Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5515249
Tingting Chen, Zheying Li
A low power architecture design method is brought forward by this paper based on DFG (Data Flow Graphic) model. Through this method, a DFG model is extracted from the logic model of a circuit or a system and is used to optimize the circuit architecture for reducing the power consumption of circuit. In this paper, the data transmission process of USB2.0 is taken as an example to prove the correctness of this low power architecture design method.
{"title":"A low power architecture design method based on DFG model","authors":"Tingting Chen, Zheying Li","doi":"10.1109/ICIEA.2010.5515249","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5515249","url":null,"abstract":"A low power architecture design method is brought forward by this paper based on DFG (Data Flow Graphic) model. Through this method, a DFG model is extracted from the logic model of a circuit or a system and is used to optimize the circuit architecture for reducing the power consumption of circuit. In this paper, the data transmission process of USB2.0 is taken as an example to prove the correctness of this low power architecture design method.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127658842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5515161
K. Hwu, K. Huang, Y. H. Chen
In this paper, a two-stage-cascaded scheme is presented to charge two Li batteries. The first stage consists of a boost converter which is used to step up the input voltage to some value and takes voltage-mode control, whereas the second stage is comprised of two paralleled buck converters which are used to charge two Li batteries under voltage-mode control and constant current control. Above all, the second stage takes interleaved control and hence the corresponding output current ripple of the boost converter is with double switching frequency and is decreased so that the life of the output capacitor of this stage is upgraded. Some experimental results, based on Cyclone II FPGA used as a control kernel, are provided to verify the proposed topology.
本文提出了一种二级级联充电方案。第一级由升压变换器组成，用于将输入电压升压到某个值并进行电压模式控制，而第二级由两个并联降压变换器组成，用于在电压模式控制和恒流控制下为两个锂电池充电。首先，第二级采用交错控制，因此升压变换器对应的输出电流纹波为双开关频率，并减小，从而提高了该级输出电容的寿命。基于Cyclone II FPGA作为控制内核，给出了一些实验结果来验证所提出的拓扑结构。
{"title":"Two-stage-cascaded Li-battery charger with current ripple considered","authors":"K. Hwu, K. Huang, Y. H. Chen","doi":"10.1109/ICIEA.2010.5515161","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5515161","url":null,"abstract":"In this paper, a two-stage-cascaded scheme is presented to charge two Li batteries. The first stage consists of a boost converter which is used to step up the input voltage to some value and takes voltage-mode control, whereas the second stage is comprised of two paralleled buck converters which are used to charge two Li batteries under voltage-mode control and constant current control. Above all, the second stage takes interleaved control and hence the corresponding output current ripple of the boost converter is with double switching frequency and is decreased so that the life of the output capacitor of this stage is upgraded. Some experimental results, based on Cyclone II FPGA used as a control kernel, are provided to verify the proposed topology.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131883434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The performance of the induction machine driving system with indirect vector control can easily be influenced by the effects of parameter mismatch and eddy current, which result that the magnetizing component of stator current can't align with the rotor flux vector, especially in the range of high speed and flux weakening. In order to achieve accurate rotor flux orientation, a novel control strategy based on the voltage controller is proposed in this paper. The relation between the phase voltage of the induction machine and the accuracy of the field orientation is analyzed and a voltage controller is used to eliminate the angle between the d-axis and the rotor flux vector due to the incorrect orientation. The simulation results show that the performance of the driving system in the whole speed region can be improved obviously. So, the robustness of the control system to the motor parameters, especially to the rotor time constant is raised highly.
