Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398157
D. Mowery, N. Hatch, M. Borrus, A. Shuen
Some preliminary results of research on new process introduction in semiconductors are presented. Data and present descriptive data on trends in manufacturing improvement drawn from the authors' current sample are discussed. The qualitative evidence on interfirm differences in management and performance in new process introduction is reviewed. An exploratory empirical model of new process introduction and manufacturing improvement is presented. Results are summarized and some directions for further research are suggested.<>
{"title":"Searching for lean production in semiconductors: New process introduction","authors":"D. Mowery, N. Hatch, M. Borrus, A. Shuen","doi":"10.1109/IEMT.1993.398157","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398157","url":null,"abstract":"Some preliminary results of research on new process introduction in semiconductors are presented. Data and present descriptive data on trends in manufacturing improvement drawn from the authors' current sample are discussed. The qualitative evidence on interfirm differences in management and performance in new process introduction is reviewed. An exploratory empirical model of new process introduction and manufacturing improvement is presented. Results are summarized and some directions for further research are suggested.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129721441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398183
C. Baudoin, J. Kantor
The situation that exists in the equipment industry with respect to software development is examined. Some of the causes for this situation are explored. The elements of a complete approach to this problem (with applicability to software suppliers and system integrators as well as to equipment makers) are presented, and the interdependency between these various elements is indicated. Practical steps that can be taken by suppliers to redress the current lag in software engineering capability are discussed.<>
{"title":"Software engineering for semiconductor manufacturing equipment suppliers","authors":"C. Baudoin, J. Kantor","doi":"10.1109/IEMT.1993.398183","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398183","url":null,"abstract":"The situation that exists in the equipment industry with respect to software development is examined. Some of the causes for this situation are explored. The elements of a complete approach to this problem (with applicability to software suppliers and system integrators as well as to equipment makers) are presented, and the interdependency between these various elements is indicated. Practical steps that can be taken by suppliers to redress the current lag in software engineering capability are discussed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134531661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398182
Y. Li, R.L. Mahajan, J. Tong
The authors relate circuit board design features to assembly yields. Design parameters that may affect the assembly yield are identified using knowledge of the assembly process. These parameters are then quantified for a set of board designs and related to the actual assembly yields by statistical regression models and artificial neural network models. These models are able to predict the assembly yield with a root-mean-square (RMS) error less than 5%. They can be used to predict the assembly yield for new board designs on the same line. Alternatively, they can be used to compare the performance of different lines by comparing the expected yields for a given design with the actual yields.<>
{"title":"Design factors and their effect on PCB assembly yield - Statistical and neural network predictive models","authors":"Y. Li, R.L. Mahajan, J. Tong","doi":"10.1109/IEMT.1993.398182","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398182","url":null,"abstract":"The authors relate circuit board design features to assembly yields. Design parameters that may affect the assembly yield are identified using knowledge of the assembly process. These parameters are then quantified for a set of board designs and related to the actual assembly yields by statistical regression models and artificial neural network models. These models are able to predict the assembly yield with a root-mean-square (RMS) error less than 5%. They can be used to predict the assembly yield for new board designs on the same line. Alternatively, they can be used to compare the performance of different lines by comparing the expected yields for a given design with the actual yields.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133313319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398210
J. Beale, R. Pease
The prosaic pressure contact is a source of unreliability not only in completed systems but more seriously in testing of ICs prior to packaging. Using a custom-built apparatus, pressure contacts are characterized with applied forces down to a few nN and contact areas down to 10/sup -11/ cm/sup 2/. Nominally clean gold-gold and iridium-gold contacts in air exhibit resistivities higher than that predicted from a simple model based on the plastic deformation of the gold. Interfacial films appear to be a source of unreliability. The surface film on gold in air appears to disrupt conduction to a similar degree.<>
