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1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)最新文献

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A new model for EEPROM cell 一种新的EEPROM单元模型
Zhiliang Hong
A new model is presented for an EEPROM cell using devices existing in most simulators. Transient simulation can be performed with this model when the EEPROM cells perform erase, write and read operations. The compatibility has been verified by the examples in this paper.
提出了一种新的EEPROM单元模型,该模型采用了大多数仿真器中已有的器件。当EEPROM单元执行擦除、写入和读取操作时,可以使用该模型进行瞬态仿真。通过算例验证了该方法的兼容性。
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引用次数: 1
Investigation of KOH anisotropic etching of Si <100> wafers for improving etched surface quality 硅片KOH各向异性刻蚀提高刻蚀表面质量的研究
Wang Wei, L. Xiaowei, Wang Xilian, L. Yuqiang, Fan Maojun
The main influences of KOH anisotropic etching of Si <100> wafers on etched surface flatness are investigated experimentally. In the Si membrane etching with Si/sub 3/N/sub 4/ mask, the Si/sub 3/N/sub 4/ etching and the sediments in KOH aqueous solution are found as the main influences. The effective method to improve surface quality is presented by the mechanism analysis.
实验研究了硅片KOH各向异性刻蚀对刻蚀表面平整度的主要影响。在Si/sub - 3/N/sub - 4/掩膜的Si膜蚀刻中,Si/sub - 3/N/sub - 4/蚀刻和KOH水溶液中的沉积物是主要影响因素。通过机理分析,提出了提高表面质量的有效方法。
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引用次数: 2
Integration of polycide/metal capacitors in advanced device fabrication 多晶硅/金属电容器在先进器件制造中的集成
A. Yin, J. White, A. Karroy, Chun Hu
Polycide/metal capacitors with high unit area capacitance and high linearity are successfully integrated into submicron CMOS device fabrication. The capacitor implementation is modular and low cost: the capacitor dielectric is deposited at low temperature and only one additional mask is needed for patterning the capacitor top plate. High voltage-capacitance linearity is obtained for the TEOS oxide capacitors of the capacitance density at 1 fF/spl mu/m/sup 2/, with the linear voltage coefficient of capacitance LVCC <5 ppm/V and the quadratic voltage coefficient of capacitance QVCC<2 ppm/V/sup 2/. For the nitride capacitors, 1.5 fF//spl mu/m/sup 2/ unit area capacitance is obtained with the LVCC <70 ppm/V and the QVCC <20 ppm/V/sup 2/.
具有高单位面积电容和高线性度的多晶硅/金属电容器成功集成到亚微米CMOS器件制造中。电容器的实现是模块化和低成本的:电容器电介质在低温下沉积,并且只需要一个额外的掩模来对电容器顶板进行图案化。电容密度为1 fF/spl mu/m/sup 2/时的TEOS氧化物电容器获得了较高的电压-电容线性度,电容线性电压系数LVCC <5 ppm/V,二次电压系数QVCC<2 ppm/V/sup 2/。对于氮化电容器,在LVCC <70 ppm/V和QVCC <20 ppm/V/sup /时,获得1.5 fF//spl mu/m/sup / 2/单位面积电容。
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引用次数: 7
Design consideration for SOI gate controlled hybrid transistor operating at low voltage 低电压SOI栅极控制混合晶体管的设计考虑
Ru Huang, Bing Yang, Xing Zhang, Yangyuan Wang
The comprehensive design guidelines for SOI gate controlled hybrid transistor (GCHT) are provided in this paper for the first time, especially for GCHT operating at low voltage, which is an advantageous operating region of GCHT. The investigated mechanisms in this study involve short channel effects, current driving capability, device off-characteristics and open-circuit voltage gain. The design curves for low operating voltage are presented by synthesizing the results, with tradeoffs between different parameter requirements for different effects illustrated explicitly. The allowable design region is greatly-broadened, pointing out the direction for deep submicron device development.
