Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521838
S. Kitagoh, H. Mitsugi, S. Koyama, I. Shohji
The effects of the filler content and temperature on tensile properties of underfill were investigated using underfill materials which are composed of bisphenol F-type epoxy resin and spheroidal SiO2 filler. Young's modulus of underfill increased and fracture strain decreased with increasing the SiO2 filler content. The effects of the SiO2 filler content on Young's modulus and fracture strain were relatively large. However, the effect on tensile strength was negligible. Tensile strength was strongly affected by the strength of matrix resin itself. When the temperature was above Tg, Young's modulus decreased and fracture strain increased remarkably. Fracture mainly occurred in matrix resin below Tg and in the interface between matrix resin and filler above Tg.
{"title":"Effect of filler content on tensile properties of underfill material for flip chip bonding","authors":"S. Kitagoh, H. Mitsugi, S. Koyama, I. Shohji","doi":"10.1109/IEMT.2012.6521838","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521838","url":null,"abstract":"The effects of the filler content and temperature on tensile properties of underfill were investigated using underfill materials which are composed of bisphenol F-type epoxy resin and spheroidal SiO2 filler. Young's modulus of underfill increased and fracture strain decreased with increasing the SiO2 filler content. The effects of the SiO2 filler content on Young's modulus and fracture strain were relatively large. However, the effect on tensile strength was negligible. Tensile strength was strongly affected by the strength of matrix resin itself. When the temperature was above Tg, Young's modulus decreased and fracture strain increased remarkably. Fracture mainly occurred in matrix resin below Tg and in the interface between matrix resin and filler above Tg.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123169890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521777
N. A. Jasli, H. A. Hamid, R. Mayappan
This study investigated the effect of Ag addition on the formation of intermetallic compounds and joint strength of the Sn-Zn-Bi based alloys under liquid state aging. The intermetallic compounds were formed by reacting Sn-8Zn-3Bi and (Sn-8Zn-3Bi)-1Ag lead free solders on copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. It was found that for Sn-8Zn-3Bi solder reacting with Cu substrate, the Cu5Zn8 intermetallic was formed. On the other hand, when 1% Ag was added into the solder, the Cu3Sn and Cu6Sn5 IMC were formed. The morphology of the Cu5Zn8 intermetallic was flat whereas for Cu3Sn and Cu6Sn5 were rather scallop. The addition of Ag into the Sn-Zn-Bi solder increases the shear strength of the solder joint. It is believed the scallop morphology of Cu-Sn contribute to strengthening the (Sn-8Zn-3Bi)-1Ag/Cu joints.
{"title":"Effect of Ag addition on the intermetallic compound and joint strength between Sn-Zn-Bi lead free solder and copper substrate","authors":"N. A. Jasli, H. A. Hamid, R. Mayappan","doi":"10.1109/IEMT.2012.6521777","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521777","url":null,"abstract":"This study investigated the effect of Ag addition on the formation of intermetallic compounds and joint strength of the Sn-Zn-Bi based alloys under liquid state aging. The intermetallic compounds were formed by reacting Sn-8Zn-3Bi and (Sn-8Zn-3Bi)-1Ag lead free solders on copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. It was found that for Sn-8Zn-3Bi solder reacting with Cu substrate, the Cu<sub>5</sub>Zn<sub>8</sub> intermetallic was formed. On the other hand, when 1% Ag was added into the solder, the Cu<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub> IMC were formed. The morphology of the Cu<sub>5</sub>Zn<sub>8</sub> intermetallic was flat whereas for Cu<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub> were rather scallop. The addition of Ag into the Sn-Zn-Bi solder increases the shear strength of the solder joint. It is believed the scallop morphology of Cu-Sn contribute to strengthening the (Sn-8Zn-3Bi)-1Ag/Cu joints.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121734047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521835
T. Oppert, T. Teutsch, G. Azdasht, E. Zakel
The miniaturization in electronics is driven by size reduction and cost, however by increasing the technical performance of the device. In regard to wafer level applications flip chip technology is still one of the interconnection methods with the potential of highest integration and cost savings. For applications other than on wafer level, 3-dimensional packages like e.g. camera modules, read-write heads for hard disk drives and various other applications a solder jetting method using solder ball diameters down to 30μm is used.
