Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688361
M. Obien, A. Hierlemann, U. Frey
High-density microelectrode arrays (HDMEAs) provide the capability to measure extracellular electric potential from brain slices and dissociated cell cultures at high spatiotemporal resolution, which is attractive for neuroscience. Since the HDMEA enables to record the activity of single neurons at sub-cellular resolution, a combination with intracellular recording techniques, such as patch clamp, will allow for new in vitro experiments. Such combination technique requires precise localization of both the cell of interest and the glass micropipette (GM) with respect to the HDMEA. Here, we present a methodology to locate the three-dimensional (3D) position of a GM on the HDMEA without the use of an optical microscope. For the (x, y) position, the achieved accuracy is (±2μm, ±5μm), which is less than the electrode pitch of 18μm. For the z-position, the obtained accuracy is ±2μm for distances of 5-50μm between the GM tip and the HDMEA surface. We also observed that variations in size of GM tips and HDMEA electrodes have minimal effects on the blind localization performance. This approach shows the feasibility of automated navigation of a GM atop the HDMEA to patch a single cell in vitro.
{"title":"Factors affecting blind localization of a glass micropipette using a high-density microelectrode array","authors":"M. Obien, A. Hierlemann, U. Frey","doi":"10.1109/ICSENS.2013.6688361","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688361","url":null,"abstract":"High-density microelectrode arrays (HDMEAs) provide the capability to measure extracellular electric potential from brain slices and dissociated cell cultures at high spatiotemporal resolution, which is attractive for neuroscience. Since the HDMEA enables to record the activity of single neurons at sub-cellular resolution, a combination with intracellular recording techniques, such as patch clamp, will allow for new in vitro experiments. Such combination technique requires precise localization of both the cell of interest and the glass micropipette (GM) with respect to the HDMEA. Here, we present a methodology to locate the three-dimensional (3D) position of a GM on the HDMEA without the use of an optical microscope. For the (x, y) position, the achieved accuracy is (±2μm, ±5μm), which is less than the electrode pitch of 18μm. For the z-position, the obtained accuracy is ±2μm for distances of 5-50μm between the GM tip and the HDMEA surface. We also observed that variations in size of GM tips and HDMEA electrodes have minimal effects on the blind localization performance. This approach shows the feasibility of automated navigation of a GM atop the HDMEA to patch a single cell in vitro.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121400807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688462
E. Yilmaz, D. Bindel
Solid-wave gyroscopes are symmetric resonators that sense rotation by measuring how Coriolis forces perturb a degenerate mode pair. The idealized dynamics of these devices are described by ODE models of two identical oscillators coupled by a perturbation due to rotation. In miniaturized solid-wave gyroscopes, geometric distortions due to imperfect fabrication also perturb the dynamics, and this limits sensing accuracy. In this work, we describe how geometric imperfections affect the dynamics of solid-wave gyroscopes. We also use selection rules both to find qualitative information about what types of geometry perturbations most affect sensor performance and to accelerate computations.
{"title":"Effects of imperfections on solid-wave gyroscope dynamics","authors":"E. Yilmaz, D. Bindel","doi":"10.1109/ICSENS.2013.6688462","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688462","url":null,"abstract":"Solid-wave gyroscopes are symmetric resonators that sense rotation by measuring how Coriolis forces perturb a degenerate mode pair. The idealized dynamics of these devices are described by ODE models of two identical oscillators coupled by a perturbation due to rotation. In miniaturized solid-wave gyroscopes, geometric distortions due to imperfect fabrication also perturb the dynamics, and this limits sensing accuracy. In this work, we describe how geometric imperfections affect the dynamics of solid-wave gyroscopes. We also use selection rules both to find qualitative information about what types of geometry perturbations most affect sensor performance and to accelerate computations.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126580451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688389
K. Yamashita, Hikaru Tanaka, Yi Yang, M. Noda
Sensitivity of piezoelectric ultrasonic microsensors has been improved through a novel buckling control technique of the diaphragms of which upward buckling yields higher sensitivity than downward one. The diaphragms have compressive-and tensile-stressed layers, and a fabrication process has been developed to optimize the stress balance to generate an upward buckling moment. The fabricated sensors have yielded upward-buckled diaphragms in 92% of 196 ones on a wafer and an improved sensitivity to 6.7 times on average.
