The development of wearable and on-skin electronics requires high-density stretchable electronic systems that can conform to soft tissue, operate continuously and provide long-term biocompatibility. Most stretchable electronic systems have low-density integration and are wired with external printed circuit boards, which limits functionality, deteriorates user experience and impedes long-term usability. Here we report an intrinsically permeable, three-dimensional integrated electronic skin. The system combines high-density inorganic electronic components with organic stretchable fibrous substrates using three-dimensional patterned, multilayered liquid metal circuits and stretchable hybrid liquid metal solder. The electronic skin exhibits high softness, durability, fabric-like permeability to air and moisture and sufficient biocompatibility for on-skin attachment for a week. We use the platform to create wireless, battery-powered and battery-free skin-attached bioelectronic systems that offer complex system-level functions, including the stable sensing of biosignals, signal processing and analysis, electrostimulation and wireless communication. An electronic skin that connects rigid inorganic electronic components with a multilayered stretchy liquid metal fibre mat using a hybrid liquid metal solder can offer high integration density while remaining soft, permeable and biocompatible.
{"title":"Permeable, three-dimensional integrated electronic skins with stretchable hybrid liquid metal solders","authors":"Qiuna Zhuang, Kuanming Yao, Chi Zhang, Xian Song, Jingkun Zhou, Yufei Zhang, Qiyao Huang, Yizhao Zhou, Xinge Yu, Zijian Zheng","doi":"10.1038/s41928-024-01189-x","DOIUrl":"10.1038/s41928-024-01189-x","url":null,"abstract":"The development of wearable and on-skin electronics requires high-density stretchable electronic systems that can conform to soft tissue, operate continuously and provide long-term biocompatibility. Most stretchable electronic systems have low-density integration and are wired with external printed circuit boards, which limits functionality, deteriorates user experience and impedes long-term usability. Here we report an intrinsically permeable, three-dimensional integrated electronic skin. The system combines high-density inorganic electronic components with organic stretchable fibrous substrates using three-dimensional patterned, multilayered liquid metal circuits and stretchable hybrid liquid metal solder. The electronic skin exhibits high softness, durability, fabric-like permeability to air and moisture and sufficient biocompatibility for on-skin attachment for a week. We use the platform to create wireless, battery-powered and battery-free skin-attached bioelectronic systems that offer complex system-level functions, including the stable sensing of biosignals, signal processing and analysis, electrostimulation and wireless communication. An electronic skin that connects rigid inorganic electronic components with a multilayered stretchy liquid metal fibre mat using a hybrid liquid metal solder can offer high integration density while remaining soft, permeable and biocompatible.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141489134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-27DOI: 10.1038/s41928-024-01206-z
Three-dimensional electronics is our 2024 technology of the year.
三维电子技术是我们的 2024 年度技术。
{"title":"Build it up","authors":"","doi":"10.1038/s41928-024-01206-z","DOIUrl":"10.1038/s41928-024-01206-z","url":null,"abstract":"Three-dimensional electronics is our 2024 technology of the year.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s41928-024-01206-z.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141462407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-27DOI: 10.1038/s41928-024-01175-3
Debendra Das Sharma, Ravi V. Mahajan
Heterogeneous integration of chips in three-dimensional systems will be needed to meet increasing global demands for computing power.
为满足全球对计算能力日益增长的需求，需要在三维系统中实现芯片的异构集成。
{"title":"Advanced packaging of chiplets for future computing needs","authors":"Debendra Das Sharma, Ravi V. Mahajan","doi":"10.1038/s41928-024-01175-3","DOIUrl":"10.1038/s41928-024-01175-3","url":null,"abstract":"Heterogeneous integration of chips in three-dimensional systems will be needed to meet increasing global demands for computing power.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141462411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Electrons carry both spin and orbital angular momentum. The search for phenomena that generate a flow of spin angular momentum—a spin current—has led to the development of spintronics. In contrast, the orbital counterpart of spin current—an orbital current—has largely been overlooked, and the generation of an orbital current remains challenging. Here we report the observation of orbital-current generation from magnetization dynamics: orbital pumping. We show that orbital pumping in nickel/titanium bilayers injects an orbital current into the titanium layer, which we detect through the inverse orbital Hall effect. Orbital pumping is the orbital counterpart of spin pumping, a versatile and powerful mechanism for spin-current generation. Our findings could, thus, provide a promising approach for generating orbital currents and could help in the development of the orbital analogue of spintronics: orbitronics. In ferromagnetic/non-magnetic bilayers of nickel/titanium, the precession of magnetization in the nickel layer can inject an orbital current into the titanium layer through orbital pumping, the orbital counterpart of spin pumping.
