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2008 IEEE MTT-S International Microwave Symposium Digest最新文献

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Design and performance of a single band 1X2 RF front end module for mobile WiMAX applications 用于移动WiMAX应用的单频段1X2射频前端模块的设计和性能
Pub Date : 2008-09-26 DOI: 10.1109/MWSYM.2008.4633268
C. Mmasi, Renbin Wu, Vinu Govind, Sung-Hwan Min, Sid Dalmia, G. White
This paper describes the design and performances of the first single band (2.6 GHz) dual receive and single transmit 50 Ohm front end module (FEM) for WiMAX applications. The module is designed to meet error vector magnitude, adjacent channel power ratio, channel power and all 802.16 e uplink requirements. The transmit chain is made up of a narrowband balun, an inductively coupled pseudo-elliptic band pass filter, a three stage amplifier, a matching network and a SPDT switch. The FEM is characterized with a 16QAM 3/4, 10MHz BW 5ms frame uplink burst at 3.6V VCC and +23 dBm output power. The transmit path achieves an EVM of 3%, gain of approximately 29dB, gain flatness of 0.3dB, rejection of 51, 25, 32, 57dB at 1.9, 2.2, 3.3, 4 GHz respectively, and a low current drain. The dual line up receive path is designed to optimize RF performance and minimize preceding baseband sensitivity. The receive path is made up of a RF switch and pre select filters with insertion loss of 2.4 dB across the band, rejections of −53, −45, −25, −24 and −40 dB at 0.96, 1.9, 2.17, 3.3, and 4 GHz respectively. The front end module is integrated in a 7X7mm 40 pad LGA package, resulting in the first and smallest 1X2 802.16e FEM.
本文介绍了用于WiMAX应用的首个单频段(2.6 GHz)双收单发50欧姆前端模块(FEM)的设计和性能。该模块旨在满足误差矢量幅度、相邻信道功率比、信道功率和所有802.16 e上行链路要求。传输链由窄带平衡器、电感耦合伪椭圆带通滤波器、三级放大器、匹配网络和SPDT开关组成。该FEM具有16QAM 3/4, 10MHz BW 5ms帧上行突发,3.6V VCC和+23 dBm输出功率。该发射路径的EVM为3%,增益约为29dB,增益平坦度为0.3dB,在1.9、2.2、3.3和4 GHz分别为51、25、32和57dB,并且具有低漏电流。双列接收路径的设计是为了优化射频性能和最小化前基带灵敏度。接收路径由射频开关和预选择滤波器组成,其在整个频带的插入损耗为2.4 dB,在0.96、1.9、2.17、3.3和4 GHz时的抑制分别为- 53、- 45、- 25、- 24和- 40 dB。前端模块集成在7X7mm 40 pad LGA封装中,从而形成第一个也是最小的1X2 802.16e FEM。
{"title":"Design and performance of a single band 1X2 RF front end module for mobile WiMAX applications","authors":"C. Mmasi, Renbin Wu, Vinu Govind, Sung-Hwan Min, Sid Dalmia, G. White","doi":"10.1109/MWSYM.2008.4633268","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633268","url":null,"abstract":"This paper describes the design and performances of the first single band (2.6 GHz) dual receive and single transmit 50 Ohm front end module (FEM) for WiMAX applications. The module is designed to meet error vector magnitude, adjacent channel power ratio, channel power and all 802.16 e uplink requirements. The transmit chain is made up of a narrowband balun, an inductively coupled pseudo-elliptic band pass filter, a three stage amplifier, a matching network and a SPDT switch. The FEM is characterized with a 16QAM 3/4, 10MHz BW 5ms frame uplink burst at 3.6V VCC and +23 dBm output power. The transmit path achieves an EVM of 3%, gain of approximately 29dB, gain flatness of 0.3dB, rejection of 51, 25, 32, 57dB at 1.9, 2.2, 3.3, 4 GHz respectively, and a low current drain. The dual line up receive path is designed to optimize RF performance and minimize preceding baseband sensitivity. The receive path is made up of a RF switch and pre select filters with insertion loss of 2.4 dB across the band, rejections of −53, −45, −25, −24 and −40 dB at 0.96, 1.9, 2.17, 3.3, and 4 GHz respectively. The front end module is integrated in a 7X7mm 40 pad LGA package, resulting in the first and smallest 1X2 802.16e FEM.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115784576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A new method for determining the characteristic impedance Zc of transmission lines embedded in symmetrical transitions 一种确定对称过渡中嵌入的传输线特性阻抗Zc的新方法
Pub Date : 2008-06-20 DOI: 10.1109/ARFTG.2008.4633329
J. E. Zuniga-Juarez, J. Reynoso‐Hernández, A. Zarate-de Landa
In this paper we present a new method for calculating the characteristic impedance of the transmission lines embedded in identical, symmetrical and reciprocal transitions. For calculating the matrix elements of the transitions as well as the characteristic impedance ZC of the lines, the proposed method uses measurements of two different lengths of transmission lines.
