Pub Date : 2019-05-01DOI: 10.1109/ASMC.2019.8791753
S. Kim, Ds Kim, Kuyngtaek Lee, Ks Park, YT Han, C. Kim, J. Dai, P. Mukundhan
PULSE™ technology is a first principles based acoustic metrology technique that is capable of measuring various parameters of interest in semiconductor manufacturing such as multi-layered metal thickness, sound velocity of dielectric films and reflectivity. In this paper, we demonstrate the applications of PULSE technology in the TC-SAW process; to control TC-SAW filter frequency which is dependent not only on IDT line spacing but also on its thickness and sound velocity of dielectric layer that is surrounding IDT. Additionally, we also demonstrate that the technology can be used to detect unwanted residual passivation layer on UBM to capture process excursion for corrective action in an early stage.
{"title":"Controlling TC SAW Filter Frequency with Picosecond Ultrasonics","authors":"S. Kim, Ds Kim, Kuyngtaek Lee, Ks Park, YT Han, C. Kim, J. Dai, P. Mukundhan","doi":"10.1109/ASMC.2019.8791753","DOIUrl":"https://doi.org/10.1109/ASMC.2019.8791753","url":null,"abstract":"PULSE™ technology is a first principles based acoustic metrology technique that is capable of measuring various parameters of interest in semiconductor manufacturing such as multi-layered metal thickness, sound velocity of dielectric films and reflectivity. In this paper, we demonstrate the applications of PULSE technology in the TC-SAW process; to control TC-SAW filter frequency which is dependent not only on IDT line spacing but also on its thickness and sound velocity of dielectric layer that is surrounding IDT. Additionally, we also demonstrate that the technology can be used to detect unwanted residual passivation layer on UBM to capture process excursion for corrective action in an early stage.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126427400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ASMC.2019.8791813
Erik Collart, M. Mooney, Luke Evason, Vincent Giorgi, David Hunt, Antonio Serapiglia, A. Ifould
The sub-fab, with its vacuum, abatement and ancillary systems has evolved dramatically over the years. In many ways it has become as sophisticated as the fab itself, and now provides key enabling process technology. There is also a growing recognition among semiconductor manufacturers that sub-fab information can no longer be dismissed when it comes to fab process and yield optimization. Available sub-fab data sources such as equipment parameters, process data and equipment fault analyses will be discussed, as well as how these may be integrated to provide overall sub fab health monitoring and deliver vacuum conditions required by today’s leading-edge technology nodes.
{"title":"Providing Key Process Enabling Vacuum Capability Through Integrated Sub-Fab Data Management","authors":"Erik Collart, M. Mooney, Luke Evason, Vincent Giorgi, David Hunt, Antonio Serapiglia, A. Ifould","doi":"10.1109/ASMC.2019.8791813","DOIUrl":"https://doi.org/10.1109/ASMC.2019.8791813","url":null,"abstract":"The sub-fab, with its vacuum, abatement and ancillary systems has evolved dramatically over the years. In many ways it has become as sophisticated as the fab itself, and now provides key enabling process technology. There is also a growing recognition among semiconductor manufacturers that sub-fab information can no longer be dismissed when it comes to fab process and yield optimization. Available sub-fab data sources such as equipment parameters, process data and equipment fault analyses will be discussed, as well as how these may be integrated to provide overall sub fab health monitoring and deliver vacuum conditions required by today’s leading-edge technology nodes.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"27 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129420287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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