Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441502
W. Jong, H. Tsai, Ching-Tzu Huang
On the complicated manufacturing processes of the high- density packages, the reliability of solder bumped IC chip on substrate and/or PCB has been confirmed by many researchers through thermal cycling tests, mechanical tests and computational modeling. In this study, the high-density package. 256-pin plastic ball grid array (PBGA) on printed circuit board (PCB) subjected to temperature cycling with the effects of element spacing ratio on the thermal- fatigue life of lead-free (95.5Sn-3.9Ag-0.6Cu) solder joints are investigated by using the validated finite-element analyses. Tins research studies the determination of thermal- fatigue life, creep responses and creep strain energy density per cycle with the various spacing ratio (-1, -5. -10, and -15) of the meshed lead-free solder joint for a range of cycling temperatures. Temperature loads are applied to the models that represent the cycling environment of chamber. After starting at room temperature, the model is subject of 5 cycles consisting of 10-minute ramps and 10- minute holds at each of 10 degC and 100 degC. Five cycles are executed in order to confirm the stabilization of the creep responses. For all the cases, the lead-free solder is assumed to obey the Garofalo- Arrhenius creep constitutive law.
{"title":"Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints","authors":"W. Jong, H. Tsai, Ching-Tzu Huang","doi":"10.1109/ICEPT.2007.4441502","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441502","url":null,"abstract":"On the complicated manufacturing processes of the high- density packages, the reliability of solder bumped IC chip on substrate and/or PCB has been confirmed by many researchers through thermal cycling tests, mechanical tests and computational modeling. In this study, the high-density package. 256-pin plastic ball grid array (PBGA) on printed circuit board (PCB) subjected to temperature cycling with the effects of element spacing ratio on the thermal- fatigue life of lead-free (95.5Sn-3.9Ag-0.6Cu) solder joints are investigated by using the validated finite-element analyses. Tins research studies the determination of thermal- fatigue life, creep responses and creep strain energy density per cycle with the various spacing ratio (-1, -5. -10, and -15) of the meshed lead-free solder joint for a range of cycling temperatures. Temperature loads are applied to the models that represent the cycling environment of chamber. After starting at room temperature, the model is subject of 5 cycles consisting of 10-minute ramps and 10- minute holds at each of 10 degC and 100 degC. Five cycles are executed in order to confirm the stabilization of the creep responses. For all the cases, the lead-free solder is assumed to obey the Garofalo- Arrhenius creep constitutive law.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124776189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441508
Xiao-qing Xiao, Jicheng Zhou, Y. En, Ni Chen
Based on robust design (Taguchi method) and finite element method (FEM). the thermo-mechanical reliability of plastic ball grid array (PBGA) solder joint subject to an accelerated thermal cycling test condition is studied. Including PCB size, substrate thickness, die coefficient of thermal expansion (CTE). and solder joint CTE et al. 8 different control factors are considered for a robust design towards enhancement of the thermal fatigue resistance of solder joint by using a mixed-level orthogonal array. From the results, importance of these factors on the thermo-mechanical reliability of PBGA solder joint is ranked. The best parameter combination is A1B2C3D1E2F1G3H1 in which the substrate CTE. solder joint CTE. the thickness of substrate, die CTE are the most important. The optimal design, after the comparative experiment with ANN (artificial neural network) and conformation experiment, has remarkable enhancement in thermo-mechanical reliability compared with the original design.
