Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626944
B. Oberlin, T. Chung
Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.
{"title":"Product-oriented BGA manufacturability and reliability study","authors":"B. Oberlin, T. Chung","doi":"10.1109/IEMT.1997.626944","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626944","url":null,"abstract":"Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121932097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626906
Y.M. Lee, J. Cho, Y. Sun, N. Kim
Bonding wire heel crack observed in large QFP was studied. From the analysis, it was found that this type of open failure was caused by heel crack at stitch bond during molding. The mold simulation was conducted for quantitative analysis. The software considers the polymerization kinetics of EMC since the mold flow depends on thermal excursion. According to simulation, it was proven that the EMC near gate shrinks with very steep gradient of conversion rate. At this moment the chemical shrinkage of EMC results in the fracture of Au wire due to the excessive tension. The mold simulation analysis coincides with experimental results. Both wire bonding and molding parameters were optimized to solve the heel crack problem. The heel crack resistance could be improved by using a capillary which makes large cross-sectional area of stitch bond. The other solution to suppress the heel crack was to use EMC having a smaller chemical shrinkage. Also an additional improvement was obtained by decreasing molding temperature from 175/spl deg/C to 168/spl deg/C. Conclusively, the chemical shrinkage of EMC is an important property and needs to be reduced to minimize the transfer molding failures, especially for the large body size packages.
{"title":"Heel cracking induced by the steep conversion of EMC in large QFP","authors":"Y.M. Lee, J. Cho, Y. Sun, N. Kim","doi":"10.1109/IEMT.1997.626906","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626906","url":null,"abstract":"Bonding wire heel crack observed in large QFP was studied. From the analysis, it was found that this type of open failure was caused by heel crack at stitch bond during molding. The mold simulation was conducted for quantitative analysis. The software considers the polymerization kinetics of EMC since the mold flow depends on thermal excursion. According to simulation, it was proven that the EMC near gate shrinks with very steep gradient of conversion rate. At this moment the chemical shrinkage of EMC results in the fracture of Au wire due to the excessive tension. The mold simulation analysis coincides with experimental results. Both wire bonding and molding parameters were optimized to solve the heel crack problem. The heel crack resistance could be improved by using a capillary which makes large cross-sectional area of stitch bond. The other solution to suppress the heel crack was to use EMC having a smaller chemical shrinkage. Also an additional improvement was obtained by decreasing molding temperature from 175/spl deg/C to 168/spl deg/C. Conclusively, the chemical shrinkage of EMC is an important property and needs to be reduced to minimize the transfer molding failures, especially for the large body size packages.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127222423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626950
H. Asai, K. Yano, K. Iyogi, N. Iwase, T. Fujiwara
A new structural face-up LSI package has been developed. The package shows low thermal resistance without a heatsink and low inductance, capacitance, and resistance values. The package is thin enough for portable multimedia equipment applications, with a thickness of 0.5 mn (not including ball height). The measured thermal resistance was 11/spl deg/C/W under natural convection without a heatsink. The simulated inductance and capacitance were 6.7 nH and 1.1 pF respectively, and measured resistance was 520 m/spl Omega/ (line length=14.7 mm, width=60 /spl mu/m). The package consists of a resin film and a ceramic substrate. The film is a liquid crystal polymer (LCP) and the substrate is aluminum nitride (AlN). LCP is a suitable material for buried-bump interconnection technology (B2it/sup TM/). AlN has high thermal conductivity and its coefficient of thermal expansion (CTE) is close to that of silicon. Both materials were laminated by an adhesive agent. This material combination provides a thin structure, low thermal resistance, and low LCR which are suitable for portable multimedia electrical equipment. This paper reports the configuration and performance characteristics of this newly developed package.
