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1993 (5th) International Conference on Indium Phosphide and Related Materials最新文献

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MOVPE growth of strained InAsP/InGaAsP quantum-well structures for low threshold 1.3 /spl mu/m lasers 低阈值1.3 /spl μ m激光中应变InAsP/InGaAsP量子阱结构的MOVPE生长
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380668
M. Yamamoto, N. Yamamoto, J. Nakano
The authors report strained InAsP quantum-well structures emitting at 1.3 /spl mu/m that were grown by low-pressure metalorganic vapor phase epitaxy. Threshold current densities as low as 88 A/cm/sup 2/ were achieved with a graded-index separate-confinement-heterostructure single-quantum-well 40-/spl mu/m wide ridge stripe waveguide laser diode. This superior laser performance clearly demonstrates the high material quality of strained InAsP/InGaAsP quantum well structures for long wavelength optical device applications.<>
作者报道了通过低压金属有机气相外延生长的应变InAsP量子阱结构,其发射速度为1.3 /spl μ m /m。采用梯度折射率分离禁锢异质结构单量子阱40-/spl mu/m宽脊条波导激光器,实现了低至88 A/cm/sup / /的阈值电流密度。这种优异的激光性能清楚地证明了应变InAsP/InGaAsP量子阱结构在长波光学器件应用中的高材料质量。
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引用次数: 11
Group V interdiffusion in In/sub 0.66/Ga/sub 0.33/As/ In/sub 0.66/Ga/sub 0.33/As/sub 0.7/P/sub 0.3/ quantum well structures in /sub 0.66/Ga/sub 0.33/As/ in /sub 0.66/Ga/sub 0.33/As/sub 0.7/P/sub 0.3/量子阱结构中的V族相互扩散
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380717
W. Gillin, I. Bradley, W. L. Foo, K. Homewood, S. Perrin, P.C. Spurdens
The diffusion coefficient for arsenic and phosphorous interdiffusion has been measured as a function of temperature in In/sub 0.66/Ga/sub 0.33/As/ In/sub 0.66/Ga/sub 0.33/As/sub 0.7/P/sub 0.3/ strained quantum wells, using the photoluminescence from the n = 1 electron to heavy hole transition. The authors have used the shift in the photoluminescence from a 100/spl Aring/ single quantum well of In/sub 0.66/Ga/sub 0.33/As in In/sub 0.66/Ga/sub 0.33/As/sub 0.7/P/sub 0.3/ barriers with annealing to monitor the interdiffusion. In this system there is no concentration gradient to drive group III interdiffusion and therefore the variation in the photoluminescence transition energy was modeled using only phosphorous/arsenic interdiffusion in the model. By performing several anneals to a single sample and measuring the shift in the photoluminescence after each anneal the interdiffusion was monitored as a function of time. Between temperatures of 900/spl deg/C and 700/spl deg/C the diffusion coefficient, D, can be described using the relationship D = D/sub o/exp(-E/sub A//kT) where D/sub o/ = 507 cm/sup 2//s and E/sub A/ = 3.9 eV.<>
利用n = 1电子到重空穴跃迁的光致发光,测定了in /sub 0.66/Ga/sub 0.33/ as / in /sub 0.66/Ga/sub 0.33/ as /sub 0.7/P/sub 0.3/应变量子阱中砷和磷的相互扩散系数随温度的变化。作者利用in /sub 0.66/Ga/sub 0.33/As在in /sub 0.66/Ga/sub 0.33/As/sub 0.7/P/sub 0.3/势垒中100/spl Aring/单量子阱的光致发光位移与退火来监测相互扩散。在该体系中,没有浓度梯度驱动III族相互扩散,因此光致发光跃迁能的变化仅使用模型中的磷/砷相互扩散来建模。通过对单个样品进行多次退火并测量每次退火后光致发光的位移,监测相互扩散作为时间的函数。在900和700之间,扩散系数D可以用关系式D = D/sub o/exp(-E/sub A//kT)来描述,其中D/sub o/ = 507 cm/sup 2//s, E/sub A/ = 3.9 eV。
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引用次数: 0
Increased breakdown voltages in In/sub 1-x-y/Ga/sub x/Al/sub y/As/InAlAs FETs in /sub - 1-x-y/Ga/sub -x /Al/sub -y/ As/InAlAs fet击穿电压增加
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380590
A. Fathimulla, H. Hier, J. Abrahams