{"title":"Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting","authors":"T. Oppert, T. Teutsch, G. Azdasht, E. Zakel","doi":"10.1109/IEMT.2012.6521835","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521835","url":null,"abstract":"The miniaturization in electronics is driven by size reduction and cost, however by increasing the technical performance of the device. In regard to wafer level applications flip chip technology is still one of the interconnection methods with the potential of highest integration and cost savings. For applications other than on wafer level, 3-dimensional packages like e.g. camera modules, read-write heads for hard disk drives and various other applications a solder jetting method using solder ball diameters down to 30μm is used.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126893143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521774
N. B. M. Nasir., C. K. Tan
Fluctuating global economic trends impact product demand, which in turn impact assembly materials volume and inventory levels in the factories leading to excessive materials scrap due to shelf life expiry during demand downturns. Therefore, the need to drive for assembly direct materials shelf life extension has become a critical focus area to improve materials inventory management. This paper describes an approach to extend the shelf life of assembly direct materials (epoxy underfill and Flip Chip Ball Grid Array (FCBGA) substrate materials) to minimize the impact of dynamic volume changes on materials scrap and provide flexibility plus cost savings in managing materials inventory. 33% scrap rate reduction was achieved for underfill and significant cost savings were realized for FCBGA substrates.
{"title":"Stretching the capability of intel direct material usability (shelf life)","authors":"N. B. M. Nasir., C. K. Tan","doi":"10.1109/IEMT.2012.6521774","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521774","url":null,"abstract":"Fluctuating global economic trends impact product demand, which in turn impact assembly materials volume and inventory levels in the factories leading to excessive materials scrap due to shelf life expiry during demand downturns. Therefore, the need to drive for assembly direct materials shelf life extension has become a critical focus area to improve materials inventory management. This paper describes an approach to extend the shelf life of assembly direct materials (epoxy underfill and Flip Chip Ball Grid Array (FCBGA) substrate materials) to minimize the impact of dynamic volume changes on materials scrap and provide flexibility plus cost savings in managing materials inventory. 33% scrap rate reduction was achieved for underfill and significant cost savings were realized for FCBGA substrates.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"2016 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132397881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521780
E. Ervina, A. Singh
Soldering is a well-known metallurgical joining method that uses the solder in which two or more metal items are joined together by melting and flowing a filler metal solder into the joint. It is widely used in the electronic applications. In parallel with the need of lead free solder, the usage of Pb is eliminated and addition of compositions such as Zn, Al, Cu and Ag has been introduced in the Sn-based solder. This is in order to produce better solder alloy for the electronic packaging. Also additions of rare earth (RE) elements are such as Bi, Sb, In, Co, Mn and etc are introduced to produce the solder alloy. In this paper, the mechanical properties of the Sn-9Zn/Cu alloy and Sn-4Zn-6Bi/Cu alloy which is tested based on the shear test and tensile test. Sn-9Zn alloy has been found out to be the better substitute of the Pb-based alloy due to its melting point of 198°C which is important for the assembly of electronic packaging. Zn is also a composition which is of low cost and this helps to overcome the high spending of any electronic company. The Sn-4Zn-6Bi alloy has been found to have better mechanical properties than Sn-9Zn alloy. The addition of Bi has decreased the melting point to 189°C. Besides that, the addition of Bi enhances the shear strength of the solder joint as well as possessing a better mechanical characteristic. This shows the Sn-4Zn-6Bi can be a better choice of a leads free solder. Test was conducted using lap shear test with three different crosshead speed using both the alloys after reflowed temperature of 230°C, 250°C and 270°C. All this measure is taken in to serious consideration and importance for producing the better lead free solder.