{"title":"Application of Robust Design on the Optimal Process Design of Thermo-mechanical Reliability of PBGA Solder Joint","authors":"Xiao-qing Xiao, Jicheng Zhou, Y. En, Ni Chen","doi":"10.1109/ICEPT.2007.4441508","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441508","url":null,"abstract":"Based on robust design (Taguchi method) and finite element method (FEM). the thermo-mechanical reliability of plastic ball grid array (PBGA) solder joint subject to an accelerated thermal cycling test condition is studied. Including PCB size, substrate thickness, die coefficient of thermal expansion (CTE). and solder joint CTE et al. 8 different control factors are considered for a robust design towards enhancement of the thermal fatigue resistance of solder joint by using a mixed-level orthogonal array. From the results, importance of these factors on the thermo-mechanical reliability of PBGA solder joint is ranked. The best parameter combination is A1B2C3D1E2F1G3H1 in which the substrate CTE. solder joint CTE. the thickness of substrate, die CTE are the most important. The optimal design, after the comparative experiment with ANN (artificial neural network) and conformation experiment, has remarkable enhancement in thermo-mechanical reliability compared with the original design.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125160747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441383
Yangfei Zhang, M. Miao, S. Bai, Yu-feng Jin
The effect of cavities and channels on the strength of LTCC substrate has been investigated by finite element analysis with commercial software ANSYS. The simulation model is based on three-point bending test of thick film LTCC substrate. Axial tensile stress and shear stress among layers are characterized to describe the effect on flexural strength and inter-layer shear strength. X, Y-axial channels, Z-axial via-hole, and cavities of various amounts are formed in the middle or surface layers of the LTCC substrate. The simulation results show that the maximum tensile stress always appears on the midline of the substrate bottom and causes fracture. The shear stress concentration has been found on the sidewalls of the holes and cavities and enhances the interlayer stripping.
{"title":"The Effect of Cavities and Channels on the Strength of LTCC Substrate","authors":"Yangfei Zhang, M. Miao, S. Bai, Yu-feng Jin","doi":"10.1109/ICEPT.2007.4441383","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441383","url":null,"abstract":"The effect of cavities and channels on the strength of LTCC substrate has been investigated by finite element analysis with commercial software ANSYS. The simulation model is based on three-point bending test of thick film LTCC substrate. Axial tensile stress and shear stress among layers are characterized to describe the effect on flexural strength and inter-layer shear strength. X, Y-axial channels, Z-axial via-hole, and cavities of various amounts are formed in the middle or surface layers of the LTCC substrate. The simulation results show that the maximum tensile stress always appears on the midline of the substrate bottom and causes fracture. The shear stress concentration has been found on the sidewalls of the holes and cavities and enhances the interlayer stripping.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128848726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441476
Rulin Shen, C. Shuai, J. Zhong
The objective of this research is to better understand in what way the ultra smooth hard disk magnetic head (the individual head also called 'slider') surface is formed in nanogrinding. A float-piece polisher was used to achieve ultra smooth and planar surface in nano-grinding way. The SEM was used to observe the diamond abrasive used in nano-grinding and the plate embedded with diamond abrasive. The slider surface was measured with SEM and AFM before and after nano-grinding. Though the micro-cutting of the continuous plane of the slider surface may exit, it was demonstrated that the un-continuous asperity of the slider surface can't be ignored in nano-grinding. According to the statistic analysis of the slider surface, the asperities are removed and replaced by a series of smaller asperities step by step, in this way, smoother surface is achieved gradually, and finally, a sub-nanometer smooth surface was achieved. A theoretical model was developed to illustrate the removal of single asperity removed by abrasive. The removal force taking by a single abrasive was calculated according to the model. Pole tip can be protected in some extent because of the regular arrange of the abrasive, so more planar slider surface was achieved in nano-grinding. Combined with the model and the distribution of the asperity of slider surface, the quality of the slider surface can be estimated and the nano-grinding procedure can be optimized.
{"title":"Study of Nano-grinding for GMR Magnetic Recording Head","authors":"Rulin Shen, C. Shuai, J. Zhong","doi":"10.1109/ICEPT.2007.4441476","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441476","url":null,"abstract":"The objective of this research is to better understand in what way the ultra smooth hard disk magnetic head (the individual head also called 'slider') surface is formed in nanogrinding. A float-piece polisher was used to achieve ultra smooth and planar surface in nano-grinding way. The SEM was used to observe the diamond abrasive used in nano-grinding and the plate embedded with diamond abrasive. The slider surface was measured with SEM and AFM before and after nano-grinding. Though the micro-cutting of the continuous plane of the slider surface may exit, it was demonstrated that the un-continuous asperity of the slider surface can't be ignored in nano-grinding. According to the statistic analysis of the slider surface, the asperities are removed and replaced by a series of smaller asperities step by step, in this way, smoother surface is achieved gradually, and finally, a sub-nanometer smooth surface was achieved. A theoretical model was developed to illustrate the removal of single asperity removed by abrasive. The removal force taking by a single abrasive was calculated according to the model. Pole tip can be protected in some extent because of the regular arrange of the abrasive, so more planar slider surface was achieved in nano-grinding. Combined with the model and the distribution of the asperity of slider surface, the quality of the slider surface can be estimated and the nano-grinding procedure can be optimized.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127640715","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441393
Z. Wu, Dejian Zhou, Yiiifeng Wu
Fast routing is one of the bottlenecks affecting the fast manufacturing of electronic equipments. The three-dimensional auto-routing system ( 3DRS) of electronic equipment is designed on the of unigraphics ( UG ) which is a three-dimensional(3D) modelling software. 3D weighed grid is applied to mesh the 3D routing space of electronic equipment, the labyrinth algorithm based on grid is used to search the route of wire. In order to describe the non-structure questions of 3D cabling space of the electronic equipment, a routing knowledge base which contains EMC analysis primarily is also designed in the system to guide routing. Based on the powerful 3D modelling ability of UG. the system is developed using Visual C++6.0 which is a visible programming tool.
