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1993 (5th) International Conference on Indium Phosphide and Related Materials最新文献

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Experiment-based projected high efficiency thermally diffused p/sup +/n (Cd,S) InP solar cells for space applications 基于实验的空间应用高效热扩散p/sup +/n (Cd,S) InP太阳能电池
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380671
M. Faur, M. Faur, D. Flood, D. Brinker, C. Goradia, M. Goradia, I. Weinberg, N. Fatemi
By drastically reducing the defect densities of p/sup +/n (Cd,S) InP diffused structures the authors have succeeded in fabricating p/sup +/n InP solar cells with measured AM0, 25/spl deg/C V/sub /spl prop// values exceeding 880 mV, without anti-reflection (AR) coating. Experiment-based projected maximum achievable AM0, 25/spl deg/C efficiency of these cells is 21.3%. Preliminary investigation of the performance parameters of p/sup +/n (Cd,S) InP structures and solar cells after irradiation with 10/sup 13/ cm/sup -2/ 3MeV protons indicate higher radiation tolerance of this configuration as compared to n/sup +/p InP configuration due to its better annealing properties.<>
通过大幅降低p/sup +/n (Cd,S) InP扩散结构的缺陷密度,作者成功地制造了p/sup +/n InP太阳能电池,其测量的AM0、25/spl度/C V/sub /spl prop//值超过880 mV,且没有增透(AR)涂层。基于实验的预测,这些电池可实现的最大am0.25 /spl度/C效率为21.3%。对10/sup + 13/ cm/sup -2/ 3MeV质子辐照后p/sup +/n (Cd,S) InP结构和太阳能电池性能参数的初步研究表明,由于其更好的退火性能,与n/sup +/p InP结构相比,该结构具有更高的辐射耐受性。
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引用次数: 2
Monolithic fabrication of NPN and PNP AlInAs/GaInAs HBTs NPN和PNP AlInAs/GaInAs HBTs的单片制备
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380557
W. Stanchina, R. Metzger, M. W. Pierce, J. Jensen, L. McCray, R. Wong-Quen, F. Williams
The authors demonstrated the feasibility of a new technique for the monolithic fabrication of complementary heterostructure bipolar transistors (HBTs). The process led to coplanar npn and pnp HBTs, the first in the AlInAs/GaInAs material system, which were comparable with the state of the art in HBTs. These devices exhibited unity current gain cutoff frequencies (f/sub T/) up to 99 GHz and 14 GHz for the npn and pnp transistors, respectively. The fabrication scheme allows each of these device types to have individually designed epitaxial structures that are grown in a single molecular beam epitaxy run. Results show that the devices will be capable of tight packing densities for IC applications.<>
作者论证了一种单片制备互补异质结构双极晶体管(hbt)的新技术的可行性。该工艺导致共面npn和pnp HBTs,这是AlInAs/GaInAs材料系统中的第一个,可与最先进的HBTs相媲美。这些器件的npn和pnp晶体管的单位电流增益截止频率(f/sub T/)分别高达99 GHz和14 GHz。制造方案允许这些器件类型中的每一种具有单独设计的外延结构,这些外延结构在单个分子束外延运行中生长。结果表明,该器件能够满足集成电路应用的紧凑封装密度
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引用次数: 13
Hole capture cross section of the deep Ti donor level in InP InP中深部Ti供体能级的空穴捕获截面
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380700
H. Scheffler, N. Baber, A. Dadgar, T. Wolf, D. Bimberg
The hole capture cross section /spl sigma//sub p/ of the deep Ti/sup 3+//Ti/sup 4+/ donor level in InP has been measured as a function of temperature. Two different capacitance spectroscopy techniques have been used, namely deep level transient spectroscopy and an isothermal capacitance measurement method for capture measurements at high and low temperatures, respectively. /spl sigma//sub p/ has been found to increase with temperature from 2.8 /spl times/ 10/sup -23/ cm/sup 2/ at 100 K to 2.7 /spl times/ 10/sup -22/ at 300 K, in agreement with a multiphonon emission process. The capture barrier for hole capture amounts to (30/spl plusmn/5) meV.<>
测量了InP中深Ti/sup 3+//Ti/sup 4+/供体能级的孔捕获截面/spl sigma//sub p/作为温度的函数。两种不同的电容光谱技术,即深能级瞬态光谱和等温电容测量方法,分别用于高温和低温下的捕获测量。发现/spl sigma//sub p/随温度升高,从100 K时的2.8 /spl倍/ 10/sup -23/ cm/sup 2/增加到300 K时的2.7 /spl倍/ 10/sup -22/,与多声子发射过程一致。空穴捕获势垒为(30/spl + usmn/5) meV。
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引用次数: 0