{"title":"Characterization of mechanical testing on lead free solder on electronic application","authors":"E. Ervina, A. Singh","doi":"10.1109/IEMT.2012.6521780","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521780","url":null,"abstract":"Soldering is a well-known metallurgical joining method that uses the solder in which two or more metal items are joined together by melting and flowing a filler metal solder into the joint. It is widely used in the electronic applications. In parallel with the need of lead free solder, the usage of Pb is eliminated and addition of compositions such as Zn, Al, Cu and Ag has been introduced in the Sn-based solder. This is in order to produce better solder alloy for the electronic packaging. Also additions of rare earth (RE) elements are such as Bi, Sb, In, Co, Mn and etc are introduced to produce the solder alloy. In this paper, the mechanical properties of the Sn-9Zn/Cu alloy and Sn-4Zn-6Bi/Cu alloy which is tested based on the shear test and tensile test. Sn-9Zn alloy has been found out to be the better substitute of the Pb-based alloy due to its melting point of 198°C which is important for the assembly of electronic packaging. Zn is also a composition which is of low cost and this helps to overcome the high spending of any electronic company. The Sn-4Zn-6Bi alloy has been found to have better mechanical properties than Sn-9Zn alloy. The addition of Bi has decreased the melting point to 189°C. Besides that, the addition of Bi enhances the shear strength of the solder joint as well as possessing a better mechanical characteristic. This shows the Sn-4Zn-6Bi can be a better choice of a leads free solder. Test was conducted using lap shear test with three different crosshead speed using both the alloys after reflowed temperature of 230°C, 250°C and 270°C. All this measure is taken in to serious consideration and importance for producing the better lead free solder.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"494 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116695109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521803
T. Braun, K. Becker, L. Bottcher, A. Ostmann, E. Jung, S. Voges, T. Thomas, R. Kahle, V. Bader, J. Bauer, R. Aschenbrenner, M. Ramelow, K. Lang
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the potential of advanced compression molding processes for multi chip embedding in combination with large area and low cost redistribution technology derived from printed circuit board manufacturing. PCB based redistribution offers the potential of real large area redistribution up to 610 × 457 mm2 and the integration of vias (also through mold vias -TMVs) as both are standard features in PCB manufacturing. The use of compression molding equipment with liquid or granular epoxy molding compounds for the targeted integration process flow is a new technology that has been especially developed to allow large area embedding process for the manufacturing of single chip packages, multi chip packages or even heterogeneous systems on wafer scale, typically in 8" to 12" format. The wiring of the embedded components can be done using PCB manufacturing technologies, i.e. a resin coated copper (RCC) film is laminated over the embedded components and on the wafer backside for double sided redistribution. In a process flow similar to conventional PCB manufacturing μvias and through mold vias are drilled using a UV laser after RCC lamination and are metalized by galvanic Cu process in one step. Conductor lines and pads are formed by Cu etching. Finally, a soldermask and a solderable surface finish are applied - all of them standard PCB processes. If solder depots are necessary, e.g. for BGA packages, those can be applied by solder balling equipment - either by printing or by preform attach. To evaluate the potential of today's encapsulants for large area embedding processes, different liquid and granular molding compounds have been intensively evaluated on their processability, process & material induced die shift and warpage results. A strong focus was put on the process chain: chip placement on a temporary carrier - compression vacuum molding for embedding - RCC lamination - laser drilling processes for μVias & through holes - metallization structuring - module singulation & 3D assembly. The feasibility of the entire process chain is demonstrated by the fabrication of a Ball Grid Array (BGA) type of system package with two embedded dies and through mold vias allowing the stacking of these BGA packages. A demonstrator with two BGAs with embedded components and PCB based redistribution stacked on each other and mounted on a base substrate enabling the electrical connection of the stacked module was generated. Reliability of the manufactured 3D stacks is evaluated by temperature cycling and is analyzed both non-destructively and destructively. In summary
{"title":"Large area mold embedding technology with PCB based redistribution","authors":"T. Braun, K. Becker, L. Bottcher, A. Ostmann, E. Jung, S. Voges, T. Thomas, R. Kahle, V. Bader, J. Bauer, R. Aschenbrenner, M. Ramelow, K. Lang","doi":"10.1109/IEMT.2012.6521803","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521803","url":null,"abstract":"The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the potential of advanced compression molding processes for multi chip embedding in combination with large area and low cost redistribution technology derived from printed circuit board manufacturing. PCB based redistribution offers the potential of real large area redistribution up to 610 × 457 mm2 and the integration of vias (also through mold vias -TMVs) as both are standard features in PCB manufacturing. The use of compression molding equipment with liquid or granular epoxy molding compounds for the targeted integration process flow is a new technology that has been especially developed