本文提出了一种计算嵌入在相同、对称和互反跃迁中的传输线特性阻抗的新方法。该方法采用测量两种不同长度的传输线,计算了过渡矩阵元素和传输线的特性阻抗ZC。
{"title":"A new method for determining the characteristic impedance Zc of transmission lines embedded in symmetrical transitions","authors":"J. E. Zuniga-Juarez, J. Reynoso‐Hernández, A. Zarate-de Landa","doi":"10.1109/ARFTG.2008.4633329","DOIUrl":"https://doi.org/10.1109/ARFTG.2008.4633329","url":null,"abstract":"In this paper we present a new method for calculating the characteristic impedance of the transmission lines embedded in identical, symmetrical and reciprocal transitions. For calculating the matrix elements of the transitions as well as the characteristic impedance ZC of the lines, the proposed method uses measurements of two different lengths of transmission lines.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117315155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A 120 watt, two-stage, LDMOS power amplifier IC at 1.8 GHz for GSM/EDGE applications 用于GSM/EDGE应用的1.8 GHz 120瓦两级LDMOS功率放大器IC
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4633067
Lei Zhao, Guillaume Bigny, Jeffrey K. Jones
A 120 Watt LDMOS radio frequency integrated circuit (RFIC) targeting 1.8 GHz GSM, EDGE, and Evolved EDGE base station applications has been developed using state of the art design techniques and LDMOS technology. The amplifier was designed to cover the 1.8 GHz to 2 GHz GSM bands, and performs exceptionally well under both GSM and EDGE conditions. The two-stage, single-chip design exhibits 27 dB of gain and delivers 132 Watts of output power (1 dB compression; 27 Volt DC supply) with an associated PAE of 51%. Under EDGE modulation, at an average output power of 46 Watts, the EVM is less than 1.6 % and the spectral re-growth is −63 dBc and −78 dBc at 400, and 600 kHz offsets, respectively. This is the highest power, 1.8 to 2 GHz, two-stage RFIC in an over-molded plastic package, reported to date.
采用最先进的设计技术和LDMOS技术,开发了针对1.8 GHz GSM、EDGE和Evolved EDGE基站应用的120瓦LDMOS射频集成电路(RFIC)。该放大器设计用于覆盖1.8 GHz至2 GHz GSM频段,并且在GSM和EDGE条件下都表现出色。两级单芯片设计提供27db增益和132瓦输出功率(1db压缩;27伏直流电源),相关PAE为51%。在EDGE调制下,在平均输出功率为46瓦时,在400 kHz和600 kHz偏置下,EVM小于1.6%,频谱再增长分别为- 63 dBc和- 78 dBc。这是迄今为止报道的最高功率,1.8至2 GHz,两级RFIC在覆盖模制塑料封装中。
{"title":"A 120 watt, two-stage, LDMOS power amplifier IC at 1.8 GHz for GSM/EDGE applications","authors":"Lei Zhao, Guillaume Bigny, Jeffrey K. Jones","doi":"10.1109/MWSYM.2008.4633067","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633067","url":null,"abstract":"A 120 Watt LDMOS radio frequency integrated circuit (RFIC) targeting 1.8 GHz GSM, EDGE, and Evolved EDGE base station applications has been developed using state of the art design techniques and LDMOS technology. The amplifier was designed to cover the 1.8 GHz to 2 GHz GSM bands, and performs exceptionally well under both GSM and EDGE conditions. The two-stage, single-chip design exhibits 27 dB of gain and delivers 132 Watts of output power (1 dB compression; 27 Volt DC supply) with an associated PAE of 51%. Under EDGE modulation, at an average output power of 46 Watts, the EVM is less than 1.6 % and the spectral re-growth is −63 dBc and −78 dBc at 400, and 600 kHz offsets, respectively. This is the highest power, 1.8 to 2 GHz, two-stage RFIC in an over-molded plastic package, reported to date.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115295132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A broadband high dynamic range analog photonic link using push-pull directly-modulated semiconductor lasers 采用推挽直调半导体激光器的宽带高动态范围模拟光子链路
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4633214
D. Marpaung, C. Roeloffzen, W. van Etten
We demonstrate an analog photonic link with a high multioctave spurious-free dynamic range (SFDR) of 119 dBHz2/3. The link consists of a pair of semiconductor DFB lasers modulated in a push-pull manner and a balanced photodetector. With precise amplitude and phase matchings, a signal enhancement of 4.5 dB and a second-order inter-modulation distortion suppression of 40 dB relative to the case of a single arm optical link with one laser can be achieved. To our knowledge, the measured SFDR is one of the highest broadband value ever achieved with directly modulated lasers.
