Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441452
Xiaoqin Lin, L. Luo
With the trend toward lead-free and miniaturization in consumer electronics, sub 100 micron lead-free solder bumping and its related reliability are becoming one of the important issues in today's electronic packaging industry. The growth and influencing factors of voids in the interfacial region of electroplated Sn-3.0 Ag solder bumps on electroplated Cu and their effects on interfacial bonding strength during multi-reflow and aging process were studied. Results show that the volume shrinkage during the phase transformation was the main reason for the void formation during multi-reflow. The Kirkendall effect was the main reason for the void formation during aging. A thick eta-phase and the voids at the boundaries among Cu6Sn5 grains promoted the voids growth in the epsiv-phase. Though the formation of voids had a trivial weakening effect to the shear strength of solder joints, the voids were a threat to the bonding reliability of solder bumps.
{"title":"The Growth and Influencing Factors of Voids in SnAg Solder Bump and their Impact on Interfacial Bond Strength","authors":"Xiaoqin Lin, L. Luo","doi":"10.1109/ICEPT.2007.4441452","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441452","url":null,"abstract":"With the trend toward lead-free and miniaturization in consumer electronics, sub 100 micron lead-free solder bumping and its related reliability are becoming one of the important issues in today's electronic packaging industry. The growth and influencing factors of voids in the interfacial region of electroplated Sn-3.0 Ag solder bumps on electroplated Cu and their effects on interfacial bonding strength during multi-reflow and aging process were studied. Results show that the volume shrinkage during the phase transformation was the main reason for the void formation during multi-reflow. The Kirkendall effect was the main reason for the void formation during aging. A thick eta-phase and the voids at the boundaries among Cu6Sn5 grains promoted the voids growth in the epsiv-phase. Though the formation of voids had a trivial weakening effect to the shear strength of solder joints, the voids were a threat to the bonding reliability of solder bumps.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129801869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441470
Rulin Shen, J. Zhong
In the traditionary nanogrinding way, a sub-nanometer smooth surface can be achieved, but the PTR can be only controlled under ten nanometers. To find a new way to reduce the PTR. ultrasonic was applied in the polishing experiment. At first, the experiment with two kinds of samples. AlTiC bulk and NiFe bulk were carried out in free abrasive lapping way with the float-piece polisher. It was discovered that the material removal rate and the roughness of surface is improved in different extent of different material, the material removal rate (MRR) of the AlTiC bulk was increased from 10 nm/m to 16 nm/m. while the MRR of the NiFe bulk was increased from 23 nm/m to 30 nm/m. Encouraged by the result of the experiment, the specimen of 70 mm*1.25 mm rowbar with 60 GMR magnetic head was polished in the same condition, as a result, the PTR was reduced from 65 nm to 45 nm. Furthermore, the ultrasonic was introduced into nanogrinding of recording head. In this way. the PTR was controlled at lnm or so and smoother surface was achieved. Two kinds of mechanism about the role of the ultrasonic were prompt to explain in what way that the material removal rate is improved and why the improved ratio is different in different materials in the polishing.
{"title":"Ultrasonic Applied in Super Precision polishing of Magnetic Recording Heads","authors":"Rulin Shen, J. Zhong","doi":"10.1109/ICEPT.2007.4441470","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441470","url":null,"abstract":"In the traditionary nanogrinding way, a sub-nanometer smooth surface can be achieved, but the PTR can be only controlled under ten nanometers. To find a new way to reduce the PTR. ultrasonic was applied in the polishing experiment. At first, the experiment with two kinds of samples. AlTiC bulk and NiFe bulk were carried out in free abrasive lapping way with the float-piece polisher. It was discovered that the material removal rate and the roughness of surface is improved in different extent of different material, the material removal rate (MRR) of the AlTiC bulk was increased from 10 nm/m to 16 nm/m. while the MRR of the NiFe bulk was increased from 23 nm/m to 30 nm/m. Encouraged by the result of the experiment, the specimen of 70 mm*1.25 mm rowbar with 60 GMR magnetic head was polished in the same condition, as a result, the PTR was reduced from 65 nm to 45 nm. Furthermore, the ultrasonic was introduced into nanogrinding of recording head. In this way. the PTR was controlled at lnm or so and smoother surface was achieved. Two kinds of mechanism about the role of the ultrasonic were prompt to explain in what way that the material removal rate is improved and why the improved ratio is different in different materials in the polishing.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134243583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441465
Xi Chen, A. Hu, Ming Li, D. Mao
Lhe influences of adding 0.05, 0.1, 0.3, 0.5 wt.% Cr to Sn-9Zn alloy on growth of intermetallic compound layer (IMCs) at the interface of Sn-9Zn-xCr/Cu was investigated during aging treatment at 85degC and relative humidity from 20% to 85% for 100 h, 200 h, 350 h, 500 h. Lhe results show that IMCs thickness of Sn-9Zn-Cr alloys is much thinner than that of Sn-9Zn alloy after aging, but there is little difference on IMCs thicknesses among Sn-9Zn-Cr alloys. It is of interest to note that IMCs growth rate of Sn-9Zn-Cr is about 1/4 times of that of Sn-9Zn alloy. We supposed the reason is that Cr can slow down diffusion rate of Zn in solder. It is quite reasonable to consider that reliability of Sn-9Zn-Cr solder joints is better than that of Sn-9Zn solder joints because of thinner intermetallic compound layer.
