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23rd IEEE VLSI Test Symposium (VTS'05)最新文献

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Built-in test of RF components using mapped feature extraction sensors 内置测试射频组件使用映射的特征提取传感器
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.33
S. S. Akbay, A. Chatterjee
At low frequencies, alternate testing is based on sampling the test response using an A/D converter and analyzing the digitized response in the external tester. In order to use alternate test at frequencies in the multi-GHz range, where the above is not possible, the test waveforms need to be very simple and the evaluation of the test response needs to be handled by on-chip analog test response "feature extractors". In this work, specialized functions of the output response from an alternate test are computed using built-in feature extraction sensors, which measure a complex function of the response waveform and output a DC signature. Different sensor structures are evaluated based on their performance in the presence of environmental effects and process shifts It is seen that very simple sensing circuitry can predict high quality alternate test for RF components.
在低频时,交替测试是基于使用A/D转换器对测试响应进行采样,并在外部测试仪中分析数字化响应。为了在多ghz范围内的频率上使用交替测试,在上述情况下是不可能的,测试波形需要非常简单,测试响应的评估需要由片上模拟测试响应“特征提取器”处理。在这项工作中,使用内置的特征提取传感器计算替代测试的输出响应的专门函数,该传感器测量响应波形的复杂函数并输出直流特征。不同的传感器结构根据其在环境影响和工艺变化下的性能进行了评估。可以看出,非常简单的传感电路可以预测射频元件的高质量替代测试。
{"title":"Built-in test of RF components using mapped feature extraction sensors","authors":"S. S. Akbay, A. Chatterjee","doi":"10.1109/VTS.2005.33","DOIUrl":"https://doi.org/10.1109/VTS.2005.33","url":null,"abstract":"At low frequencies, alternate testing is based on sampling the test response using an A/D converter and analyzing the digitized response in the external tester. In order to use alternate test at frequencies in the multi-GHz range, where the above is not possible, the test waveforms need to be very simple and the evaluation of the test response needs to be handled by on-chip analog test response \"feature extractors\". In this work, specialized functions of the output response from an alternate test are computed using built-in feature extraction sensors, which measure a complex function of the response waveform and output a DC signature. Different sensor structures are evaluated based on their performance in the presence of environmental effects and process shifts It is seen that very simple sensing circuitry can predict high quality alternate test for RF components.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"92 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134205351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 60
Diagnosis of arbitrary defects using neighborhood function extraction 基于邻域函数提取的任意缺陷诊断
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.41
R. Desineni, R. D. Blanton
We present a methodology for diagnosing arbitrary defects in digital integrated circuits (ICs). Rather than using one or a set of fault models in a cause-effect or effect-cause approach, our methodology derives defect behavior from, the test set, the circuit and its response, and the physical neighbors that surround a potential defect location. The defect locations themselves are identified using a model-independent stage. The methodology enables accurate identification of defect location and behavior through validation via simulation using passing and additional diagnostic test patterns. A byproduct of our methodology is the distinction that can be made among stuck-fault equivalencies which results in improved diagnostic resolution. Several types of shorts and opens are used to demonstrate the applicability of our approach to the diagnosis of arbitrary defects.
我们提出了一种诊断数字集成电路(ic)中任意缺陷的方法。我们的方法不是在因果或因果方法中使用一个或一组故障模型,而是从测试集、电路及其响应以及围绕潜在缺陷位置的物理邻居中派生缺陷行为。缺陷位置本身是使用与模型无关的阶段确定的。该方法能够通过使用通过和附加诊断测试模式的模拟验证来准确地识别缺陷位置和行为。我们的方法的副产品是可以在卡断等效之间进行区分,从而提高诊断分辨率。几种类型的短路和开放被用来证明我们的方法的适用性,以诊断任意缺陷。
{"title":"Diagnosis of arbitrary defects using neighborhood function extraction","authors":"R. Desineni, R. D. Blanton","doi":"10.1109/VTS.2005.41","DOIUrl":"https://doi.org/10.1109/VTS.2005.41","url":null,"abstract":"We present a methodology for diagnosing arbitrary defects in digital integrated circuits (ICs). Rather than using one or a set of fault models in a cause-effect or effect-cause approach, our methodology derives defect behavior from, the test set, the circuit and its response, and the physical neighbors that surround a potential defect location. The defect locations themselves are identified using a model-independent stage. The methodology enables accurate identification of defect location and behavior through validation via simulation using passing and additional diagnostic test patterns. A byproduct of our methodology is the distinction that can be made among stuck-fault equivalencies which results in improved diagnostic resolution. Several types of shorts and opens are used to demonstrate the applicability of our approach to the diagnosis of arbitrary defects.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122527658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 41
Soft error mitigation for SRAM-based FPGAs 基于sram的fpga的软误差缓解
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.75
H. Asadi, M. Tahoori
FPGA-based designs are more susceptible to single-event up-sets (SEUs) compared to ASIC designs, since SEUs in configuration bits of FPGAs result in permanent errors in the mapped design. Moreover, the number of sensitive configuration bits is two orders of magnitude more than user bits in typical FPGA-based circuits. In this paper, we present a high-reliable low-cost mitigation technique which can significantly improve the availability of designs mapped into FPGAs. Experimental results show that, using this technique, the availability of an FPGA mapped design can be increases to more than 99%.
