Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906493
Yiping Liu, Li-Anne View, Ruiling Luo, L. An, V. Bright, M. Dunn, J. Daily, R. Raj
Ceramics and polymers are becoming attractive candidate materials for MEMS applications because of the wide range of properties that can be obtained and the promise of improved performance as compared to the existing materials set for MEMS. A challenge in the fabrication of ceramic MEMS is prohibiting cracking that can occur during processing. For example, this is significant in the development of a microcasting fabrication technique from a polymer precursor for silicon carbonitride (SiCN) MEMS. In this case, shrinkage mismatch between the SiCN structure and the microfabricated mold during thermal processes leads to significant stresses that can crack the ceramic structure. Here we propose an approach to overcome this problem that relies on demolding prior to the large shrinkage mismatch thermal processes, which itself is a nontrivial challenge. To this end, we propose a microforging process that facilitates demolding. We describe the process and show representative results for numerous SiCN ceramic microstructures.
{"title":"Fabrication of SiCN MEMS structures using microforged molds","authors":"Yiping Liu, Li-Anne View, Ruiling Luo, L. An, V. Bright, M. Dunn, J. Daily, R. Raj","doi":"10.1109/MEMSYS.2001.906493","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906493","url":null,"abstract":"Ceramics and polymers are becoming attractive candidate materials for MEMS applications because of the wide range of properties that can be obtained and the promise of improved performance as compared to the existing materials set for MEMS. A challenge in the fabrication of ceramic MEMS is prohibiting cracking that can occur during processing. For example, this is significant in the development of a microcasting fabrication technique from a polymer precursor for silicon carbonitride (SiCN) MEMS. In this case, shrinkage mismatch between the SiCN structure and the microfabricated mold during thermal processes leads to significant stresses that can crack the ceramic structure. Here we propose an approach to overcome this problem that relies on demolding prior to the large shrinkage mismatch thermal processes, which itself is a nontrivial challenge. To this end, we propose a microforging process that facilitates demolding. We describe the process and show representative results for numerous SiCN ceramic microstructures.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130669972","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906611
S. Maruo, K. Ikuta, K. Hayato
Freely movable microstructures were made by use of high-speed two-photon microstereolithography with 200 nm resolution. In our method, movable microstructures are fabricated by fast scanning of an ultrashort-pulsed near-infrared laser beam through the inside of a liquid photocurable polymer. Since the method does not require sacrificial etching processes normally used in major micromachining such as surface micromachining and LIGA process, the fabrication process of movable microstructures can be drastically simplified. In addition, the movable microstructures can be driven by means of laser-scanning micromanipulation, because the resultant microstructures are transparent to visible and near infrared light. In our experiments, micromechanisms such as a microgear and micromanipulators were successfully driven by a focused laser beam. Such light-driven micromechanism should be developed into various microdevices applicable to microfluidics, chemistry and biochemistry.
{"title":"Light-driven MEMS made by high-speed two-photon microstereolithography","authors":"S. Maruo, K. Ikuta, K. Hayato","doi":"10.1109/MEMSYS.2001.906611","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906611","url":null,"abstract":"Freely movable microstructures were made by use of high-speed two-photon microstereolithography with 200 nm resolution. In our method, movable microstructures are fabricated by fast scanning of an ultrashort-pulsed near-infrared laser beam through the inside of a liquid photocurable polymer. Since the method does not require sacrificial etching processes normally used in major micromachining such as surface micromachining and LIGA process, the fabrication process of movable microstructures can be drastically simplified. In addition, the movable microstructures can be driven by means of laser-scanning micromanipulation, because the resultant microstructures are transparent to visible and near infrared light. In our experiments, micromechanisms such as a microgear and micromanipulators were successfully driven by a focused laser beam. Such light-driven micromechanism should be developed into various microdevices applicable to microfluidics, chemistry and biochemistry.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116664592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906477
A. Partridge, A. Rice, T. Kenny, M. Lutz
This paper reports a new method of thin film encapsulation for surface micromachined sensors using an epitaxially grown polysilicon cap layer. This technique saves die area and enables the sensors to be handled in standard mounting processes such as pick and place and is suitable for injection plastic molding. The 'epipoly' encapsulation is designed for a lateral piezoresistive accelerometer, but is broadly applicable. This paper presents an analytic model that describes the deflection of the epipoly encapsulation as a function of pressure, thickness, length, shape, standoff height, venting, sealing, and material properties. This model is verified with Finite Element Analysis (FEA) and experiment.