to allow large area embedding process for the manufacturing of single chip packages, multi chip packages or even heterogeneous systems on wafer scale, typically in 8\" to 12\" format. The wiring of the embedded components can be done using PCB manufacturing technologies, i.e. a resin coated copper (RCC) film is laminated over the embedded components and on the wafer backside for double sided redistribution. In a process flow similar to conventional PCB manufacturing μvias and through mold vias are drilled using a UV laser after RCC lamination and are metalized by galvanic Cu process in one step. Conductor lines and pads are formed by Cu etching. Finally, a soldermask and a solderable surface finish are applied - all of them standard PCB processes. If solder depots are necessary, e.g. for BGA packages, those can be applied by solder balling equipment - either by printing or by preform attach. To evaluate the potential of today's encapsulants for large area embedding processes, different liquid and granular molding compounds have been intensively evaluated on their processability, process & material induced die shift and warpage results. A strong focus was put on the process chain: chip placement on a temporary carrier - compression vacuum molding for embedding - RCC lamination - laser drilling processes for μVias & through holes - metallization structuring - module singulation & 3D assembly. The feasibility of the entire process chain is demonstrated by the fabrication of a Ball Grid Array (BGA) type of system package with two embedded dies and through mold vias allowing the stacking of these BGA packages. A demonstrator with two BGAs with embedded components and PCB based redistribution stacked on each other and mounted on a base substrate enabling the electrical connection of the stacked module was generated. Reliability of the manufactured 3D stacks is evaluated by temperature cycling and is analyzed both non-destructively and destructively. In summary","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130998193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521753
M. O. Pahanel
Debugging hardware (ex. Device-Interface-Board or DIB) is very difficult especially if it is not your hardware design or set-up problems during production. ATE has their own checker to identify the problem of the instruments cards. Is your own designed test hardware or production released hardware has its own checker? If none, then you need a hardware checker module. A hardware checker module helps engineers/technicians to easily identify the problem of a typical set-up. The module consists of either a checker program or a resistor-insert or both. A checker program can be developed either an open loop or a closed-loop (with resistor-insert). It can also be a stand-alone program or embedded on the production released FT/WS program. The benefit of this practice is faster debugging. Faster debugging means faster cycle time to release of a new or down/defective hardware. It will also benefit manufacturing OEE. It will help identify the problem of the set-up either ATE or test hardware.
{"title":"Hardware checker module","authors":"M. O. Pahanel","doi":"10.1109/IEMT.2012.6521753","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521753","url":null,"abstract":"Debugging hardware (ex. Device-Interface-Board or DIB) is very difficult especially if it is not your hardware design or set-up problems during production. ATE has their own checker to identify the problem of the instruments cards. Is your own designed test hardware or production released hardware has its own checker? If none, then you need a hardware checker module. A hardware checker module helps engineers/technicians to easily identify the problem of a typical set-up. The module consists of either a checker program or a resistor-insert or both. A checker program can be developed either an open loop or a closed-loop (with resistor-insert). It can also be a stand-alone program or embedded on the production released FT/WS program. The benefit of this practice is faster debugging. Faster debugging means faster cycle time to release of a new or down/defective hardware. It will also benefit manufacturing OEE. It will help identify the problem of the set-up either ATE or test hardware.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132082137","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521818
F. Che, Dandong Ge, Yik Siong Tay, M. Yazid, S. L. Gan
Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties and outstanding robustness against delamination compared to traditional epoxy die attach. However, die tilt is usually one of the important issues and challenges during the soft solder process. The soft solder with Ni balls was introduced to reduce and control die tilt. During solder process, the Ni balls will not melt and will keep the ball shape, which would help control bond line thickness (BLT). The creep-fatigue failure is one typical failure mechanism for solder material under thermal cycling. So it is essential to investigate the effect of Ni ball on the material properties and reliability of the solder joint layer. In this work, tensile creep tests for solder wire with and without Ni ballss have been conducted at various temperatures and stress levels using Dynamic Mechanical Analyzer (DMA) to obtain the creep properties of the solders. The steady-state creep strain rates are similar for both solder typesl, which means that the Ni ball addition does not affect the creep behaviour of soft solder significantly. Creep constitutive models were developed and the material constants of the model were determined based on experimental results for both solders. The creep constitutive models can be implemented in finite element analysis (FEA) to investigate the creep behavior of solder in the power packages for evaluation of package reliability.