{"title":"Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate","authors":"Xi Chen, A. Hu, Ming Li, D. Mao","doi":"10.1109/ICEPT.2007.4441465","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441465","url":null,"abstract":"Lhe influences of adding 0.05, 0.1, 0.3, 0.5 wt.% Cr to Sn-9Zn alloy on growth of intermetallic compound layer (IMCs) at the interface of Sn-9Zn-xCr/Cu was investigated during aging treatment at 85degC and relative humidity from 20% to 85% for 100 h, 200 h, 350 h, 500 h. Lhe results show that IMCs thickness of Sn-9Zn-Cr alloys is much thinner than that of Sn-9Zn alloy after aging, but there is little difference on IMCs thicknesses among Sn-9Zn-Cr alloys. It is of interest to note that IMCs growth rate of Sn-9Zn-Cr is about 1/4 times of that of Sn-9Zn alloy. We supposed the reason is that Cr can slow down diffusion rate of Zn in solder. It is quite reasonable to consider that reliability of Sn-9Zn-Cr solder joints is better than that of Sn-9Zn solder joints because of thinner intermetallic compound layer.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"145 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133810336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441378
Yinghui Wang, T. Suga
The feasibility of solid state bonding for low-profiled Sn-3.0Ag-0.5Cu (wt%) solder bumps is confirmed at 25-200degC by thermo-compression bonding (TCB) and surface activated bonding (SAB) in ambient air. 100% bond yield was achieved. The bonding windows of the necessary bonding force and temperature were described. The composite percent on the bonding surfaces was analyzed quantitatively by X-ray photoelectron spectroscopy (XPS). The successful bonding of Sn-Ag-Cu solder bumps in solid state is benefited from dispersing contaminants and oxides. With the activated process to the bonding surfaces prior to the assembly, the thickness of contaminant and oxide layers in SAB is less than 2 nm, which is much smaller than that of TCB. SAB method is much helpful to reduce the necessary bonding force or temperature compared with TCB method.
{"title":"Feasibility of Solid State Bonding for Sn-Ag-Cu Solder Bumps in Ambient Air","authors":"Yinghui Wang, T. Suga","doi":"10.1109/ICEPT.2007.4441378","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441378","url":null,"abstract":"The feasibility of solid state bonding for low-profiled Sn-3.0Ag-0.5Cu (wt%) solder bumps is confirmed at 25-200degC by thermo-compression bonding (TCB) and surface activated bonding (SAB) in ambient air. 100% bond yield was achieved. The bonding windows of the necessary bonding force and temperature were described. The composite percent on the bonding surfaces was analyzed quantitatively by X-ray photoelectron spectroscopy (XPS). The successful bonding of Sn-Ag-Cu solder bumps in solid state is benefited from dispersing contaminants and oxides. With the activated process to the bonding surfaces prior to the assembly, the thickness of contaminant and oxide layers in SAB is less than 2 nm, which is much smaller than that of TCB. SAB method is much helpful to reduce the necessary bonding force or temperature compared with TCB method.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132380855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441402
Yusheng Cao, T. Jiang, Jun Liu, B. Lian
The thermal capacity of unit volume is increasing with the development of 3D IC package density. The technology of thermal analysis and thermal design for 3D package becomes more and more important. This paper analyzes the structure and working mode of a particular 3D SRAM component. The thermal distribution is simulated with the ANSYS software in which the finite element method is applied. The simulation results can be well compared with the experimental data, which further supports the reliability design of 3D SRAM package technology and the thermal analysis technology.
