Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906582
A. Torkkeli, J. Saarilahti, A. Haara, H. Harma, T. Soukka, P. Tolonen
This article reports electrostatic transportation of water droplets on superhydrophobic alkylketene dimer (AKD) and Teflon AF/sup R/ surfaces. The actuation is based on electrostatic forces generated by metal electrodes placed underneath the surface. By switching the electrode voltages, the droplets moved stepwise along the electrode paths. The lowest voltage which resulted continuous movement was 124 VAC (rms) and the maximum speed was over 1 cm/s which shows great improvement with respect to previously reported electrostatic actuation of water droplets in open air [M. Washizu, "Electrostatic Actuation of Liquid Droplets for microreactor Applications", IEEE Trans. Ind. App. 34, 4 (1998), pp. 732-737].
{"title":"Electrostatic transportation of water droplets on superhydrophobic surfaces","authors":"A. Torkkeli, J. Saarilahti, A. Haara, H. Harma, T. Soukka, P. Tolonen","doi":"10.1109/MEMSYS.2001.906582","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906582","url":null,"abstract":"This article reports electrostatic transportation of water droplets on superhydrophobic alkylketene dimer (AKD) and Teflon AF/sup R/ surfaces. The actuation is based on electrostatic forces generated by metal electrodes placed underneath the surface. By switching the electrode voltages, the droplets moved stepwise along the electrode paths. The lowest voltage which resulted continuous movement was 124 VAC (rms) and the maximum speed was over 1 cm/s which shows great improvement with respect to previously reported electrostatic actuation of water droplets in open air [M. Washizu, \"Electrostatic Actuation of Liquid Droplets for microreactor Applications\", IEEE Trans. Ind. App. 34, 4 (1998), pp. 732-737].","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"151 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132144606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906603
T. Toriyama, M. Yajima, S. Sugiyama
A prototype self-standing polysilicon-metal junction thermopile has been developed. In order to realize ideal higher thermal isolation, a thermopile without a membrane and having self-standing structure is proposed. The hot and cold contacts in the proposed thermopile are reversible. The thermocouple is composed of an n-type polysilicon and an Au junction. The thermopile was fabricated by MICS (Micromachine Integrated Chip Service: three polysilicon layers structure) organized by the Cooperative Research Committee for Standardization of Micromachines in IEE of Japan. Output characteristics were measured as a function of distance between hot contact of the thermocouple and the radiation source, in order to confirm performance of the proposed thermopile as a micro power generator. Experimental results were in good agreement with the calculations.
{"title":"Thermoelectric micro power generator utilizing self-standing polysilicon-metal thermopile","authors":"T. Toriyama, M. Yajima, S. Sugiyama","doi":"10.1109/MEMSYS.2001.906603","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906603","url":null,"abstract":"A prototype self-standing polysilicon-metal junction thermopile has been developed. In order to realize ideal higher thermal isolation, a thermopile without a membrane and having self-standing structure is proposed. The hot and cold contacts in the proposed thermopile are reversible. The thermocouple is composed of an n-type polysilicon and an Au junction. The thermopile was fabricated by MICS (Micromachine Integrated Chip Service: three polysilicon layers structure) organized by the Cooperative Research Committee for Standardization of Micromachines in IEE of Japan. Output characteristics were measured as a function of distance between hot contact of the thermocouple and the radiation source, in order to confirm performance of the proposed thermopile as a micro power generator. Experimental results were in good agreement with the calculations.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"181 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124892123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906512
P. Machtle, R. Berger, A. Dietzel, M. Despont, W. Haberle, R. Stutz, G. Binnig, P. Vettiger
Air-bearing sliders in today's hard-disk drives are flying above the spinning magnetic disks at a very low distance. With continuously increasing recording density this distance reduces and will fall below ten nanometers in the near future. This paper discusses the use of thin-film microheaters integrated into the air-bearing surface of such sliders for in-situ flying-height control. The microheaters can be realized with only a few fabrication steps that can be added to the standard slider manufacturing process. The microheaters transfer thermal energy into the sliders leading to nonuniform deformation, of the air-bearing surfaces. As a consequence the balance between the air cushion lift forces and the load forces is shifted and the flying height is varied. A transfer of thermal energy into the air cushion is also discussed. A comparison of experiments and simulations reveals that microheater-induced changes in the waviness of the air-bearing surface are responsible for flying-height actuation with both polarities. Based on this finding actuation schemes with improved efficiency are discussed that offer the possibility of compensating manufacturing tolerances and also of improving the reliability of future hard-disk drives.