Improved fabrication of 4 /spl times/ 4 polarisation insensitive switch matrices on InP by introduction of an etch stop layer 通过引入刻蚀停止层,改进了在InP上制作4 /spl倍/ 4极化不敏感开关矩阵的方法
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380704
J. Peyre, A. Goutelle, P. Pagnod-Rossiaux, J. Vinchant
The first polarization insensitive to 4 /spl times/ 4 switch matrix on InP with digital optical switches (DOS) has been recently presented (J-F. Vinchant et al., 1992). The authors report processing and performance improvements of this matrix by introduction of an etch stop layer in the structure grown by gas source molecular beam epitaxy (GSMBE). Several heterostructures grown on 2-inch wafers by GSMBE in a Virian reactor have been processed. This epitaxial technique allows high homogeneity of layers' thickness and doping. The optical characterization of the matrices has been done by using a 1.54 /spl mu/m wavelength laser for both transverse electric (TE) and transverse magnetic (TM) polarization. The results are reported.<>
最近首次在带数字光开关(DOS)的InP上实现了对4 /spl倍/ 4开关矩阵不敏感的偏振(J-F)。Vinchant et al., 1992)。通过在气源分子束外延(GSMBE)生长的结构中引入蚀刻停止层,作者报道了该矩阵的加工和性能改进。在维里安反应器中,用GSMBE在2英寸硅片上生长了几种异质结构。这种外延技术允许层厚度和掺杂的高度均匀性。利用波长为1.54 /spl μ m的激光进行了横向电(TE)和横向磁(TM)极化的光学表征。结果被报告
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引用次数: 2
In/sub 1-x/Ga/sub x/As/In/sub .53/Ga/sub .47/As strained superlattices grown by gas source molecular beam epitaxy 气体源分子束外延生长In/sub 1-x/Ga/sub x/As/In/sub .53/Ga/sub .47/As的应变超晶格
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380689
A. Godefroy, A. Le Corre, F. Clérot, J. Caulet, A. Poudoulec, S. Salaun, D. Lecrosnier
Strained epitaxial heterostructures yield attractive optoelectronic properties for laser diodes and optical amplifiers. Using various characterization techniques consisting of continuous and time resolved photoluminescence, X-ray diffraction, and transmission electron microscopy, the authors demonstrate the importance of the growth temperature on the relaxation of strained superlattices (SL). By lowering the growth temperature, high quality highly strained SL layers could be obtained.<>
应变外延异质结构为激光二极管和光放大器提供了吸引人的光电性能。利用各种表征技术,包括连续和时间分辨光致发光、x射线衍射和透射电子显微镜,作者证明了生长温度对应变超晶格(SL)弛豫的重要性。通过降低生长温度,可以得到高质量的高应变SL层
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引用次数: 0
Control of beryllium redistribution in InP grown by gas source molecular beam epitaxy 气源分子束外延生长InP中铍重分布的控制
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380674
P. Pagnod-Rossiaux, D. Bonnevie, M. Boulou, F. Gaborit, F. Chouquais, L. Goldstein
Beryllium is widely used in molecular beam epitaxy (MBE) as a p-type dopant. The authors report on the diffusion of Be in InP with beryllium concentrations in excess of 1/spl times/10/sup 19/ cm/sup -3/ during growth by gas-source MBE. Diffusion profiles are analyzed by secondary ion mass spectrometry and C(V) profiling. The dependency of diffusion on the type and doping of InP is investigated. It was found experimentally that diffusion depths are mainly correlated to the heavily-doped layer thickness, and strongly depend on the type and doping level of the host material. This is consistent with a mechanism of fast diffusing positively charged interstitial, further incorporated as a substitutional, with an electrical activity close to 1, as shown by C(V) profiling. Diffusion of Be in InP:Fe shows a peculiar iron out-diffusion induced by the excess interstitial Be.<>
铍作为p型掺杂剂广泛应用于分子束外延(MBE)中。作者报道了铍浓度超过1/spl倍/10/sup / 19/ cm/sup -3/的铟磷在气源MBE生长过程中的扩散。采用二次离子质谱和C(V)谱分析扩散谱。研究了扩散与InP的类型和掺杂的关系。实验发现,扩散深度主要与重掺杂层厚度相关,并与基体材料的类型和掺杂水平密切相关。C(V)谱图显示,这与快速扩散带正电的间隙的机制是一致的,并进一步作为取代物加入,其电活性接近1。Be在InP:Fe中的扩散表现出一种特殊的铁向外扩散,这是由过量的间隙Be引起的。
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引用次数: 0
MeV ion implantation for electrical isolation of p/sup +/ InP epi-layers MeV离子注入对p/sup +/ InP外延层电隔离的影响
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380636
M. Ridgway, M. Davies, J. Sedivy, R. Vandenberg, S. Rolfe, T. Jackman