{"title":"Sensitivity-enhanced ultrasonic microsensors on buckled diaphragms through stress balance control of multilayered structure","authors":"K. Yamashita, Hikaru Tanaka, Yi Yang, M. Noda","doi":"10.1109/ICSENS.2013.6688389","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688389","url":null,"abstract":"Sensitivity of piezoelectric ultrasonic microsensors has been improved through a novel buckling control technique of the diaphragms of which upward buckling yields higher sensitivity than downward one. The diaphragms have compressive-and tensile-stressed layers, and a fabrication process has been developed to optimize the stress balance to generate an upward buckling moment. The fabricated sensors have yielded upward-buckled diaphragms in 92% of 196 ones on a wafer and an improved sensitivity to 6.7 times on average.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125920702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688453
Ganquan Song, Rishabh M. Shetty, Haixin Zhu, Shashanka Ashili, Liqiang Zhang, Grace Kim, Andrew Shabilla, Wacey Teller, Q. Mei, L. Kelbauskas, Yanqing Tian, Hong Wang, Roger H. Johnson, D. Meldrum
We present the design, fabrication and characterization of multiple micro-pocket lid arrays used in live single cell metabolic analysis. In previous work we reported a platform for quantifying single cell oxygen consumption rates realized using a fused silica deep wet etching process. Here we extend that work to a dual-depth wet etching process for microfabrication of multiple sensor trapping (MST) lid arrays. Each lid comprises multiple micro-pockets. Oxygen, pH, other extra-cellular sensors, and reference dye were deposited in the pockets. In order to achieve simultaneous monitoring of multiple metabolic parameters, the lid array serves to hermetically seal arrays of microwells, each containing a single cell. The dual-depth etching process we developed can be easily applied to other glass-based microfabrication purposes requiring dual- or multiple-depth microstructures.
{"title":"Multiple sensor arrays for single cell metabolic analysis","authors":"Ganquan Song, Rishabh M. Shetty, Haixin Zhu, Shashanka Ashili, Liqiang Zhang, Grace Kim, Andrew Shabilla, Wacey Teller, Q. Mei, L. Kelbauskas, Yanqing Tian, Hong Wang, Roger H. Johnson, D. Meldrum","doi":"10.1109/ICSENS.2013.6688453","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688453","url":null,"abstract":"We present the design, fabrication and characterization of multiple micro-pocket lid arrays used in live single cell metabolic analysis. In previous work we reported a platform for quantifying single cell oxygen consumption rates realized using a fused silica deep wet etching process. Here we extend that work to a dual-depth wet etching process for microfabrication of multiple sensor trapping (MST) lid arrays. Each lid comprises multiple micro-pockets. Oxygen, pH, other extra-cellular sensors, and reference dye were deposited in the pockets. In order to achieve simultaneous monitoring of multiple metabolic parameters, the lid array serves to hermetically seal arrays of microwells, each containing a single cell. The dual-depth etching process we developed can be easily applied to other glass-based microfabrication purposes requiring dual- or multiple-depth microstructures.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126044913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688139
K. Murawski, T. Sondej, K. Rózanowski, O. Truszczyński, M. Macander, L. Macander
In this paper we present the contactless active optical sensor for driver fatigue detection in variable weather and lighting conditions. The fatigue was determined by monitoring activity of the eyes. In our case the bright pupil effect was used. The brightness of the pupil was increased by developing a new keying technique of controlling the IR emitter signal. This technique caused the brightness to increase in comparison to the continuous signal by 50%on average. The new developed sensor, as well as, the image processing algorithm was used during the construction of the driver fatigue monitoring system. The system detects fatigue by analyzing the variability of the following signals: PERCLOSE, PEROPEN, blink frequency, activity of the eyes and pupil diameter.