我们展示了一个模拟光子链路,其高多倍频程无杂散动态范围(SFDR)为119 dBHz2/3。该链路由一对以推挽方式调制的半导体DFB激光器和一个平衡光电探测器组成。通过精确的幅度和相位匹配,相对于单臂光链路的情况,可以实现4.5 dB的信号增强和40 dB的二阶调制间失真抑制。据我们所知,测量的SFDR是直接调制激光器实现的最高宽带值之一。
{"title":"A broadband high dynamic range analog photonic link using push-pull directly-modulated semiconductor lasers","authors":"D. Marpaung, C. Roeloffzen, W. van Etten","doi":"10.1109/MWSYM.2008.4633214","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633214","url":null,"abstract":"We demonstrate an analog photonic link with a high multioctave spurious-free dynamic range (SFDR) of 119 dBHz2/3. The link consists of a pair of semiconductor DFB lasers modulated in a push-pull manner and a balanced photodetector. With precise amplitude and phase matchings, a signal enhancement of 4.5 dB and a second-order inter-modulation distortion suppression of 40 dB relative to the case of a single arm optical link with one laser can be achieved. To our knowledge, the measured SFDR is one of the highest broadband value ever achieved with directly modulated lasers.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115603299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
A mixed HEMT-HBT MMIC technology using MBE regrowth 利用MBE再生的混合HEMT-HBT MMIC技术
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4633020
E. Kunkee, S. Consolazio, J. Barner, T. Retelny, G. Dietz, E. Bogus, A. Cavus, J. Chen, J. Uyeda, R. Hsing, P. Chin, A. Ahkiyat, D. Chua, R. Clark, R. Haubenstricker, M. Johnson, T. Nguyen, P. Sahm, E. Zeliasz, R. Lai
Current microwave systems are constructed by integrating a large number of single technology components into a final product due to the limitations of any single transistor technology across all functions and metrics, thereby increasing cost and size of a given system. In this paper, we present a fabrication process using Molecular Beam Epitaxy (MBE) regrowth which allows the combination of High Electron Mobility Transistors (HEMT) with Heterostructure Bipolar Transistors (HBT) on a single GaAs chip without compromising the performance of either the HBT or HEMT. HBT fT/Fmax of 40/85 GHz and Beta of 170 for a collector current of 1mA; and HEMT fT/Fmax of 115/160 GHz with a gm-peak of 755 mS/mm has been achieved. Circuit performance demonstrates the potential of performance advances over HEMT-only circuit embodiments.