The authors report the performance of In/sub 1-x-y/Ga/sub x/Al/sub y/As FETs lattice-matched to InP. An improvement in the drain-source breakdown voltage was achieved by adding Al in the channel of InGaAs/InAlAs FETs. The microwave gains are comparable to those of the InGaAs/InAlAs FETs. The DC and RF characteristics are discussed.<>
本文报道了与InP晶格匹配的In/sub - 1-x-y/Ga/sub -x /Al/sub -y/ As fet的性能。通过在InGaAs/InAlAs fet通道中添加Al,可以改善漏源击穿电压。微波增益可与InGaAs/InAlAs fet相媲美。讨论了直流和射频特性。
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引用次数: 0
High-performance 0.15 /spl mu/m-gatelength OMVPE-grown InAlAs/InGaAs MODFETs 高性能0.15 /spl mu/m栅极长度omvppe生长InAlAs/InGaAs modfet
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380598
I. Adesida, K. Nummila, M. Tong, C. Caneau, R. Bhat
The DC and microwave performance of modulation-doped field effect transistors (MODFETs) with 0.15 /spl mu/m T-gates fabricated in a organo-metallic vapor phase epitaxy (OMVPE)-grown lattice-matched InAlAs/InGaAs/InP heterostructure are reported. Devices with extrinsic transconductance, g/sub m/, as high as 1080 mS/mm at 508 mA/mm and a unity current-gain cutoff frequency, f/sub T/, of 187 GHz are shown. To date, this is the highest f/sub T/ reported for OMVPE-grown MODFETs.<>
报道了在有机-金属气相外延(OMVPE)生长的晶格匹配InAlAs/InGaAs/InP异质结构中制备的0.15 /spl mu/m t栅极调制掺杂场效应晶体管(modfet)的直流和微波性能。在508 mA/mm时,器件的外部跨导g/sub /高达1080 mS/mm,单位电流增益截止频率f/sub /为187 GHz。迄今为止,这是报道的om聚乙烯生长的modfet的最高f/sub T/。
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引用次数: 0
Nonlinear behavior of InP:Fe under high electric field 高电场作用下InP:Fe的非线性行为
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380645
K. Turki, G. Picoli, J. Viallet
The I-V characteristics were investigated on both long liquid encapsulated Czochralski (LEC) and short epitaxial semi-insulating (SI) InP:Fe samples. These characteristics show a linear regime at low voltages followed for higher voltages by a nonlinear one and a current breakdown. This has been widely explained by the single injection theory of Lampert and Mark (1970). The authors show that these characteristics are more complicated than previously recognized and exhibit three further features: (1) The nonlinear behavior occurs at a field of 10 kV/cm independent of the temperature, the nature of the contacts, and the sample thickness. (2) A current transient occurs for LEC long samples from this critical field affecting the I-V characteristics. (3) A S-type negative differential conductivity takes place at a higher field. This behavior is explained by a field-enhancement of the deep-level capture cross section and impact-ionization of deep levels.<>
研究了长液包封直切拉尔斯基(LEC)和短外延半绝缘(SI) InP:Fe样品的I-V特性。这些特性在低电压时呈线性,在高电压时呈非线性和电流击穿。这已经被Lampert和Mark(1970)的单注入理论所广泛解释。作者表明,这些特性比以前认识到的更复杂,并表现出三个进一步的特征:(1)非线性行为发生在10kv /cm的场中,与温度、触点性质和样品厚度无关。(2)从该临界场出发的LEC长样品发生电流瞬变,影响I-V特性。(3)在较高场强处出现s型负微分电导率。这种行为可以用深能级捕获截面的场增强和深能级的撞击电离来解释
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引用次数: 1
Improved Al/InP Schottky barriers by coimplantation of Be/P Be/P共注入改善Al/InP肖特基屏障
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380638
R. Tyagi, T. Chow, J. Borrego, K.A. Pisarczyk
The development of conventional InP MESFET technology is strongly hampered by the low barrier height (0.3-0.4eV) obtained in InP, due to surface Fermi level pinning, and consequent high reverse leakage currents. As a result, several techniques are being applied to increase the Schottky barrier height on n-InP. The authors present a technique for obtaining improved Al/InP Schottky barriers on n-InP by using coimplantation of Be/P. Schottky barrier heights as high as 0.64 eV have been obtained, along with an ideality factor very close to unity. The reverse leakage current density is also reduced by almost four orders of magnitude.<>
