Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659816
I. Papautsky, J. Brazzle, T. Ameel, A. B. Frazier
In this paper, we describe microchannel fluid behavior using a numerical model based on micropolar fluid theory and experimentally verify the model using micromachined channels. The micropolar fluid theory augments the laws of classical continuum mechanics by incorporating the effects of fluid molecules on the continuum. The behavior of fluids was studied using surface micromachined rectangular metallic pipette arrays. A downstream port for static pressure measurement was used to eliminate entrance effects. The numerical model of the micropolar fluid theory compares favorably with the experimental data.
{"title":"Microchannel fluid behavior using micropolar fluid theory","authors":"I. Papautsky, J. Brazzle, T. Ameel, A. B. Frazier","doi":"10.1109/MEMSYS.1998.659816","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659816","url":null,"abstract":"In this paper, we describe microchannel fluid behavior using a numerical model based on micropolar fluid theory and experimentally verify the model using micromachined channels. The micropolar fluid theory augments the laws of classical continuum mechanics by incorporating the effects of fluid molecules on the continuum. The behavior of fluids was studied using surface micromachined rectangular metallic pipette arrays. A downstream port for static pressure measurement was used to eliminate entrance effects. The numerical model of the micropolar fluid theory compares favorably with the experimental data.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124610852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659799
O.B. Zou, J. Pang, Z. Wang, Z. Qian, H. Gong, M. K. Lim, Z.J. Li
A novel single-chip fabrication technique, i.e., cover on meshes technique for single-chip fabrication of three-dimensional structures (CoMSaT), has been applied to the 3D integrated fluid system (IFS). The fabrication involves a 2-stage etching through opening meshes and cover the meshes by deposition. 3D structures with membranes suspended on deep cavities have been obtained without wafer/chip bonding or alignment, and on-chip circuits have been integrated within single-chip by further IC-compatible processes. Several miniaturized integrated micropumps, valves and measurement-units are designed and fabricated in the chip area of 5.9/spl times/6.4 mm/sup 2/. Theories and primary experiments show that this fabrication technique is promising in the batch production of miniaturized integrated fluid systems.
{"title":"Single-chip fabrication of integrated fluid systems (IFS)","authors":"O.B. Zou, J. Pang, Z. Wang, Z. Qian, H. Gong, M. K. Lim, Z.J. Li","doi":"10.1109/MEMSYS.1998.659799","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659799","url":null,"abstract":"A novel single-chip fabrication technique, i.e., cover on meshes technique for single-chip fabrication of three-dimensional structures (CoMSaT), has been applied to the 3D integrated fluid system (IFS). The fabrication involves a 2-stage etching through opening meshes and cover the meshes by deposition. 3D structures with membranes suspended on deep cavities have been obtained without wafer/chip bonding or alignment, and on-chip circuits have been integrated within single-chip by further IC-compatible processes. Several miniaturized integrated micropumps, valves and measurement-units are designed and fabricated in the chip area of 5.9/spl times/6.4 mm/sup 2/. Theories and primary experiments show that this fabrication technique is promising in the batch production of miniaturized integrated fluid systems.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"724 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115128713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659782
C. Lyons, A. Friedberger, W. Welser, G. Muller, G. Krotz, R. Kassing
A novel type of micromachined thermal mass flow sensor has been developed which is characterised by enhanced mechanical and thermal stability. For its realisation /spl beta/-SiC films were heteroepitaxially deposited onto pre-processed silicon wafers. After structuring the surface /spl beta/-SiC films to form heater and temperature sensing elements, porous silicon was formed in predetermined parts of the silicon substrate to form flow channels. The so formed devices are able to detect bidirectional flows of air with a temporal resolution of 2-3 msec. Due to the excellent mechanical and thermal stability of the /spl beta/-SiC heater and temperature sensing elements, the devices are able to sustain extremely harsh environmental and operating conditions: firstly, flows of pressurised air could be sustained without inflicting mechanical damage to the micromachined /spl beta/-SiC bridges, secondly, several hours of thermal cleaning at white glow in ambient air could be endured before breakages due to thermal oxidation occurred.