快速路由是影响电子设备快速制造的瓶颈之一。利用unigraphics (UG)三维建模软件设计了电子设备三维自动布线系统(3DRS)。采用三维加权网格对电子设备的三维布线空间进行网格化，采用基于网格的迷宫算法进行布线搜索。为了描述电子设备三维布线空间的非结构性问题，系统还设计了以电磁兼容分析为主要内容的布线知识库来指导布线。基于UG强大的三维建模能力。本系统是使用Visual c++ 6.0可视化编程工具开发的。
{"title":"Research of 3D Routing System of Electronic Equipment","authors":"Z. Wu, Dejian Zhou, Yiiifeng Wu","doi":"10.1109/ICEPT.2007.4441393","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441393","url":null,"abstract":"Fast routing is one of the bottlenecks affecting the fast manufacturing of electronic equipments. The three-dimensional auto-routing system ( 3DRS) of electronic equipment is designed on the of unigraphics ( UG ) which is a three-dimensional(3D) modelling software. 3D weighed grid is applied to mesh the 3D routing space of electronic equipment, the labyrinth algorithm based on grid is used to search the route of wire. In order to describe the non-structure questions of 3D cabling space of the electronic equipment, a routing knowledge base which contains EMC analysis primarily is also designed in the system to guide routing. Based on the powerful 3D modelling ability of UG. the system is developed using Visual C++6.0 which is a visible programming tool.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123920955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441405
J. Kong, L. Lau
Package modeling and simulation is the essence of every designer daily work flow. With a trend towards ever more complex designs, the potential reward for designer is the ability to solve previously intractable problems quickly and accurately. Experts still argue about the fastest and most elegant approaches to solving electromagnetic problems yet no single method has emerged as an outright winner [1]. This paper presents a case study to make comparison between two enormously commercially-used full-wave electromagnetic (EM) simulation techniques in the advanced packaging technology. It examines the efficiency in terms of simulation time and memory requirement when modeling and simulating a 3D WB-PBGA package. Simulation results in both frequency and time domains have been obtained and correlated with empirical data.
{"title":"Efficiency Evaluation of Full-Wave Electromagnetic Simulation Techniques in 3D WB-PBGA Package Modeling","authors":"J. Kong, L. Lau","doi":"10.1109/ICEPT.2007.4441405","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441405","url":null,"abstract":"Package modeling and simulation is the essence of every designer daily work flow. With a trend towards ever more complex designs, the potential reward for designer is the ability to solve previously intractable problems quickly and accurately. Experts still argue about the fastest and most elegant approaches to solving electromagnetic problems yet no single method has emerged as an outright winner [1]. This paper presents a case study to make comparison between two enormously commercially-used full-wave electromagnetic (EM) simulation techniques in the advanced packaging technology. It examines the efficiency in terms of simulation time and memory requirement when modeling and simulating a 3D WB-PBGA package. Simulation results in both frequency and time domains have been obtained and correlated with empirical data.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124016456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441456
Hongyan Xu, Hai-xia Yang, Jingang Liu, Zhiqiang Tao, L. Fan, Shiyang Yang
Molecular weight-controlled aromatic polyimide resins for fabrication of high density IC packaging substrates have been developed. The aromatic polyimide resins showed good laminate processability, which could easily dissolve in organic solvent to give low viscosity solution for impregnation of E-glass fiber cloths. After completely removal of the organic volatile, the polyimide/glass fiber (PI/GF) cloth prepreg could be plied up and then thermally cured at 280degC to give the PI/GF laminate suitable as packaging substrate core. Experimental results indicated that the polyimide laminates have the desirable characteristics for packaging substrate core, including 1) excellent thermal stability with initial thermal decomposition temperature of >500degC, CLE(in-plane) of 15-19 ppm/degC and glass transition temperature of >220degC; 2) good mechanical properties with flexural strength of >430 Ma and flexural modulus of 20 GPa, tensile strength of >230 MPa and impact toughness of 84 kJ/m2; 3) great electrical insulating and dielectric properties with volume resistivity of >1016 Omegaldrcm, dielectric constant of 4.1 and dissipation factor of 0.005 etc.; and 4) high peel strength of copper foil to laminate in Cu-claded laminate (>1.5N/mm).
