Pub Date : 2019-04-17DOI: 10.23919/ICEP.2019.8733525
Shih-Wei Liu, Chia-Han Tsai, K. Chiang
In an electronic packaging process, an improper molding process or design will result in excessive warpage of the package structure. When the warpage is too large, the subsequent process will be difficult to perform. The finite element method (FEM) is a common method for evaluating warpage during the molding process. However, in order to fully simulate the behavior of the epoxy resin during the molding process, a large number of experiments and simulations are required to obtain material parameters. Therefore, this study uses the equivalent thermal expansion coefficient method to simplify the simulation process and estimate the actual experimental warpage. And the method is used to build a panel-level package finite element model to estimate the amount of warpage.
{"title":"Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE","authors":"Shih-Wei Liu, Chia-Han Tsai, K. Chiang","doi":"10.23919/ICEP.2019.8733525","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733525","url":null,"abstract":"In an electronic packaging process, an improper molding process or design will result in excessive warpage of the package structure. When the warpage is too large, the subsequent process will be difficult to perform. The finite element method (FEM) is a common method for evaluating warpage during the molding process. However, in order to fully simulate the behavior of the epoxy resin during the molding process, a large number of experiments and simulations are required to obtain material parameters. Therefore, this study uses the equivalent thermal expansion coefficient method to simplify the simulation process and estimate the actual experimental warpage. And the method is used to build a panel-level package finite element model to estimate the amount of warpage.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114561648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-17DOI: 10.23919/ICEP.2019.8733496
Zechun Yu, Shize Wang, S. Letz, C. F. Bayer, Felix Häußler, A. Schletz, K. Suganuma
In this study, Ag stress migration bonding (SMB) is demonstrated with various Ag film materials and bonding conditions. The main effects and interactions of various processing parameters such as bonding temperature, process time and applied pressure on the interfacial shear strength of the DUTs are firstly investigated via the design of experiments (DoE) method. The hillock and grain growth process in Ag films deposited on a Si substrate depending on process temperature and time has been investigated. Hillock formation is clearly observed on all film surfaces at 300 °C. Furthermore, various direct bonding tests are carried out with the optimal parameters using two different metal-stacks, Cr/Ni/Ag and Ti/Ag. Compared to the Cr/Ni/Ag metallized samples, a highly increased shear strength of 73 MPa is achieved with Ti/Ag film. In addition, the lifetime of direct bonded Ag joints was examined by passive thermal cycling tests. The results show no significant change in the shear strength after 700 thermal cycles.
{"title":"Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments","authors":"Zechun Yu, Shize Wang, S. Letz, C. F. Bayer, Felix Häußler, A. Schletz, K. Suganuma","doi":"10.23919/ICEP.2019.8733496","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733496","url":null,"abstract":"In this study, Ag stress migration bonding (SMB) is demonstrated with various Ag film materials and bonding conditions. The main effects and interactions of various processing parameters such as bonding temperature, process time and applied pressure on the interfacial shear strength of the DUTs are firstly investigated via the design of experiments (DoE) method. The hillock and grain growth process in Ag films deposited on a Si substrate depending on process temperature and time has been investigated. Hillock formation is clearly observed on all film surfaces at 300 °C. Furthermore, various direct bonding tests are carried out with the optimal parameters using two different metal-stacks, Cr/Ni/Ag and Ti/Ag. Compared to the Cr/Ni/Ag metallized samples, a highly increased shear strength of 73 MPa is achieved with Ti/Ag film. In addition, the lifetime of direct bonded Ag joints was examined by passive thermal cycling tests. The results show no significant change in the shear strength after 700 thermal cycles.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114783861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-17DOI: 10.23919/ICEP.2019.8733458
H. Kudo, M. Akazawa, Shouhei Yamada, Masaya Tanaka, Haruo Iida, Jyunya Suzuki, T. Takano, S. Kuramochi
A topside Cu-filled through-glass via ("Cu bridge") is presented as a novel transmission channel. The simulated signal transmission loss of the Cu bridge was as low as í0.04 dB at a signal frequency of 18 GHz, corresponding to the PCI Express 5.0 bus standard. Its signal transmission loss was less than 0.13 % in a typical long-reach SerDes channel with a loss of í30 dB. The minimum pitch of the Cu bridge was as narrow as 100 μm, which meets the requirements for increased signal I/O. The simple few-step fabrication of the Cu bridge effectively reduces the cost of manufacturing glass interposers. This is a great advantage compared to silicon interposers, which require a complicated process to fabricate Cu through-silicon vias. A glass substrate embedded with Cu bridges supports semi-additive and damascene-based redistribution layers, which increases the number of potential packaging configurations. This Cu bridge is thus a promising approach to next-generation heterogeneous integration based on 2.nD interposers.