{"title":"New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers","authors":"A. Partridge, A. Rice, T. Kenny, M. Lutz","doi":"10.1109/MEMSYS.2001.906477","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906477","url":null,"abstract":"This paper reports a new method of thin film encapsulation for surface micromachined sensors using an epitaxially grown polysilicon cap layer. This technique saves die area and enables the sensors to be handled in standard mounting processes such as pick and place and is suitable for injection plastic molding. The 'epipoly' encapsulation is designed for a lateral piezoresistive accelerometer, but is broadly applicable. This paper presents an analytic model that describes the deflection of the epipoly encapsulation as a function of pressure, thickness, length, shape, standoff height, venting, sealing, and material properties. This model is verified with Finite Element Analysis (FEA) and experiment.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121808523","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906470
C. Wilson, Y. Gianchandani
This paper reports on the etching of Si using spatially confined SF/sub 6/ microplasmas that are generated by applying a DC bias across a metal-polyimide-metal electrode stack patterned on a sample substrate. The typical operating pressure and power density are in the range of 1-20 Torr and 1-10 W/cm/sup 2/, respectively. The plasma confinement can be varied from <100 /spl mu/m to >1 cm by variations in the electrode area, operating pressure, and power. Etch rates of 4-17 /spl mu/m/min have been achieved. The etch rate per unit power density increases with increasing pressure, while the plasma resistance decreases with increasing power density. In a shared anode configuration, which is suitable for small feature sizes, reducing the trench width from 106 /spl mu/m to 6 /spl mu/m reduces the etch rate by 14%. Numerical modeling is used to correlate variations in the local electric fields to measured trends in the etch rate and asymmetry in the etch profile.
{"title":"Progress in silicon etching by in-situ dc microplasmas","authors":"C. Wilson, Y. Gianchandani","doi":"10.1109/MEMSYS.2001.906470","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906470","url":null,"abstract":"This paper reports on the etching of Si using spatially confined SF/sub 6/ microplasmas that are generated by applying a DC bias across a metal-polyimide-metal electrode stack patterned on a sample substrate. The typical operating pressure and power density are in the range of 1-20 Torr and 1-10 W/cm/sup 2/, respectively. The plasma confinement can be varied from <100 /spl mu/m to >1 cm by variations in the electrode area, operating pressure, and power. Etch rates of 4-17 /spl mu/m/min have been achieved. The etch rate per unit power density increases with increasing pressure, while the plasma resistance decreases with increasing power density. In a shared anode configuration, which is suitable for small feature sizes, reducing the trench width from 106 /spl mu/m to 6 /spl mu/m reduces the etch rate by 14%. Numerical modeling is used to correlate variations in the local electric fields to measured trends in the etch rate and asymmetry in the etch profile.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130129516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906467
H. Yamada, T. Togasaki, M. Kimura, H. Sudo
High-density three-dimensional (3D) packaging technology for a CCD micro-camera system module has been developed by applying high-density interconnection stack-unit modules that have fine-pitch flip-chip interconnections within copper-column-based solder bumps and high-aspect-ratio sidewall footprints for vertical interconnections. Copper-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump and to achieve fine-pitch flip-chip interconnection with high reliability. High-aspect-ratio sidewall footprints were realized by the copper-filled stacked vias at the edge of the module substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stack-unit substrates simultaneously. The fabricated three-dimensional package has operated satisfactorily as the CCD imaging data transmission circuit module. The technology was confirmed to be effective for incorporating many devices of different sizes at far higher packaging density than it is possible to attain using conventional technology.
