Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250065
G. Antonini, J. Drewniak, M. Leone, A. Orlandi, V. Ricchiuti
Large and complex ASICs are source of propagating noise inside the powerbus planes. A lumped noise source model is proposed and validated by means of a statistics based method.
{"title":"Statistical approach to the EMI modeling of large ASICs by a single noise-current source","authors":"G. Antonini, J. Drewniak, M. Leone, A. Orlandi, V. Ricchiuti","doi":"10.1109/EPEP.2003.1250065","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250065","url":null,"abstract":"Large and complex ASICs are source of propagating noise inside the powerbus planes. A lumped noise source model is proposed and validated by means of a statistics based method.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125342533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250036
D. de Araujo, J. Diepenbrock, M. Cases, N. Pham
As the demand for higher performance increases the operating frequencies, the complexity and sophistication of interface designs are increased to enable operation of high speed links in imperfect, lossy, and cost competitive environments. This paper investigates three equalization methods for high speed differential serial links: transmitter equalization, discrete equalization, and distributed cable equalization. The performance, advantages, and tradeoffs among the methods is examined.
{"title":"Transmitter and channel equalization for high-speed server interconnects","authors":"D. de Araujo, J. Diepenbrock, M. Cases, N. Pham","doi":"10.1109/EPEP.2003.1250036","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250036","url":null,"abstract":"As the demand for higher performance increases the operating frequencies, the complexity and sophistication of interface designs are increased to enable operation of high speed links in imperfect, lossy, and cost competitive environments. This paper investigates three equalization methods for high speed differential serial links: transmitter equalization, discrete equalization, and distributed cable equalization. The performance, advantages, and tradeoffs among the methods is examined.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121494976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250040
Joong-Ho Kim, Dong-ho Han
This paper presents a hybrid method that combines measurements, electromagnetic (EM) numerical tools, and extrapolation techniques for accurate modeling of lossy multi-transmission lines over tens of gigahertz (GHz) ranges. The parameters of the RLGC model are made up of the frequency-dependent characteristic impedance and the propagation constant, which are de-embedded from measured scattering (S) matrices of two transmission lines of different lengths and an extrapolation technique. By combining the extracted RLGC parameters with an EM tool, the relative permittivity and loss tangent of a dielectric substrate and the effective conductivity of a conductor for considering the surface resistivity due to skin effect and surface roughness are determined accurately. Multiconductor transmission lines are simulated using tabular W-element models based on frequency-dependent RLGC parameters.
{"title":"Hybrid method for frequency-dependent lossy coupled transmission line characterization and modeling","authors":"Joong-Ho Kim, Dong-ho Han","doi":"10.1109/EPEP.2003.1250040","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250040","url":null,"abstract":"This paper presents a hybrid method that combines measurements, electromagnetic (EM) numerical tools, and extrapolation techniques for accurate modeling of lossy multi-transmission lines over tens of gigahertz (GHz) ranges. The parameters of the RLGC model are made up of the frequency-dependent characteristic impedance and the propagation constant, which are de-embedded from measured scattering (S) matrices of two transmission lines of different lengths and an extrapolation technique. By combining the extracted RLGC parameters with an EM tool, the relative permittivity and loss tangent of a dielectric substrate and the effective conductivity of a conductor for considering the surface resistivity due to skin effect and surface roughness are determined accurately. Multiconductor transmission lines are simulated using tabular W-element models based on frequency-dependent RLGC parameters.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124428188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250050
I. Stievano, F. Canavero, I. Maio
The properties of common behavioral macromodels for single ended CMOS integrated circuits output buffers are discussed with the aim of providing criteria for an effective use of possible modeling options.
{"title":"On the behavioral modeling of integrated circuit output buffers","authors":"I. Stievano, F. Canavero, I. Maio","doi":"10.1109/EPEP.2003.1250050","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250050","url":null,"abstract":"The properties of common behavioral macromodels for single ended CMOS integrated circuits output buffers are discussed with the aim of providing criteria for an effective use of possible modeling options.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127073706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250008
T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink
The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results show a very good agreement.
{"title":"Determination of frequency dependent transmission line parameters on product related on chip test line structures using S-parameter measurements","authors":"T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink","doi":"10.1109/EPEP.2003.1250008","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250008","url":null,"abstract":"The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results show a very good agreement.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117017422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250014
H. Tsai
In this paper, we present the core switching noise analysis of the power distribution system (PDS) for a signal processor on a card. The SPEED2000, a SPICE and full-wave based simulation tool is used to study the frequency and transient responses of the core switching noise. The correlation between the result in frequency domain and time domain is discussed in detail. The frequency responses of the on-chip switching current and package current are introduced to illustrate that the noise level caused by the high impedance of the PDS is also frequency dependent.
{"title":"Impact of high impedance mid-frequency noise on power delivery","authors":"H. Tsai","doi":"10.1109/EPEP.2003.1250014","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250014","url":null,"abstract":"In this paper, we present the core switching noise analysis of the power distribution system (PDS) for a signal processor on a card. The SPEED2000, a SPICE and full-wave based simulation tool is used to study the frequency and transient responses of the core switching noise. The correlation between the result in frequency domain and time domain is discussed in detail. The frequency responses of the on-chip switching current and package current are introduced to illustrate that the noise level caused by the high impedance of the PDS is also frequency dependent.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131170643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250026
I. Balk
Modern trends in simulation of large microelectronics systems has introduced the necessity for development of fast and robust nonlinear model order algorithms. This paper discusses polynomial selection in conjunction with piecewise polynomial model order reduction. The advantage of mean value convergence over pointwise convergence is shown in respect to input function expansion.
{"title":"Notes on polynomial selection for piecewise polynomial model order reduction [nonlinear systems]","authors":"I. Balk","doi":"10.1109/EPEP.2003.1250026","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250026","url":null,"abstract":"Modern trends in simulation of large microelectronics systems has introduced the necessity for development of fast and robust nonlinear model order algorithms. This paper discusses polynomial selection in conjunction with piecewise polynomial model order reduction. The advantage of mean value convergence over pointwise convergence is shown in respect to input function expansion.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"190 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124215937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250042
A. Engin, W. John, G. Sommer, W. Mathis
A multiconductor transmission line model for stripline structures is derived, which can represent the interaction between the signal lines and the power planes. The advantages of the proposed model over an existing alternative model are discussed.
{"title":"Modeling of non-ideal planes in stripline structures","authors":"A. Engin, W. John, G. Sommer, W. Mathis","doi":"10.1109/EPEP.2003.1250042","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250042","url":null,"abstract":"A multiconductor transmission line model for stripline structures is derived, which can represent the interaction between the signal lines and the power planes. The advantages of the proposed model over an existing alternative model are discussed.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114224448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250011
Pingshan Wang, E. Kan
High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.
{"title":"Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids","authors":"Pingshan Wang, E. Kan","doi":"10.1109/EPEP.2003.1250011","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250011","url":null,"abstract":"High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130609816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2003-12-08DOI: 10.1109/EPEP.2003.1250061
M. Kobrinsky, S. Chakravarty, D. Jiao, M. Harmes, S. List, M. Mazumder
Since advanced microprocessors are designed based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and fullwave simulation tools, for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the trade-offs between accuracy and computation expenses for a large variety of cases.
{"title":"Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters","authors":"M. Kobrinsky, S. Chakravarty, D. Jiao, M. Harmes, S. List, M. Mazumder","doi":"10.1109/EPEP.2003.1250061","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250061","url":null,"abstract":"Since advanced microprocessors are designed based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and fullwave simulation tools, for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the trade-offs between accuracy and computation expenses for a large variety of cases.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132361301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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