由于单晶体管技术在所有功能和指标上的局限性,目前的微波系统是通过将大量单一技术组件集成到最终产品中来构建的,从而增加了给定系统的成本和尺寸。在本文中,我们提出了一种使用分子束外延(MBE)再生的制造工艺,该工艺允许在单个GaAs芯片上结合高电子迁移率晶体管(HEMT)和异质结构双极晶体管(HBT),而不会影响HBT或HEMT的性能。集电极电流为1mA时,HBT fT/Fmax为40/85 GHz, Beta为170;HEMT的fT/Fmax为115/160 GHz,峰值为755 mS/mm。电路性能展示了相对于仅hemt的电路实施例的性能进步的潜力。
{"title":"A mixed HEMT-HBT MMIC technology using MBE regrowth","authors":"E. Kunkee, S. Consolazio, J. Barner, T. Retelny, G. Dietz, E. Bogus, A. Cavus, J. Chen, J. Uyeda, R. Hsing, P. Chin, A. Ahkiyat, D. Chua, R. Clark, R. Haubenstricker, M. Johnson, T. Nguyen, P. Sahm, E. Zeliasz, R. Lai","doi":"10.1109/MWSYM.2008.4633020","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633020","url":null,"abstract":"Current microwave systems are constructed by integrating a large number of single technology components into a final product due to the limitations of any single transistor technology across all functions and metrics, thereby increasing cost and size of a given system. In this paper, we present a fabrication process using Molecular Beam Epitaxy (MBE) regrowth which allows the combination of High Electron Mobility Transistors (HEMT) with Heterostructure Bipolar Transistors (HBT) on a single GaAs chip without compromising the performance of either the HBT or HEMT. HBT fT/Fmax of 40/85 GHz and Beta of 170 for a collector current of 1mA; and HEMT fT/Fmax of 115/160 GHz with a gm-peak of 755 mS/mm has been achieved. Circuit performance demonstrates the potential of performance advances over HEMT-only circuit embodiments.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123042597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Characterization and thermal analysis of a 48 V GaN HFET device technology for wireless infrastructure applications 用于无线基础设施应用的48 V GaN HFET器件技术的特性和热分析
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4632916
B. Green, H. Henry, J. Selbee, F. Clayton, K. Moore, M. CdeBaca, J. Abdou, C.L. Liu, O. Hartin, D. Hill, M. Miller, C. Weitzel
This report presents the DC, pulsed I–V, small signal, and large signal characteristics of Freescale’s 48 V GaN HFET technology. Characterization of large signal performance for a 12.6 mm at 48V drain bias shows 89 W output power with an associated power density of 7.1 W/mm, linear gain of 17.5 dB, and a power-added efficiency (PAE) of 62%. Analysis of channel temperature over drain bias shows that the maximum channel temperatures at 28 V and 48 V are 107 °C and 245 °C, respectively during saturated RF operation. Data for RF drift over time on a 16.2 mm device show less than 0.2 dB of RF drift for ≫1000 hrs. of testing. This level of RF performance represents a significant ≫4 dB gain and ≫2 W/mm power density improvement over Freescale’s previously reported GaN HFET technology.
本报告介绍了飞思卡尔48 V GaN HFET技术的直流、脉冲I-V、小信号和大信号特性。在48V漏极偏置下,12.6 mm的大信号性能表征显示,输出功率为89 W,相关功率密度为7.1 W/mm,线性增益为17.5 dB,功率附加效率(PAE)为62%。通道温度过漏偏置分析表明,饱和RF工作时,28v和48v的最大通道温度分别为107°C和245°C。在16.2 mm器件上随时间的射频漂移数据显示,在1000小时内,射频漂移小于0.2 dB。的测试。与飞思卡尔先前报道的GaN HFET技术相比,这一射频性能水平有了显著的4 dB增益和2 W/mm功率密度的提高。
{"title":"Characterization and thermal analysis of a 48 V GaN HFET device technology for wireless infrastructure applications","authors":"B. Green, H. Henry, J. Selbee, F. Clayton, K. Moore, M. CdeBaca, J. Abdou, C.L. Liu, O. Hartin, D. Hill, M. Miller, C. Weitzel","doi":"10.1109/MWSYM.2008.4632916","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4632916","url":null,"abstract":"This report presents the DC, pulsed I–V, small signal, and large signal characteristics of Freescale’s 48 V GaN HFET technology. Characterization of large signal performance for a 12.6 mm at 48V drain bias shows 89 W output power with an associated power density of 7.1 W/mm, linear gain of 17.5 dB, and a power-added efficiency (PAE) of 62%. Analysis of channel temperature over drain bias shows that the maximum channel temperatures at 28 V and 48 V are 107 °C and 245 °C, respectively during saturated RF operation. Data for RF drift over time on a 16.2 mm device show less than 0.2 dB of RF drift for ≫1000 hrs. of testing. This level of RF performance represents a significant ≫4 dB gain and ≫2 W/mm power density improvement over Freescale’s previously reported GaN HFET technology.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116880942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A tunable and reduced size power divider using ferroelectric thin-film varactors 一种使用铁电薄膜变容体的可调谐小尺寸功率分压器
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4632995
E. Lourandakis, Matthias Schmidt, A. Leidl, S. Seitz, R. Weigel
A new concept for a reduced size and tunable power divider is presented based on Barium-Strontium-Titanate (BST) varactors. The proposed topology operates like a conventional Wilkinson power divider while achieving size reduction and a frequency agile behavior in the frequency range of 1.7GHz to 2.1GHz. Tuning the operating frequency is achieved by substituting the quarter-wavelength transmission line segments with equivalent lowpass structures and using ferroelectric varactors as tuning elements. A prototype circuit was implemented and characterized showing good agreement between simulation results and measurements. The additional insertion loss in both output branches varied from 1.2 dB to 0.6 dB while maintaining a worst case amplitude- and phase difference of 0.5 dB and 9 degrees respectively for all operating cases. The isolation between the two output ports exceeded 25 dB over the whole tuning range.