{"title":"An organic and ceramic laminated BGA package with high thermal and electrical performance characteristics","authors":"H. Asai, K. Yano, K. Iyogi, N. Iwase, T. Fujiwara","doi":"10.1109/IEMT.1997.626950","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626950","url":null,"abstract":"A new structural face-up LSI package has been developed. The package shows low thermal resistance without a heatsink and low inductance, capacitance, and resistance values. The package is thin enough for portable multimedia equipment applications, with a thickness of 0.5 mn (not including ball height). The measured thermal resistance was 11/spl deg/C/W under natural convection without a heatsink. The simulated inductance and capacitance were 6.7 nH and 1.1 pF respectively, and measured resistance was 520 m/spl Omega/ (line length=14.7 mm, width=60 /spl mu/m). The package consists of a resin film and a ceramic substrate. The film is a liquid crystal polymer (LCP) and the substrate is aluminum nitride (AlN). LCP is a suitable material for buried-bump interconnection technology (B2it/sup TM/). AlN has high thermal conductivity and its coefficient of thermal expansion (CTE) is close to that of silicon. Both materials were laminated by an adhesive agent. This material combination provides a thin structure, low thermal resistance, and low LCR which are suitable for portable multimedia electrical equipment. This paper reports the configuration and performance characteristics of this newly developed package.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127853515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626888
L. Mendicino, L. Beu
Motorola has traditionally focused on cost, yield, performance, and logistics as primary drivers for decision-making. In the semiconductor industry, environment, health and safety (EHS) issues have resulted in major modifications of tools and process steps, as well as the addition of environmental controls to the facility, because they are not routinely considered when making process design and manufacturing choices, nor is their impact on cost, yield, and cycle time. Certain business driving forces, such as cost, sustainability of processes/tools, time to market, market access, and market share, are leading Motorola to a cultural change in which EHS impacts must be considered during product and process design; however, design and process engineers have not been able to adequately address these impacts. Motorola's Advanced Process Research and Development Laboratory (APRDL) in the Semiconductor Product Sector (SPS) has recognized this and has established its own environmental group (separate from the site EHS compliance group) to implement a Design for EHS (DFEHS) strategy. The APRDL environmental group works with several project teams to address EHS issues in process development. These teams have been investigating copper metallization, wet cleans processes and tools, and other areas to ensure that the long-term EHS implications are identified and addressed before a process is transferred or a tool set recommended to a manufacturing fab. To empower engineers to consider, on their own, the EHS impacts of their materials and processes at the earliest possible stage, the APRDL environmental group has developed a DFEHS training course. This self-instructed, web-based course targets semiconductor design and process engineers and is available through Motorola University, the corporate training institution. The group has also established a procedure for approving new materials for the development lab in which EHS criteria are included.
{"title":"Addressing environment, health and safety in semiconductor process development","authors":"L. Mendicino, L. Beu","doi":"10.1109/IEMT.1997.626888","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626888","url":null,"abstract":"Motorola has traditionally focused on cost, yield, performance, and logistics as primary drivers for decision-making. In the semiconductor industry, environment, health and safety (EHS) issues have resulted in major modifications of tools and process steps, as well as the addition of environmental controls to the facility, because they are not routinely considered when making process design and manufacturing choices, nor is their impact on cost, yield, and cycle time. Certain business driving forces, such as cost, sustainability of processes/tools, time to market, market access, and market share, are leading Motorola to a cultural change in which EHS impacts must be considered during product and process design; however, design and process engineers have not been able to adequately address these impacts. Motorola's Advanced Process Research and Development Laboratory (APRDL) in the Semiconductor Product Sector (SPS) has recognized this and has established its own environmental group (separate from the site EHS compliance group) to implement a Design for EHS (DFEHS) strategy. The APRDL environmental group works with several project teams to address EHS issues in process development. These teams have been investigating copper metallization, wet cleans processes and tools, and other areas to ensure that the long-term EHS implications are identified and addressed before a process is transferred or a tool set recommended to a manufacturing fab. To empower engineers to consider, on their own, the EHS impacts of their materials and processes at the earliest possible stage, the APRDL environmental group has developed a DFEHS training course. This self-instructed, web-based course targets semiconductor design and process engineers and is available through Motorola University, the corporate training institution. The group has also established a procedure for approving new materials for the development lab in which EHS criteria are included.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126915583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626872
D. He, Nduka Nnamdi (Ndy) Ekere, M. A. Currie
Solder paste is a dense suspension (volume fraction of about 50%) of spherical solder alloy particles in a flux/vehicle system. It is known to exhibit viscoelastic properties and under oscillatory shear, the dynamic viscosity has been shown to decrease as the shear frequency increases. This paper presents experimental results of the effect of sinusoidal vibration on solder paste, and its impact on the performance of the paste printing process. In the first experiment, the solder paste sample was horizontally vibrated inside a cylindrical container. Observations of the sample following vibration showed that a thin liquid rich layer was formed on the surface and at the interface between the container and the paste. In the second experiment the sample was placed on a flat plate and as the plate moved towards a vibration squeegee, the sample was pushed by the squeegee blade to produce a paste roll. In both experiments, the vibration frequency and amplitude were varied to observe their effect.