{"title":"High-speed High-density Cost-effective Cu-filled Through-Glass-Via Channel for Heterogeneous Chip Integration","authors":"H. Kudo, M. Akazawa, Shouhei Yamada, Masaya Tanaka, Haruo Iida, Jyunya Suzuki, T. Takano, S. Kuramochi","doi":"10.23919/ICEP.2019.8733458","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733458","url":null,"abstract":"A topside Cu-filled through-glass via (\"Cu bridge\") is presented as a novel transmission channel. The simulated signal transmission loss of the Cu bridge was as low as í0.04 dB at a signal frequency of 18 GHz, corresponding to the PCI Express 5.0 bus standard. Its signal transmission loss was less than 0.13 % in a typical long-reach SerDes channel with a loss of í30 dB. The minimum pitch of the Cu bridge was as narrow as 100 μm, which meets the requirements for increased signal I/O. The simple few-step fabrication of the Cu bridge effectively reduces the cost of manufacturing glass interposers. This is a great advantage compared to silicon interposers, which require a complicated process to fabricate Cu through-silicon vias. A glass substrate embedded with Cu bridges supports semi-additive and damascene-based redistribution layers, which increases the number of potential packaging configurations. This Cu bridge is thus a promising approach to next-generation heterogeneous integration based on 2.nD interposers.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130842361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-17DOI: 10.23919/ICEP.2019.8733521
D. Ishikawa, B. An, M. Mail, H. Wurst, B. Leyrer, T. Blank, Marc Weber, Suguru Ueda, H. Nakako, Yuki Kawana
this paper describes thermal stabilities (573 K for 8 h) of pressureless-sintered Copper (Cu) on four kinds of top metallization layers (Ni, Cu, Ag, and Au) by experiments. Evolutions of sintering process of Cu nanoparticles and diffusion coefficients of interfaces between a bulk Cu layer and metallization layers were also evaluated by molecular dynamics (MD) simulations. After aging at 573 K for 8 h in terms of bonding samples, the shear strengths of sintered Cu on Ni and Cu layer increased, whereas those of sintered Cu on Ag and Au layer decreased. It was confirmed that interdiffusion occurred in the interfaces between sintered Cu layer and Ag layer or Au layer by energy dispersive X-ray spectroscopy (EDX), which increased the porosities of sintered Cu near the interfaces. The increases of interfacial porosities on sintered Cu/Ag and sintered Cu/Au decreased the shear strengths. In contrast, the porosities near the interface between sintered Cu layer and Ni layer or Cu layer hardly changed after aging. MD simulations revealed that Kirkendall voids were promoted by higher interdiffusion coefficients and higher ratio of intrinsic diffusion coefficients between a bulk Cu layer and metallization layers, which consequently increased the porosities of sintered Cu near the interfaces. The interdiffusion coefficients, which seem to have a correlation with the shear strengths of sintered Cu, can be used as an index value to find metallization layers that are suitable for the sintered Cu layer by calculations of MD simulations.