{"title":"Integrated microheaters for in-situ flying-height control of sliders used in hard-disk drives","authors":"P. Machtle, R. Berger, A. Dietzel, M. Despont, W. Haberle, R. Stutz, G. Binnig, P. Vettiger","doi":"10.1109/MEMSYS.2001.906512","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906512","url":null,"abstract":"Air-bearing sliders in today's hard-disk drives are flying above the spinning magnetic disks at a very low distance. With continuously increasing recording density this distance reduces and will fall below ten nanometers in the near future. This paper discusses the use of thin-film microheaters integrated into the air-bearing surface of such sliders for in-situ flying-height control. The microheaters can be realized with only a few fabrication steps that can be added to the standard slider manufacturing process. The microheaters transfer thermal energy into the sliders leading to nonuniform deformation, of the air-bearing surfaces. As a consequence the balance between the air cushion lift forces and the load forces is shifted and the flying height is varied. A transfer of thermal energy into the air cushion is also discussed. A comparison of experiments and simulations reveals that microheater-induced changes in the waviness of the air-bearing surface are responsible for flying-height actuation with both polarities. Based on this finding actuation schemes with improved efficiency are discussed that offer the possibility of compensating manufacturing tolerances and also of improving the reliability of future hard-disk drives.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127096226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906572
R.H. Liu, H. Chen, K. Luehrsen, D. Ganser, D. Weston, J. Blackwell, P. Grodzinski
Microfluidic biochannel arrays that integrates massively parallel microfluidic channels with Motorola glass-based microarray biochips have been successfully developed. We demonstrated that such a device allows DNA hybridization assays to be performed in a miniaturized and highly parallel fashion. The biochannel arrays are a new DNA diagnostics platform that has several desirable features such as single-use and cost-effective, highly parallel (up to 52 protocols in parallel), and processed rapidly. Additionally, only nanoliter-volumes (/spl sim/100 nL) of DNA sample/reagents are consumed per array.
{"title":"Highly parallel integrated microfluidic biochannel arrays","authors":"R.H. Liu, H. Chen, K. Luehrsen, D. Ganser, D. Weston, J. Blackwell, P. Grodzinski","doi":"10.1109/MEMSYS.2001.906572","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906572","url":null,"abstract":"Microfluidic biochannel arrays that integrates massively parallel microfluidic channels with Motorola glass-based microarray biochips have been successfully developed. We demonstrated that such a device allows DNA hybridization assays to be performed in a miniaturized and highly parallel fashion. The biochannel arrays are a new DNA diagnostics platform that has several desirable features such as single-use and cost-effective, highly parallel (up to 52 protocols in parallel), and processed rapidly. Additionally, only nanoliter-volumes (/spl sim/100 nL) of DNA sample/reagents are consumed per array.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129531565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906545
E. Quevy, L. Buchaillot, D. Collard
This paper proposes and experimentally demonstrates a novel technique for the realization and the actuation of continuous-membrane for adaptive optics application. This original device demonstrates, for the first time, both positive and negative deflection with individual pixel displacement of +/- 10 /spl mu/m, which is one order of magnitude larger than in usual approaches. The deformable mirror is constituted by a thin film bulk-micromachined membrane which covers an original set of actuators composed of an array of self-assembling/self-locking 3D polysilicon electrostatic micro-structures.
{"title":"Realization and actuation of continuous-membrane by an array of 3D self-assembling micro-mirrors for adaptive optics","authors":"E. Quevy, L. Buchaillot, D. Collard","doi":"10.1109/MEMSYS.2001.906545","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906545","url":null,"abstract":"This paper proposes and experimentally demonstrates a novel technique for the realization and the actuation of continuous-membrane for adaptive optics application. This original device demonstrates, for the first time, both positive and negative deflection with individual pixel displacement of +/- 10 /spl mu/m, which is one order of magnitude larger than in usual approaches. The deformable mirror is constituted by a thin film bulk-micromachined membrane which covers an original set of actuators composed of an array of self-assembling/self-locking 3D polysilicon electrostatic micro-structures.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128905160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906480
L. Chu, L. Que, Y. Gianchandani
This paper presents the use of micromachined differential capacitive strain sensors to investigate mechanical properties of electroplated Ni deposited under two different conditions on Si and glass substrates. The thermal expansion coefficient (/spl alpha/), Young's modulus, and residual strain were studied as a function of temperature. The measured a was 8-16 ppm/K over 23-150/spl deg/C; the residual strain changed from neutral to -880 microstrain over 23-100/spl deg/C in one case and +68.5 microstrain to -420 microstrain over 23-130/spl deg/C in another case; and the Young's modulus ranged from 115-135 GPa at room temperature. The sensitivity of the device to structural non-idealities was evaluated by numerical modeling.
{"title":"Temperature coefficients of material properties for electrodeposited MEMS","authors":"L. Chu, L. Que, Y. Gianchandani","doi":"10.1109/MEMSYS.2001.906480","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906480","url":null,"abstract":"This paper presents the use of micromachined differential capacitive strain sensors to investigate mechanical properties of electroplated Ni deposited under two different conditions on Si and glass substrates. The thermal expansion coefficient (/spl alpha/), Young's modulus, and residual strain were studied as a function of temperature. The measured a was 8-16 ppm/K over 23-150/spl deg/C; the residual strain changed from neutral to -880 microstrain over 23-100/spl deg/C in one case and +68.5 microstrain to -420 microstrain over 23-130/spl deg/C in another case; and the Young's modulus ranged from 115-135 GPa at room temperature. The sensitivity of the device to structural non-idealities was evaluated by numerical modeling.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123287528","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906571
Y. Pan, Y. Hanein, D. Leach-Scampavia, K. Bohringer, B. Ratner, D. D. Denton
A surface coating technique is investigated to enhance device biocompatibility by eliminating bio-fouling, the strong but non-specific affinity of proteins and cells to attach to surfaces. This coating is a conformal, thin poly(ethylene glycol)-like film deposited in a glow discharge of tetraglyme. Substrates with different chemistries are successfully modified, and exhibit ultralow protein adsorption and cell attachment with the coating. This "stealth" or "non-fouling" coating can also be faithfully patterned using standard photolithography processes. The interaction of proteins and cells with patterned surfaces is limited only to the protein-adhesive domains, thus creating heterogeneous patterns of proteins and cell cultures on the surface. The potential benefits of our technique to applications such as cell-based assays and micro-electrodes are discussed.