{"title":"The contactless active optical sensor for vehicle driver fatigue detection","authors":"K. Murawski, T. Sondej, K. Rózanowski, O. Truszczyński, M. Macander, L. Macander","doi":"10.1109/ICSENS.2013.6688139","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688139","url":null,"abstract":"In this paper we present the contactless active optical sensor for driver fatigue detection in variable weather and lighting conditions. The fatigue was determined by monitoring activity of the eyes. In our case the bright pupil effect was used. The brightness of the pupil was increased by developing a new keying technique of controlling the IR emitter signal. This technique caused the brightness to increase in comparison to the continuous signal by 50%on average. The new developed sensor, as well as, the image processing algorithm was used during the construction of the driver fatigue monitoring system. The system detects fatigue by analyzing the variability of the following signals: PERCLOSE, PEROPEN, blink frequency, activity of the eyes and pupil diameter.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116705504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688143
Haitao Li, Xiaoyi Mu, Zhe Wang, Min Guo, Xiangqun Zeng, A. Mason
This paper presents a real-time, electrochemical gas sensor array system featuring room temperature ionic-liquid interfaces and targeting safety monitoring in underground mines. A prototype system was constructed using a custom ionic-liquid sensor array, a custom multi-mode electrochemical sensor readout board, and a commercial low power microcontroller board. Gas sensors for multiple mine gases were implemented in a 2 by 2 miniaturized array. A novel resource-sharing circuit tailored to our gas sensor array was utilized to significantly decrease power, cost and size while implementing two electrochemical detection modes. The system achieves a resolution as high as 0.01% vol in amperometry mode and 0.06% vol in impedance spectroscopy mode for oxygen as an example target gas.
{"title":"Room temperature ionic-liquid electrochemical gas sensor array system for real-time mine safety monitoring","authors":"Haitao Li, Xiaoyi Mu, Zhe Wang, Min Guo, Xiangqun Zeng, A. Mason","doi":"10.1109/ICSENS.2013.6688143","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688143","url":null,"abstract":"This paper presents a real-time, electrochemical gas sensor array system featuring room temperature ionic-liquid interfaces and targeting safety monitoring in underground mines. A prototype system was constructed using a custom ionic-liquid sensor array, a custom multi-mode electrochemical sensor readout board, and a commercial low power microcontroller board. Gas sensors for multiple mine gases were implemented in a 2 by 2 miniaturized array. A novel resource-sharing circuit tailored to our gas sensor array was utilized to significantly decrease power, cost and size while implementing two electrochemical detection modes. The system achieves a resolution as high as 0.01% vol in amperometry mode and 0.06% vol in impedance spectroscopy mode for oxygen as an example target gas.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114242323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688251
Q. Guo, R. Surapaneni, Yu-Pin Hsu, C. Mastrangelo, D. Young
This paper presents the electrical characterization results of a 26 × 26 high-density ground reaction sensor array (HD-GRSA) interfaced with two parallel electronic detection channels. The system was developed for improving inertial measurement unit (IMU) positioning accuracy. The HD-GRSA is composed of 26 × 26 sensing nodes, which can measure dynamic ground force and shear strain associated with a ground locomotion gait. Each electronic detection channel consists of a front-end multiplexer that can sequentially connect individual sensing nodes from a 13 × 13 sub-array to a capacitance-to-voltage (C/V) converter followed by a 12-bit algorithmic ADC. The electronics were fabricated in a 0.35 μm CMOS process occupying an area of 7.7 mm2 for each channel while dissipating a DC power of 3 mW from a 3V supply. The HD-GRSA demonstrates the designed functionality achieving a gait ground velocity resolution of approximately 95 μmRMS/sec, limited by the electronic interference signals due to the long metal traces on the sensor array. Further performance improvement is expected by employing interference suppression techniques and better matching for critical wiring traces.