{"title":"High-density 3D packaging technology for CCD micro-camera system module","authors":"H. Yamada, T. Togasaki, M. Kimura, H. Sudo","doi":"10.1109/MEMSYS.2001.906467","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906467","url":null,"abstract":"High-density three-dimensional (3D) packaging technology for a CCD micro-camera system module has been developed by applying high-density interconnection stack-unit modules that have fine-pitch flip-chip interconnections within copper-column-based solder bumps and high-aspect-ratio sidewall footprints for vertical interconnections. Copper-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump and to achieve fine-pitch flip-chip interconnection with high reliability. High-aspect-ratio sidewall footprints were realized by the copper-filled stacked vias at the edge of the module substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stack-unit substrates simultaneously. The fabricated three-dimensional package has operated satisfactorily as the CCD imaging data transmission circuit module. The technology was confirmed to be effective for incorporating many devices of different sizes at far higher packaging density than it is possible to attain using conventional technology.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"368 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114008265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906593
C. Cabuz, W. Herb, E. Cabuz, S. Lu
This paper reports a major advancement in gas pumping at micro- and meso-scale, made possible by the newly developed, electrostatically actuated, dual-diaphragm pump (DDP). The DDP uses a conformal pumping chamber and two electrostatically actuated, structured diaphragms, to achieve perfect rectification. The DDP demonstrates flow rates of about 30 ml/min and a power consumption of about 8 mW at an overall pump volume of about 1.5/spl times/1.5/spl times/0.1 cm/sup 3/. The DDP is fully symmetrical, having true bidirectional operation; has essentially zero dead space; and is fully scalable. For increased throughput the individual pumping channels can be built in 1D, 2D and 3D arrays. This feature allows the optimization of the individual pumping channel for best performance under electrostatic actuation, but allows scaling of the pumping rate to the desired level. Arrays of 2/spl times/3/spl times/5 pumps have been successfully demonstrated. A DDP array pumping 4 liters per minute will be about 4 times smaller in volume and will use about 4 times less power than the most advanced commercially available air pumps.
{"title":"The dual diaphragm pump","authors":"C. Cabuz, W. Herb, E. Cabuz, S. Lu","doi":"10.1109/MEMSYS.2001.906593","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906593","url":null,"abstract":"This paper reports a major advancement in gas pumping at micro- and meso-scale, made possible by the newly developed, electrostatically actuated, dual-diaphragm pump (DDP). The DDP uses a conformal pumping chamber and two electrostatically actuated, structured diaphragms, to achieve perfect rectification. The DDP demonstrates flow rates of about 30 ml/min and a power consumption of about 8 mW at an overall pump volume of about 1.5/spl times/1.5/spl times/0.1 cm/sup 3/. The DDP is fully symmetrical, having true bidirectional operation; has essentially zero dead space; and is fully scalable. For increased throughput the individual pumping channels can be built in 1D, 2D and 3D arrays. This feature allows the optimization of the individual pumping channel for best performance under electrostatic actuation, but allows scaling of the pumping rate to the desired level. Arrays of 2/spl times/3/spl times/5 pumps have been successfully demonstrated. A DDP array pumping 4 liters per minute will be about 4 times smaller in volume and will use about 4 times less power than the most advanced commercially available air pumps.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127694202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906594
J. van Honschoten, G. Krijnen, V. Svetovoy, H. de Bree, M. Elwenspoek
The Microflown is an acoustic sensor measuring particle velocity instead of pressure, which is usually measured by conventional microphones. In this paper an analytical model is presented to describe the physical processes that govern the behaviour of the sensor and determine its sensitivity. The Microflown consists of two heaters that act simultaneously as sensors. Forced convection by an acoustic wave leads to a small perturbation of this temperature profile, resulting in a temperature difference between the two sensors. This temperature difference, to which the sensitivity is proportional, is calculated with perturbation theory. Consequently the frequency dependent behaviour of the sensitivity is analysed; it is found that there are two important corner frequencies, the first related to the time constant velocity of heat diffusion between the sensors, the second related to the heat capacity of the heaters. The developed model is verified by experiments. Previously a very good model has been given for the performance of the Microflown in a channel, i.e. with both heaters between fixed walls walls in the positive and negative z-direction. Here, a model is presented that describes the situation of the present used sensors: without walls under and above them. Model predictions are compared to experimental results.