{"title":"A precision technology for controlling protein adsorption and cell adhesion in bioMEMS","authors":"Y. Pan, Y. Hanein, D. Leach-Scampavia, K. Bohringer, B. Ratner, D. D. Denton","doi":"10.1109/MEMSYS.2001.906571","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906571","url":null,"abstract":"A surface coating technique is investigated to enhance device biocompatibility by eliminating bio-fouling, the strong but non-specific affinity of proteins and cells to attach to surfaces. This coating is a conformal, thin poly(ethylene glycol)-like film deposited in a glow discharge of tetraglyme. Substrates with different chemistries are successfully modified, and exhibit ultralow protein adsorption and cell attachment with the coating. This \"stealth\" or \"non-fouling\" coating can also be faithfully patterned using standard photolithography processes. The interaction of proteins and cells with patterned surfaces is limited only to the protein-adhesive domains, thus creating heterogeneous patterns of proteins and cell cultures on the surface. The potential benefits of our technique to applications such as cell-based assays and micro-electrodes are discussed.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117095463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906465
M. Brandl, V. Kempe
Austria Mikro Systeme International has developed a high performance, one axis accelerometer with capacitive readout for the automotive sensor market. The full-scale range is customizable from 1 g to 200 g. The novel sensor concept combines the advantages of monolithic and hybrid concepts and focuses on mature, high yield/low cost batch fabrication process modules. Industrialization and performance capabilities of the sensor concept have been demonstrated.
{"title":"High performance accelerometer based on CMOS technologies with low cost add-ons","authors":"M. Brandl, V. Kempe","doi":"10.1109/MEMSYS.2001.906465","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906465","url":null,"abstract":"Austria Mikro Systeme International has developed a high performance, one axis accelerometer with capacitive readout for the automotive sensor market. The full-scale range is customizable from 1 g to 200 g. The novel sensor concept combines the advantages of monolithic and hybrid concepts and focuses on mature, high yield/low cost batch fabrication process modules. Industrialization and performance capabilities of the sensor concept have been demonstrated.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131440433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906546
J. Hane, I. Komazaki, T. Ito, Y. Kuroda, E. Yamamoto
A newly developed encoder using a vertical cavity surface-emitting laser (VCSEL) is presented. This high-resolution encoder is the smallest in its class and has a large allowance for the gap alignment between the sensor head and the scale. These features are realized simultaneously by adopting VCSEL and multi-functional IC and by incorporating the technique of Talbot interference: no optical elements are required for the sensor head except a light source and a photosensor, which can be reduced in size by the semiconductor production technology. In comparison to our previous model, this encoder has greater tolerance against optical disturbances to the scale such as dust.
{"title":"Ultra-compact encoder using Talbot interference","authors":"J. Hane, I. Komazaki, T. Ito, Y. Kuroda, E. Yamamoto","doi":"10.1109/MEMSYS.2001.906546","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906546","url":null,"abstract":"A newly developed encoder using a vertical cavity surface-emitting laser (VCSEL) is presented. This high-resolution encoder is the smallest in its class and has a large allowance for the gap alignment between the sensor head and the scale. These features are realized simultaneously by adopting VCSEL and multi-functional IC and by incorporating the technique of Talbot interference: no optical elements are required for the sensor head except a light source and a photosensor, which can be reduced in size by the semiconductor production technology. In comparison to our previous model, this encoder has greater tolerance against optical disturbances to the scale such as dust.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"163 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127382854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906518
Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi
A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO/sub 2/ bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 kHz. The ON resistance R/sub ON/, that includes contact resistance and signal line resistance is in the range of 200-500 m/spl Omega/ and switching time is about 300 /spl mu/sec. 10/sup 7/ cycles operation has been performed keeping the R/sub ON/ around 300 m/spl Omega/.
{"title":"A thermomechanical relay with microspring contact array","authors":"Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi","doi":"10.1109/MEMSYS.2001.906518","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906518","url":null,"abstract":"A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO/sub 2/ bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 kHz. The ON resistance R/sub ON/, that includes contact resistance and signal line resistance is in the range of 200-500 m/spl Omega/ and switching time is about 300 /spl mu/sec. 10/sup 7/ cycles operation has been performed keeping the R/sub ON/ around 300 m/spl Omega/.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126672086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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