{"title":"Electrical characterization of 26 × 26 ground reaction sensor array interfaced with two parallel electronic detection channels","authors":"Q. Guo, R. Surapaneni, Yu-Pin Hsu, C. Mastrangelo, D. Young","doi":"10.1109/ICSENS.2013.6688251","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688251","url":null,"abstract":"This paper presents the electrical characterization results of a 26 × 26 high-density ground reaction sensor array (HD-GRSA) interfaced with two parallel electronic detection channels. The system was developed for improving inertial measurement unit (IMU) positioning accuracy. The HD-GRSA is composed of 26 × 26 sensing nodes, which can measure dynamic ground force and shear strain associated with a ground locomotion gait. Each electronic detection channel consists of a front-end multiplexer that can sequentially connect individual sensing nodes from a 13 × 13 sub-array to a capacitance-to-voltage (C/V) converter followed by a 12-bit algorithmic ADC. The electronics were fabricated in a 0.35 μm CMOS process occupying an area of 7.7 mm2 for each channel while dissipating a DC power of 3 mW from a 3V supply. The HD-GRSA demonstrates the designed functionality achieving a gait ground velocity resolution of approximately 95 μmRMS/sec, limited by the electronic interference signals due to the long metal traces on the sensor array. Further performance improvement is expected by employing interference suppression techniques and better matching for critical wiring traces.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125319409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688484
Anirban Das, Tsung-Cheng Chen, Yi-Ting Lin, Chao‐Sung Lai, Y. Liao, Chia‐Ming Yang
In chemical image sensor, spatial resolution and scanning speed are the most important factors which may need to optimize and trade off. Before the minimization of spatial resolution, scanning speed of system needs to be improved to have an image in a short time within few seconds. In this study, ultra-high scanning speed of light addressable potentiometric sensor (LAPS) could be achieved by means of the combination of laser diode and single analog micro-mirror in light source. In the constant bias operation, an U-shape of pH solution can be detected within 8.5 sec for 14×121 points in the area of 3.2 mm×6.12 mm by using 5 kHz of ac signal in laser diode. The image resolution of the present LAPS system with 10 μm-thick Si3N4/3 nm-thick SiO2 on 500 μm-thick silicon wafer is 0.0116 mm2 which could be further improved by LAPS structure optimization with thinner substrate. A chemical image sensor with ultra-high scanning speed is demonstrated by the application of analog micro-mirror for LAPS.
{"title":"Ultra-high scanning speed chemical image sensor based on light addressable potentiometric sensor with analog micro-mirror","authors":"Anirban Das, Tsung-Cheng Chen, Yi-Ting Lin, Chao‐Sung Lai, Y. Liao, Chia‐Ming Yang","doi":"10.1109/ICSENS.2013.6688484","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688484","url":null,"abstract":"In chemical image sensor, spatial resolution and scanning speed are the most important factors which may need to optimize and trade off. Before the minimization of spatial resolution, scanning speed of system needs to be improved to have an image in a short time within few seconds. In this study, ultra-high scanning speed of light addressable potentiometric sensor (LAPS) could be achieved by means of the combination of laser diode and single analog micro-mirror in light source. In the constant bias operation, an U-shape of pH solution can be detected within 8.5 sec for 14×121 points in the area of 3.2 mm×6.12 mm by using 5 kHz of ac signal in laser diode. The image resolution of the present LAPS system with 10 μm-thick Si3N4/3 nm-thick SiO2 on 500 μm-thick silicon wafer is 0.0116 mm2 which could be further improved by LAPS structure optimization with thinner substrate. A chemical image sensor with ultra-high scanning speed is demonstrated by the application of analog micro-mirror for LAPS.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"422 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122724259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688319
S. Thomas, Z. Rácz, M. Cole, J. Gardner
This paper describes the development of a low-cost robust Surface Acoustic Wave Resonator (SAWR) micro sensor capable of detecting sub-micron size particles below 1 ng. The device comprises two 262 MHz Rayleigh wave SAW resonators fabricated on ST-cut quartz where one is used for particle sensing and the other as a reference channel. Electro-acoustic detection of different particles (including carbon, gold, sucrose, silicon, and PTFE) with different diameters was studied. The mass sensitivity of the SAWR was found to be typically 275 Hz/ng or 4 pg/Hz for the detection of 750 nm diameter gold particles. We believe that the device could be used as a low-cost and low power microsensor for the real-time and ubiquitous monitoring of airborne particulate matter. In particular, our SAWR sensor can be used to detect the typical levels of ultrafine particulate pollutants (PM2.5) found in city air today.