{"title":"The study of the response of solder pastes under sinusoidal vibration","authors":"D. He, Nduka Nnamdi (Ndy) Ekere, M. A. Currie","doi":"10.1109/IEMT.1997.626872","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626872","url":null,"abstract":"Solder paste is a dense suspension (volume fraction of about 50%) of spherical solder alloy particles in a flux/vehicle system. It is known to exhibit viscoelastic properties and under oscillatory shear, the dynamic viscosity has been shown to decrease as the shear frequency increases. This paper presents experimental results of the effect of sinusoidal vibration on solder paste, and its impact on the performance of the paste printing process. In the first experiment, the solder paste sample was horizontally vibrated inside a cylindrical container. Observations of the sample following vibration showed that a thin liquid rich layer was formed on the surface and at the interface between the container and the paste. In the second experiment the sample was placed on a flat plate and as the plate moved towards a vibration squeegee, the sample was pushed by the squeegee blade to produce a paste roll. In both experiments, the vibration frequency and amplitude were varied to observe their effect.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131022253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626955
R. Uzsoy, Cheng-Shuo Wang
We describe a prototype decomposition procedure which uses global information on shop status to develop improved schedules for wafer fabrication facilities. The system studied contains reentrant product flows, multiple products and both unit capacity and batch machines. Preliminary experiments show that the decomposition procedure yields significantly better schedules in reasonable CPU times.
{"title":"Decomposition procedures for global scheduling of complex job shops","authors":"R. Uzsoy, Cheng-Shuo Wang","doi":"10.1109/IEMT.1997.626955","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626955","url":null,"abstract":"We describe a prototype decomposition procedure which uses global information on shop status to develop improved schedules for wafer fabrication facilities. The system studied contains reentrant product flows, multiple products and both unit capacity and batch machines. Preliminary experiments show that the decomposition procedure yields significantly better schedules in reasonable CPU times.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122055588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626932
T. Eskridge, M. DeYong, John W. Grace, Jeff E. Newberry
The need for automated populated board inspection stems from the desire to reduce the number of defective board escapes, and to improve the yield of the production line. There are two main goals of populated board inspection: (1) to detect and classify defects, (2) provide process control information. Although at first glance the goals may appear to be independent, they are actually very closely related through the technology used to perform populated board inspection. The current generation of inspection technology typically trades classification accuracy-and hence the ability to provide meaningful process control information-with detection ability and ease of implementation. So while the current generation of technologies may be able to detect a wide range of anomalies on the populated board, detection is not the same as classification. Detection without robust classification will not lead to improved production yields because the information needed to improve the process will not be collected. In this paper we briefly overview the current generation of inspection technology, presenting its weaknesses with respect to the two stated goals. In order to address these goals, a new approach to populated board inspection is described.
{"title":"Speeding populated board inspection: a new technology","authors":"T. Eskridge, M. DeYong, John W. Grace, Jeff E. Newberry","doi":"10.1109/IEMT.1997.626932","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626932","url":null,"abstract":"The need for automated populated board inspection stems from the desire to reduce the number of defective board escapes, and to improve the yield of the production line. There are two main goals of populated board inspection: (1) to detect and classify defects, (2) provide process control information. Although at first glance the goals may appear to be independent, they are actually very closely related through the technology used to perform populated board inspection. The current generation of inspection technology typically trades classification accuracy-and hence the ability to provide meaningful process control information-with detection ability and ease of implementation. So while the current generation of technologies may be able to detect a wide range of anomalies on the populated board, detection is not the same as classification. Detection without robust classification will not lead to improved production yields because the information needed to improve the process will not be collected. In this paper we briefly overview the current generation of inspection technology, presenting its weaknesses with respect to the two stated goals. In order to address these goals, a new approach to populated board inspection is described.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122467761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626939
X. Dai, P. Ho
An experimental technique of in-situ moire interferometry has been applied to investigate the thermo-mechanical deformations induced by to thermal loading in an underfilled flip-chip-on-board packaging. Thermo-mechanical deformations and shear strains generated from CTE mismatch are determined experimentally as a function of thermal loading. Semi-quantitative agreement is established between measured and FEA-simulated deformations. The results show that moire interferometry with in-situ thermal loading capabilities is effective for experimental studies of electronic packaging. Through this study, the role of underfill in reducing shear strains over solder bumps and thus in improving solder shear fatigue reliability is clarified. A methodology is demonstrated to differentiate effects of underfill properties on packaging thermo-mechanical performance.