与ASIC设计相比,基于fpga的设计更容易受到单事件up-set (seu)的影响,因为fpga配置位中的seu会导致映射设计中的永久性错误。此外,在典型的基于fpga的电路中,敏感配置位的数量比用户位多两个数量级。在本文中,我们提出了一种高可靠的低成本缓解技术,可以显着提高设计映射到fpga的可用性。实验结果表明,采用该技术,FPGA映射设计的可用性可提高到99%以上。
{"title":"Soft error mitigation for SRAM-based FPGAs","authors":"H. Asadi, M. Tahoori","doi":"10.1109/VTS.2005.75","DOIUrl":"https://doi.org/10.1109/VTS.2005.75","url":null,"abstract":"FPGA-based designs are more susceptible to single-event up-sets (SEUs) compared to ASIC designs, since SEUs in configuration bits of FPGAs result in permanent errors in the mapped design. Moreover, the number of sensitive configuration bits is two orders of magnitude more than user bits in typical FPGA-based circuits. In this paper, we present a high-reliable low-cost mitigation technique which can significantly improve the availability of designs mapped into FPGAs. Experimental results show that, using this technique, the availability of an FPGA mapped design can be increases to more than 99%.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"700 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124796566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 72
Meeting the test challenges of the 1 Gbps parallel RapidIO/spl reg/ interface with new automatic test equipment capabilities 通过新的自动测试设备功能,满足1 Gbps并行RapidIO/spl reg/接口的测试挑战
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.55
Darren Aaberge, K. Mockler, Dieu Van Dinh, R. Belleau, Tim Donovan, R. Hewlitt
This paper describes an approach to testing the 1 Gbps Parallel RapidIO/spl reg/ interface specifications. The unique test requirements for this bus require the application of new test techniques as well as new ATE capabilities. ATE performance attributes important for parallel source-synchronous buses will be identified and presented with methods to measure these attributes.
本文介绍了一种测试1 Gbps并行RapidIO/spl reg/接口规范的方法。该总线的独特测试要求要求应用新的测试技术以及新的ATE功能。将识别对并行源同步总线很重要的ATE性能属性,并提供测量这些属性的方法。
{"title":"Meeting the test challenges of the 1 Gbps parallel RapidIO/spl reg/ interface with new automatic test equipment capabilities","authors":"Darren Aaberge, K. Mockler, Dieu Van Dinh, R. Belleau, Tim Donovan, R. Hewlitt","doi":"10.1109/VTS.2005.55","DOIUrl":"https://doi.org/10.1109/VTS.2005.55","url":null,"abstract":"This paper describes an approach to testing the 1 Gbps Parallel RapidIO/spl reg/ interface specifications. The unique test requirements for this bus require the application of new test techniques as well as new ATE capabilities. ATE performance attributes important for parallel source-synchronous buses will be identified and presented with methods to measure these attributes.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"210 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123195482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Flash memory built-in self-diagnosis with test mode control 闪存内置自诊断与测试模式控制
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.45
J. Yeh, Yan-Ting Lai, Yuan-Yuan Shih, Cheng-Wen Wu, Chien-Hung Ho, Yen-Tai Lin
The objective of this paper is to present a cost-effective fault diagnosis methodology for flash memory. Flash memory is enjoying a rapid market growth. The research for flash memory testing is mainly to reduce the test cost and improve the production yield. In this paper, we propose a fault diagnosis flow for flash memory. We also propose a flexible built-in self-diagnosis (BISD) design with enhanced test mode control, which reduces the test time and diagnostic data shift-out cycles by using parallel programming and erasure and employing a parallel shift-out mechanism. The area overhead of our BISD circuit is only about 0.5% for a 256Mb commodity flash memory chip. Experimental results from industrial chips show that the proposed diagnosis methodology has high accuracy in distinguishing the fault type.
