Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8277026
Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu
The three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology offer a solution to meet the continuously increasing demand on high-speed electronic products. In order to comprehensively evaluate the signal transmission of TSV in increasing signal frequency, accuracy equivalent circuit model is necessary. In this paper, a method of double-T type equivalent circuit modelling for TSVs is proposed and applied to coaxial TSV and ground-signal (GS)-type TSVs. Furthermore, the transmission parameters (S21) of the double-T models are evaluated by SPICE and compared with the results of 3-D full-wave electromagnetic field simulation (HFSS). The good accordance of the results up to 50GHz verifies the accuracy of the proposed method.
{"title":"Double-T type equivalent circuit modelling method for TSVs up to 50GHz","authors":"Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu","doi":"10.1109/EDAPS.2017.8277026","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277026","url":null,"abstract":"The three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology offer a solution to meet the continuously increasing demand on high-speed electronic products. In order to comprehensively evaluate the signal transmission of TSV in increasing signal frequency, accuracy equivalent circuit model is necessary. In this paper, a method of double-T type equivalent circuit modelling for TSVs is proposed and applied to coaxial TSV and ground-signal (GS)-type TSVs. Furthermore, the transmission parameters (S21) of the double-T models are evaluated by SPICE and compared with the results of 3-D full-wave electromagnetic field simulation (HFSS). The good accordance of the results up to 50GHz verifies the accuracy of the proposed method.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129498052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8277033
Jianyu Lin, Dongying Li, Wenxian Yu
A brief review regarding the theory, design methodologies and applications of the zero index metamaterial(ZIM) is given. Special focuses are laid on two major applications of ZIMs, including the energy tunneling and the beam focusing. Moreover, a comparison of antennas utilizing ZIMs and their performance is presented.
{"title":"A review of zero index metamaterial","authors":"Jianyu Lin, Dongying Li, Wenxian Yu","doi":"10.1109/EDAPS.2017.8277033","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277033","url":null,"abstract":"A brief review regarding the theory, design methodologies and applications of the zero index metamaterial(ZIM) is given. Special focuses are laid on two major applications of ZIMs, including the energy tunneling and the beam focusing. Moreover, a comparison of antennas utilizing ZIMs and their performance is presented.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126341463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A self-consistent model incorporating the gain into a dispersive metamaterial nanostructure was proposed and numericallysolved by parallel FDTD method. We numerically show that the losses of dispersive metamaterials can be compensated by gain with investigating the transmission, reflection and absorption data as well as the retrieved effective parameters. The systematic theoretical model for pump-probe experiments of metallic metamaterials coupled with the gain material are also well investigated.
{"title":"The self-consistent model incorporating the gain into a dispersive metamaterial nanostructure","authors":"Zhixiang Huang, Yongkang Zhang, Ming Fang, Kaikun Niu, Xingang Ren, Xianliang Wu","doi":"10.1109/EDAPS.2017.8276938","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8276938","url":null,"abstract":"A self-consistent model incorporating the gain into a dispersive metamaterial nanostructure was proposed and numericallysolved by parallel FDTD method. We numerically show that the losses of dispersive metamaterials can be compensated by gain with investigating the transmission, reflection and absorption data as well as the retrieved effective parameters. The systematic theoretical model for pump-probe experiments of metallic metamaterials coupled with the gain material are also well investigated.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124022056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8277010
Xu Chen, J. Schutt-Ainé, A. Cangellaris
Fiber-weave effect impacts the transmission of signal waves on printed circuit board transmission lines. The effect is especially pronounced for differential signals, since the difference in dielectric properties between glass fiber and resin can lead to different propagation velocity between two lines in the pair, which results in intra-pair skew. The fiber-weave effect is difficult to model exactly since it depends on the relative position of the etched traces with respect to the glass fiber bundles in the substrate. In this paper, we present a method to model coupled transmission line traces with uncertainties due to the fiber-weave effect. We also present a very fast and efficient stochastic transient simulator to produce time-domain waveform of the differential signal. The simulator uses finite difference scheme in combination with Stochastic Galerkin Method to quantify the results of uncertainties in the circuit with a single simulation of an expanded state-space system.