{"title":"Optimisation of a two-wire thermal sensor for flow and sound measurements","authors":"J. van Honschoten, G. Krijnen, V. Svetovoy, H. de Bree, M. Elwenspoek","doi":"10.1109/MEMSYS.2001.906594","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906594","url":null,"abstract":"The Microflown is an acoustic sensor measuring particle velocity instead of pressure, which is usually measured by conventional microphones. In this paper an analytical model is presented to describe the physical processes that govern the behaviour of the sensor and determine its sensitivity. The Microflown consists of two heaters that act simultaneously as sensors. Forced convection by an acoustic wave leads to a small perturbation of this temperature profile, resulting in a temperature difference between the two sensors. This temperature difference, to which the sensitivity is proportional, is calculated with perturbation theory. Consequently the frequency dependent behaviour of the sensitivity is analysed; it is found that there are two important corner frequencies, the first related to the time constant velocity of heat diffusion between the sensors, the second related to the heat capacity of the heaters. The developed model is verified by experiments. Previously a very good model has been given for the performance of the Microflown in a channel, i.e. with both heaters between fixed walls walls in the positive and negative z-direction. Here, a model is presented that describes the situation of the present used sensors: without walls under and above them. Model predictions are compared to experimental results.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133680370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906568
J. Koo, L. Jiang, L. Zhang, P. Zhou, Sankha Banerjee, T. Kenny, J. Santiago, K. Goodson
Microchannel heat sinks with forced convective boiling can satisfy the increasing heat removal requirements of VLSI chips. But little is known about two-phase boiling flow in channels with cross-sectional dimensions below 100 /spl mu/m. This work develops and experimentally verifies microchannel simulations, which relate the temperature field to the applied power and flowrate. The simulations consider silicon conduction and assume an immediate transition to homogeneous misty flow, without the bubbly and plug-flow regimes in larger channels. Pressure drop and wall temperature predictions are consistent with data for a channel with cross-sectional dimensions of 50 /spl mu/m/spl times/70 /spl mu/m. The simulations explore the performance of a novel heat sink system with an electrokinetic pump for the liquid phase, which provides 1 atm and 15 ml/min. A temperature rise below 40 K is predicted for a 200 W heat sink for a 25 mm/spl times/25 mm chip.