{"title":"Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers","authors":"D. Ishikawa, B. An, M. Mail, H. Wurst, B. Leyrer, T. Blank, Marc Weber, Suguru Ueda, H. Nakako, Yuki Kawana","doi":"10.23919/ICEP.2019.8733521","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733521","url":null,"abstract":"this paper describes thermal stabilities (573 K for 8 h) of pressureless-sintered Copper (Cu) on four kinds of top metallization layers (Ni, Cu, Ag, and Au) by experiments. Evolutions of sintering process of Cu nanoparticles and diffusion coefficients of interfaces between a bulk Cu layer and metallization layers were also evaluated by molecular dynamics (MD) simulations. After aging at 573 K for 8 h in terms of bonding samples, the shear strengths of sintered Cu on Ni and Cu layer increased, whereas those of sintered Cu on Ag and Au layer decreased. It was confirmed that interdiffusion occurred in the interfaces between sintered Cu layer and Ag layer or Au layer by energy dispersive X-ray spectroscopy (EDX), which increased the porosities of sintered Cu near the interfaces. The increases of interfacial porosities on sintered Cu/Ag and sintered Cu/Au decreased the shear strengths. In contrast, the porosities near the interface between sintered Cu layer and Ni layer or Cu layer hardly changed after aging. MD simulations revealed that Kirkendall voids were promoted by higher interdiffusion coefficients and higher ratio of intrinsic diffusion coefficients between a bulk Cu layer and metallization layers, which consequently increased the porosities of sintered Cu near the interfaces. The interdiffusion coefficients, which seem to have a correlation with the shear strengths of sintered Cu, can be used as an index value to find metallization layers that are suitable for the sintered Cu layer by calculations of MD simulations.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122401238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-01DOI: 10.23919/ICEP.2019.8733451
Hidetoshi Ishibashi, H. Yoshida, Daisuke Murata, S. Morisaki, Hodaka Rokubuichi, A. Minamide, Nobuhiro Asaji
Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This paper introduces the new package technology has the Power board (thicker copper printed circuit board) as inner connection instead of the conventional wire connection. This technology leads further downsizing, lower package stray inductance, and robustness to answer the market requirements.
{"title":"Direct Power Board Bonding Technology for 3D Power Module Package","authors":"Hidetoshi Ishibashi, H. Yoshida, Daisuke Murata, S. Morisaki, Hodaka Rokubuichi, A. Minamide, Nobuhiro Asaji","doi":"10.23919/ICEP.2019.8733451","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733451","url":null,"abstract":"Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This paper introduces the new package technology has the Power board (thicker copper printed circuit board) as inner connection instead of the conventional wire connection. This technology leads further downsizing, lower package stray inductance, and robustness to answer the market requirements.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121810548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-01DOI: 10.23919/ICEP.2019.8733485
T. Ito, Y. Koya, N. Miki
Our group has been developing implantable artificial dialysis system to decrease burden of chronic kidney disease patients. To evaluate the device, long-term in vivo experiments are mandatory. However, we need to complete the detailed design of the devices prior to the long-term tests, which range from the temporal change of the device performance to time to surgical procedures. To do so, we need to conduct mid- and long-term in vivo experiments for multiple times to acquire sufficient information. It is useful to use small animals, such as rats, for in vivo experiment. However, there is no prior work that discusses mid- and long-term coagulation ability control in small animals. In this study, we investigated the heparin administration to manage the coagulability. A simplified device was connected to SD rats under coagulability control and the blood coagulation in the device was characterized. And succeeded in blood clotting inhibition for 48 hours