{"title":"Limits of high density, low-force pressure contacts","authors":"J. Beale, R. Pease","doi":"10.1109/IEMT.1993.398210","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398210","url":null,"abstract":"The prosaic pressure contact is a source of unreliability not only in completed systems but more seriously in testing of ICs prior to packaging. Using a custom-built apparatus, pressure contacts are characterized with applied forces down to a few nN and contact areas down to 10/sup -11/ cm/sup 2/. Nominally clean gold-gold and iridium-gold contacts in air exhibit resistivities higher than that predicted from a simple model based on the plastic deformation of the gold. Interfacial films appear to be a source of unreliability. The surface film on gold in air appears to disrupt conduction to a similar degree.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128260512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398176
T. Mikazuki, K. Yasuda, N. Sugiura, H. Oka
The speed at which data can be transmitted in communication rack systems is limited by crosstalk simultaneous switching noise in the data signal. The relationship between this noise and transmission speed is experimentally evaluated. The experimental rack system has 24 independently driven channels consisting of a driver-printed board assembly (PBA), connector, back panel (BP), connector and receiver-PBA. A small, high-density multicoaxial package connector is used and an error-rate detector is used to determine the error-free transmission speed at various receiver reference voltages. For a 45-cm line, the maximum speed of the rack system is 622 Mb/s for a 45 cm line.<>
{"title":"High-speed data transmission in a rack system with coaxial board connectors","authors":"T. Mikazuki, K. Yasuda, N. Sugiura, H. Oka","doi":"10.1109/IEMT.1993.398176","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398176","url":null,"abstract":"The speed at which data can be transmitted in communication rack systems is limited by crosstalk simultaneous switching noise in the data signal. The relationship between this noise and transmission speed is experimentally evaluated. The experimental rack system has 24 independently driven channels consisting of a driver-printed board assembly (PBA), connector, back panel (BP), connector and receiver-PBA. A small, high-density multicoaxial package connector is used and an error-rate detector is used to determine the error-free transmission speed at various receiver reference voltages. For a 45-cm line, the maximum speed of the rack system is 622 Mb/s for a 45 cm line.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121753167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398181
A. Hidde, Holger Rath
Based on a standardized, product and production independent concept for factory automation, some general thoughts concerning the acquisition of operation, machine and quality data for manufacturing are presented, and the application of a printed circuit board (PCB) production preparation system as a part of the manufacturing design system is discussed. The necessity of automation of production preparation is based on a continuous flow of information in the manufacturing environment to reduce the throughput/cycle time, to reduce the set-up time and to have better product quality. The decrease of time in the different hierarchical layers of the production reference model, especially in the area of production preparation, can be used to develop tested, error-free, simulated and optimized product, process and machine describing data files.<>
{"title":"Graphics file generation for a computer-aided manual work station in the electronics manufacturing environment","authors":"A. Hidde, Holger Rath","doi":"10.1109/IEMT.1993.398181","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398181","url":null,"abstract":"Based on a standardized, product and production independent concept for factory automation, some general thoughts concerning the acquisition of operation, machine and quality data for manufacturing are presented, and the application of a printed circuit board (PCB) production preparation system as a part of the manufacturing design system is discussed. The necessity of automation of production preparation is based on a continuous flow of information in the manufacturing environment to reduce the throughput/cycle time, to reduce the set-up time and to have better product quality. The decrease of time in the different hierarchical layers of the production reference model, especially in the area of production preparation, can be used to develop tested, error-free, simulated and optimized product, process and machine describing data files.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127163431","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398155
K. Feldmann, J. Franke, A. Rothhaupt
The application of computer aided tools in process planning and their integration with CAD systems and manufacturing equipment improves the efficiency in electronic production. The authors present a computer aided process planning system which integrated the functionality for the entire fabrication and assembly chain of printed circuit boards. This tool enables the optimization, simulation, NC-programming and documentation for the following process steps: photo plot, drilling and insertion. The modules for the Automated Generating and Simulation of Insertion Sequences (AGASIS) are discussed.<>
