Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906473
P. Melvås, E. Kalvesten, G. Stemme
The first entirely surface micromachined resonant beam pressure sensor is presented. Using a fully surface micromachined process an encapsulated beam resonant pressure sensor with a pressure sensitive diaphragm of 100/spl times/150/spl times/2 /spl mu/m has been fabricated. The resonating beam is fully enclosed inside the reference vacuum cavity formed beneath the diaphragm. The new design enables high pressure sensitivity and a miniature chip size, essential for sensors such as catheter mounted intravascular blood pressure sensors. The pressure sensitivity is measured to 3.2%/bar with a beam resonance frequency at about 700 kHz.
{"title":"A surface micromachined resonant beam pressure sensor","authors":"P. Melvås, E. Kalvesten, G. Stemme","doi":"10.1109/MEMSYS.2001.906473","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906473","url":null,"abstract":"The first entirely surface micromachined resonant beam pressure sensor is presented. Using a fully surface micromachined process an encapsulated beam resonant pressure sensor with a pressure sensitive diaphragm of 100/spl times/150/spl times/2 /spl mu/m has been fabricated. The resonating beam is fully enclosed inside the reference vacuum cavity formed beneath the diaphragm. The new design enables high pressure sensitivity and a miniature chip size, essential for sensors such as catheter mounted intravascular blood pressure sensors. The pressure sensitivity is measured to 3.2%/bar with a beam resonance frequency at about 700 kHz.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123613687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906481
K. Takahata, Y. Gianchandani
This paper examines scaling issues for electrode arrays used in micro-electro-discharge machining (micro-EDM). In particular, it explores constraints in the fabrication and usage of high aspect ratio LIGA-fabricated electrode arrays, as well as the limits imposed by the pulse discharge circuits on machining rates. A LIGA-fabricated array of 400 Cu electrodes with 20 /spl square/m diameter was used to machine through-holes in 50 /spl square/m thick stainless steel. An array of multi-layer structures that included tapered shapes was fabricated by the sequential use of three electrode arrays of varying shape. The electrode fabrication and usage for these efforts are described. With respect to the pulse discharge circuits, it is shown that the machining time can be reduced by >50% by dividing the electrode array into sections have independent control of pulse discharge timing. This is implemented by using individual RC timing circuits for each section. A correlation between electrode area per RC circuit and machining rate is described.
{"title":"Batch mode micro-EDM for high-density and high-throughput micromachining","authors":"K. Takahata, Y. Gianchandani","doi":"10.1109/MEMSYS.2001.906481","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906481","url":null,"abstract":"This paper examines scaling issues for electrode arrays used in micro-electro-discharge machining (micro-EDM). In particular, it explores constraints in the fabrication and usage of high aspect ratio LIGA-fabricated electrode arrays, as well as the limits imposed by the pulse discharge circuits on machining rates. A LIGA-fabricated array of 400 Cu electrodes with 20 /spl square/m diameter was used to machine through-holes in 50 /spl square/m thick stainless steel. An array of multi-layer structures that included tapered shapes was fabricated by the sequential use of three electrode arrays of varying shape. The electrode fabrication and usage for these efforts are described. With respect to the pulse discharge circuits, it is shown that the machining time can be reduced by >50% by dividing the electrode array into sections have independent control of pulse discharge timing. This is implemented by using individual RC timing circuits for each section. A correlation between electrode area per RC circuit and machining rate is described.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134599556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906581
Z. Yang, R. Maeda
The design, fabrication and evaluation of a micro-degasser are described. The intended use of the device is in portable dialysis systems. Degassing processes were based on ultrasound induced cavitation. The pattern of the degassing chamber was formed in a glass wafer and that of the gas-venting channels were formed in a silicon wafer. The entire flow path network was encapsulated by the anodic bonding of the Si to the glass wafer. A diaphragm (6 mm/spl times/6 mm/spl times/0:1 mm) was etched on the Si side for oscillation. The ultrasonic vibration originated from a bulk piezoelectric PZT ceramic (5 mm/spl times/4 mm/spl times/0.15 mm) which was excited by a 49 kHz square wave at 100 V (peak-to-peak). The gas venting channels (2 /spl mu/m width and 2.7 /spl mu/m depth) were hydrophobically passivated using a chemical. Cavitation occurred in a degassing chamber (6 mm/spl times/6 mm/spl times/0.02 mm) when the Si oscillating diaphragm was driven by the PZT. Water was used to demonstrate the degassing process. The entire process was recorded using a microscope equipped with a video camera. The gas bubbles were vented effectively and no gas bubbles flowing out of the degassing chamber with water were observed.
