided-wave photonic integrated circuits (PICs). By operating at wavelengths close to the bandgap, enhanced electrooptic effects allow QW waveguide switches and modulators to have sizes that are significantly smaller than those in bulk semiconductors. Compactness is an advantage for monolithic integration with other components, for high-speed operation, and for lowering the unit cost by increasing the number of devices per wafer. However for QW devices to be useful in real optical systems, the negative implications of using near-bandedge phenomena must be confronted. These may include high propagation loss, limited optical bandwidth, and polarization-dependence. For manufacture of QW PICs the number of processing steps and their complexity must be reduced. These issues were examined and it was found that some can be successfully addressed through materials science and bandgap engineering.<>
作者讨论了在导波光子集成电路(PICs)中引入基于inp的量子阱(qw)时出现的一些器件问题。通过在接近带隙的波长下工作,增强的电光效应使QW波导开关和调制器的尺寸比体半导体中的开关和调制器小得多。对于与其他组件的单片集成,高速运行以及通过增加每个晶圆的器件数量来降低单位成本,紧凑性是一个优势。然而,为了使量子波器件在实际光学系统中发挥作用,必须面对使用近带现象的负面影响。这些可能包括高传播损耗,有限的光带宽,和偏振依赖性。为了制造量子阱光子晶体,必须降低加工步骤的数量和复杂性。对这些问题进行了研究,发现其中一些可以通过材料科学和带隙工程成功地解决
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引用次数: 0
Flat FM response without thermal dip for an optimized two section phase tunable DFB laser 优化后的两段相位可调谐DFB激光器无热倾角的平坦调频响应
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380571
J. Jacquet, J. Provost, M. Sotom, O. Gautheron, F. Poingt, O. Le Gouezigou, D. Leclerc, C. Labourie, J. Benoit
The authors point out both theoretically and experimentally that photon distribution in two-active section lasers can greatly influence the FM response of such devices. Optical communication systems based on frequency shift keying (FSK) require laser sources featuring high FM efficiency for low spurious amplitude modulation, high bandwidth for high bit rate operation and flat FM response to avoid any degradation induced by long transmitted data sequences. These requirements are not fully met by standard distributed feedback (DFB) lasers, mainly because thermal effects induce a dip with phase inversion in the FM response at a relatively low frequency. To overcome this problem, a new two-segment DFB structure is proposed emitting at 1.5 /spl mu/m with high FM sensitivity and flat FM response up to 1 GHz. The design of this structure relies on the optimum use of the effect of the inhomogeneous photon distribution along the cavity.<>
从理论上和实验上指出,双有源截面激光器的光子分布对器件的调频响应有很大的影响。基于频移键控(FSK)的光通信系统要求激光源具有高调频效率以实现低杂散调幅,高带宽以实现高比特率操作,平坦调频响应以避免长时间传输数据序列引起的衰减。标准的分布式反馈(DFB)激光器不能完全满足这些要求,主要是因为在相对较低的频率下,热效应会导致调频响应的相位反转。为了克服这个问题,提出了一种新的两段DFB结构,发射频率为1.5 /spl mu/m,具有高调频灵敏度和高达1 GHz的平坦调频响应。这种结构的设计依赖于对沿腔不均匀光子分布效应的最佳利用。
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引用次数: 1
Determination of the refractive indices and interfaces of In/sub 0.53/Al/sub 0.16/Ga/sub 0.31/As and In/sub 0.53/Al/sub 0.21/ layers on InP in the wavelength range from 280 to 1900 nm In/sub 0.53/Al/sub 0.16/Ga/sub 0.31/As和In/sub 0.53/Al/sub 0.21/层在InP上280 ~ 1900 nm波长范围内折射率和界面的测定
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380555
H. Dinges, H. Burkhard, R. Losch, H. Nickel, W. Schlapp
The refractive indices of In/sub 0.53/Al/sub 0.16/Ga/sub 0.31/As and In/sub 0.53/Al/sub 0.21/Ga/sub 0.26/As/InP were measured for the first time in the wavelength range from 280 to 1900 nm by spectroscopic ellipsometry. The results on InP and GaAs are in good agreement with the measurements in the literature. The interface layer due to the exchange of phosphorus and arsenic atoms during the desorption procedure of the molecular beam epitaxy growth exists and was also found by high resolution X-ray diffraction.<>