本文首次提出了SOI栅极控制混合晶体管(GCHT)的综合设计准则,特别是在低电压条件下的设计准则,这是GCHT的有利工作区域。本文研究的机制包括短通道效应、电流驱动能力、器件失活特性和开路电压增益。综合结果,给出了低工作电压的设计曲线,并明确说明了不同参数要求对不同效果的权衡。大大拓宽了允许设计的范围,为深亚微米器件的发展指明了方向。
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引用次数: 0
Design consideration for planar doped barrier diodes' dc characteristics 平面掺杂势垒二极管直流特性的设计考虑
Wu Jie, Guo Fang-min, Xia Guan-qun
By variation of the thickness and doping concentration of the p/sup +/ and intrinsic regions, the barrier height and asymmetry of the structure can be independently varied. A model is developed to investigate the extent to which the above factors may affect the PDBDs' dc characteristics.
通过改变p/sup +/和本征区的厚度和掺杂浓度,可以独立地改变结构的势垒高度和不对称性。建立了一个模型来研究上述因素对pdbd直流特性的影响程度。
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引用次数: 1
Semiconductor laser amplifier and applications 半导体激光放大器及其应用
Hu Dexiu
Semiconductor laser amplifier (SLA) will be an important device in the fields of both of fiber-optic communication and optical information processing. In this paper the SLA's future is analyzed. Some experimental results about SLA and its application for wavelength conversion are studied.
半导体激光放大器将成为光纤通信和光信息处理领域的重要器件。本文对SLA的发展前景进行了分析。研究了SLA的一些实验结果及其在波长转换中的应用。
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引用次数: 0
A fixed-point DSP implementation for a low bit rate vocoder 低比特率声码器的定点DSP实现
Fengying Yao, Bizhou Li, Min Zhang
Fixed-point DSP implementation of the decoder and the synthesizer of a real time vocoder with 1.4 kbps bit rate has been accomplished instead of the usual realization of low bit rate vocoder in floating point DSP. Replacing floating point values with fixed-point ones and other approaches have been adopted to reach a real time solution. The implemented fixed-point decoder and synthesizer run at 11.3 MIPS on the average and occupy 1246 words of program memory, 1338 words of table ROM and 814 words of RAM in a 40 MHz TMS320C50 DSP chip. The results indicate the possibility to implement the whole vocoder with low cost fixed-point DSP.
采用定点DSP实现了一个1.4 kbps码率的实时声码器的解码器和合成器,取代了通常在浮点DSP上实现的低码率声码器。将浮点值替换为定点值和其他方法已被采用以达到实时解决方案。所实现的定点解码器和合成器在40mhz TMS320C50 DSP芯片上的平均运行速度为11.3 MIPS,占用1246个字的程序存储器、1338个字的表ROM和814个字的RAM。结果表明,用低成本的定点DSP实现整个声码器是可行的。
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引用次数: 4
Micro electromechanical systems (MEMS): technology and future applications in circuits 微机电系统(MEMS):电路中的技术和未来应用
Chang Liu
MEMS technology can enable new circuit components. Current examples include RF signal switches, tunable capacitors and inductors, resonant filters, antennas, and relays. These components, all involving micromechanical principles, can provide enhanced performances and reconfigurability, reduced component sizes, and potentially simplified system-level design. I will discuss our DARPA-funded efforts in developing electromechanical RF switches, high-gain antennas, and new types of planar waveguides. Thermal-mechanical RF switches exhibit low on-state insertion loss and high off-state isolation compared with conventional transistor-based counterparts, while operating under IC-compatible bias conditions.