{"title":"A rotor flux oriented scheme of induction machine based on voltage controller","authors":"Minglei Zhou, Ke-yin Wei, Chenchen Wang, X. You, Jian Wang, Liwei Zhang","doi":"10.1109/ICIEA.2010.5516940","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5516940","url":null,"abstract":"The performance of the induction machine driving system with indirect vector control can easily be influenced by the effects of parameter mismatch and eddy current, which result that the magnetizing component of stator current can't align with the rotor flux vector, especially in the range of high speed and flux weakening. In order to achieve accurate rotor flux orientation, a novel control strategy based on the voltage controller is proposed in this paper. The relation between the phase voltage of the induction machine and the accuracy of the field orientation is analyzed and a voltage controller is used to eliminate the angle between the d-axis and the rotor flux vector due to the incorrect orientation. The simulation results show that the performance of the driving system in the whole speed region can be improved obviously. So, the robustness of the control system to the motor parameters, especially to the rotor time constant is raised highly.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127062237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5515233
Chung-Chuan Cheng, J. Taur, T. Hsieh, C. Tao
Fluorescence patterns at present are usually examined laboriously by experienced physicians through manually inspecting the slides with the help of a microscope. The readings in indirect immunofluorescene (IIF) usually suffer from the disadvantages such as the inter-observer variability that limits the reproducibility. This study proposes a segmented method based on the watershed algorithm to detect the edges of HEp-2 cells automatically. Experimental results show that the system has an overall correct rate of 92.81%. This system can be used as a preprocessing system for an automatic HEp-2 cells identification system.
{"title":"Segmentation of anti-nuclear antibody images based on the watershed approach","authors":"Chung-Chuan Cheng, J. Taur, T. Hsieh, C. Tao","doi":"10.1109/ICIEA.2010.5515233","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5515233","url":null,"abstract":"Fluorescence patterns at present are usually examined laboriously by experienced physicians through manually inspecting the slides with the help of a microscope. The readings in indirect immunofluorescene (IIF) usually suffer from the disadvantages such as the inter-observer variability that limits the reproducibility. This study proposes a segmented method based on the watershed algorithm to detect the edges of HEp-2 cells automatically. Experimental results show that the system has an overall correct rate of 92.81%. This system can be used as a preprocessing system for an automatic HEp-2 cells identification system.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115481206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5515469
M. Lehmpfuhl, Hao Chongyang, A. Hess, M. Gaudnek, Michael Sibila
The exact knowledge of the blood vessel geometry plays an important role, not only in clinical applications (stroke diagnosis, detection of stenosis), but also for deeper analysis of hemodynamic functional data, such as fMRI strongly depending on the vessel structure. Such vessel geometries can be obtained by different MR angiographic. First we present algorithms for automatic vessel reconstructions from different MRA angiographic modalities. Moreover, we show that simulations using computational fluid dynamics (CFD) can be used to validate the vessel geometry, reconstructed from time-of-flight (TOF) angiograms. CFD simulations are based on phase-contrast angiography (PC-MRA) data, since these data contain rheological information (phases) besides merely amplitudes as is the case for TOF measurements. Parts of the rat brain vessel system are carefully modeled consisting of a main tube and second order branches. By analyzing velocity changes up and downstream of bifurcations, we show that CFD can be used to help detecting missing vessels in the TOF based reconstruction. We demonstrated this by artificially deleting a branch from the reconstruction and compared the flow in both resulting CFD simulations. Finally the simulations help to understand the effects of secondary branches on the flow in the main tube.
{"title":"Examination of blood flow in rat brain vessels using fluid dynamic simulation and phase contrast magnetic resonance angiography","authors":"M. Lehmpfuhl, Hao Chongyang, A. Hess, M. Gaudnek, Michael Sibila","doi":"10.1109/ICIEA.2010.5515469","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5515469","url":null,"abstract":"The exact knowledge of the blood vessel geometry plays an important role, not only in clinical applications (stroke diagnosis, detection of stenosis), but also for deeper analysis of hemodynamic functional data, such as fMRI strongly depending on the vessel structure. Such vessel geometries can be obtained by different MR angiographic. First we present algorithms for automatic vessel reconstructions from different MRA angiographic modalities. Moreover, we show that simulations using computational fluid dynamics (CFD) can be used to validate the vessel geometry, reconstructed from time-of-flight (TOF) angiograms. CFD simulations are based on phase-contrast angiography (PC-MRA) data, since these data contain rheological information (phases) besides merely amplitudes as is the case for TOF measurements. Parts of the rat brain vessel system are carefully modeled consisting of a main tube and second order branches. By analyzing velocity changes up and downstream of bifurcations, we show that CFD can be used to help detecting missing vessels in the TOF based reconstruction. We demonstrated this by artificially deleting a branch from the reconstruction and compared the flow in both resulting CFD simulations. Finally the simulations help to understand the effects of secondary branches on the flow in the main tube.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114619145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5515601
He Ketai, Li Li
Remote diagnosis system is an effective way to forecast the trends of tobacco diseases and insect pests. The system is a B/S application. It includes User side, Server side and Data collection module. Tobacco farmer can find the prevention and cure methods of tobacco diseases and insect pests with the system and the application can diagnose tobacco diseases and insect pests by images shot by the wireless sensors or by farmers. With the history Data and expert knowledge, the system can forecast the develop trend of the tobacco diseases and insect pests.