{"title":"The Study for Thermal Analysis Technology of Three-Dimension SRAM Component","authors":"Yusheng Cao, T. Jiang, Jun Liu, B. Lian","doi":"10.1109/ICEPT.2007.4441402","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441402","url":null,"abstract":"The thermal capacity of unit volume is increasing with the development of 3D IC package density. The technology of thermal analysis and thermal design for 3D package becomes more and more important. This paper analyzes the structure and working mode of a particular 3D SRAM component. The thermal distribution is simulated with the ANSYS software in which the finite element method is applied. The simulation results can be well compared with the experimental data, which further supports the reliability design of 3D SRAM package technology and the thermal analysis technology.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133580240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441496
Liuxi Tan, Jia Li, Sheng Liu
As high power LEDs develop rapidly, sapphire substrate on which LED's chips are grown, cannot meet the needs of the increasing performance any longer. Therefore, transfer of the devices from the former sapphire substrates to more thermally and electrically conductive receptor substrates is recommended. Laser peeling has been a new technology of separating films of GaN from the substrate on which they are grown. Experience shows that the films can be debonded intactly when the laser parameters are well controlled. In this contribution, the mechanics of the laser-assisted debonding of GaN films on sapphire, silicon and copper substrates is considered so that the specific parameters can be optimized in order to achieve a feasible process scheme that may be used in the industry. During the simulation, the knowledge of interfacial crack generation between dissimilar materials is considered to be the essential principle of the process of "liftoff". Failure of the interfaces results in the debonding. Whatever, the films of chips should not be damaged in the duration of the "lift-off" process. A few important issues such as temperature distribution, stress distribution and energy release rate are raised in terms of examining whether the films are likely to be damaged.
{"title":"Modeling and Simulation of Laser Lift-off Process for LED's Substrates","authors":"Liuxi Tan, Jia Li, Sheng Liu","doi":"10.1109/ICEPT.2007.4441496","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441496","url":null,"abstract":"As high power LEDs develop rapidly, sapphire substrate on which LED's chips are grown, cannot meet the needs of the increasing performance any longer. Therefore, transfer of the devices from the former sapphire substrates to more thermally and electrically conductive receptor substrates is recommended. Laser peeling has been a new technology of separating films of GaN from the substrate on which they are grown. Experience shows that the films can be debonded intactly when the laser parameters are well controlled. In this contribution, the mechanics of the laser-assisted debonding of GaN films on sapphire, silicon and copper substrates is considered so that the specific parameters can be optimized in order to achieve a feasible process scheme that may be used in the industry. During the simulation, the knowledge of interfacial crack generation between dissimilar materials is considered to be the essential principle of the process of \"liftoff\". Failure of the interfaces results in the debonding. Whatever, the films of chips should not be damaged in the duration of the \"lift-off\" process. A few important issues such as temperature distribution, stress distribution and energy release rate are raised in terms of examining whether the films are likely to be damaged.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114606745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441428
L. Qi, Jihua Huang, Xingke Zhao, Huanshui Zhang
The creep response of solder joints in a microelectronic package, which are subjected to aggressive thermal-shearing cycling during service, often limits the reliability of the entire package. Furthermore, during cycle, the microstructures of the new lead-free solders (Sn-Ag-Cu) can undergo significant in strain-enhanced coarsening, resulting in in-service evolution of the creep behavior. In this paper, the coarsening kinetics of Ag3Sn particles in Sn-Ag-Cu solder are studied, and the results are correlated with impression creep data from individual microelectronic solder balls subjected to thermal aging treatments. The formation mechanism of Ag3Sn particles under the thermal-shearing cycling condition was investigated.