传统的InP MESFET技术的发展受到InP中由于表面费米能级钉钉而获得的低势垒高度(0.3-0.4eV)以及由此产生的高反向泄漏电流的严重阻碍。因此,几种技术被应用于增加n-InP上的肖特基势垒高度。作者提出了一种利用Be/P共注入在n-InP上获得改进Al/InP肖特基势垒的方法。已获得高达0.64 eV的肖特基势垒高度,以及非常接近于统一的理想因子。反漏电流密度也降低了近4个数量级。
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引用次数: 8
High performance In/sub 0.47/Ga/sub 0.53/As tunnel junctions grown by chemical beam epitaxy on InP and GaAs and Si substrates 用化学束外延在InP和GaAs和Si衬底上生长出高性能In/sub 0.47/Ga/sub 0.53/As隧道结
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380669
M. Vilela, A. Freundlich, A. Bensaoula, N. Medelci
High performance In/sub 0.47/Ga/sub 0.53/As tunnel junctions were successfully realized using chemical beam epitaxy on InP, GaAs and GaAs/Si substrates. The achievement of high performance tunnel junctions, besides extremely high hole and electron concentrations requires low interdiffusion of dopant species in the narrow space-charge region of the junction during the device growth procedure. Therefore a relatively low temperature growth process and a good control of interface properties is required. Using chemical beam epitaxy (CBE) high quality InP and InGaAs can be grown at temperatures substantially lower than those used in more conventional liquid phase epitaxy and metalorganic vapor phase epitaxy techniques rendering CBE specially attractive for such tunnel junction fabrication. The peak currents obtained on samples grown on InP substrates are the highest ever reported for such tunnel junctions. These results demonstrate that CBE is perfectly suited for fabrication of InP/InGaAs tandem solar cells.<>
利用化学束外延技术在InP、GaAs和GaAs/Si衬底上成功实现了高性能的In/sub 0.47/Ga/sub 0.53/As隧道结。为了实现高性能的隧道结,除了极高的空穴和电子浓度外,还需要在器件生长过程中,在结的狭窄空间电荷区中掺杂物质的低互扩散。因此,需要一个相对低温的生长过程和良好的界面性能控制。使用化学束外延(CBE)可以在比传统液相外延和金属有机气相外延技术低得多的温度下生长高质量的InP和InGaAs,这使得CBE对这种隧道结制造特别有吸引力。在InP衬底上生长的样品所获得的峰值电流是此类隧道结所报道的最高的。这些结果表明,CBE非常适合于制造InP/InGaAs串联太阳能电池。
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引用次数: 2
Interface roughness scattering in AlAs/InGaAs/AlAs RTD with InAs subwell 带InAs亚井的AlAs/InGaAs/AlAs RTD界面粗糙度散射
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380629
P. Roblin, R. Potter, A. Fathimulla
The authors present simulation results demonstrating the impact of 3D scattering on the I-V characteristics of an InP-based resonant tunneling diode (RTD). Of particular interest is interface-roughness scattering at the InGaAs/AlAs and InGaAs/InAs interfaces. Interface-roughness scattering is found to be the dominant scattering process. For the circuit application considered, interface-roughness scattering is shown to provide an important contribution for shaping the device characteristic.<>
作者给出了三维散射对基于inp的谐振隧道二极管(RTD)的I-V特性的影响的仿真结果。特别令人感兴趣的是InGaAs/AlAs和InGaAs/InAs界面的界面粗糙度散射。界面粗糙度散射是主要的散射过程。对于所考虑的电路应用,界面粗糙度散射显示为形成器件特性提供了重要贡献。
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引用次数: 0
Optimization of the buffer thickness for high performance 1 /spl mu/m gate GaAs MESFETs on InP substrate for OEICs oeic用InP衬底上高性能1 /spl mu/m栅极GaAs mesfet缓冲厚度的优化
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380596
M. Chertouk, A. Boudiaf, A. Chovet, R. Azoulay, A. Clei