{"title":"Modeling of two-phase microchannel heat sinks for VLSI chips","authors":"J. Koo, L. Jiang, L. Zhang, P. Zhou, Sankha Banerjee, T. Kenny, J. Santiago, K. Goodson","doi":"10.1109/MEMSYS.2001.906568","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906568","url":null,"abstract":"Microchannel heat sinks with forced convective boiling can satisfy the increasing heat removal requirements of VLSI chips. But little is known about two-phase boiling flow in channels with cross-sectional dimensions below 100 /spl mu/m. This work develops and experimentally verifies microchannel simulations, which relate the temperature field to the applied power and flowrate. The simulations consider silicon conduction and assume an immediate transition to homogeneous misty flow, without the bubbly and plug-flow regimes in larger channels. Pressure drop and wall temperature predictions are consistent with data for a channel with cross-sectional dimensions of 50 /spl mu/m/spl times/70 /spl mu/m. The simulations explore the performance of a novel heat sink system with an electrokinetic pump for the liquid phase, which provides 1 atm and 15 ml/min. A temperature rise below 40 K is predicted for a 200 W heat sink for a 25 mm/spl times/25 mm chip.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134130967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906491
C. Dan, E. S. Kim
The paper presents a technique to fabricate a cantilever-like diaphragm that releases the residual stress (and also is mechanically flexible) much like a cantilever, and yet is itself a diaphragm with its four edges clamped. Using the high mechanical flexibility (i.e., extremely low Young's Modulus) of parylene as a holding layer, we have successfully fabricated various piezoelectric acoustic transducers built on silicon nitride layer (either in cantilever form and/or freely-suspended island form) with electrodes and piezoelectric ZnO film. Since parylene has relatively low melting point (around 280/spl deg/C for parylene C), we deposit the parylene holding layer toward the end of the fabrication process after processing all the high temperature steps. Then after releasing the diaphragm with KOH etching, the silicon nitride is patterned from the backside with a reactive ion etcher (RIE). To demonstrate the effectiveness of a parylene-held cantilever-like diaphragm in releasing the residual stress, the devices before and after patterning the silicon nitride are compared. The acoustic outputs of the fabricated transducers have been measured with B&K 4135 microphone.
{"title":"Fabrication of piezoelectric acoustic transducers built on cantilever-like diaphragm","authors":"C. Dan, E. S. Kim","doi":"10.1109/MEMSYS.2001.906491","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906491","url":null,"abstract":"The paper presents a technique to fabricate a cantilever-like diaphragm that releases the residual stress (and also is mechanically flexible) much like a cantilever, and yet is itself a diaphragm with its four edges clamped. Using the high mechanical flexibility (i.e., extremely low Young's Modulus) of parylene as a holding layer, we have successfully fabricated various piezoelectric acoustic transducers built on silicon nitride layer (either in cantilever form and/or freely-suspended island form) with electrodes and piezoelectric ZnO film. Since parylene has relatively low melting point (around 280/spl deg/C for parylene C), we deposit the parylene holding layer toward the end of the fabrication process after processing all the high temperature steps. Then after releasing the diaphragm with KOH etching, the silicon nitride is patterned from the backside with a reactive ion etcher (RIE). To demonstrate the effectiveness of a parylene-held cantilever-like diaphragm in releasing the residual stress, the devices before and after patterning the silicon nitride are compared. The acoustic outputs of the fabricated transducers have been measured with B&K 4135 microphone.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115733230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-01-21DOI: 10.1109/MEMSYS.2001.906614
W. Lindsay, D. Teasdale, V. Milanovic, K. Pister, C. Fernandez-Pello
Progress has been made in the development of flying silicon. Fully self-contained MEMS rockets have been designed, fabricated and tested. A peak thrust of 4 mN was obtained from a rocket with a mass of 0.98 grams. This rocket was comprised of a 3.2 mm inside diameter ceramic tube bonded to a silicon chip containing the rocket nozzle, igniter and an array of twelve thermopiles. One thermopile was measured during combustion and yielded 20 micro Watts of electrical power during a combustion event of approximately 10 seconds. Third-generation devices have demonstrated liftoff.
{"title":"Thrust and electrical power from solid propellant microrockets. 2. Actuators","authors":"W. Lindsay, D. Teasdale, V. Milanovic, K. Pister, C. Fernandez-Pello","doi":"10.1109/MEMSYS.2001.906614","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906614","url":null,"abstract":"Progress has been made in the development of flying silicon. Fully self-contained MEMS rockets have been designed, fabricated and tested. A peak thrust of 4 mN was obtained from a rocket with a mass of 0.98 grams. This rocket was comprised of a 3.2 mm inside diameter ceramic tube bonded to a silicon chip containing the rocket nozzle, igniter and an array of twelve thermopiles. One thermopile was measured during combustion and yielded 20 micro Watts of electrical power during a combustion event of approximately 10 seconds. Third-generation devices have demonstrated liftoff.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130850613","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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