{"title":"Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder","authors":"L. Qi, Jihua Huang, Xingke Zhao, Huanshui Zhang","doi":"10.1109/ICEPT.2007.4441428","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441428","url":null,"abstract":"The creep response of solder joints in a microelectronic package, which are subjected to aggressive thermal-shearing cycling during service, often limits the reliability of the entire package. Furthermore, during cycle, the microstructures of the new lead-free solders (Sn-Ag-Cu) can undergo significant in strain-enhanced coarsening, resulting in in-service evolution of the creep behavior. In this paper, the coarsening kinetics of Ag3Sn particles in Sn-Ag-Cu solder are studied, and the results are correlated with impression creep data from individual microelectronic solder balls subjected to thermal aging treatments. The formation mechanism of Ag3Sn particles under the thermal-shearing cycling condition was investigated.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114772923","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441552
Jie Gu, M. Pecht
Reliability is the ability of a product or system to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life-cycle environment. Commonly-used electronics reliability prediction methods (e.g. Mil-HDBK-217, 217-PLUS, PRISM, Telcordia, FIDES) based on handbook methods have been shown to be misleading and provide erroneous life predictions, a fact that led the U. S. military to abandon their electronics reliability prediction methods. The use of stress and damage models permits a far superior accounting of the reliability and the physics-of-failure, however sufficient knowledge of the actual operating and environmental application conditions of the product are still required. This paper presents a physics-of-failure based prognostics and health management approach for effective reliability prediction. The procedure includes failure modes, mechanisms, and effects analysis, data reduction and feature extraction from the life cycle loads, damage accumulation, and assessment of uncertainty.
{"title":"Predicting the Reliability of Electronic Products","authors":"Jie Gu, M. Pecht","doi":"10.1109/ICEPT.2007.4441552","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441552","url":null,"abstract":"Reliability is the ability of a product or system to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life-cycle environment. Commonly-used electronics reliability prediction methods (e.g. Mil-HDBK-217, 217-PLUS, PRISM, Telcordia, FIDES) based on handbook methods have been shown to be misleading and provide erroneous life predictions, a fact that led the U. S. military to abandon their electronics reliability prediction methods. The use of stress and damage models permits a far superior accounting of the reliability and the physics-of-failure, however sufficient knowledge of the actual operating and environmental application conditions of the product are still required. This paper presents a physics-of-failure based prognostics and health management approach for effective reliability prediction. The procedure includes failure modes, mechanisms, and effects analysis, data reduction and feature extraction from the life cycle loads, damage accumulation, and assessment of uncertainty.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"133 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128636409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441441
Wei Zhang, Chunqing Wang, Yanhong Tian
The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called Surface Evolver and the three-dimensional (3D) geometry of solder joint with different pad shape was analyzed. Then, the self-alignment behavior of solder joint with an initial yaw misalignment was discussed and the theoretical equilibrium positions of five different pad shapes were calculated. Next, experiments were done to examine the theoretical equilibrium positions of these pads. The numerical results show that the theoretical equilibrium positions of ellipse pad are the major axis of ellipse, and it is much more appropriate for self-alignment. And the diamond pad and the combined pad have also self-alignment effects, but the square and the crisscross pad are not appropriate for self-alignment due to more than two equilibrium positions. The experimental results show the solder joint with initial yaw angle can be self-aligned to the theoretical equilibrium position of these five pads and solder joint of ellipse pad demonstrates smaller alignment error than that of diamond and combined pads.
{"title":"Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering","authors":"Wei Zhang, Chunqing Wang, Yanhong Tian","doi":"10.1109/ICEPT.2007.4441441","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441441","url":null,"abstract":"The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called Surface Evolver and the three-dimensional (3D) geometry of solder joint with different pad shape was analyzed. Then, the self-alignment behavior of solder joint with an initial yaw misalignment was discussed and the theoretical equilibrium positions of five different pad shapes were calculated. Next, experiments were done to examine the theoretical equilibrium positions of these pads. The numerical results show that the theoretical equilibrium positions of ellipse pad are the major axis of ellipse, and it is much more appropriate for self-alignment. And the diamond pad and the combined pad have also self-alignment effects, but the square and the crisscross pad are not appropriate for self-alignment due to more than two equilibrium positions. The experimental results show the solder joint with initial yaw angle can be self-aligned to the theoretical equilibrium position of these five pads and solder joint of ellipse pad demonstrates smaller alignment error than that of diamond and combined pads.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"26 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125743473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-08-01DOI: 10.1109/ICEPT.2007.4441388
H. Huang, De-jian Zhou, Zhaohua Wu
In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.
{"title":"The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network","authors":"H. Huang, De-jian Zhou, Zhaohua Wu","doi":"10.1109/ICEPT.2007.4441388","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441388","url":null,"abstract":"In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"236 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123883582","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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