{"title":"Automated generating and simulation of insertion sequences","authors":"K. Feldmann, J. Franke, A. Rothhaupt","doi":"10.1109/IEMT.1993.398155","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398155","url":null,"abstract":"The application of computer aided tools in process planning and their integration with CAD systems and manufacturing equipment improves the efficiency in electronic production. The authors present a computer aided process planning system which integrated the functionality for the entire fabrication and assembly chain of printed circuit boards. This tool enables the optimization, simulation, NC-programming and documentation for the following process steps: photo plot, drilling and insertion. The modules for the Automated Generating and Simulation of Insertion Sequences (AGASIS) are discussed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115669136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398169
L.K. Keys, R. Hirschfeld, T. W. Liao
In the 1992 IEMT15S Proceedings Louisiana State University (LSU) presented the outlines for an initiative in mechatronics engineering. Progress, developments, and changes of the past year are discussed. The emphasis of the program has grown from mechatronic products to integrated manufacturing systems. The broader focus includes the multi-disciplinary concepts of mechatronics, but adds larger scale interaction and intelligence. The LSU facility is composed of a network of manufacturing systems or cells which interact to form a multi-cell facility. Demonstrations, student instructional laboratories, and graduate research use and contribute to continued growth.<>
{"title":"The intelligent manufacturing systems initiative at Louisiana State University","authors":"L.K. Keys, R. Hirschfeld, T. W. Liao","doi":"10.1109/IEMT.1993.398169","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398169","url":null,"abstract":"In the 1992 IEMT15S Proceedings Louisiana State University (LSU) presented the outlines for an initiative in mechatronics engineering. Progress, developments, and changes of the past year are discussed. The emphasis of the program has grown from mechatronic products to integrated manufacturing systems. The broader focus includes the multi-disciplinary concepts of mechatronics, but adds larger scale interaction and intelligence. The LSU facility is composed of a network of manufacturing systems or cells which interact to form a multi-cell facility. Demonstrations, student instructional laboratories, and graduate research use and contribute to continued growth.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131615036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398226
T. Amano, H. Shiroishi, M. Kohno, Y. Obara
By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed.<>
{"title":"Practical application of fine pitch component mounting with precoat soldering","authors":"T. Amano, H. Shiroishi, M. Kohno, Y. Obara","doi":"10.1109/IEMT.1993.398226","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398226","url":null,"abstract":"By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126846031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-10-04DOI: 10.1109/IEMT.1993.398227
D. Glajchen
When measuring the RF noise figure on-wafer on ultra low-noise GaAs microwave devices, the magnitude of the noise figures measured become comparable to the instrumentation accuracy. It becomes necessary to determine the discriminating capability of the instrumentation, and take this into account. For the GaAs device discussed, the instrumentation accuracy is determined by running a repeat measurement on a statistically large sample, and calculating the limits inside of which the measurement system is not capable of discriminating. These measurements are done on an RF autoprober, which allows the noise figure of each of the test devices to be characterized repetitively at multiple frequencies without operator intervention. The results and their implication with respect to conclusions that can be drawn when searching for process performance improvements which are comparable to the discriminating power of the instrumentation are discussed. Some of the alternate statistical techniques applied to attempt to discriminate these improvements are discussed.<>
{"title":"RF instrument accuracy - Some effects of measurement uncertainty","authors":"D. Glajchen","doi":"10.1109/IEMT.1993.398227","DOIUrl":"https://doi.org/10.1109/IEMT.1993.398227","url":null,"abstract":"When measuring the RF noise figure on-wafer on ultra low-noise GaAs microwave devices, the magnitude of the noise figures measured become comparable to the instrumentation accuracy. It becomes necessary to determine the discriminating capability of the instrumentation, and take this into account. For the GaAs device discussed, the instrumentation accuracy is determined by running a repeat measurement on a statistically large sample, and calculating the limits inside of which the measurement system is not capable of discriminating. These measurements are done on an RF autoprober, which allows the noise figure of each of the test devices to be characterized repetitively at multiple frequencies without operator intervention. The results and their implication with respect to conclusions that can be drawn when searching for process performance improvements which are comparable to the discriminating power of the instrumentation are discussed. Some of the alternate statistical techniques applied to attempt to discriminate these improvements are discussed.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129177851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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