MEMS技术可以实现新的电路元件。目前的例子包括射频信号开关、可调谐电容器和电感、谐振滤波器、天线和继电器。这些组件都涉及微机械原理,可以提供增强的性能和可重构性,减小组件尺寸,并可能简化系统级设计。我将讨论darpa资助我们在开发机电射频开关、高增益天线和新型平面波导方面的努力。与传统的基于晶体管的开关相比,热机械射频开关具有低的导通状态插入损耗和高的关断状态隔离,同时在ic兼容的偏置条件下工作。
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引用次数: 10
Thermally excited micromechanical vacuum resonator 热激发微机械真空谐振器
Wang Yaqiang, Jin Zhonghe, Wang Yuelin, Ding Chun
A micromechanical resonator is proposed and realized. It consists of a single-crystal silicon beam and two P-type silicon resistors. One resistor is used to excite the vibrating beam and the other to sense vibration of the beam. The dimensions of the resonator are about 4/spl times/2.5 mm/sup 2/, the resonant frequency is about 7.8 KHz, Q factor about 190 in air and above 2500 in vacuum degree of 7.5/spl times/10/sup -4/ Pa. The theory of thermal excitation is analyzed and the characteristics of the resonator are tested. We conclude that the resonator can be applied to vacuum measurement by the means of closed-loop resonating circuit. The design and realization of the circuit are described.
提出并实现了一种微机械谐振器。它由单晶硅梁和两个p型硅电阻组成。一个电阻器用于激励振动梁,另一个电阻器用于检测梁的振动。谐振腔的尺寸约为4/spl倍/2.5 mm/sup 2/,谐振频率约为7.8 KHz,在空气中Q因子约为190,在真空度为7.5/spl倍/10/sup -4/ Pa时Q因子在2500以上。分析了热激发原理,测试了谐振腔的特性。结果表明,该谐振器可以采用闭环谐振电路的方式用于真空测量。介绍了该电路的设计与实现。
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引用次数: 1
An investigation of single crystal Co-SALICIDE (self-aligned silicide) process for deep sub-micrometer CMOS devices 深亚微米CMOS器件单晶自对准硅化物工艺研究
Honghao Ji, Qiuxia Xu
In this paper, the Co-SALICIDE process has been investigated intensively for the application to deep sub-micron CMOS VLSI. Adopting a Co/Ti/Si structure, epitaxial growth of a single crystal CoSi/sub 2/ film on the [100] Si substrate through two-step RTA has been demonstrated in detail. The heat-reaction characteristics of the Co/Ti/Si structure for forming the single crystal CoSi/sub 2/ film have been studied. We have applied the single crystal CoSi/sub 2/ to SALICIDE process post junction fabrication to obtain a smoother interface. Focusing on the disadvantage of a large leakage current that Co-salicided diodes usually suffer, ultra-shallow junctions especially, we found the leakage current to be large and investigated several methods to reduce diode leakage. The experiments show that PAI can improve the inverse I-V characteristics remarkably. A leakage current density of a Co-salicided diode as low as 8/spl times/10/sup -8/ A/cm/sup 2/ (V=5 v) was obtained for a junction depth of 107 nm. The resistivity of the single crystal CoSi/sub 2/ film is 16.5 /spl mu//spl Omega//sub (BH)/cm.
本文对Co-SALICIDE工艺在深亚微米CMOS VLSI中的应用进行了深入的研究。采用Co/Ti/Si结构,通过两步RTA在[100]Si衬底上外延生长单晶CoSi/sub 2/薄膜。研究了Co/Ti/Si结构形成单晶CoSi/ sub2 /薄膜的热反应特性。我们已将单晶CoSi/sub 2/应用于SALICIDE工艺后结制造,以获得更光滑的界面。针对co -salicide二极管普遍存在的漏电流大的缺点,特别是超浅结,我们发现漏电流大,并研究了几种降低二极管漏电流的方法。实验表明,PAI可以显著改善I-V逆特性。在结深为107 nm时,共盐化二极管的漏电流密度低至8/spl倍/10/sup -8/ A/cm/sup 2/ (V=5 V)。单晶CoSi/sub 2/薄膜的电阻率为16.5 /spl mu//spl Omega//sub (BH)/cm。
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引用次数: 0
期刊
1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)
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