{"title":"The design of the remote diagnosis system of the main tobacco diseases and insect pests","authors":"He Ketai, Li Li","doi":"10.1109/ICIEA.2010.5515601","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5515601","url":null,"abstract":"Remote diagnosis system is an effective way to forecast the trends of tobacco diseases and insect pests. The system is a B/S application. It includes User side, Server side and Data collection module. Tobacco farmer can find the prevention and cure methods of tobacco diseases and insect pests with the system and the application can diagnose tobacco diseases and insect pests by images shot by the wireless sensors or by farmers. With the history Data and expert knowledge, the system can forecast the develop trend of the tobacco diseases and insect pests.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115028041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.
{"title":"Application of image processing to wafer probe mark area calculation","authors":"Chau‐Shing Wang, Wen-Ren Yang, Cheng-Yen Chung, Wen-Liang Chang","doi":"10.1109/ICIEA.2010.5516928","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5516928","url":null,"abstract":"This paper presents an image processing approach that calculates the probe mark area on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this paper, we present an imaging processing approach to calculate the probe mark area utilizing high magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to traditional methods.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"38 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116789421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5515818
Jiann-Jong Chen, Bo-Han Hwang, Che-Min Kung, Weiyu Tai, Yuh-Shyan Hwang
A new single-inductor quadratic buck converter using average-current-mode control without slope-compensation is proposed in this paper. The average-current-mode technology minimizes several power-management problems, such as efficiency, EMI, size, transient response, design complexity, and cost. In DC/DC conversion applications that require a wide range of input and/or output voltages, conventional PWM buck converter topologies always operate at exceptionally low duty ratios, which limit the operation to the lower switching frequencies due to minimum ON-time of the transistor switch. The DC voltage conversion ratio of the proposed converter has a quadratic dependence on duty cycle, producing an extensive step-down; therefore, the high conversion ratio is achieved. This scheme employs an inner loop for current gain and an outer loop for PID-controller. The proposed buck converter only uses an inductor, two capacitors and single control circuit to achieve quadratic conversion ratio, therefore, an inductor and a control circuit is reduced. The advantages of the proposed quadratic buck converter are fast transient response, no use for slope-compensation, high-conversion-ratio, and an inductor reduction. The prototype of the proposed quadratic buck converter has been fabricated with TSMC 0.35µm 2P4M CMOS processes. The total chip area is 1.917 × 2.334 mm2.