{"title":"Creep properties of soft solder die attach with Ni balls in power package applications","authors":"F. Che, Dandong Ge, Yik Siong Tay, M. Yazid, S. L. Gan","doi":"10.1109/IEMT.2012.6521818","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521818","url":null,"abstract":"Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties and outstanding robustness against delamination compared to traditional epoxy die attach. However, die tilt is usually one of the important issues and challenges during the soft solder process. The soft solder with Ni balls was introduced to reduce and control die tilt. During solder process, the Ni balls will not melt and will keep the ball shape, which would help control bond line thickness (BLT). The creep-fatigue failure is one typical failure mechanism for solder material under thermal cycling. So it is essential to investigate the effect of Ni ball on the material properties and reliability of the solder joint layer. In this work, tensile creep tests for solder wire with and without Ni ballss have been conducted at various temperatures and stress levels using Dynamic Mechanical Analyzer (DMA) to obtain the creep properties of the solders. The steady-state creep strain rates are similar for both solder typesl, which means that the Ni ball addition does not affect the creep behaviour of soft solder significantly. Creep constitutive models were developed and the material constants of the model were determined based on experimental results for both solders. The creep constitutive models can be implemented in finite element analysis (FEA) to investigate the creep behavior of solder in the power packages for evaluation of package reliability.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"343 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124312985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521831
Li Bin, Ong Kang Eu, I. Azid
Due to requirements of cost-saving and miniaturization, Package-on-Package (PoP) has recently gained popularity in many applications. However, its board level solder joint reliability during the thermal cycling test is not as well-studied as common single die BGA.. In this research, solder joint fatigue life of PoP is analyzed in detail. 3D model is established for PoP by using ABAQUS design software with consideration of detailed design, realistic shape of solder ball and non-linear material properties. The fatigue model is based on the Hyperbolic Sine Creep Model and it is taken from the works of Park,Hong and Lau. [1] The critical solder ball is observed located at the inner ring of bottom solder balls which is in between SPBGA and test board. The results show that in general, solder ball diameter has no much effect on its fatigue life..
{"title":"Solder paramater sensitivity for Package-on-Package (POP) on fatigue life prediction","authors":"Li Bin, Ong Kang Eu, I. Azid","doi":"10.1109/IEMT.2012.6521831","DOIUrl":"https://doi.org/10.1109/IEMT.2012.6521831","url":null,"abstract":"Due to requirements of cost-saving and miniaturization, Package-on-Package (PoP) has recently gained popularity in many applications. However, its board level solder joint reliability during the thermal cycling test is not as well-studied as common single die BGA.. In this research, solder joint fatigue life of PoP is analyzed in detail. 3D model is established for PoP by using ABAQUS design software with consideration of detailed design, realistic shape of solder ball and non-linear material properties. The fatigue model is based on the Hyperbolic Sine Creep Model and it is taken from the works of Park,Hong and Lau. [1] The critical solder ball is observed located at the inner ring of bottom solder balls which is in between SPBGA and test board. The results show that in general, solder ball diameter has no much effect on its fatigue life..","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124409594","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-11-01DOI: 10.1109/IEMT.2012.6521749
H. T. Wang, K. B. Yeo
Super high thermal die attach adhesive towards better thermal resistance and RDSON is highly desired in green robust package development. Novel inventions, include new basic resin, new type and distribution of silver filler, unique blend solvent to enhance silver filler compactness. Thermal and electrical conductivity are directly proportional to degree of silver compactness. Seven high thermal epoxies with thermal conductivity 20 to 65W/K.m and volume resistivity 0.01×10-8 to 7.62Ø10-5 are formulated, and assembled into TO263 package. Package thermal resistance, RDSON and SAM have been carried out to assess the glue robustness after MSL3@260dC, 1000 cycle thermal cycling and pressure cooker test. This paper studies the adhesive key challenges to dispensability, wire bond and reliability test. High viscosity due to high filler loading and resin type raise the concern of inconsistent dispensing. Writing dispensing and viscosity lower than 9.5Pa.s are recommended to achieve good dispensability. Higher silver filler to resin ratio enhances compactness of filler, however interfacial adhesion may be weaken which induce lifted die in wire bond. It is shown that minimum 0.16kg/mm2 strength with cohesive mode are sufficient to prevent die lifted. Good interfacial adhesion is also important to improve package thermal resistance by 12%. New thermoset resin and high silver filler loading tend to increase adhesive elastic modulus. This increases the concern of die attach material crack in reliability test. Addition of thermoplastic as resin effectively reduces elastic modulus of epoxy glue. Adhesive's thermal conductivity exceeding 20W/K.m is sufficient to meet TO263 thermal resistance. Thermal conductivity can be improved 11% with addition of spherical silver filler. RDSON test reveals all adhesives have good electrical conductivity in TO263 package.
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