{"title":"Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines","authors":"Xu Chen, J. Schutt-Ainé, A. Cangellaris","doi":"10.1109/EDAPS.2017.8277010","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277010","url":null,"abstract":"Fiber-weave effect impacts the transmission of signal waves on printed circuit board transmission lines. The effect is especially pronounced for differential signals, since the difference in dielectric properties between glass fiber and resin can lead to different propagation velocity between two lines in the pair, which results in intra-pair skew. The fiber-weave effect is difficult to model exactly since it depends on the relative position of the etched traces with respect to the glass fiber bundles in the substrate. In this paper, we present a method to model coupled transmission line traces with uncertainties due to the fiber-weave effect. We also present a very fast and efficient stochastic transient simulator to produce time-domain waveform of the differential signal. The simulator uses finite difference scheme in combination with Stochastic Galerkin Method to quantify the results of uncertainties in the circuit with a single simulation of an expanded state-space system.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"364 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115441985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8277020
J. N. Tripathi, R. Achar
In this paper, a method is presented to estimate the effect of transmission media on power supply induced jitter for a voltage-mode driver circuit. Transmission media is represented via its equivalent models of transmission lines while calculating the power supply induced jitter. The proposed semi-analytical method for jitter analysis is compared against the conventional simulations (commercial tools) in a 55nm technology of STMicroelectronics. A reasonable matching is reported.
{"title":"Modeling the effects of transmission media on power supply induced jitter","authors":"J. N. Tripathi, R. Achar","doi":"10.1109/EDAPS.2017.8277020","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277020","url":null,"abstract":"In this paper, a method is presented to estimate the effect of transmission media on power supply induced jitter for a voltage-mode driver circuit. Transmission media is represented via its equivalent models of transmission lines while calculating the power supply induced jitter. The proposed semi-analytical method for jitter analysis is compared against the conventional simulations (commercial tools) in a 55nm technology of STMicroelectronics. A reasonable matching is reported.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131382369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8276973
Yan Li, Xiaochun Li, J. Mao
In this paper, a novel 1-D high-temperature superconductor (HTS) microstrip bandstop electromagnetic band-gap (EBG) structure is proposed. Tapering technology is used to reduce the ripple level in the passband. Full-wave simulation results show the HTS structure has much slighter attenuation in passband and larger suppression in stopband than the copper one, which shows its good prospect in HTS microwave applications.
{"title":"A novel tapered HTS microstrip bandstop EBG structure","authors":"Yan Li, Xiaochun Li, J. Mao","doi":"10.1109/EDAPS.2017.8276973","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8276973","url":null,"abstract":"In this paper, a novel 1-D high-temperature superconductor (HTS) microstrip bandstop electromagnetic band-gap (EBG) structure is proposed. Tapering technology is used to reduce the ripple level in the passband. Full-wave simulation results show the HTS structure has much slighter attenuation in passband and larger suppression in stopband than the copper one, which shows its good prospect in HTS microwave applications.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130641605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8276987
X. Han, Kaixue Ma, Shouxian Mou, F. Meng
This paper presents a 6-bit digital phase shifter designed at Ku-band for electronic beam steering of satellite based phased array antenna systems, which is implemented in a commercial 0.35-μm SiGe BiCMOS technology. The 6-bit phase shifter utilizes embedded switched filter structure with n-MOS transistors as switches. Four different phase shifter topologies are adopted to achieve the desired insertion phases with accurate phase shifting control, low insertion loss and small inter-state amplitude errors. The simulated performance of all 64 states of the phase shifter demonstrates an insertion loss of 11±2.7 dB and a RMS phase error of <5°, and P1dB of better than 16 dBm. The input/output return losses are better than −8 dB over the 14–18 GHz frequency range respectively. And the chip size of this prototype is only 1.4×0.93 mm2 excluding PADs.