本文的目的是提出一种经济有效的快闪存储器故障诊断方法。闪存的市场正在快速增长。闪存测试的研究主要是为了降低测试成本,提高产品成品率。本文提出了一种闪存故障诊断流程。我们还提出了一种灵活的内置自诊断(BISD)设计,增强了测试模式控制,通过使用并行编程和擦除以及采用并行移出机制,减少了测试时间和诊断数据移出周期。我们的bsd电路的面积开销仅为256Mb商品闪存芯片的0.5%左右。工业芯片的实验结果表明,所提出的诊断方法对故障类型的识别具有较高的准确率。
{"title":"Flash memory built-in self-diagnosis with test mode control","authors":"J. Yeh, Yan-Ting Lai, Yuan-Yuan Shih, Cheng-Wen Wu, Chien-Hung Ho, Yen-Tai Lin","doi":"10.1109/VTS.2005.45","DOIUrl":"https://doi.org/10.1109/VTS.2005.45","url":null,"abstract":"The objective of this paper is to present a cost-effective fault diagnosis methodology for flash memory. Flash memory is enjoying a rapid market growth. The research for flash memory testing is mainly to reduce the test cost and improve the production yield. In this paper, we propose a fault diagnosis flow for flash memory. We also propose a flexible built-in self-diagnosis (BISD) design with enhanced test mode control, which reduces the test time and diagnostic data shift-out cycles by using parallel programming and erasure and employing a parallel shift-out mechanism. The area overhead of our BISD circuit is only about 0.5% for a 256Mb commodity flash memory chip. Experimental results from industrial chips show that the proposed diagnosis methodology has high accuracy in distinguishing the fault type.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132038900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Static compaction of delay tests considering power supply noise 考虑电源噪声的延迟静态压缩试验
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.77
Jing Wang, Xiang Lu, Wangqi Qiu, Ziding Yue, Steve Fancler, Weiping Shi, D. Walker
Excessive power supply noise can lead to overkill during delay test. A static compaction algorithm is described in this paper that prevents such overkill. A power supply noise estimation tool has been built and integrated into the compaction process. Compaction results for KLPG delay tests for ISCAS89 circuits under different power grid environments are presented.
过多的电源噪声会导致延迟测试时的过杀。本文描述了一种静态压缩算法来防止这种过度压缩。建立了电源噪声估计工具,并将其集成到压实过程中。给出了ISCAS89电路在不同电网环境下KLPG时延测试的压实结果。
{"title":"Static compaction of delay tests considering power supply noise","authors":"Jing Wang, Xiang Lu, Wangqi Qiu, Ziding Yue, Steve Fancler, Weiping Shi, D. Walker","doi":"10.1109/VTS.2005.77","DOIUrl":"https://doi.org/10.1109/VTS.2005.77","url":null,"abstract":"Excessive power supply noise can lead to overkill during delay test. A static compaction algorithm is described in this paper that prevents such overkill. A power supply noise estimation tool has been built and integrated into the compaction process. Compaction results for KLPG delay tests for ISCAS89 circuits under different power grid environments are presented.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127006145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
Highly configurable programmable built-in self test architecture for high-speed memories 用于高速存储器的高度可配置可编程内置自检架构
Pub Date : 2005-05-01 DOI: 10.1109/VTS.2005.49
I. Bayraktaroglu, O. Caty, Yickkei Wong
With the rapid growth in the number, the size, and the density of embedded memories in the current generation of microprocessors, developing high coverage memory built-in self-test (MBIST) engines has become increasingly challenging. The MBIST engine should provide high defect coverage and accurate diagnostic capabilities. Furthermore, MBIST engine should be accessible not only at the tester but also at the system. We present our work to develop a MBIST architecture that fulfils all such requirements and supports various flavors of embedded SRAMs. Extensive utilization of the proposed architecture in our products will result in increased productivity by reducing the development time and the verification and productization effort.