{"title":"Dual high-frequency Surface Acoustic Wave Resonator for ultrafine particle sensing","authors":"S. Thomas, Z. Rácz, M. Cole, J. Gardner","doi":"10.1109/ICSENS.2013.6688319","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688319","url":null,"abstract":"This paper describes the development of a low-cost robust Surface Acoustic Wave Resonator (SAWR) micro sensor capable of detecting sub-micron size particles below 1 ng. The device comprises two 262 MHz Rayleigh wave SAW resonators fabricated on ST-cut quartz where one is used for particle sensing and the other as a reference channel. Electro-acoustic detection of different particles (including carbon, gold, sucrose, silicon, and PTFE) with different diameters was studied. The mass sensitivity of the SAWR was found to be typically 275 Hz/ng or 4 pg/Hz for the detection of 750 nm diameter gold particles. We believe that the device could be used as a low-cost and low power microsensor for the real-time and ubiquitous monitoring of airborne particulate matter. In particular, our SAWR sensor can be used to detect the typical levels of ultrafine particulate pollutants (PM2.5) found in city air today.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131543951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-12-19DOI: 10.1109/ICSENS.2013.6688626
F. Oesterle, R. Weigel, A. Koelpin
With a tremendous shipment increase of MEMS microphones during the last few years, enhanced testing methods have become a key issue for industrial batch manufacturing, focusing on the mechanical sensitivity of the sound transducing diaphragm. Instead of semi-parallel techniques, in which test channels and measurement equipment are duplicated (with a multiplication of invest) for the purpose of further reduction of test time, this paper shows a novel approach for a massive parallel test of MEMS sensors. With several DUTs connected in parallel, the resulting measurements hence reveal several overlain device characteristics, each accounting for the sensitivity of one single DUT. For the specific correlation of those characteristics to each DUT, a reconstruction method known from tomography imaging techniques is adapted. The measurement results on wafer level shown in this paper exhibit the basic suitability of a single test of several DUTs in parallel and prove the concept of this novel method.
{"title":"A new approach on MEMS sensor batch testing using an analogue parallel test methodology for massive reduction of test time","authors":"F. Oesterle, R. Weigel, A. Koelpin","doi":"10.1109/ICSENS.2013.6688626","DOIUrl":"https://doi.org/10.1109/ICSENS.2013.6688626","url":null,"abstract":"With a tremendous shipment increase of MEMS microphones during the last few years, enhanced testing methods have become a key issue for industrial batch manufacturing, focusing on the mechanical sensitivity of the sound transducing diaphragm. Instead of semi-parallel techniques, in which test channels and measurement equipment are duplicated (with a multiplication of invest) for the purpose of further reduction of test time, this paper shows a novel approach for a massive parallel test of MEMS sensors. With several DUTs connected in parallel, the resulting measurements hence reveal several overlain device characteristics, each accounting for the sensitivity of one single DUT. For the specific correlation of those characteristics to each DUT, a reconstruction method known from tomography imaging techniques is adapted. The measurement results on wafer level shown in this paper exhibit the basic suitability of a single test of several DUTs in parallel and prove the concept of this novel method.","PeriodicalId":258260,"journal":{"name":"2013 IEEE SENSORS","volume":"99 10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128006911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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