{"title":"Ultrasonic micro-degassing device","authors":"Z. Yang, R. Maeda","doi":"10.1109/MEMSYS.2001.906581","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906581","url":null,"abstract":"The design, fabrication and evaluation of a micro-degasser are described. The intended use of the device is in portable dialysis systems. Degassing processes were based on ultrasound induced cavitation. The pattern of the degassing chamber was formed in a glass wafer and that of the gas-venting channels were formed in a silicon wafer. The entire flow path network was encapsulated by the anodic bonding of the Si to the glass wafer. A diaphragm (6 mm/spl times/6 mm/spl times/0:1 mm) was etched on the Si side for oscillation. The ultrasonic vibration originated from a bulk piezoelectric PZT ceramic (5 mm/spl times/4 mm/spl times/0.15 mm) which was excited by a 49 kHz square wave at 100 V (peak-to-peak). The gas venting channels (2 /spl mu/m width and 2.7 /spl mu/m depth) were hydrophobically passivated using a chemical. Cavitation occurred in a degassing chamber (6 mm/spl times/6 mm/spl times/0.02 mm) when the Si oscillating diaphragm was driven by the PZT. Water was used to demonstrate the degassing process. The entire process was recorded using a microscope equipped with a video camera. The gas bubbles were vented effectively and no gas bubbles flowing out of the degassing chamber with water were observed.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130966806","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906505
Huikai Xie, G. Fedder
This paper reports on the experimental results from the first design of a CMOS lateral-axis vibratory gyroscope that utilizes comb fingers for both actuation and sensing. The fabrication is compatible with standard CMOS processes and the design has an integrated, fully-differential capacitive interface circuit. This gyroscope design uses integrated comb drives for out-of-plane actuation, and is motivated by the desire to integrate three-axis gyroscopes on a single chip. The packaged gyroscope operates at atmospheric pressure with a sensitivity of 0.12 mV/deg/s and the resonant frequency of the drive mode is thermomechanically tuned between 4.2-5.1 kHz. Resonant frequency matching between the drive and sense modes is realized by integrating a polysilicon heater inside the spring beams.
{"title":"A CMOS-MEMS lateral-axis gyroscope","authors":"Huikai Xie, G. Fedder","doi":"10.1109/MEMSYS.2001.906505","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906505","url":null,"abstract":"This paper reports on the experimental results from the first design of a CMOS lateral-axis vibratory gyroscope that utilizes comb fingers for both actuation and sensing. The fabrication is compatible with standard CMOS processes and the design has an integrated, fully-differential capacitive interface circuit. This gyroscope design uses integrated comb drives for out-of-plane actuation, and is motivated by the desire to integrate three-axis gyroscopes on a single chip. The packaged gyroscope operates at atmospheric pressure with a sensitivity of 0.12 mV/deg/s and the resonant frequency of the drive mode is thermomechanically tuned between 4.2-5.1 kHz. Resonant frequency matching between the drive and sense modes is realized by integrating a polysilicon heater inside the spring beams.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133213033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906590
A. Bertsch, S. Heimgartner, P. Cousseau, P. Renaud
Mixing liquids on the micro-scale is difficult because the low Reynolds numbers in microchannels and in microreactors prohibit the use of conventional mixing techniques based on mechanical stirring which induces turbulence. Static mixers can be used to solve this mixing problem. In this paper, micromixers having geometries very close to those of conventional large-scale static mixers used in the chemical and food-processing industry are presented. Two kind of geometries have been studied. The first type of mixers is composed of a series of stationary rigid elements that form intersecting channels to split, rearrange and combine component streams. The second type of geometry is composed of a series of short helix elements arranged in pairs; each pair comprised of a right-handed and left-handed element arranged alternately in a pipe. Micromixers of both types have been designed by CAD and manufactured with the integral microstereolithography process, a new microfabrication technique that enables the manufacturing of complex, three-dimensional objects in polymers. The realized structures have been tested experimentally. Numerical simulations of the micromixers with the CFD program Fluent/sup TM/ have been performed to evaluate their mixing efficiency.