在280 ~ 1900 nm波长范围内,利用椭圆偏振光谱首次测量了In/sub 0.53/Al/sub 0.16/Ga/sub 0.31/As和In/sub 0.53/Al/sub 0.21/Ga/sub 0.26/As/InP的折射率。对InP和GaAs的测量结果与文献中的测量结果一致。在分子束外延生长的解吸过程中,由于磷和砷原子的交换而形成的界面层也存在,并通过高分辨率x射线衍射发现
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引用次数: 0
DC characteristics of In/sub 0.52/Al/sub 0.48/As/ In/sub 0.53/(Al/sub x/Ga/sub 1-x/)/sub 0.47/As NPN double heterojunction bipolar transistors In/sub 0.52/Al/sub 0.48/As/ In/sub 0.53/(Al/sub x/Ga/sub 1-x/)/sub 0.47/As NPN双异质结双极晶体管的直流特性
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380589
C. Huang, Tsuen-Lin Lee, H. Lin
Wide band gap materials, InAlAs and InAlGaAs, were used in the collector of double heterojunction bipolar transistors (DHBTs). Base-collector designs and their effects on the DC characteristics of the DHBTs were investigated. It is found that in the InAlAs/InGaAs/InAlAs DHBT, the unusual large conduction band discontinuity results in a two-dimensional electron gas (2DEG) stored in base-collector abrupt junction. This 2DEG will push the heterojunction spike up and cause a reach-through effect with a InGaAs space layer inserted between the base-collector junction. Junction grading seems to be the only method to remove the effect. For the InAlAs/InGaAs/InAlGaAs DHBT, the smaller the conduction band discontinuity, the less significant is the 2DEG effect. When the discontinuity is smaller than 0.27 eV, the knee-shape and reach-through characteristics disappear.<>
采用宽禁带材料InAlAs和InAlGaAs作为双异质结双极晶体管集电极。研究了基极集电极设计及其对dhbt直流特性的影响。发现在InAlAs/InGaAs/InAlAs DHBT中,不寻常的大导带不连续导致二维电子气体(2DEG)储存在碱-集电极突变结中。这种2DEG将推动异质结尖峰上升,并在基极-集电极结之间插入InGaAs空间层,从而产生通达效应。接合处分级似乎是消除这种影响的唯一方法。对于InAlAs/InGaAs/InAlGaAs DHBT,导带不连续越小,2DEG效应越不显著。当不连续性小于0.27 eV时,膝状和通达特性消失
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引用次数: 0
Residual impurities in high purity InP grown by chemical beam epitaxy 化学束外延生长高纯InP中的残留杂质
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380694
T. S. Rao, C. Lacelle, S. Rolfe, L. Allard, S. Charbonneau, A. P. Roth, T. Steiner, M. Thewalt
In the past few years, chemical beam epitaxy (CBE) has succeeded in producing high purity InP with residual carrier concentrations in the low 10/sup 14/ cm/sup -3/ range and liquid nitrogen temperature mobilities much higher than 10/sup 5/ cm/sup 2//Vs. The authors present the results of a study where they have combined electrical, chemical, and optical measurements to identify the residual impurities in InP layers grown with different growth parameters. It is shown that S and Si are the two major residual donor impurities in InP layers grown by CBE and that they originate from the gas sources. Arsenic contamination of InP layers is a common problem in gas source systems, particularly when a single cracker cell is used for both As and P sources. However this contamination can be greatly reduced with a thorough baking prior to InP growth. The concentration of acceptors is negligible and too low to allow the identification of the residual acceptor impurities. Under optimized growth conditions, InP layers with residual carrier concentrations less than 10/sup 14/ cm/sup -3/ can be routinely grown with 77 K mobilities larger than 2 /spl times/ 10/sup 5/ cm/sup 2//Vs.<>
在过去的几年里,化学束外延(CBE)已经成功地生产出了高纯度的InP,其残余载体浓度在10/sup 14/ cm/sup -3/范围内,液氮温度迁移率远高于10/sup 5/ cm/sup 2//Vs。作者介绍了一项研究的结果,他们将电学、化学和光学测量相结合,以确定在不同生长参数下生长的InP层中的残留杂质。结果表明,在CBE生长的InP层中,S和Si是两种主要的残余供体杂质,它们来源于气源。砷污染的InP层是一个常见的问题,在气源系统,特别是当一个裂化装置同时用于砷和磷源。然而,在InP生长之前进行彻底的烘烤可以大大减少这种污染。受体的浓度可以忽略不计,并且太低,无法识别残留的受体杂质。在优化的生长条件下,剩余载流子浓度小于10/sup 14/ cm/sup -3/ /的InP层可以正常生长,77k迁移率大于2/ spl倍/ 10/sup 5/ cm/sup 2//Vs.>
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引用次数: 0