{"title":"Long-term in vivo Experiment Protocol Using SD Rats","authors":"T. Ito, Y. Koya, N. Miki","doi":"10.23919/ICEP.2019.8733485","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733485","url":null,"abstract":"Our group has been developing implantable artificial dialysis system to decrease burden of chronic kidney disease patients. To evaluate the device, long-term in vivo experiments are mandatory. However, we need to complete the detailed design of the devices prior to the long-term tests, which range from the temporal change of the device performance to time to surgical procedures. To do so, we need to conduct mid- and long-term in vivo experiments for multiple times to acquire sufficient information. It is useful to use small animals, such as rats, for in vivo experiment. However, there is no prior work that discusses mid- and long-term coagulation ability control in small animals. In this study, we investigated the heparin administration to manage the coagulability. A simplified device was connected to SD rats under coagulability control and the blood coagulation in the device was characterized. And succeeded in blood clotting inhibition for 48 hours","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123591089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-01DOI: 10.23919/ICEP.2019.8733531
H. Chuang, C. H. Huang, A. Liao
This study uses a novel fabrication method of thin metal coatings by Ni electroplating combining ultrasonic agitation with supercritical CO2 (US-SC-CO2) mixed into conventional electrolyte. Coatings were also produced by the conventional and regular SC-CO2 electroplating methods for comparison. The characteristics obtained from the three fabrication methods such as surface morphology, hardness, roughness; crystallographic orientation, grain size; wear and corrosion resistance were all individually analyzed. Results show that plating quality achieved by US-SC-CO2 method is superior to that of regular SC-CO2 and conventional methods. With US-SC-CO2 process we achieved smoother and more compact surface morphologies, smaller grain size, lower surface roughness and higher microhardness, which also suggest good wear resistance.
{"title":"Characteristics of nickel thin film electroplated by supercritical CO2 emulsion assisted with ultrasonic agitation","authors":"H. Chuang, C. H. Huang, A. Liao","doi":"10.23919/ICEP.2019.8733531","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733531","url":null,"abstract":"This study uses a novel fabrication method of thin metal coatings by Ni electroplating combining ultrasonic agitation with supercritical CO2 (US-SC-CO2) mixed into conventional electrolyte. Coatings were also produced by the conventional and regular SC-CO2 electroplating methods for comparison. The characteristics obtained from the three fabrication methods such as surface morphology, hardness, roughness; crystallographic orientation, grain size; wear and corrosion resistance were all individually analyzed. Results show that plating quality achieved by US-SC-CO2 method is superior to that of regular SC-CO2 and conventional methods. With US-SC-CO2 process we achieved smoother and more compact surface morphologies, smaller grain size, lower surface roughness and higher microhardness, which also suggest good wear resistance.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115524502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-01DOI: 10.23919/ICEP.2019.8733427
Zhi Cao, Haiping Shang, Yinghui Wang, Shengkai Wang, Weibing Wang
The detection of trace metals is of great significance for understanding and utilizing ocean resources. However, in-situ detection of trace metals with high detection accuracy remains an important problem because of the complexity of the marine environment. In this paper, we have successfully fabricated gel-integrated mercury-plated microelectrode array sensors and realized the detection of trace metals in standard metal solutions by anodic stripping voltammetry (ASV). We have coated 1.5% agarose gel film on the microelectrode array, which can prevent electrodes from being polluted and not affect the diffusion of metal ions. For the analysis of trace metals, mercury is deposited on the iridium-based microelectrode array. Cyclic voltammetry shows that mercury plating effectively expands the negative application range of working electrodes and can be used for simultaneous detection of Zn, Cd and Pb. The detection limits of Zn, Cd and Pb were 0.63, 0.60 and 0.59 μg/mL in standard metal solution at the deposition time of 2000 s. In summary, quantitative detection of three metal ions in standard metal solution is realized, which embodies the advantages of anodic stripping voltammetry in seawater metal detection.