{"title":"Aromatic Polyimide Resins for High Density Packaging Substrates","authors":"Hongyan Xu, Hai-xia Yang, Jingang Liu, Zhiqiang Tao, L. Fan, Shiyang Yang","doi":"10.1109/ICEPT.2007.4441456","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441456","url":null,"abstract":"Molecular weight-controlled aromatic polyimide resins for fabrication of high density IC packaging substrates have been developed. The aromatic polyimide resins showed good laminate processability, which could easily dissolve in organic solvent to give low viscosity solution for impregnation of E-glass fiber cloths. After completely removal of the organic volatile, the polyimide/glass fiber (PI/GF) cloth prepreg could be plied up and then thermally cured at 280degC to give the PI/GF laminate suitable as packaging substrate core. Experimental results indicated that the polyimide laminates have the desirable characteristics for packaging substrate core, including 1) excellent thermal stability with initial thermal decomposition temperature of >500degC, CLE(in-plane) of 15-19 ppm/degC and glass transition temperature of >220degC; 2) good mechanical properties with flexural strength of >430 Ma and flexural modulus of 20 GPa, tensile strength of >230 MPa and impact toughness of 84 kJ/m2; 3) great electrical insulating and dielectric properties with volume resistivity of >1016 Omegaldrcm, dielectric constant of 4.1 and dissipation factor of 0.005 etc.; and 4) high peel strength of copper foil to laminate in Cu-claded laminate (>1.5N/mm).","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117280093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441443
B. An, C.M.L. Wu
Composite solder pastes were made so that composite solders can be manufactured using the reflow process. Using this approach, the wettability of Sn-3.0Ag-0.5Cu (SAC) composite solder reinforced with micro-sized Ag and Cu particles was investigated by three methods: temperature profile, solder beading and copper clad laminate (CCL) wetting. The composite solder on copper coupon showed less wetting force in the temperature profile test than that of SAC due to the depression of flow of the molten solder by the Ag or Cu particles. It is also noted that during the soldering dwell time, the wetting force changed with time in either small step-wise force changes, or mild force increase, indicating some dynamical occurrence in the molten solder with reinforcing particles. The solder beading test revealed that the solder beading duration of the composite solder is fast than that of the SAC solder, possibly due to the excellent thermal conductivity of reinforcing particles. The CCL wetting tests pointed out that with the increase in weight proportion of reinforcing particles, the composite solder exhibited either smaller spreading area, or dull appearance with Ag particles added paste, and leaching of Cu particles into flux residues when Cu particles were used as reinforcement. The examination of the microstructure of SAC reinforced with 1% Ag particles revealed that although Ag particles quickly reacted with the molten solder and formed Ag3Sn intermetallic compounds, which distributed 11011-uniformly through the thickness of the solder. When reinforced with 1% Cu particles, the latter reacted with SAC to form Cu6Sn5 reinforcing particles, which dispersed also non-uniformly in the solder matrix. It is also noted that leaching of Cu particles through the flow of flux occurred. In view of the present results, further exploration for improvement in the manufacturability of the composite solder alloys is needed.