{"title":"Observation of orbital pumping","authors":"Hiroki Hayashi, Dongwook Go, Satoshi Haku, Yuriy Mokrousov, Kazuya Ando","doi":"10.1038/s41928-024-01193-1","DOIUrl":"10.1038/s41928-024-01193-1","url":null,"abstract":"Electrons carry both spin and orbital angular momentum. The search for phenomena that generate a flow of spin angular momentum—a spin current—has led to the development of spintronics. In contrast, the orbital counterpart of spin current—an orbital current—has largely been overlooked, and the generation of an orbital current remains challenging. Here we report the observation of orbital-current generation from magnetization dynamics: orbital pumping. We show that orbital pumping in nickel/titanium bilayers injects an orbital current into the titanium layer, which we detect through the inverse orbital Hall effect. Orbital pumping is the orbital counterpart of spin pumping, a versatile and powerful mechanism for spin-current generation. Our findings could, thus, provide a promising approach for generating orbital currents and could help in the development of the orbital analogue of spintronics: orbitronics. In ferromagnetic/non-magnetic bilayers of nickel/titanium, the precession of magnetization in the nickel layer can inject an orbital current into the titanium layer through orbital pumping, the orbital counterpart of spin pumping.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141461899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-27DOI: 10.1038/s41928-024-01188-y
Elisa Vianello, Melika Payvand
Three-dimensional technology — which can offer enhanced integration density and improved data communication — will be required to build large-scale artificial computing systems inspired by the brain.
三维技术可以提高集成密度，改善数据通信，是建立受大脑启发的大规模人工计算系统所必需的。
{"title":"Scaling neuromorphic systems with 3D technologies","authors":"Elisa Vianello, Melika Payvand","doi":"10.1038/s41928-024-01188-y","DOIUrl":"10.1038/s41928-024-01188-y","url":null,"abstract":"Three-dimensional technology — which can offer enhanced integration density and improved data communication — will be required to build large-scale artificial computing systems inspired by the brain.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141462658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-27DOI: 10.1038/s41928-024-01187-z
Chao Xiang, John E. Bowers
The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.
{"title":"Building 3D integrated circuits with electronics and photonics","authors":"Chao Xiang, John E. Bowers","doi":"10.1038/s41928-024-01187-z","DOIUrl":"10.1038/s41928-024-01187-z","url":null,"abstract":"The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141462659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-27DOI: 10.1038/s41928-024-01191-3
Peng Wu, Jing Kong
Atomic-layer yttrium doping can be used to form ohmic contacts between molybdenum disulfide channel layers and metals, creating high-performance 2D transistors with low contact resistances.
{"title":"Doping for ohmic contacts in 2D transistors","authors":"Peng Wu, Jing Kong","doi":"10.1038/s41928-024-01191-3","DOIUrl":"10.1038/s41928-024-01191-3","url":null,"abstract":"Atomic-layer yttrium doping can be used to form ohmic contacts between molybdenum disulfide channel layers and metals, creating high-performance 2D transistors with low contact resistances.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141461989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-27DOI: 10.1038/s41928-024-01190-4
Kuangye Lu, Jaewoo Shim, Ki Seok Kim, Sang Won Kim, Jeehwan Kim
Two-dimensional (2D) semiconductors could be used to build advanced 3D chips based on monolithic 3D integration. But challenges related to growing single-crystalline materials at low temperatures — as well as enhancing the performance of 2D transistors — need to be addressed first.
{"title":"2D materials can unlock single-crystal-based monolithic 3D integration","authors":"Kuangye Lu, Jaewoo Shim, Ki Seok Kim, Sang Won Kim, Jeehwan Kim","doi":"10.1038/s41928-024-01190-4","DOIUrl":"10.1038/s41928-024-01190-4","url":null,"abstract":"Two-dimensional (2D) semiconductors could be used to build advanced 3D chips based on monolithic 3D integration. But challenges related to growing single-crystalline materials at low temperatures — as well as enhancing the performance of 2D transistors — need to be addressed first.","PeriodicalId":19064,"journal":{"name":"Nature Electronics","volume":null,"pages":null},"PeriodicalIF":33.7,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141462577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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