随着当前一代微处理器中嵌入式存储器的数量、尺寸和密度的快速增长,开发高覆盖内存内置自检(MBIST)引擎变得越来越具有挑战性。MBIST引擎应该提供高缺陷覆盖率和准确的诊断能力。此外,MBIST引擎不仅应该在测试器上访问,而且应该在系统上访问。我们介绍了开发MBIST架构的工作,该架构满足所有这些需求并支持各种类型的嵌入式ram。在我们的产品中广泛使用所建议的体系结构将通过减少开发时间、验证和产品化工作来提高生产力。
{"title":"Highly configurable programmable built-in self test architecture for high-speed memories","authors":"I. Bayraktaroglu, O. Caty, Yickkei Wong","doi":"10.1109/VTS.2005.49","DOIUrl":"https://doi.org/10.1109/VTS.2005.49","url":null,"abstract":"With the rapid growth in the number, the size, and the density of embedded memories in the current generation of microprocessors, developing high coverage memory built-in self-test (MBIST) engines has become increasingly challenging. The MBIST engine should provide high defect coverage and accurate diagnostic capabilities. Furthermore, MBIST engine should be accessible not only at the tester but also at the system. We present our work to develop a MBIST architecture that fulfils all such requirements and supports various flavors of embedded SRAMs. Extensive utilization of the proposed architecture in our products will result in increased productivity by reducing the development time and the verification and productization effort.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121550827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Test technology educational program: Overview of tutorials 测试技术教育计划:教程概述
Pub Date : 1900-01-01 DOI: 10.1109/VTS.2005.83
The Tutorials & Education Group of the IEEE Computer Society Test Technology Technical Council (TTTC) organizes in 2005 a comprehensive set of Test Technology Tutorials to be held in conjunction with TTTC sponsored technical meetings and included in the annual and expanding Test Technology Educational Program (TTEP). TTEP intends to serve the test and design professionals offering fundamental education and expert knowledge in state-ofthe- art test technology topics. Participation in TTEP-organized tutorials is credited by TTTC. Each full day tutorial corresponds to four TTEP units. Upon completion of each sixteen TTEP units official accreditation in the form of an "IEEE TTTC Test Technology Certificate" will be presented to the participants. In addition to the tutorials, certified university courses and industrial seminars related to test technology can also be included in TTEP and the participation in these credited similar to TTEP tutorials. For information on TTEP 2005 please visit the TTEP web site http://tab.computer.org/tttc/teg/ttep. The test technology tutorials of the VTS 2005 technical program are part of TTEP 2005.
IEEE计算机学会测试技术技术委员会(TTTC)的教程和教育组在2005年组织了一套全面的测试技术教程,与TTTC赞助的技术会议一起举行,并纳入年度和扩展的测试技术教育计划(TTEP)。TTEP旨在为测试和设计专业人士提供最先进的测试技术主题的基础教育和专家知识。参加TTTC组织的教程由TTTC负责。每个全天的教程对应四个TTEP单元。在每16个TTEP单元完成后,将以“IEEE TTTC测试技术证书”的形式向参与者颁发官方认证。除了教程之外,与测试技术相关的认证大学课程和工业研讨会也可以包含在TTEP中,并且参与这些课程的学分与TTEP教程相似。有关TTEP 2005的信息,请访问TTEP网站http://tab.computer.org/tttc/teg/ttep。VTS 2005技术程序的测试技术教程是TTEP 2005的一部分。
{"title":"Test technology educational program: Overview of tutorials","authors":"","doi":"10.1109/VTS.2005.83","DOIUrl":"https://doi.org/10.1109/VTS.2005.83","url":null,"abstract":"The Tutorials & Education Group of the IEEE Computer Society Test Technology Technical Council (TTTC) organizes in 2005 a comprehensive set of Test Technology Tutorials to be held in conjunction with TTTC sponsored technical meetings and included in the annual and expanding Test Technology Educational Program (TTEP). TTEP intends to serve the test and design professionals offering fundamental education and expert knowledge in state-ofthe- art test technology topics. Participation in TTEP-organized tutorials is credited by TTTC. Each full day tutorial corresponds to four TTEP units. Upon completion of each sixteen TTEP units official accreditation in the form of an \"IEEE TTTC Test Technology Certificate\" will be presented to the participants. In addition to the tutorials, certified university courses and industrial seminars related to test technology can also be included in TTEP and the participation in these credited similar to TTEP tutorials. For information on TTEP 2005 please visit the TTEP web site http://tab.computer.org/tttc/teg/ttep. The test technology tutorials of the VTS 2005 technical program are part of TTEP 2005.","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117317940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
VTS 2004 Best Innovative Practices Session Award VTS 2004最佳创新实践奖
Pub Date : 1900-01-01 DOI: 10.1109/VTS.2005.89
C. Hora, S. Eichenberger, B. Benware, B. Madge, A. Majhi, G. Gronthoud
{"title":"VTS 2004 Best Innovative Practices Session Award","authors":"C. Hora, S. Eichenberger, B. Benware, B. Madge, A. Majhi, G. Gronthoud","doi":"10.1109/VTS.2005.89","DOIUrl":"https://doi.org/10.1109/VTS.2005.89","url":null,"abstract":"","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"1145 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121735512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
VTS 2004 Best Paper Award VTS 2004最佳论文奖
Pub Date : 1900-01-01 DOI: 10.1109/VTS.2005.91
Nadir Achouri, L. Anghel
{"title":"VTS 2004 Best Paper Award","authors":"Nadir Achouri, L. Anghel","doi":"10.1109/VTS.2005.91","DOIUrl":"https://doi.org/10.1109/VTS.2005.91","url":null,"abstract":"","PeriodicalId":268324,"journal":{"name":"23rd IEEE VLSI Test Symposium (VTS'05)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121399732","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
23rd IEEE VLSI Test Symposium (VTS'05)
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