{"title":"A high-speed mass flow sensor with heated silicon carbide bridges","authors":"C. Lyons, A. Friedberger, W. Welser, G. Muller, G. Krotz, R. Kassing","doi":"10.1109/MEMSYS.1998.659782","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659782","url":null,"abstract":"A novel type of micromachined thermal mass flow sensor has been developed which is characterised by enhanced mechanical and thermal stability. For its realisation /spl beta/-SiC films were heteroepitaxially deposited onto pre-processed silicon wafers. After structuring the surface /spl beta/-SiC films to form heater and temperature sensing elements, porous silicon was formed in predetermined parts of the silicon substrate to form flow channels. The so formed devices are able to detect bidirectional flows of air with a temporal resolution of 2-3 msec. Due to the excellent mechanical and thermal stability of the /spl beta/-SiC heater and temperature sensing elements, the devices are able to sustain extremely harsh environmental and operating conditions: firstly, flows of pressurised air could be sustained without inflicting mechanical damage to the micromachined /spl beta/-SiC bridges, secondly, several hours of thermal cleaning at white glow in ambient air could be endured before breakages due to thermal oxidation occurred.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"78 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129763561","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659772
C. Bark, T. Binnenbose, G. Vogele, T. Weisener, M. Widmann
At Fraunhofer IPA various adhesive grippers have been developed. The gripper's main features are high flexibility regarding shape, size and material of the units handled. Furthermore adhesive gripping provides a very accurate centring effect as well as a compliance effect. The adhesive used for gripping is a fluid of low viscosity, that evaporates without leaving particles on the unit's surface which influence the function. The surface tension of the fluid attracts the unit to the gripper and builds up forces that can hold micromechanical parts very safely without damaging the breakable surface structures of these parts. The automated adhesive gripping-system can be integrated as a standard tool in handling systems such as for MEMS, for microelectronical devices or for precision engineering products. Theoretical examinations and experimental results concerning process parameters, lifting forces and tolerances of the parts position are presented. Besides the automatic gripper two different manual adhesive grippers have been built and investigated.
{"title":"Gripping with low viscosity fluids","authors":"C. Bark, T. Binnenbose, G. Vogele, T. Weisener, M. Widmann","doi":"10.1109/MEMSYS.1998.659772","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659772","url":null,"abstract":"At Fraunhofer IPA various adhesive grippers have been developed. The gripper's main features are high flexibility regarding shape, size and material of the units handled. Furthermore adhesive gripping provides a very accurate centring effect as well as a compliance effect. The adhesive used for gripping is a fluid of low viscosity, that evaporates without leaving particles on the unit's surface which influence the function. The surface tension of the fluid attracts the unit to the gripper and builds up forces that can hold micromechanical parts very safely without damaging the breakable surface structures of these parts. The automated adhesive gripping-system can be integrated as a standard tool in handling systems such as for MEMS, for microelectronical devices or for precision engineering products. Theoretical examinations and experimental results concerning process parameters, lifting forces and tolerances of the parts position are presented. Besides the automatic gripper two different manual adhesive grippers have been built and investigated.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129967101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659741
K. Matsumoto, T. Kawakami, M. Nakao, Y. Hatamura, T. Kitamori, T. Sawada
To execute chemical experiments with less sample volume, shorter experiment time and higher measurement resolution, the authors are developing a quartz-chip laboratory with a thermal lens microscope. However, turbulence of fluid flow causes double-count measurement error of microparticles. To increase preciseness of the measurement, a narrow lamina-flow channels called "nano-channel" is employed. Nano-channels of 50 and 900 nm width, flat-structured ball mixer and bubble pump/valve were designed and fabricated on a quartz substrate to estimate their feasibilities.