Highly selective etching of InGaAs on InAlAs in HBr plasma HBr等离子体中InGaAs在InAlAs上的高选择性蚀刻
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380567
I. Adesida, S. Agarwala, C. Caneau, R. Bhat
A selective reactive ion etching (SRIE) process for the etching of InGaAs on InAlAs in HBr plasmas has been developed. A selectivity value as high as 160 was achieved at a bias voltage of -100 V. To date, this is the highest selectivity ever reported for this material system. The etch-stop mechanism is inferred from Auger electron spectroscopy to be due the formation of involatile aluminum oxide. The SRIE process reported should be for the fabrication of InAlAs/InGaAs/InP heterostructure field effect transistors (HFETs).<>
提出了一种选择性反应离子刻蚀(SRIE)工艺,用于在HBr等离子体中刻蚀InGaAs。在-100 V的偏置电压下,选择性值高达160。迄今为止,这是该材料系统报道的最高选择性。从俄歇电子能谱推断,腐蚀停止机制是由于形成的渐开式氧化铝。报道的SRIE工艺应该用于制造InAlAs/InGaAs/InP异质结构场效应晶体管(hfet)。
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引用次数: 3
Time-resolved photoluminescence studies on transferred thin film InP epilayers 转移InP薄膜脱膜的时间分辨光致发光研究
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380614
G. Augustine, B. Keyes, N. Jokerst, A. Rohatgi, R. Ahrenkiel
Time-resolved photoluminescence data are reported on InP thin films transferred on glass substrates. The films were kept below 1.1 /spl mu/m in thickness to reduce the photon recycling effect. The data were taken by means of the time-correlated single photon counting technique. The thin films were grown by the liquid phase epitaxial process. The lower doped n-type samples showed evidence of Shockley-Read-Hall recombination. For higher electron densities, the lifetime is found to be controlled by the radiative recombination process. An estimate of the radiative recombination coefficient, B, was made in terms of the photon recycling factor.<>
报道了在玻璃衬底上转移的InP薄膜的时间分辨光致发光数据。薄膜厚度保持在1.1 /spl mu/m以下,以减小光子的循环效应。数据采用时间相关单光子计数技术。采用液相外延法制备薄膜。低掺杂的n型样品显示出Shockley-Read-Hall复合的证据。对于较高的电子密度,发现寿命受辐射复合过程的控制。用光子再循环系数估计了辐射复合系数B。
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引用次数: 3
Design of high quality thermally diffused p/sup +/n and n/sup +/p InP structures with the help of electrochemical studies 借助电化学研究设计高质量的热扩散p/sup +/n和n/sup +/p InP结构
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380620
M. Faur, M. Ghalla-Goradia, C. Vargas-Aburto
The authors report on the use of electrochemical (EC) techniques for characterization and step-by-step optimization of n/sup +/p and p/sup +/n InP structures fabricated by thermal diffusion, for making high efficiency radiation resistant InP solar cells. The emitter layer and the junction proximity of the base are characterized as functions of: (a) various surface preparation procedures; (b) diffusion cap; (c) diffusion source; and (d) diffusion conditions consisting of diffusion temperature and time, amount of source material and added phosphorus, and temperature difference between the source and substrates. The EC characterization of the emitter layer provides: (a) thickness of front damaged layers; (b) density of surface and deep dislocations, and precipitates; (c) net majority carrier concentration depth profiles; and (d) surface and deep trap levels. The EC characterization was done both before and after irradiating the structure with high energy electrons and protons.<>
作者报告了利用电化学(EC)技术对热扩散制备的n/sup +/p和p/sup +/n InP结构进行表征和逐步优化,以制备高效耐辐射的InP太阳能电池。发射极层和基极的结邻近度的特征为:(a)各种表面制备程序的函数;(b)扩散帽;(c)扩散源;(d)扩散条件,包括扩散温度和时间、源物质和磷添加量、源与底物温差。发射层的EC表征提供:(a)前损伤层的厚度;(b)表面和深层位错和沉淀的密度;(c)净多数载流子浓度深度分布;(d)表层和深层圈闭水平。在高能电子和质子辐照前后对结构进行了EC表征。
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引用次数: 0
期刊
1993 (5th) International Conference on Indium Phosphide and Related Materials
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