提出了一种基于钛酸钡锶(BST)变容体的小尺寸可调谐功率分压器的新概念。所提出的拓扑结构与传统的威尔金森功率分配器相似,同时在1.7GHz至2.1GHz的频率范围内实现了尺寸减小和频率敏捷性。用等效的低通结构代替四分之一波长传输线段,并使用铁电变容管作为调谐元件,实现了工作频率的调谐。实现了一个原型电路,并对其进行了表征,仿真结果与实测结果吻合较好。两个输出支路的附加插入损耗从1.2 dB变化到0.6 dB,同时在所有工作情况下保持最坏情况下的幅度和相位差分别为0.5 dB和9度。在整个调谐范围内,两个输出端口之间的隔离度超过25 dB。
{"title":"A tunable and reduced size power divider using ferroelectric thin-film varactors","authors":"E. Lourandakis, Matthias Schmidt, A. Leidl, S. Seitz, R. Weigel","doi":"10.1109/MWSYM.2008.4632995","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4632995","url":null,"abstract":"A new concept for a reduced size and tunable power divider is presented based on Barium-Strontium-Titanate (BST) varactors. The proposed topology operates like a conventional Wilkinson power divider while achieving size reduction and a frequency agile behavior in the frequency range of 1.7GHz to 2.1GHz. Tuning the operating frequency is achieved by substituting the quarter-wavelength transmission line segments with equivalent lowpass structures and using ferroelectric varactors as tuning elements. A prototype circuit was implemented and characterized showing good agreement between simulation results and measurements. The additional insertion loss in both output branches varied from 1.2 dB to 0.6 dB while maintaining a worst case amplitude- and phase difference of 0.5 dB and 9 degrees respectively for all operating cases. The isolation between the two output ports exceeded 25 dB over the whole tuning range.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"23 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120860692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Low-cost high-resolution handheld VNA using RF interferometry 使用射频干涉测量的低成本高分辨率手持式VNA
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4633181
K. Will, T. Meyer, Abbas Omar
A low-cost vector network analyzer (VNA) using a novel measurement technique is presented in this paper. The phase measurement is based on RF interferometry. A multiple output direct digital synthesizer (DDS) and low-cost scalar detectors are used for high-resolution phase measurements. A hardware example working up to a frequency of 150MHz and having board dimensions of only 10 cm × 6 cm is introduced. The accuracy is demonstrated by measurements and compared to a commercially available VNA using heterodyne detectors.
本文提出了一种采用新型测量技术的低成本矢量网络分析仪(VNA)。相位测量是基于射频干涉测量。采用多输出直接数字合成器(DDS)和低成本标量检测器进行高分辨率相位测量。介绍了一个工作频率高达150MHz且电路板尺寸仅为10cm × 6cm的硬件示例。通过测量证明了其准确性,并与使用外差检测器的市售VNA进行了比较。
{"title":"Low-cost high-resolution handheld VNA using RF interferometry","authors":"K. Will, T. Meyer, Abbas Omar","doi":"10.1109/MWSYM.2008.4633181","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633181","url":null,"abstract":"A low-cost vector network analyzer (VNA) using a novel measurement technique is presented in this paper. The phase measurement is based on RF interferometry. A multiple output direct digital synthesizer (DDS) and low-cost scalar detectors are used for high-resolution phase measurements. A hardware example working up to a frequency of 150MHz and having board dimensions of only 10 cm × 6 cm is introduced. The accuracy is demonstrated by measurements and compared to a commercially available VNA using heterodyne detectors.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121027225","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
MEMS liquid metal through-wafer microstrip to microstrip transition MEMS液态金属晶圆微带到微带的过渡
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4633098
Xiaoguang Liu, L. Katehi, D. Peroulis
A novel approach for creating an RF MEMS switch in the form of a microstrip-to-microstrip liquid-metal transition is presented. A slug of non-toxic liquid metal that controllably fills a through-wafer via is the key component of the switch. The large contact area between this slug and the solid microstrip lines renders this design an excellent candidate for high-power switching and particularly for hot-switching applications. With the slug inside the via the switch presents a measured insertion loss of 0.24 and 1.1 dB up to 5 and 10 GHz respectively. When the slug is removed from the via the switch isolation is measured to be more than 20 dB up to 7 GHz. The fabrication technology and critical trade-offs between RF and microfluidic performances are discussed in the paper. The slug movement is controlled by an external micropump. The recent advances in microfluidics have resulted in a large variety of practical micropumps that may be monolithically integrated with such switching designs.