{"title":"A new single-inductor quadratic buck converter using average-current-mode control without slope-compensation","authors":"Jiann-Jong Chen, Bo-Han Hwang, Che-Min Kung, Weiyu Tai, Yuh-Shyan Hwang","doi":"10.1109/ICIEA.2010.5515818","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5515818","url":null,"abstract":"A new single-inductor quadratic buck converter using average-current-mode control without slope-compensation is proposed in this paper. The average-current-mode technology minimizes several power-management problems, such as efficiency, EMI, size, transient response, design complexity, and cost. In DC/DC conversion applications that require a wide range of input and/or output voltages, conventional PWM buck converter topologies always operate at exceptionally low duty ratios, which limit the operation to the lower switching frequencies due to minimum ON-time of the transistor switch. The DC voltage conversion ratio of the proposed converter has a quadratic dependence on duty cycle, producing an extensive step-down; therefore, the high conversion ratio is achieved. This scheme employs an inner loop for current gain and an outer loop for PID-controller. The proposed buck converter only uses an inductor, two capacitors and single control circuit to achieve quadratic conversion ratio, therefore, an inductor and a control circuit is reduced. The advantages of the proposed quadratic buck converter are fast transient response, no use for slope-compensation, high-conversion-ratio, and an inductor reduction. The prototype of the proposed quadratic buck converter has been fabricated with TSMC 0.35µm 2P4M CMOS processes. The total chip area is 1.917 × 2.334 mm2.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116482237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5516784
Zhu Yi, Kaican Wang, L. Kang, Zhai Guofu, Shujuan Wang
As a result of the development of higher speeds and heavier loads of rail networks, rail defects have been more serious than ever before. Current piezoelectric ultrasonic detection devices are often inadequate for rail inspection, due to high misjudgement or undetected error rate, and complex structure. This paper introduces a novel rail detection system. The system is based on multi-channel electromagnetic acoustic transducers under the control of DSP. Cumulative average and cross-correlation algorithms are realized by FPGA, exploiting the advantages of FPGA in high calculating speed and designing flexibility. Combining EMATs with FPGA, the system is free of couplant, compact in structure and low use-cost, and can realize an overall detection of rails.
{"title":"Rail flaw detection system based on electromagnetic acoustic technique","authors":"Zhu Yi, Kaican Wang, L. Kang, Zhai Guofu, Shujuan Wang","doi":"10.1109/ICIEA.2010.5516784","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5516784","url":null,"abstract":"As a result of the development of higher speeds and heavier loads of rail networks, rail defects have been more serious than ever before. Current piezoelectric ultrasonic detection devices are often inadequate for rail inspection, due to high misjudgement or undetected error rate, and complex structure. This paper introduces a novel rail detection system. The system is based on multi-channel electromagnetic acoustic transducers under the control of DSP. Cumulative average and cross-correlation algorithms are realized by FPGA, exploiting the advantages of FPGA in high calculating speed and designing flexibility. Combining EMATs with FPGA, the system is free of couplant, compact in structure and low use-cost, and can realize an overall detection of rails.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117242221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-06-15DOI: 10.1109/ICIEA.2010.5517072
Zhong Huang, Zhongqiang Cheng, Mingguang Wu
Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. In this paper, a novel substrate technology for an effective solution to two major problems that affect the heat dissipation performance has been introduced. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven operational temperature of LED arrays; (2) The high operational temperature caused by the accumulated heat. This new type of Vapor chamber substrate printed circuit board (PCB) consists of a thermally-conductive Vapor chamber substrate which is insulated by a dielectric layer of aluminum nitride (ALN). Circuit is formed on the dielectric layer with pulse magnetron sputtering technology. Experimental results in the form of average temperature show that the vapor chamber substrate PCB can improve the temperature uniformity. And good thermal performance for high power LED arrays can also be achieved.
{"title":"Heat Dissipation for LED Lighting: Vapor Chamber Substrate Printed Circuit Board","authors":"Zhong Huang, Zhongqiang Cheng, Mingguang Wu","doi":"10.1109/ICIEA.2010.5517072","DOIUrl":"https://doi.org/10.1109/ICIEA.2010.5517072","url":null,"abstract":"Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. In this paper, a novel substrate technology for an effective solution to two major problems that affect the heat dissipation performance has been introduced. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven operational temperature of LED arrays; (2) The high operational temperature caused by the accumulated heat. This new type of Vapor chamber substrate printed circuit board (PCB) consists of a thermally-conductive Vapor chamber substrate which is insulated by a dielectric layer of aluminum nitride (ALN). Circuit is formed on the dielectric layer with pulse magnetron sputtering technology. Experimental results in the form of average temperature show that the vapor chamber substrate PCB can improve the temperature uniformity. And good thermal performance for high power LED arrays can also be achieved.","PeriodicalId":234296,"journal":{"name":"2010 5th IEEE Conference on Industrial Electronics and Applications","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124739121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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