Yttrium aluminum garnet (YAG) wafers are critical components of high-energy thin-film lasers, requiring precise processing to achieve superior surface quality for higher damage thresholds. Ultra-precision grinding provides an efficient method to thin the wafers and obtain low-damage surfaces, reducing subsequent processing time and costs. However, research regarding the impact of grinding damage on the minimum chip thickness (MCT) and subsurface damage (SSD) of YAG wafers remains insufficient. In this research, variable and constant load scratch tests were conducted on pre-ground and pre-polished YAG wafer. The surface topography and SSD of the scratches was examined. The MCT of these surfaces were determined based on the friction coefficient and surface morphology, and the results were validated through grinding experiments. The findings reveal that, under identical normal loads, scratches on the polished surface exhibit a greater tendency for chip formation. Grinding damage substantially increases the MCT compared to the polished surface. Material removal becomes unfeasible as the grain cutting depth is insufficient to initiate the MCT during grinding. Additionally, the SSD depth of scratch on the surface with grinding damage is considerably lower than that on the polished one. Furthermore, to clarify the impact of grinding damage on the MCT and SSD depth, the stress field was calculated. The findings of this work could provide crucial support for optimizing grinding parameters and predicting grinding forces in hard-brittle materials.
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