提出了一种以微带到微带液态金属转换的形式创建RF MEMS开关的新方法。一种无毒液态金属的段塞可以被控制地填满通晶圆孔,这是开关的关键部件。这种段塞和固体微带线之间的大接触面积使这种设计成为高功率开关,特别是热开关应用的绝佳选择。由于通孔内的段塞,开关在5 GHz和10 GHz时的测量插入损耗分别为0.24和1.1 dB。当从通孔中移除段塞时,测量到开关隔离度大于20 dB,最高可达7 GHz。本文讨论了射频和微流控性能之间的关键权衡和制造技术。段塞流的运动由外部微泵控制。微流体学的最新进展导致了各种各样的实用微泵,这些微泵可以单片集成这种开关设计。
{"title":"MEMS liquid metal through-wafer microstrip to microstrip transition","authors":"Xiaoguang Liu, L. Katehi, D. Peroulis","doi":"10.1109/MWSYM.2008.4633098","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633098","url":null,"abstract":"A novel approach for creating an RF MEMS switch in the form of a microstrip-to-microstrip liquid-metal transition is presented. A slug of non-toxic liquid metal that controllably fills a through-wafer via is the key component of the switch. The large contact area between this slug and the solid microstrip lines renders this design an excellent candidate for high-power switching and particularly for hot-switching applications. With the slug inside the via the switch presents a measured insertion loss of 0.24 and 1.1 dB up to 5 and 10 GHz respectively. When the slug is removed from the via the switch isolation is measured to be more than 20 dB up to 7 GHz. The fabrication technology and critical trade-offs between RF and microfluidic performances are discussed in the paper. The slug movement is controlled by an external micropump. The recent advances in microfluidics have resulted in a large variety of practical micropumps that may be monolithically integrated with such switching designs.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121337603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
High power and efficiency space traveling-wave tube amplifiers with reduced size and mass for NASA missions 高功率和高效率的空间行波管放大器,减小了NASA任务的尺寸和质量
Pub Date : 2008-06-15 DOI: 10.1109/MWSYM.2008.4633167
R. Simons, Jeffrey D. Wilson, D. A. Force
Recent advances in high power and efficiency space traveling-wave tube amplifiers (TWTAs) for NASA’s space-to-Earth communications are presented in this paper. The RF power and efficiency of a new K-Band amplifier is 40 Watts and 50% and that of a new Ka-Band amplifier is 200 Watts and 60%. An important figure-of-merit, which is defined as the ratio of the RF power output to the mass (W/kg) of a TWT has improved by a factor of ten over the previous generation Ka-Band devices.
介绍了用于NASA空间对地通信的大功率高效空间行波管放大器(TWTAs)的最新进展。新型k波段放大器的射频功率和效率为40瓦和50%,新型ka波段放大器的射频功率和效率为200瓦和60%。一个重要的性能指标,定义为行波管的射频输出功率与质量(W/kg)之比,比上一代ka波段设备提高了十倍。
{"title":"High power and efficiency space traveling-wave tube amplifiers with reduced size and mass for NASA missions","authors":"R. Simons, Jeffrey D. Wilson, D. A. Force","doi":"10.1109/MWSYM.2008.4633167","DOIUrl":"https://doi.org/10.1109/MWSYM.2008.4633167","url":null,"abstract":"Recent advances in high power and efficiency space traveling-wave tube amplifiers (TWTAs) for NASA’s space-to-Earth communications are presented in this paper. The RF power and efficiency of a new K-Band amplifier is 40 Watts and 50% and that of a new Ka-Band amplifier is 200 Watts and 60%. An important figure-of-merit, which is defined as the ratio of the RF power output to the mass (W/kg) of a TWT has improved by a factor of ten over the previous generation Ka-Band devices.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125290495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
期刊
2008 IEEE MTT-S International Microwave Symposium Digest
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