{"title":"A Ku-band 6-bit phase shifter in 0.35-μm SiGe BiCMOS technology","authors":"X. Han, Kaixue Ma, Shouxian Mou, F. Meng","doi":"10.1109/EDAPS.2017.8276987","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8276987","url":null,"abstract":"This paper presents a 6-bit digital phase shifter designed at Ku-band for electronic beam steering of satellite based phased array antenna systems, which is implemented in a commercial 0.35-μm SiGe BiCMOS technology. The 6-bit phase shifter utilizes embedded switched filter structure with n-MOS transistors as switches. Four different phase shifter topologies are adopted to achieve the desired insertion phases with accurate phase shifting control, low insertion loss and small inter-state amplitude errors. The simulated performance of all 64 states of the phase shifter demonstrates an insertion loss of 11±2.7 dB and a RMS phase error of <5°, and P1dB of better than 16 dBm. The input/output return losses are better than −8 dB over the 14–18 GHz frequency range respectively. And the chip size of this prototype is only 1.4×0.93 mm2 excluding PADs.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125679740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8276910
Jin Shi, Kai Xu
In this paper, a filtering balanced-to-single-ended power divider with arbitrary power division ratio is proposed, which is realized by the coupling structures and the microstrip lines with specific impedance requirement. Benefitting from the structure, the fused function of arbitrary differential-mode power dividing, common-mode suppression and filtering can be achieved. For demonstration, a prototype with the ratio (1:2) is implemented. The measured results exhibit the minimum insertion loss of 1.6 dB with a 1-dB bandwidth of 3.8%.
{"title":"Filtering balanced-to-single-ended power divider with arbitrary power division ratio","authors":"Jin Shi, Kai Xu","doi":"10.1109/EDAPS.2017.8276910","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8276910","url":null,"abstract":"In this paper, a filtering balanced-to-single-ended power divider with arbitrary power division ratio is proposed, which is realized by the coupling structures and the microstrip lines with specific impedance requirement. Benefitting from the structure, the fused function of arbitrary differential-mode power dividing, common-mode suppression and filtering can be achieved. For demonstration, a prototype with the ratio (1:2) is implemented. The measured results exhibit the minimum insertion loss of 1.6 dB with a 1-dB bandwidth of 3.8%.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"162 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114177946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8277028
Fengjuan Wang, G. Wang, N. Yu
The electrical characteristics of signal-ground through-silicon-via (GS-TSV) in slow-wave mode are analyzed according to microwave theory and simulated by ADS software. The results show that with the increasing radius of TSV, the transmission characteristic is getting better and better, however, with increasing height of TSV, the transmission characteristic of TSV becomes worse within the range from 0 to 15GHz.
{"title":"Electrical characteristics of GS-TSV in slow wave mode","authors":"Fengjuan Wang, G. Wang, N. Yu","doi":"10.1109/EDAPS.2017.8277028","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277028","url":null,"abstract":"The electrical characteristics of signal-ground through-silicon-via (GS-TSV) in slow-wave mode are analyzed according to microwave theory and simulated by ADS software. The results show that with the increasing radius of TSV, the transmission characteristic is getting better and better, however, with increasing height of TSV, the transmission characteristic of TSV becomes worse within the range from 0 to 15GHz.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114866036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/EDAPS.2017.8276953
A. Apriyana, Y. Zhang
This paper presents the design of LTCC-based packages for CMOS-based defected ground structure (DGS) low pass filter (LPF) single-pole single-throw (SPST) and single-pole double-throw (SPDT) switches. The packaged SPST switch can operate from DC to 20 GHz with an insertion loss less than 1 dB, return loss large than 10 dB, and isolation larger than 15 dB. The packaged SPDT switch can operate from DC to 16 GHz with an insertion loss less than 2 dB, return loss large than 15 dB, and isolation larger than 30 dB.
{"title":"Design of LTCC package for DGS LPF switch","authors":"A. Apriyana, Y. Zhang","doi":"10.1109/EDAPS.2017.8276953","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8276953","url":null,"abstract":"This paper presents the design of LTCC-based packages for CMOS-based defected ground structure (DGS) low pass filter (LPF) single-pole single-throw (SPST) and single-pole double-throw (SPDT) switches. The packaged SPST switch can operate from DC to 20 GHz with an insertion loss less than 1 dB, return loss large than 10 dB, and isolation larger than 15 dB. The packaged SPDT switch can operate from DC to 16 GHz with an insertion loss less than 2 dB, return loss large than 15 dB, and isolation larger than 30 dB.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124411394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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