{"title":"3D micromixers-downscaling large scale industrial static mixers","authors":"A. Bertsch, S. Heimgartner, P. Cousseau, P. Renaud","doi":"10.1109/MEMSYS.2001.906590","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906590","url":null,"abstract":"Mixing liquids on the micro-scale is difficult because the low Reynolds numbers in microchannels and in microreactors prohibit the use of conventional mixing techniques based on mechanical stirring which induces turbulence. Static mixers can be used to solve this mixing problem. In this paper, micromixers having geometries very close to those of conventional large-scale static mixers used in the chemical and food-processing industry are presented. Two kind of geometries have been studied. The first type of mixers is composed of a series of stationary rigid elements that form intersecting channels to split, rearrange and combine component streams. The second type of geometry is composed of a series of short helix elements arranged in pairs; each pair comprised of a right-handed and left-handed element arranged alternately in a pipe. Micromixers of both types have been designed by CAD and manufactured with the integral microstereolithography process, a new microfabrication technique that enables the manufacturing of complex, three-dimensional objects in polymers. The realized structures have been tested experimentally. Numerical simulations of the micromixers with the CFD program Fluent/sup TM/ have been performed to evaluate their mixing efficiency.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115589617","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906550
W. Hsu, J.R. Clark, C. Nguyen
A fabrication process has been demonstrated that combines polysilicon surface micromachining, metal electroplating, and a sidewall sacrificial-spacer technique, to achieve high-aspect-ratio, submicron, lateral capacitive gaps between a micromechanical structure and its metal electrodes, without the need for advanced lithographic and etching technology. Among the devices demonstrated using this process are lateral free-free beam micromechanical resonators (Q=10,470 at 10.47 MHz), contour mode disk resonators (Q=9,400 at 156 MHz), and temperature-compensated micromechanical resonators (Q=10,317 at 13.5 MHz, with a -200 ppm frequency variation over a full 80/spl deg/C range).
{"title":"A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators","authors":"W. Hsu, J.R. Clark, C. Nguyen","doi":"10.1109/MEMSYS.2001.906550","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906550","url":null,"abstract":"A fabrication process has been demonstrated that combines polysilicon surface micromachining, metal electroplating, and a sidewall sacrificial-spacer technique, to achieve high-aspect-ratio, submicron, lateral capacitive gaps between a micromechanical structure and its metal electrodes, without the need for advanced lithographic and etching technology. Among the devices demonstrated using this process are lateral free-free beam micromechanical resonators (Q=10,470 at 10.47 MHz), contour mode disk resonators (Q=9,400 at 156 MHz), and temperature-compensated micromechanical resonators (Q=10,317 at 13.5 MHz, with a -200 ppm frequency variation over a full 80/spl deg/C range).","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114765288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/JMEMS.2002.805045
Y. Su, L. Lin, A. Pisano
This paper presents a microactuator that draws power directly from water and produces mechanical actuation without any electrical energy consumption. The microactuator is made of cellulose acetate with cylindrical cavity of 0.5 to 1.5 mm in diameter and 0.4 to 1 mm in depth. These cavities are filled with sodium chloride and a polyvinylidene chloride copolymer diaphragm is spun on as the cover. Using osmosis for the first time on the microscale, this water-powered, osmotic actuator can provide both high pressure (up to 35.6 MPa) and large actuating displacement (up to 0.8 mm as measured with an actuator of 0.8 mm in diameter). Incompressible water flow controlled by membrane characteristics and chemical potential enables the direct energy conversion to provide mechanical actuation. Measurement results show that constant volume change of 4/spl sim/15 nl/hr can be achieved depending on the design. When integrated with other microfluidic devices, this osmotic microactuator can serve as a clean, compact and inexpensive fluid power source.
{"title":"Water-powered, osmotic microactuator","authors":"Y. Su, L. Lin, A. Pisano","doi":"10.1109/JMEMS.2002.805045","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805045","url":null,"abstract":"This paper presents a microactuator that draws power directly from water and produces mechanical actuation without any electrical energy consumption. The microactuator is made of cellulose acetate with cylindrical cavity of 0.5 to 1.5 mm in diameter and 0.4 to 1 mm in depth. These cavities are filled with sodium chloride and a polyvinylidene chloride copolymer diaphragm is spun on as the cover. Using osmosis for the first time on the microscale, this water-powered, osmotic actuator can provide both high pressure (up to 35.6 MPa) and large actuating displacement (up to 0.8 mm as measured with an actuator of 0.8 mm in diameter). Incompressible water flow controlled by membrane characteristics and chemical potential enables the direct energy conversion to provide mechanical actuation. Measurement results show that constant volume change of 4/spl sim/15 nl/hr can be achieved depending on the design. When integrated with other microfluidic devices, this osmotic microactuator can serve as a clean, compact and inexpensive fluid power source.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121965384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906563
Jr-Hung Tsai, L. Lin
A valve-less micropump using the principles of thermal bubble actuation and nozzle-diffuser flow regulation is successfully demonstrated. The pump consists of a meander-shaped resistive heater, a pair of nozzle-diffuser flow controllers, and a 1 mm in diameter, 50 /spl mu/m in depth pumping chamber. Liquid is actuated by periodically expanding and collapsing thermal bubbles via resistive heating and a net flow is induced by the nozzle-diffuser flow regulator. Both single-bubble and dual-bubble actuation modes have been investigated. In the single-bubble pumping mode, a maximum flow rate of 5 /spl mu/l/min is measured at the driving pulse of 10% duty cycle at 250 Hz under an average power consumption of 1 W. A similar flow rate of 4.5 /spl mu/l/min is measured in the dual-bubble pumping mode, at the driving pulse of 5% duty cycle at 400 Hz with 0.5 W of average power consumption. The highest measured pumping pressure is 377 Pascal at zero volume flow rate.