{"title":"Nano-channel on quartz-chip laboratory using single molecular detectable thermal lens microscope","authors":"K. Matsumoto, T. Kawakami, M. Nakao, Y. Hatamura, T. Kitamori, T. Sawada","doi":"10.1109/MEMSYS.1998.659741","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659741","url":null,"abstract":"To execute chemical experiments with less sample volume, shorter experiment time and higher measurement resolution, the authors are developing a quartz-chip laboratory with a thermal lens microscope. However, turbulence of fluid flow causes double-count measurement error of microparticles. To increase preciseness of the measurement, a narrow lamina-flow channels called \"nano-channel\" is employed. Nano-channels of 50 and 900 nm width, flat-structured ball mixer and bubble pump/valve were designed and fabricated on a quartz substrate to estimate their feasibilities.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115114719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659824
W. Kronast, B. Muller, W. Siedel, Stoffel, Fachhochschule Furtwangen
A single-chip IC-compatible silicon condenser microphone with a highly sensitive silicon nitride membrane and a rigid monocrystalline silicon counterelectrode with acoustic holes was designed and built. Porous silicon with its high dissolution rate in 1% KOH was used as an auxiliary sacrificial layer in combination with sputtered SiO/sub 2/ to define the air gap. This results in low parasitic capacitances and a microphone structure where the membrane is coplanar with its suspensions. The rigid backelectrode is undistorted, the membrane under low tensile stress, a prerequisite for high sensitivity. Microphones of different dimensions of round and square electrodes with single membranes and membrane arrays were built and packaged in round chip carriers. The open loop sensitivity is in the mV/Pa range depending on the type of microphone. The frequency response goes beyond 25 kHz for an air gap of 1.3 /spl mu/m.
{"title":"Single-chip condenser microphone using porous silicon as sacrificial layer for the air gap","authors":"W. Kronast, B. Muller, W. Siedel, Stoffel, Fachhochschule Furtwangen","doi":"10.1109/MEMSYS.1998.659824","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659824","url":null,"abstract":"A single-chip IC-compatible silicon condenser microphone with a highly sensitive silicon nitride membrane and a rigid monocrystalline silicon counterelectrode with acoustic holes was designed and built. Porous silicon with its high dissolution rate in 1% KOH was used as an auxiliary sacrificial layer in combination with sputtered SiO/sub 2/ to define the air gap. This results in low parasitic capacitances and a microphone structure where the membrane is coplanar with its suspensions. The rigid backelectrode is undistorted, the membrane under low tensile stress, a prerequisite for high sensitivity. Microphones of different dimensions of round and square electrodes with single membranes and membrane arrays were built and packaged in round chip carriers. The open loop sensitivity is in the mV/Pa range depending on the type of microphone. The frequency response goes beyond 25 kHz for an air gap of 1.3 /spl mu/m.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128228993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659788
N. Osakabe, M. Kurosawa, T. Higuchi, O. Shinoura
Using a silicon fabricated slider, the output force and the maximum traverse velocity of a surface acoustic wave motor has been improved up to 12 times larger force and twice faster speed than the previous motor which used a multi contact points slider. To obtain the high output force, large contact area between the slider and the stator transducer is required. Therefore a silicon slider was developed and tested. As a result, the maximum output force of 3.5 N and the maximum traverse velocity of 0.65 m/s were obtained. The maximum output force of 3.5 N was 90 times of the transducer weight. Such a high output force performance is produced by high power density of surface acoustic wave devices and friction drive.
{"title":"Surface acoustic wave linear motor using silicon slider","authors":"N. Osakabe, M. Kurosawa, T. Higuchi, O. Shinoura","doi":"10.1109/MEMSYS.1998.659788","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659788","url":null,"abstract":"Using a silicon fabricated slider, the output force and the maximum traverse velocity of a surface acoustic wave motor has been improved up to 12 times larger force and twice faster speed than the previous motor which used a multi contact points slider. To obtain the high output force, large contact area between the slider and the stator transducer is required. Therefore a silicon slider was developed and tested. As a result, the maximum output force of 3.5 N and the maximum traverse velocity of 0.65 m/s were obtained. The maximum output force of 3.5 N was 90 times of the transducer weight. Such a high output force performance is produced by high power density of surface acoustic wave devices and friction drive.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"169 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128236347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659835
S. Konishi, M. Yoda, N. Hosaka, S. Sugiyama, S. Akishita
We present a tunable acoustic absorbing system. Most of the conventional acoustic absorbers can absorb an only sound of a fixed frequency. We propose an acoustic absorbing system with a tunable compliance in order to absorb variable sounds. The developed system forms an array of the Helmholtz resonator with a deep hole array by a X-ray lithography. Micro deep holes are effective at a low frequency. The resonator has an air cavity whose volume is controllable so as to tune its resonant frequency to a desired frequency. This paper reports characteristics of our developed acoustic absorbing system and our project status.