{"title":"Gel-Integrated mercury-plated microelectrode arrays for trace metal detection","authors":"Zhi Cao, Haiping Shang, Yinghui Wang, Shengkai Wang, Weibing Wang","doi":"10.23919/ICEP.2019.8733427","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733427","url":null,"abstract":"The detection of trace metals is of great significance for understanding and utilizing ocean resources. However, in-situ detection of trace metals with high detection accuracy remains an important problem because of the complexity of the marine environment. In this paper, we have successfully fabricated gel-integrated mercury-plated microelectrode array sensors and realized the detection of trace metals in standard metal solutions by anodic stripping voltammetry (ASV). We have coated 1.5% agarose gel film on the microelectrode array, which can prevent electrodes from being polluted and not affect the diffusion of metal ions. For the analysis of trace metals, mercury is deposited on the iridium-based microelectrode array. Cyclic voltammetry shows that mercury plating effectively expands the negative application range of working electrodes and can be used for simultaneous detection of Zn, Cd and Pb. The detection limits of Zn, Cd and Pb were 0.63, 0.60 and 0.59 μg/mL in standard metal solution at the deposition time of 2000 s. In summary, quantitative detection of three metal ions in standard metal solution is realized, which embodies the advantages of anodic stripping voltammetry in seawater metal detection.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122899432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-01DOI: 10.23919/ICEP.2019.8733418
R. Ishimatsu, Eri Kunisawa, Hirosato Shintaku, K. Nakano, T. Imato
Portable analytical detection systems based on light emitting devices, organic light-emitting diode (OLED), and electrogenerated chemiluminescence (ECL) are described. The OLED is composed of an Eu(III) complex, whose emission spectrum is very sharp, was applied for fluorescence detection, and ECL of a boron-dipyrromethene derivative showing relatively sharp spectrum was used for the absorbance measurements.
{"title":"Portable Analytical Detection Systems Based on Light Emitting Devices","authors":"R. Ishimatsu, Eri Kunisawa, Hirosato Shintaku, K. Nakano, T. Imato","doi":"10.23919/ICEP.2019.8733418","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733418","url":null,"abstract":"Portable analytical detection systems based on light emitting devices, organic light-emitting diode (OLED), and electrogenerated chemiluminescence (ECL) are described. The OLED is composed of an Eu(III) complex, whose emission spectrum is very sharp, was applied for fluorescence detection, and ECL of a boron-dipyrromethene derivative showing relatively sharp spectrum was used for the absorbance measurements.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117072400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-04-01DOI: 10.23919/ICEP.2019.8733508
Hirofumi Nogami, Kosuke Komatsutani, T. Hirata, R. Sawada
Laser Doppler blood flowmeter (LDF) is a non-invasive method for measuring micro circulation, and has been developed since 1977. It is necessary to control contact force between a LDF and measurement part (skin surface), in order to obtain accurate blood flow. We suggest new multifunctional sensor modules which can measure both blood flow and contact force. A sensor module has a multi-layer ceramic chip with vertical cavity surface emitting laser (VCSEL), photo diodes, and op-amp circuits, and a hollow shell with a mirror and a lug. Some of incident light penetrates into a finger, and the scattering light, which have biological signal (blood flow) are detected by one photodiode. On the other hand, a photodiode can detect reflecting light from a mirror, which is displaced by a contact force. In this paper, we fabricate multifunctional sensor module and attempt to simultaneously measure the blood flow and contact force.
{"title":"Integrated laser Doppler blood flowing combining optical contact force","authors":"Hirofumi Nogami, Kosuke Komatsutani, T. Hirata, R. Sawada","doi":"10.23919/ICEP.2019.8733508","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733508","url":null,"abstract":"Laser Doppler blood flowmeter (LDF) is a non-invasive method for measuring micro circulation, and has been developed since 1977. It is necessary to control contact force between a LDF and measurement part (skin surface), in order to obtain accurate blood flow. We suggest new multifunctional sensor modules which can measure both blood flow and contact force. A sensor module has a multi-layer ceramic chip with vertical cavity surface emitting laser (VCSEL), photo diodes, and op-amp circuits, and a hollow shell with a mirror and a lug. Some of incident light penetrates into a finger, and the scattering light, which have biological signal (blood flow) are detected by one photodiode. On the other hand, a photodiode can detect reflecting light from a mirror, which is displaced by a contact force. In this paper, we fabricate multifunctional sensor module and attempt to simultaneously measure the blood flow and contact force.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124784265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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