{"title":"Thermo-mechanical deformation of underfilled flip-chip packaging","authors":"X. Dai, P. Ho","doi":"10.1109/IEMT.1997.626939","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626939","url":null,"abstract":"An experimental technique of in-situ moire interferometry has been applied to investigate the thermo-mechanical deformations induced by to thermal loading in an underfilled flip-chip-on-board packaging. Thermo-mechanical deformations and shear strains generated from CTE mismatch are determined experimentally as a function of thermal loading. Semi-quantitative agreement is established between measured and FEA-simulated deformations. The results show that moire interferometry with in-situ thermal loading capabilities is effective for experimental studies of electronic packaging. Through this study, the role of underfill in reducing shear strains over solder bumps and thus in improving solder shear fatigue reliability is clarified. A methodology is demonstrated to differentiate effects of underfill properties on packaging thermo-mechanical performance.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"454 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123023995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626880
A. Krauss, E. Kamen, C. M. Chng, A. C. Thé
Material deposition is one of the repeated, and important, steps in electronics manufacturing. Meniscus coating is a low-waste technique that may be used in applications where spin coating is found. The process exhibits time-varying behavior and thus utilizing feedback control methods to compensate for this behavior is desirable. This paper describes the large-area meniscus coating process, explains modeling techniques used and presents results from closed-loop experiments. Feedback in the form of Kalman filtering and EWMA filtering is contrasted, with Kalman Filter techniques improving performance considerably. These process control techniques require no additional hardware and therefore very little cost is associated with implementation of these feedback algorithms.
{"title":"Recipe generation for large-area meniscus coating using Kalman filter estimation","authors":"A. Krauss, E. Kamen, C. M. Chng, A. C. Thé","doi":"10.1109/IEMT.1997.626880","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626880","url":null,"abstract":"Material deposition is one of the repeated, and important, steps in electronics manufacturing. Meniscus coating is a low-waste technique that may be used in applications where spin coating is found. The process exhibits time-varying behavior and thus utilizing feedback control methods to compensate for this behavior is desirable. This paper describes the large-area meniscus coating process, explains modeling techniques used and presents results from closed-loop experiments. Feedback in the form of Kalman filtering and EWMA filtering is contrasted, with Kalman Filter techniques improving performance considerably. These process control techniques require no additional hardware and therefore very little cost is associated with implementation of these feedback algorithms.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114338062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1997-10-13DOI: 10.1109/IEMT.1997.626925
M. Nguyen, I. Chien
A new type of die attach material based on a modified olefin thermoset polymer has been developed. Due to its hydrophobic molecular structure, moisture absorption is inherently very low. For example, it absorbs less than 0.05% moisture at 85/spl deg/C/85% RH/168 hrs. Even in HAST test (150/spl deg/C/85% RH/168 hrs.), moisture content is only 0.1%. The olefinic polymer is formulated as a low stress, electrical and thermally conducting paste adhesive. Its other principal features include good processability, less resin bleed and low temperature cure. The new die attach candidates were evaluated using 208 LD PQFP packages with standard epoxy molding compounds. This type of package passed moisture reliability tests at level 3. At JEDEC level 1, there were still package cracks and delaminations at the mold compound interfaces. However, no die attach delamination was observed. These studies clearly demonstrated the need for replacing conventional epoxies with low moisture absorbing polymers for die attachment and encapsulation in order to produce moisture insensitive packages. In summary, the new olefinic thermoset adhesives have shown promise for many die attach applications. These materials will provide important process and reliability improvement for advanced device packaging.
{"title":"Development of an ultra low moisture polymer adhesive for die attach applications","authors":"M. Nguyen, I. Chien","doi":"10.1109/IEMT.1997.626925","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626925","url":null,"abstract":"A new type of die attach material based on a modified olefin thermoset polymer has been developed. Due to its hydrophobic molecular structure, moisture absorption is inherently very low. For example, it absorbs less than 0.05% moisture at 85/spl deg/C/85% RH/168 hrs. Even in HAST test (150/spl deg/C/85% RH/168 hrs.), moisture content is only 0.1%. The olefinic polymer is formulated as a low stress, electrical and thermally conducting paste adhesive. Its other principal features include good processability, less resin bleed and low temperature cure. The new die attach candidates were evaluated using 208 LD PQFP packages with standard epoxy molding compounds. This type of package passed moisture reliability tests at level 3. At JEDEC level 1, there were still package cracks and delaminations at the mold compound interfaces. However, no die attach delamination was observed. These studies clearly demonstrated the need for replacing conventional epoxies with low moisture absorbing polymers for die attachment and encapsulation in order to produce moisture insensitive packages. In summary, the new olefinic thermoset adhesives have shown promise for many die attach applications. These materials will provide important process and reliability improvement for advanced device packaging.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133240496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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