Electrical isolation of p/sup +/-InP epi-layers with B, O and Fe ion implantation at MeV energies has been investigated. For each of the three ion species, sheet resistance (R/sub s/) values of 5-8 /spl times/ 10/sup 6/ /spl Omega//square were attained after post-implant annealing at temperatures between 300-400/spl deg/C. R/sub s/ values were relatively insensitive to ion dose varying by one order of magnitude for an ion dose range of three orders of magnitude. Fe diffusion was apparent at an annealing temperature of 800/spl deg/C.<>
研究了以MeV能量注入B、O和Fe离子后p/sup +/-InP外接层的电隔离。对于每种离子,在300-400/spl℃的温度下,植入后退火得到的薄片电阻(R/sub /s /)值为5-8 /spl times/ 10/sup 6/ /spl Omega//square。在三个数量级的离子剂量范围内,R/sub /s值对离子剂量变化一个数量级相对不敏感。退火温度为800/spl℃时,Fe扩散明显。
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引用次数: 1
Evaporated thin silicon interlayers for indium phosphide device applications 用于磷化铟器件的蒸发薄硅中间层
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380652
H. Dauplaise, J. P. Lorenzo, E. Martín, K. Vaccaro, G. Ramseyer
The use of thin silicon films for indium phosphide device applications was investigated. Devices prepared with the silicon interlayers show a decrease in hysteresis, flat band voltage shift, and interface state density. Angular resolved X-ray photoelectron spectroscopy studies of the silicon-indium phosphide interface indicate that these effects are due to the interaction of the silicon with the native oxide of indium phosphide prior to dielectric deposition.<>
研究了硅薄膜在磷化铟器件中的应用。用硅中间层制备的器件显示出迟滞、平带电压位移和界面态密度的降低。角分辨x射线光电子能谱对硅-磷化铟界面的研究表明,这些效应是由于硅在介电沉积之前与磷化铟的天然氧化物相互作用所致
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引用次数: 0
Via hole formation in semi-insulating InP using wet photoelectrochemical etching 利用湿式光电化学蚀刻技术在半绝缘InP中形成通孔
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380565
R. Khare, E. Hu, J.J. Brown, M. Melendes
Laser-assisted wet photoelectrochemical etching has been used in conjunction with a metal mask to make via holes in semi-insulating InP. It was found that the incident laser intensity and applied bias can control the degree of sidewall taper in the via holes as well as the vertical and lateral etch rates. It was found that the etch rate is faster for smaller via hole dimensions due to the smaller anode-to-cathode path length. There are however geometric limitations to the overall etched depth for small vias etched at low intensities due to the taper of the sidewalls. This method has demonstrated high etch rates and minimal undercut. Custom tailoring of the etch profile is achievable through adjustment of the etch parameters.<>
激光辅助湿式光电化学蚀刻与金属掩膜相结合,在半绝缘InP上制造通孔。结果表明,入射激光强度和施加偏置可以控制通孔侧壁锥度以及垂直和横向刻蚀速率。研究发现,由于阳极-阴极路径长度较小,通孔尺寸越小,蚀刻速度越快。然而,由于侧壁的锥度,在低强度下蚀刻的小通孔的整体蚀刻深度存在几何限制。这种方法已经证明了高蚀刻率和最小的削弱。通过调整蚀刻参数,可以实现蚀刻轮廓的定制
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引用次数: 0
Absorption and photoluminescence investigations of excitonic transitions in compressively strained InGaAs/InGaAlAs multiple quantum wells 压缩应变InGaAs/InGaAlAs多量子阱中激子跃迁的吸收和光致发光研究
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380580
W. Choi, Y. Hirayama, C. Fonstad
The authors present the results of investigations in which excitonic transitions in compressively strained InGaAs multiple quantum wells (QWs) on InP are studied by absorption and photoluminescence (PL) measurements. Specifically, quantitative exciton parameters such as transition energies, exciton binding energies and radii are estimated from absorption measurements. A comparison is made between strained and lattice-matched QWs. From PL measurements, luminescence characteristics are qualitatively analyzed as a function of well thickness and temperature.<>
本文介绍了用吸收和光致发光(PL)测量研究了InP上压缩应变InGaAs多量子阱(QWs)中的激子跃迁的结果。具体来说,定量激子参数如跃迁能、激子结合能和半径由吸收测量估计。比较了应变和晶格匹配的量子波。根据PL测量,定性分析了发光特性作为井厚和温度的函数。
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引用次数: 1
期刊
1993 (5th) International Conference on Indium Phosphide and Related Materials
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