{"title":"Tunable acoustic absorbing system using a deep hole array","authors":"S. Konishi, M. Yoda, N. Hosaka, S. Sugiyama, S. Akishita","doi":"10.1109/MEMSYS.1998.659835","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659835","url":null,"abstract":"We present a tunable acoustic absorbing system. Most of the conventional acoustic absorbers can absorb an only sound of a fixed frequency. We propose an acoustic absorbing system with a tunable compliance in order to absorb variable sounds. The developed system forms an array of the Helmholtz resonator with a deep hole array by a X-ray lithography. Micro deep holes are effective at a low frequency. The resonator has an air cavity whose volume is controllable so as to tune its resonant frequency to a desired frequency. This paper reports characteristics of our developed acoustic absorbing system and our project status.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130956726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659736
J. Kranert, C. Deter, T. Gessner, W. Dotzel
A new laser projection system is presented within this paper. The working principle and the main components are discussed. A cost effective and small sized laser projection system becomes possible by the use of solid-state lasers and the application of microsystem devices for laser beam deflection. The light deflecting devices fabricated by micromachining are an essential of this paper. Design, different technological approaches and measurement results of the vertical scanner and of the line scanning micromirror arrays are discussed.
{"title":"Laser display technology","authors":"J. Kranert, C. Deter, T. Gessner, W. Dotzel","doi":"10.1109/MEMSYS.1998.659736","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659736","url":null,"abstract":"A new laser projection system is presented within this paper. The working principle and the main components are discussed. A cost effective and small sized laser projection system becomes possible by the use of solid-state lasers and the application of microsystem devices for laser beam deflection. The light deflecting devices fabricated by micromachining are an essential of this paper. Design, different technological approaches and measurement results of the vertical scanner and of the line scanning micromirror arrays are discussed.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114097465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659747
T. Hirata, T. Akashi, A. Bertholds, Hans-Peter Gruber, A. Schmid, M. Gretillat, O. Guenat, N. F. D. Rooij
This paper presents a one-dimensional pneumatic actuator fabricated by combining several micromachining technologies such as microelectro-discharge machining (micro-EDM) as well as isotropic and anisotropic wet-etching. Unlike the existing pneumatic actuators, which usually convey the object by means of friction, this device employs the dynamic pressure of inclined driving jets in order to enhance the horizontal transportation performance. Typical slider speeds of 4 to 5 cm/s can be obtained. Comparisons are presented between different types of sliders. By an appropriate patterning of the slider bottom surface, the speed could be increased by 50% to 60%. Similarly a maximum tangential force of 20 /spl mu/N was obtained using this dynamic pressure concept. The latter is about two times larger than that of a slider with a smooth surface.
{"title":"A novel pneumatic actuator system realised by microelectro-discharge machining","authors":"T. Hirata, T. Akashi, A. Bertholds, Hans-Peter Gruber, A. Schmid, M. Gretillat, O. Guenat, N. F. D. Rooij","doi":"10.1109/MEMSYS.1998.659747","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659747","url":null,"abstract":"This paper presents a one-dimensional pneumatic actuator fabricated by combining several micromachining technologies such as microelectro-discharge machining (micro-EDM) as well as isotropic and anisotropic wet-etching. Unlike the existing pneumatic actuators, which usually convey the object by means of friction, this device employs the dynamic pressure of inclined driving jets in order to enhance the horizontal transportation performance. Typical slider speeds of 4 to 5 cm/s can be obtained. Comparisons are presented between different types of sliders. By an appropriate patterning of the slider bottom surface, the speed could be increased by 50% to 60%. Similarly a maximum tangential force of 20 /spl mu/N was obtained using this dynamic pressure concept. The latter is about two times larger than that of a slider with a smooth surface.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132976860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176
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