{"title":"Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver and Copper Particles","authors":"B. An, C.M.L. Wu","doi":"10.1109/ICEPT.2007.4441443","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441443","url":null,"abstract":"Composite solder pastes were made so that composite solders can be manufactured using the reflow process. Using this approach, the wettability of Sn-3.0Ag-0.5Cu (SAC) composite solder reinforced with micro-sized Ag and Cu particles was investigated by three methods: temperature profile, solder beading and copper clad laminate (CCL) wetting. The composite solder on copper coupon showed less wetting force in the temperature profile test than that of SAC due to the depression of flow of the molten solder by the Ag or Cu particles. It is also noted that during the soldering dwell time, the wetting force changed with time in either small step-wise force changes, or mild force increase, indicating some dynamical occurrence in the molten solder with reinforcing particles. The solder beading test revealed that the solder beading duration of the composite solder is fast than that of the SAC solder, possibly due to the excellent thermal conductivity of reinforcing particles. The CCL wetting tests pointed out that with the increase in weight proportion of reinforcing particles, the composite solder exhibited either smaller spreading area, or dull appearance with Ag particles added paste, and leaching of Cu particles into flux residues when Cu particles were used as reinforcement. The examination of the microstructure of SAC reinforced with 1% Ag particles revealed that although Ag particles quickly reacted with the molten solder and formed Ag3Sn intermetallic compounds, which distributed 11011-uniformly through the thickness of the solder. When reinforced with 1% Cu particles, the latter reacted with SAC to form Cu6Sn5 reinforcing particles, which dispersed also non-uniformly in the solder matrix. It is also noted that leaching of Cu particles through the flow of flux occurred. In view of the present results, further exploration for improvement in the manufacturability of the composite solder alloys is needed.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130872463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441525
C. Zeng, Chunqing Wang, Yanhong Tian, Lingchao Kong
This paper investigates the defect formed by the mechanical cutting processing of green sheet of alumina ceramic by evaluating the surface integrity in terms of surface morphology, and the flexural strength and its variance. The Weibull strength distribution method is introduced to compare the strength between defect-contained specimens and specimens without hot-cutting defect. Experimental results show that the defect causes a remarkable decline in strength and small specimens are more affected than big ones. The surface contains the hot-cutting defect is more dangerous than the natural surface. A FEM method (ANSYS) is utilized to quantitatively evaluate residual stresses of the ceramic insulator in brazing process. Based on the stress analysis, a Defect-free-stress design concept is put forward to give some guidance to structure design and material selection.
{"title":"The Impact of Defect formed in Hot-cutting Process on Reliability of Ceramic Packaging And A Novel Structure Design Concept","authors":"C. Zeng, Chunqing Wang, Yanhong Tian, Lingchao Kong","doi":"10.1109/ICEPT.2007.4441525","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441525","url":null,"abstract":"This paper investigates the defect formed by the mechanical cutting processing of green sheet of alumina ceramic by evaluating the surface integrity in terms of surface morphology, and the flexural strength and its variance. The Weibull strength distribution method is introduced to compare the strength between defect-contained specimens and specimens without hot-cutting defect. Experimental results show that the defect causes a remarkable decline in strength and small specimens are more affected than big ones. The surface contains the hot-cutting defect is more dangerous than the natural surface. A FEM method (ANSYS) is utilized to quantitatively evaluate residual stresses of the ceramic insulator in brazing process. Based on the stress analysis, a Defect-free-stress design concept is put forward to give some guidance to structure design and material selection.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131284780","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441400
C. Qian, K. Jansen, L. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher
Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process. In tins paper, the cure kinetics of a molding compound is described by the Kamal-Sourour equation, including the effect of diffusion limitation, and the corresponding parameters are determined. Furthermore, a preliminary dynamic mechanical experiment during cure is presented to show an application of our cure kinetic model.
{"title":"Characterization and Modelling of Cure Kinetics of A Molding Compound","authors":"C. Qian, K. Jansen, L. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher","doi":"10.1109/ICEPT.2007.4441400","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441400","url":null,"abstract":"Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process. In tins paper, the cure kinetics of a molding compound is described by the Kamal-Sourour equation, including the effect of diffusion limitation, and the corresponding parameters are determined. Furthermore, a preliminary dynamic mechanical experiment during cure is presented to show an application of our cure kinetic model.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130635817","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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