GaAs/InP FETs on InP appear to be promising for the realization of optoelectronic integrated circuits (OEICs) for low and high bit-rate optical communication. However, there are two fundamental problems, the 3.9% lattice mismatch and 210/sup -6///spl deg/C difference in thermal expansion coefficients leading to the formation of a high density of dislocations and to a high level of tensile stress in the GaAs layer. For possible applications it is mandatory to investigate the effect of this mismatch through the buffer thickness on the DC and microwave performance of GaAs/InP MESFETs. An improvement in the DC and microwave performance of GaAs MESFETs on InP substrate has been observed when increasing the undoped GaAs buffer thickness. For a 3 /spl mu/m thick GaAs buffer, the 1 /spl mu/m gate MESFET has a maximum extrinsic transconductance larger than 230mS/mm, a current gain cut-off frequency of 15 GHz, a maximum frequency of oscillation of 28 GHz, a minimum noise figure of 1 dB at 4 GHz and a Hooge parameter of 2.5 10/sup -5/. Such results clearly indicate the potential of GaAs/InP MESFETs for application to OEICs.<>
基于InP的GaAs/InP场效应管在实现低、高比特率光通信的光电集成电路(oeic)方面前景广阔。然而,有两个基本问题,即3.9%的晶格错配和210/sup -6///spl的热膨胀系数差导致了GaAs层中高密度位错的形成和高水平的拉伸应力。对于可能的应用,必须研究这种不匹配通过缓冲厚度对GaAs/InP mesfet的直流和微波性能的影响。当增加未掺杂的GaAs缓冲层厚度时,在InP衬底上的GaAs mesfet的直流和微波性能都得到了改善。对于3 /spl mu/m厚的GaAs缓冲器,1 /spl mu/m栅极MESFET的最大外部跨导大于230mS/mm,电流增益截止频率为15 GHz,最大振荡频率为28 GHz, 4 GHz时最小噪声系数为1 dB, Hooge参数为2.5 10/sup -5/。这些结果清楚地表明了GaAs/InP mesfet应用于OEICs的潜力。
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引用次数: 2
Submicron pseudomorphic double heterojunction InAlAs/In/sub 0.7/Ga/sub 0.3/As HEMTs with high cut-off and current-drive capability 亚微米伪晶双异质结InAlAs/In/sub 0.7/Ga/sub 0.3/As hemt具有高截止和电流驱动能力
Pub Date : 1993-04-19 DOI: 10.1109/ICIPRM.1993.380583
Y. Kwon, D. Pavlidis, T. Brock, G. Ng, K. Tan, J. Velebir, D. Streit
Lattice-matched and strained (pseudomorphic) InAlAs/InGaAs high electron mobility transistors (HEMTs) are recognized as the most suitable components for operation at millimeter-waves. Pseudomorphic InAlAs/In/sub x/Ga/sub 1-x/As (x>0.53) HEMTs are particularly promising candidates for high-frequency and low-noise applications due to the superior material properties of the strained InGaAs channel. The InGaAs channel with excess indium provides improved low-field mobility characteristics, better carrier confinement and higher peak velocity due to the larger /spl Gamma/-to-L valley separation, compared with lattice-matched channels. The authors address such pseudomorphic designs using double heterostructure (DH) HEMT designs. They demonstrate the possibility of combining pseudomorphic rather than lattice-matched channels with a double heterostructure design to optimize the frequency and current drive characteristics of DH-HEMTs. The DC and microwave characteristics of the fabricated submicron DH-HEMTs are presented and compared with single heterostructure (SH)-devices processed at the same time. Improved f/sub max/ and higher current density have been obtained with the pseudomorphic DH-HEMTs compared to SH-HEMTs.<>
晶格匹配和应变(伪晶)InAlAs/InGaAs高电子迁移率晶体管(hemt)被认为是最适合在毫米波下工作的元件。假晶InAlAs/In/sub x/Ga/sub 1-x/As (x>0.53) hemt由于其应变InGaAs通道优越的材料特性而成为高频和低噪声应用的特别有希望的候选者。与晶格匹配的通道相比,含有过量铟的InGaAs通道提供了更好的低场迁移特性,更好的载流子约束和更高的峰值速度,因为伽马/到l谷分离更大。作者采用双异质结构(DH) HEMT设计来解决这种伪晶设计。他们证明了将假晶通道而不是晶格匹配通道与双异质结构设计相结合的可能性,以优化dh - hemt的频率和电流驱动特性。介绍了所制备的亚微米dh - hemt的直流和微波特性,并与同时期加工的单异质结构(SH)器件进行了比较。与SH-HEMTs相比,伪晶DH-HEMTs获得了更好的f/sub max/和更高的电流密度
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引用次数: 9
期刊
1993 (5th) International Conference on Indium Phosphide and Related Materials
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