{"title":"A thermal bubble actuated micro nozzle-diffuser pump","authors":"Jr-Hung Tsai, L. Lin","doi":"10.1109/MEMSYS.2001.906563","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906563","url":null,"abstract":"A valve-less micropump using the principles of thermal bubble actuation and nozzle-diffuser flow regulation is successfully demonstrated. The pump consists of a meander-shaped resistive heater, a pair of nozzle-diffuser flow controllers, and a 1 mm in diameter, 50 /spl mu/m in depth pumping chamber. Liquid is actuated by periodically expanding and collapsing thermal bubbles via resistive heating and a net flow is induced by the nozzle-diffuser flow regulator. Both single-bubble and dual-bubble actuation modes have been investigated. In the single-bubble pumping mode, a maximum flow rate of 5 /spl mu/l/min is measured at the driving pulse of 10% duty cycle at 250 Hz under an average power consumption of 1 W. A similar flow rate of 4.5 /spl mu/l/min is measured in the dual-bubble pumping mode, at the driving pulse of 5% duty cycle at 400 Hz with 0.5 W of average power consumption. The highest measured pumping pressure is 377 Pascal at zero volume flow rate.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125797148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906530
F. Gueissaz, D. Piguet
A passive magnetostatic sensing MEMS device, similar to a reed switch, having a packaged volume of 2 mm/sup 3/ is described. It is capable of sensing the field of a 1 mm/sup 3/ SmCo magnet at a distance of more than 2 mm. The contact force between the microformed rhodium contact surfaces lies between 10 and 30 /spl mu/N, and contact resistances as low as 2 /spl Omega/ are measured. No contact sticking is observed. The device operation life extends to at least 200,000 cycles when packaged at wafer level with epoxy sealing. The device operation life increases to 100/spl times/10/sup 6/ cycles when measured on bare wafers in argon, showing that these MEMS sensors are intrinsically reliable in spite of the very low contact forces.
{"title":"The MicroReed, an ultra-small passive MEMS magnetic proximity sensor designed for portable applications","authors":"F. Gueissaz, D. Piguet","doi":"10.1109/MEMSYS.2001.906530","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906530","url":null,"abstract":"A passive magnetostatic sensing MEMS device, similar to a reed switch, having a packaged volume of 2 mm/sup 3/ is described. It is capable of sensing the field of a 1 mm/sup 3/ SmCo magnet at a distance of more than 2 mm. The contact force between the microformed rhodium contact surfaces lies between 10 and 30 /spl mu/N, and contact resistances as low as 2 /spl Omega/ are measured. No contact sticking is observed. The device operation life extends to at least 200,000 cycles when packaged at wafer level with epoxy sealing. The device operation life increases to 100/spl times/10/sup 6/ cycles when measured on bare wafers in argon, showing that these MEMS sensors are intrinsically reliable in spite of the very low contact forces.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129678145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906498
Songsheng Tan, R. Boudreau, M. L. Reed
We present silicon etch rate measurements from wagon wheel patterns and widely separated V-grooves etched in KOH solutions. The data indicates there is a reactant depletion effect when using wagon wheel patterns, which obscures the true surface-reaction-rate-limited etch rate. Etch rates obtained from widely separated V-grooves, which are less influenced by reactant transport, indicate the activation energy of {111} etching is less than that of {100} etching, in contrast to previous reports. Our experiments yield activation energies of 0.53 eV for {111} planes and 0.62 eV for {100} planes. The apparent activation energy is highly sensitive to slight angular misalignments off the {111}.
{"title":"Measurement of {111} silicon anisotropic etching activation energy","authors":"Songsheng Tan, R. Boudreau, M. L. Reed","doi":"10.1109/MEMSYS.2001.906498","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906498","url":null,"abstract":"We present silicon etch rate measurements from wagon wheel patterns and widely separated V-grooves etched in KOH solutions. The data indicates there is a reactant depletion effect when using wagon wheel patterns, which obscures the true surface-reaction-rate-limited etch rate. Etch rates obtained from widely separated V-grooves, which are less influenced by reactant transport, indicate the activation energy of {111} etching is less than that of {100} etching, in contrast to previous reports. Our experiments yield activation energies of 0.53 eV for {111} planes and 0.62 eV for {100} planes. The apparent activation energy is highly sensitive to slight angular misalignments off the {111}.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129840731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：